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Lockheed Martin Priorities for FHE and Printed

Electronics

Steve Gonya & Jeff Stuart

Copyright 2016 Lockheed Martin Corporation

Lockheed Martin Platforms

Solutions for Air,

Land, Sea &

Space Domains

Our platforms operate in

a wide range of

environments, imposing

stringent demands on

supporting electronic

and mechanical systems

Copyright 2016 Lockheed Martin Corporation

Copyright 2016 Lockheed Martin Corporation

FHE and the Defense Industry

• Defense Environmental Operational Ranges

– High Altitude / Outer space

– Deep Ocean

– Environmental Extremes in Temperature and Pressure

• Extreme thermal and pressure gradients

– High acceleration and deceleration operations

• Critical Factors: ruggedization, performance, reliability, qualification

• From the perspective of the defense industry, recasting electronic components in new form factors introduces new design paradigms, free from the constraints of rigid circuit boards.

• SWaP: In an industry constrained in terms of size, weight, space, and cost, FHE will provide unique solutions to these drivers for Lockheed Martin platforms.

Extreme Environments

Copyright 2016 Lockheed Martin Corporation

The Importance of Ruggedization

• Driver: Electronics Survivability under extreme conditions

• FHE / Direct Write components face large challenges to integration into high-performance systems,

given the absence of past performance data

• Certification of new materials and technologies for DoD high-performance platforms can take years

• There is a lack of test strategies to ensure long term system reliability for defense applications

• Initial applications will find use in secondary, noncritical systems, and in platforms with less stringent

requirements

– Unmanned vehicles

– Sensor platforms

– Energy harvesting

– Conformal antennas

• Demonstration in operational environments is key

• Ruggedization = Reliability! Stringent V&V of FHE in extreme environments will lower hurdles to qualification

for defense platforms

Copyright 2016 Lockheed Martin Corporation

FHE Performance Drivers

• Ruggedized interconnects

• Substrate adhesion

• Device resistance to environmental exposure

– Moisture penetration

– Oxidation

• Hybrid components

• Packaging

• Substrates that survive wide temperature ranges

– Stability around glass transition temperature

– Thermal expansion mismatch

• Outgassing

• Vibration isolation

• Chemical degradation / oxidation

• Humidity and temperature induced delamination

• Fatigue and aging

• High performance active materials that can

operate in extreme environments

• Resistance to environmental exposure

– Moisture

– UV light

– Oxidation

• Resistance to fatigue and aging

Copyright 2016 Lockheed Martin Corporation

Lockheed Martin Interest in Direct-Write Printed Electronics

• Conformal Sensors for Asset Monitoring

• Conformal Antennas and 3D Antenna Structures

• Critical System Protection - Volume Protection/Anti-Tamper

• Multilayer RF Hybrid Electronic Packaging

• Printed Discrete Resistors, Capacitors and Inductors

• Printed Embedded PWB Optical Waveguides

Copyright 2016 Lockheed Martin Corporation

Lockheed Martin Interest in Flexible Hybrid Electronics

• Soldier Wearable Bio-Sensors

– Vital Signs (T-P-BP)

– Physiological Status

– Hydration Level

– Pathogen Detection

– Injury Detection

• Body Wearable Antennas

– Soldier Radio

– Wi-Fi / WLAN

– Cellular / GSM

– GPS Tracker

– RFID Tag

• Energy Harvesting & Storage

– Photovoltaics

– Piezoelectric

– Thermoelectric

– Conformal Battery

• Flexible Computing

– Flexible Display

– Data Storage

– Real-Time Monitoring

• Stealth Wear

– IR Reflecting

– Color/Pattern Change

Copyright 2016 Lockheed Martin Corporation

Lockheed Martin Interest in Flexible Hybrid Electronics

• Wearable Electronics

• Flexible Hybrid Electronics (FHE) utilizing combination of flexible circuitry, additive printed

electronics and thinned silicon devices

• Medical Health Monitoring & Human Performance Monitoring

• Asset Structural Health Monitoring identify issues before failure

Copyright 2016 Lockheed Martin Corporation