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Lockheed Martin Priorities for FHE and Printed

Electronics

Steve Gonya & Jeff Stuart

Copyright 2016 Lockheed Martin Corporation

Lockheed Martin Platforms

Solutions for Air,

Land, Sea &

Space Domains

Our platforms operate in

a wide range of

environments, imposing

stringent demands on

supporting electronic

and mechanical systems



FHE and the Defense Industry

• Defense Environmental Operational Ranges

– High Altitude / Outer space

– Deep Ocean

– Environmental Extremes in Temperature and Pressure

• Extreme thermal and pressure gradients

– High acceleration and deceleration operations

• Critical Factors: ruggedization, performance, reliability, qualification

• From the perspective of the defense industry, recasting electronic components in new form factors introduces new design paradigms, free from the constraints of rigid circuit boards.

• SWaP: In an industry constrained in terms of size, weight, space, and cost, FHE will provide unique solutions to these drivers for Lockheed Martin platforms.

Extreme Environments


The Importance of Ruggedization

• Driver: Electronics Survivability under extreme conditions

• FHE / Direct Write components face large challenges to integration into high-performance systems,

given the absence of past performance data

• Certification of new materials and technologies for DoD high-performance platforms can take years

• There is a lack of test strategies to ensure long term system reliability for defense applications

• Initial applications will find use in secondary, noncritical systems, and in platforms with less stringent

requirements

– Unmanned vehicles

– Sensor platforms

– Energy harvesting

– Conformal antennas

• Demonstration in operational environments is key

• Ruggedization = Reliability! Stringent V&V of FHE in extreme environments will lower hurdles to qualification

for defense platforms


FHE Performance Drivers

• Ruggedized interconnects

• Substrate adhesion

• Device resistance to environmental exposure

– Moisture penetration

– Oxidation

• Hybrid components

• Packaging

• Substrates that survive wide temperature ranges

– Stability around glass transition temperature

– Thermal expansion mismatch

• Outgassing

• Vibration isolation

• Chemical degradation / oxidation

• Humidity and temperature induced delamination

• Fatigue and aging

• High performance active materials that can

operate in extreme environments

• Resistance to environmental exposure

– Moisture

– UV light

– Oxidation

• Resistance to fatigue and aging


Lockheed Martin Interest in Direct-Write Printed Electronics

• Conformal Sensors for Asset Monitoring

• Conformal Antennas and 3D Antenna Structures

• Critical System Protection - Volume Protection/Anti-Tamper

• Multilayer RF Hybrid Electronic Packaging

• Printed Discrete Resistors, Capacitors and Inductors

• Printed Embedded PWB Optical Waveguides

http://www.selectconnecttech.com/wp-content/uploads/2011/11/IMG_1153.jpg


Lockheed Martin Interest in Flexible Hybrid Electronics

• Soldier Wearable Bio-Sensors

– Vital Signs (T-P-BP)

– Physiological Status

– Hydration Level

– Pathogen Detection

– Injury Detection

• Body Wearable Antennas

– Soldier Radio

– Wi-Fi / WLAN

– Cellular / GSM

– GPS Tracker

– RFID Tag

• Energy Harvesting & Storage

– Photovoltaics

– Piezoelectric

– Thermoelectric

– Conformal Battery

• Flexible Computing

– Flexible Display

– Data Storage

– Real-Time Monitoring

• Stealth Wear

– IR Reflecting

– Color/Pattern Change


Lockheed Martin Interest in Flexible Hybrid Electronics

• Wearable Electronics

• Flexible Hybrid Electronics (FHE) utilizing combination of flexible circuitry, additive printed

electronics and thinned silicon devices

• Medical Health Monitoring & Human Performance Monitoring

• Asset Structural Health Monitoring identify issues before failure

lockheed martin priorities for fhe and printed electronics · lockheed martin priorities for fhe...

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