moldex3d_tips_20150401 apr, 1st, 2015 advanced hot runner setting

Moldex3D_TIPs_20150401Apr, 1st, 2015

Advanced Hot Runner Setting

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> All hot runner component supported– Hot Runner Metal

• Bushing, manifold, nozzle, valve pin…– Heating System

• Heating rod/coil, sensor…– Boundary Conduction

• Insulating air gap, heat conduction face…

Main Features of Advanced Hot Runner (AHR) Module

Hot runner metal Heating rod/coil

Heat conduction face

Valve pin design

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Hot Runner Metal Component – Moldex3D Mesh

> To attribute Hot Runner Metal component in Moldex3D-Mesh

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Hot Runner Metal Component – Designer

> To attribute Hot Runner Metal component in Designer

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Heat Conduction Faces

- Heat conduction face : Heat conduction face is the conductible interface between hot runner metal and mold base (mold insert).

- Insulating air gap : The condition will be insulation without heat conduction face setting between hot runner metal and mold base (mold insert).

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> To assign Heat Conduction Faces in Moldex3D Mesh

Heat Conduction Faces – Moldex3D Mesh

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Heat Conduction Faces – Designer

> To assign Heat Conduction Faces in Designer

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Heating System

Heating Rod

Sensor

Each heating rod can be assigned a sensor node control in process setting Once heating rod (or cooling channel) contacts with hot runner metal, it will be considered that part

of hot runner metal (within insulating air gap)

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Computation ParameterHow to activate Air Gap Boundary

> In Cool computation parameter tab, enable “Apply air gap boundary condition on hot runner metal”

> Default air gap boundary is ideal heat insulation

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Heat Transfer Coefficient of Air Gap

> Heat transfer coefficient of air gap can be adjusted in Filling/Packing Advanced Setting.

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Air Gap Boundary Condition

> Air gap boundary will be assigned on contact face between Hot runner metal and Mold base (Mold insert)

> Once heating rod (or cooling channel) contacts with hot runner metal, it will be considered that part of hot runner metal (within insulating air gap)

Conduction face

Heat dissipation from conduction face

Air gap B.C.

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Appendix 1

> Relation between HTC and thickness of air gap (thickness 0.5 cm ~ 25 cm)

0 5 10 15 20 250

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2

3

4

5

6

7

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HTC

HTC

Thickness (cm)

HT

C(W

/m^

2.K

)

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Appendix 2

> Relation between HTC and thickness of air gap (thickness 0.02 cm ~ 0.5 cm)

0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.50

50

100

150

200

250

HTC

HTC

Thickness (cm)

HT

C(W

/m^

2.K

)

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