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PID PBSN PCB MOLYBDENUM CORE -NON CONFIDENTIAL-

Copyright/ Schutzvermerk DIN ISO 16016DIN ISO 16016

Copying of this document, and giving it to others and the use or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or design.

Weitergabe sowie Vervielfältigung dieser Unterlage, Verwertung und Mitteilung ihres Inhalts ist nicht gestattet, soweit nicht ausdrücklich zugestanden. Zuwiderhandlungen verpflichten zu Schadensersatz. Alle Rechte für den Fall der Patenterteilung oder Gebrauchsmuster‐Erteilung vorbehalten.

Document-Number Issue Project Date Class Page 63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 1/19 PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010

PID PbSn PCB Molybdenum core -non confidential-

Approved in SAP by Workflow

Prepared by QS2 D. Fuggmann

Engineering MT21 T. Maihöfer

PCB & Plating MT21 T. Bartscherer

Pre‐Production MT2 M. Jonek

Quality QS2 D. Fuggmann

Configuration Management CS3 I. Rock

CM Release

DVS‐No. TD00893909



CHANGE RECORD

Issue Details of Change Date

A Initial issue 2014‐04‐01



INDEX

1 Introduction ............................................................................................................... 4

1.1 Purpose ............................................................................................................................................... 4

1.2 Scope .................................................................................................................................................. 4

1.3 Abbreviations ...................................................................................................................................... 4

1.4 Applicable Documents ........................................................................................................................ 4

2 Organisation ............................................................................................................... 6

3 Processes ................................................................................................................... 8

4 Manufacturing flow .................................................................................................... 9

5 Qualified domain ..................................................................................................... 11

6 Manufacturing Area ................................................................................................. 12

7 Manufacturing Documentation ................................................................................ 14

8 Manufacturing Quality Control ................................................................................. 14

9 List of Materials........................................................................................................ 15

10 List of Equipment ..................................................................................................... 15

11 List of Test Equipment .............................................................................................. 17

12 List of Manufacturing Instructions ............................................................................ 18

13 List of Inspection Requirements................................................................................ 19



1 Introduction

1.1 Purpose

This document shows the processes for manufacturing PCB’s with molybdenum core and PbSn surface.

1.2 Scope

The listed processes and techniques are qualified in different qualification programs. This docu‐ment describes PCB’s with molybdenum core and PbSn surface. The domain only includes symmetric copper (etching process) layers. Blind via have full copper wrap. Planarization is not qualified. The domain includes the following PCB types (internal definition):

‐ Type 3: Rigid double‐sided PCBs ‐ Type 4: Rigid “Switch”‐PCBs ‐ Type 5: Rigid multilayer up to 8 layer (copper > 35µm) ‐ Type 5.1: Rigid multilayer > 8 layer (copper > 35µm) ‐ Type 6: Rigid multilayer up to 4 layer with blind via ‐ Type 6.1: Rigid multilayer > 6 layer with blind via ‐ Type 8: Rigid multilayer with blind and buried via

1.3 Abbreviations

Abbreviation Description

ECSS European Cooperation for Space Standardization

ESA European Space Agency

FM PbSn

Flight Model Lead tin

PCB Printed Circuit Board

PID Process Identification Document

1.4 Applicable Documents

AD 1 HB‐TESAT Managementhandbuch Management Manual, Iss. C

AD 2 HB‐QS2‐Prüfbefundmangemet Nonconformance Management, Reporting and Docu‐ mentation, Iss. B

AD 3 HB‐QS2‐Evaluation Qualifikation Evaluations, Qualifications, Material and Process Con‐ trol Board, Iss. B

AD 4 HB‐MT21 Leiterplattenproduktion PCB manufacturing and plating area, Iss. A

AD 5 63.3000.002.00FRL Design rules for FM PCB, Iss. C



AD 6 63.1013.001.00FNO Cleanliness‐ and Room Classes, Iss. D

AD 7 ECSS‐Q‐ST‐70‐10 Qualification of printed circuit boards, Iss. C

AD 8 ECSS‐Q‐ST‐70‐11 Procurement of printed circuit boards, Iss. C


Document-Number Issue Project Date Class 3.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 6/19 PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010

2 Organisation

Tesat‐Spacecom’s organizational structure is shown in Figure 1 to Figure 4. They represent the sta‐tus at the time of publishing this issue and include the short names of the organizational units.

Figure 1 provides the top level organization. The units shown are further subdivided as described in Figure 2 to Figure 4.

Figure 1: CEO Organization

Figure 2: COO Organization



Figure 3: MT Organization

Figure 4: MT21 Organization

PID ESA PBSN PCB MOLYBDENUM CORE

Document-Number Issue Project Date Class Page

63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 8/19

PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010

3 Processes

Processes Specifications

Preproduction and planning 63.1503.000.00VAR Incoming inspection of laminates 63.2721.031.00BVS

63.2721.032.00BVS 63.2721.041.00BVS

Incoming inspection of prepregs 63.2711.005.00BVS Inspection of artwork, -touch up, -control 63.1950.060.00FVS Chemical cleaning 63.1950.054.00FVS

63.4451.008.00IPV Mechanical cleaning 63.1950.013.00FVS Photoresist -application -exposure

63.1950.031.00FVS 63.1950.032.00FVS 63.4451.008.00IPV

Photoresist development Inspection photoresist

63.1950.033.00FVS

Acidic etching process (tenting technology) 63.1950.005.00FVS 63.4451.008.00IPV

Resist stripping process 63.1950.004.00FVS 63.4451.008.00IPV

Inspection etching 63.1892.003.00IPV Treatment of multilayers 63.1950.055.00FVS

63.4451.008.00IPV Storage of prepregs and laminates 63.1950.026.00FVS Laminate process 63.1950.026.00FVS Drilling and milling 63.1950.064.00FVS

Laserdrilling 63.1950.056.00FVS X-Ray drilling 63.1950.057.00FVS Deburring 63.1950.001.00FVS Etchback 63.1950.009.00FVS Inspection after drilling and etchback 63.1892.005.00IPV Panel (through hole) plating and bathcontrol 63.1950.002.00FVS

63.4451.008.00IPV Pattern plating (tin/lead) and bath control 63.1950.003.00FVS

63.4451.008.00IPV Additional surfaces 63.1950.042.00FVS

63.4451.008.00IPV Alkaline etching process (metal resist technology)

63.1950.046.00FVS 63.4451.008.00IPV

Tin lead fusing 63.1950.917.00FVS Microsection and controls 63.1892.006.00IPV Inspection 6P.1892.004.00

63.1892.005.00IPV Ultra sonic cleaning 63.1950.061.00FVS Packaging 63.1950.038.00FVS Baking Other comments 63.4451.008.00IPV





4 Manufacturing flow

The flow is an example of PbSn – PCB’s with molybdenum core and µVia connection. In brackets the steps, described in chapter 2, Processes. It was used for the requalification board in 2011. The different set‐ups defined in the design rules will be documented in the respective traveller.

Layer 51 / 52 Layer 53 til 58 Layer 59 / 60

Preproduction and planning

A

Drilling and milling

Cleaning


Cleaning

Photoresist exposure

Photoresist exposure Cleaning

Preproductionand planning


Etchback

Cleaning

Panel (PTH) plating

Cleaning


Photoresist development

Acidic etching

Resist stripping

X-Ray drilling

Cleaning

Inspection etching

Cleaning

Treatment of multilayers


Acidic etching

Resist stripping

X-Ray drilling

Cleaning

Inspection etching

Cleaning


Laminate process


Deburring

Cleaning


Acidic etching

Resist stripping)

Cleaning

Inspection etching


Cleaning


Laminate process

Drilling and milling)

Deburring

Laserdrilling

Etchback

Cleaning

Inspection

Panel (PTH) plating

Cleaning



Acidic etching

Resist stripping

X-Ray drilling

Cleaning

Inspection etching

Cleaning


Cleaning )

Etchback

Cleaning

Panel (PTH) plating

Cleaning



Acidic etching

Resist stripping

X-Ray drilling

Cleaning

Inspection etching

Cleaning






Multilayer complete

A


Laminate process


Deburring


Ultra sonic cleaning

Etchback

Deburring

Inspection

Panel (PTH) plating

Cleaning



Pattern plating tin/lead

Resist stripping

Alkaline etching process




Ultra sonic cleaning

Tin lead fusing

Ultra sonic cleaning)

Inspection

Microsection and controls

Baking

Packaging





5 Qualified domain

Objects ESA requirements TESAT – qualified parameters Possible parameters

Base material In Conformance with ECSS-Q-ST-70

Isola FR4 HTg IS420 Isola FR4 HTg IS420

Prepreg types In Conformance with ECSS-Q-ST-70

Isola 1080, 2116 Isola 1080, 2116, 106

External dimension toler-ance

± 0,2 mm +0; -0,15 mm +0; -0,15 mm

Thickness tolerance ± 10% ± 10% ± 10% Maximum board thickness 3,2 mm 3,2 mm 3,6 mm Conductor width minimum Internal: 120µm

External: 200 µm (for fine pitch 120 µm)

Internal: 120µm (17 µm copper thickness) External: 200 µm (for fine pitch 120 µm)

Internal: 100 µm (17 µm copper thickness) External: 150 µm (for fine pitch 120 µm)

Conductor spacing mini-mum

Internal: 150µm External: 300 µm (for fine pitch 150 µm)

Internal: 150µm External: 300 µm (for fine pitch 150 µm)

Internal: 100 µm (17 µm copper thickness) External: 150 µm (for fine pitch 150 µm)

PTH Via hole minimum 0,25 mm Aspect Ratio: 6

0,3 mm Aspect Ratio: 6

0,2 mm Aspect Ratio: 7

Mechanical depth drilled blind via hole minimum

None 0,6 mm Aspect Ratio: 1,0

0,4 mm Aspect Ratio: 1,0

µVia hole laser drilled minimum

None 0,3 mm Aspect Ratio: 0,5

0,2 mm Aspect Ratio: 0,7

Relative misregistration pad/hole

≤ 0,15 mm ≤ 0,15 mm ≤ 0,15 mm

Misalignment External layer solder side

0,2 mm 0,2 mm 0,2 mm

Misalignment External layer Non soldering hole

0,1 mm 0,1 mm 0,1 mm

Misalignment External layer solder side

0,1 mm 0,1 mm 0,1 mm

Misalignment Internal layer 0,05 mm 0,05 mm 0,05 mm Layer to layer registration ± 0,1 mm ± 0,1 mm ± 0,1 mm Number of layers maxi-mum

18 10 30

Electronic copper platingMinimum purity

95% 95% 95%

Copper thickness of sur-face pattern

≥ 25 µm ≥ 25 µm ≥ 25 µm

Copper thickness of plat-ed-through holes

≥ 25 µm ≥ 25 µm ≥ 25 µm

Copper thickness of via holes (blind via)

≥ 18 µm ≥ 18 µm ≥ 18 µm

Copper thickness of via holes (µvia) core connection

No requirements ≥ 10 µm ≥ 10 µm

Copper thickness innerlayer minimum

13 µm 13 µm 13 µm

Copper thickness innerlayer maximum

No requirements No requirements No requirements





Galvanic copper thickness outerlayer minimum

25 µm 25 µm 25 µm

Galvanic copper thickness outerlayer maximum

No requirements No requirements No requirements

Tin lead plating reflow Tin content of alloy

63 ± 8 % 63 ± 8 % 63 ± 8 %

Tin lead thickness on surface

≥ 8 µm in highest part ≥ 8 µm in highest part ≥ 8 µm in highest part

Tin lead thickness in plat-ed-through holes

≥ 8 µm in highest part ≥ 8 µm in highest part ≥ 8 µm in highest part

Tin lead thickness on angle cormer

≥ 2 µm ≥ 2 µm ≥ 2 µm

Insulation between layers minimum

70 µm 70 µm 40 µm (17µm copper)

Prepreg minimum Not required 1 1 Prepreg maximum Not required 5 8 Used core thickness Not required 0,1 up to 1,55 mm 0,1 up to 1,55 mm Warp and twist ≤ 1,1% for board thickness

≥ 1,6 mm ≤ 1,5% for board thickness < 1,6 mm

≤ 1,1% for board thickness ≥ 1,6 mm ≤ 1,5% for board thickness < 1,6 mm

≤ 1,1% for board thickness ≥ 1,6 mm ≤ 1,5% for board thickness < 1,6 mm

6 Manufacturing Area

The manufacturing of PCBs is performed in rooms with a cleanliness level according to the ge‐neric specification 63.1013.001.00FNO.

Plant layout:





The manufacturing area of PCB’s has been located in building No 099

Figure 5: Manufacturing area MT21, building 099/ground floor





Figure 6: Manufacturing area MT21, building 099/first floor

7 Manufacturing Documentation

For each PCB lot a job traveller is maintained. This job traveller contains all information neces‐sary for each subsequent working step. Additional electronic job tracking is used. This job travel‐ler will be kept in a manufacturing folder which contains also all relevant manufacturing draw‐ings.

8 Manufacturing Quality Control

Quality acceptance of the production of FM PCB’s is carried out by production lot control. The control contains 100% electrical and visual inspection. Microsectioning will be carried out on each panel and on one PCB per lot. Automated optical equipment is used additionally for inspection.





9 List of Materials

Material Type Film Idealine PRF

Base material FR4 IS 420 (HTg) Prepreg types: 106; 1080; 2116

Base material Polyimid 49 N (HTg) No Flow Prepreg type: 1080

Base material Polyimide (Flex) Pyralux Types: AP, LF

Copper foil CAC-foil; Cu-foil; 12 µm; 17 µm; 35 µm; 70 µm

Metal core Copper-Invar-Copper;

Metal core Molybdenum

10 List of Equipment

Process Equipment Supplier Artwork Laserplotter Silverwriter

Developper Agfaline 86 HT Barco Agfa

Film registration Punching Machine Digiraster

Microetching layer Microetching machine 930 Pill

Pumice scrubbing Pumiflex IS

Hot – Roll Laminator HRL - 24 Du Pont

Auto. Laminator CSL 2000 Yield Master Du Pont

Resist exposure system PC printer 130 Du Pont

Resist Developer Premium Line Schmid

Etching Innerlayer Premium Line Schmid

Resist stripping Premium Line Schmid

Brown oxidation Innerlayer Horizontal plating line Export 650

Pill

Lamination Multilayer Hydraulic Vacuum Press Bürkle

Drilling and Milling MX1 Schmoll

Etchback Plasma Etching machine Plasonic

Deburring Universal 601 Wesero

Pinning Machine Posafor Posalux

Electroless Copper and Panel plat-ing

Autom.Plating Line Galvabau

Pattern Plating (Tin/ Lead) Autom.Plating Line Galvabau

Etching external layer Horizontal plating line MacDermid

SnPb-fusing Heated Oil Tank Opelka

Dryer Export 450 Pill

Dryer UN 750 Plus Memmert





Ultrasonic washing machine

Export 600 Pill

Automatical exposure FAPS 600 Bacher

Drilling of tooling holes Via x-ray

XRX Schmoll

Registration and bonding of innerlayers

Bonding machine Wicke

Punching of innerlayers Punching machine Piergiacomi

Laserdrilling GS 600 Lumonics





11 List of Test Equipment

Test Test Equipment Supplier Microscope with measuring equip-ment

Axioplan Axioskop Axio Imager (A1)

Zeiss Zeiss Zeiss

Stereo-Microscope Stemi SV8 Stemi SV11

Zeiss Zeiss

Solderability Rotary Solderability Test Station CEMCO

Fluidizes Sand Bath SBL-1 Techne

Lamination and Prepreg Test Polystat 200 T Schwabenthan

Cations Atomic Spectrometer ASZ5000 Hitachi

Microsectioning Microsection Equipment Struers

Metall Coating Thickness, PbSn Fischerscope X-Ray XDLH Fischer

Copper Coating Thickness Fischerscope MMS Multimeasuringsystem

Fischer

Conductor Width/ Spacing Measuring Microsope Leitz

Glas Transition Temperature DSC-Equipment Netzsch

CVS QL 10 EX ECI Technology

MLB Over all Thickness Overarm Micrometer Ceco

Volume resistivity µVia 6290-7BV5 Almemo

Titration analysis Titrando 808 Metrohm

Scanning electron microscope Hitachi TM 1000 Hitachi

Inspection innerlayer Argos Mania Barco

Electrical testing Flying probe tester A3 ATG

Stereo-Microscope LYNX / VS8 Vision Engineering





12 List of Manufacturing Instructions

Mechanics Specification no. Plasmaätzen 63.1950.009.00FVS

Bohren und Fräsen Schmoll - Einrichtungen 63.1950.064.00FVS

Verpressen von Leiterplatten 63.1950.026.00FVS

Laserbohren 63.1950.056.00FVS

Röntgenbohren 63.1950.057.00FVS

Registrieren und Verschweißen von Lagen 63.1950.059.00FVS

Endreinigen von Leiterplatten (Ultraschallreinigen) 63.1950.061.00FVS

Structuring Specification no. Entschichten von Fotoresist (Strippen) 63.1950.004.00FVS

Ätzen von Leiterplatten 63.1950.005.00FVS

Reinigen von unbestückten Leiterplatten 63.1950.013.00FVS

Laminieren und Beschneiden von Fotoresist auf LP 63.1950.031.00FVS

Belichten des Fotoresists auf Leiterplatten 63.1950.032.00FVS

Entwickeln des Fotoresists auf Leiterplatten 63.1950.033.00FVS

Reinigen und Entfernen von Oxidschichten auf Cu-Oberflächen

63.1950.054.00FVS

Oxidieren von Innenlagen 63.1950.055.00FVS

Stanzen von Referenzlöchern 63.1950.058.00FVS

Filme für Strukturierung von Leiterplatten erstellen 63.1950.060.00FVS

Plating Specification no. Reinigen und Entgraten von unbestückten Leiterplatten 63.1950.001.00FVS

Vormetallisieren von Leiterplatten 63.1950.002.00FVS

Aufmetallisieren von Leiterplatten 63.1950.003.00FVS

Zinnstrippen von Leiterplatten 63.1950.042.00FVS

Ätzen von Leiterplatten in Metallresisttechnik 63.1950.046.00FVS

Chemisch Vernickeln und Vergolden von Leiterplatten 63.1950.050.00FVS

Aufschmelzen von Leiterplatten 63.1950.917.00FVS

General Specification no. Rahmenbedingungen für das Fertigen und Prüfen von LP‘n

63.1950.201.00FVS

Verpacken von Leiterplatten 63.1950.038.00FVS





13 List of Inspection Requirements

Inspection Specification no. Automatische Optische Inspektion von LP 63.1892.003.00IPV

Visuelle Kontrolle von LP 63.1892.005.00IPV

Schliffprüfung von LP 63.1892.006.00IPV

Elektrische Endprüfung von LP 6P.1892.004.00

Analytik Leiterplatten-Galvanik 63.4451.008.00IPV