from concept to product - inemithor.inemi.org/.../pres/nano_2011/nist_nnn_ws_gamota_sept2011.pdf ·...

iNEMI Flexible Electronics Roadmap- Enabled by Nanotechnology and Roll-To-Roll Manufacturing -

From Concept

to Product

dan.gamota@printovatetech.com

Daniel Gamota, Chair

Margaret Joyce, Co-Chair

Jie Zhang, Co-Chair

to Product … many routes can be taken and

a roadmap simplifies the process

Nanotechnology, Roll-to-Roll, and Flexible

Electronics Materials, Processes, and Structures

Roadmap Definition

Purpose: To support the development,

communication, implementation, and

execution of strategy.

Applications

• Product Planning

• Services/Capability Planning

• Strategic Planning

• Program Planning

• Knowledge Asset Planning

• Process Planning

Formats

• Bars

• Tables

• Graphs

• Flow Charts

• Text

• Single/Multiple Layers

R2R Nanomanufacturing Roadmap – Strategic Planning

Enabling Technology Roadmap

2007 ITRS

Lithography

Roadmap for

Semiconductors

Moore’s Law –

A self-fulfilling prophecy

Enabling Technology Roadmap

ATTRIBUTES ASSESSMENT EXPECTATIONS

IPC International Technology Roadmap for Electronic Interconnections 2006 - 2007

Strategic Planning Roadmap Format

TGAPS/

Markets

Products

Partners

Skills/Talent

Assets

TNEEDSAssets

Organization

Technologies

Strategic Dimension – Opportunities and Threats

Software

Build toOrder

Materials

Components

iNEMI Mission

Equipment

MaterialsTransformation

Collaborative Design Life Cycle

SolutionsSoftware

Assure Leadership of the Global Electronics Manufacturing Supply Chain for the benefit of members and the industry

Software Solutions

Marketing Design ManufacturingOrder

Fulfillment

Supply Chain ManagementInformation Technology

LogisticsCommunications

Business Practices

Materials

Customer

Equipment Software Solutions

Product Needs

Technology Evolution

GAP Research

Methodology

Competitive

Roadmap

GovernmentAvailable

to Market

Global Industry

Participation Disruptive

Technology

AnalysisResearch

Projects

Competitive Solutions

Industry Solution Needed

Academia

iNEMIMembers

Collaborate

No Work

Required

Statistics for the 2011 iNEMI Roadmap

• > 575 Participants

• > 310 Companies/organizations

• 18 Countries from 4 Continents

• 21 Technology Working Groups (TWGs)

• 6 Product Emulator Groups (PEGs)

• Over 1800 Pages of Information

• Roadmaps the needs for 2011-2021

• > 60 Research Needs Identified

• > 155 Technical Gaps Identified

iNEMI MembersOEM/EMS, Suppliers, Government, & Universities

Roadmap Development

Product Emulator GroupsTWGs (21 total)

ical P

Semiconductor Technology

Product Sector Needs Vs. Technology Evolution

Business Processes

Prod Lifecycle Information Mgmt.

le / C

ical P

Design Technologies

Manufacturing Technologies

Comp./Subsyst. Technologies

Modeling, Thermal, etc.

Board Assy, Test, etc.

Large Area Flexible Electronics,Displays, Packaging, etc.

le / C

ice / L

Flexible Electronics Roadmap History

09/2005 – iNEMI Stakeholders identify Flexible Electronics as Future Growth Market and authorize formation of TWG

01/2006 – Flexible Electronics TWG formed (25 participants)

09/2006 – 1st Edition submitted for final editing

01/2007 – 1st Edition iNEMI Roadmap released to public

01/2009 – 2nd Edition iNEMI Roadmap released to public (67 participants)

01/2011 – 3rd Edition iNEMI Roadmap released to public

1st Edition Released at APEX 2007

iNEMI Flexible Electronics Roadmap Nanoenabled Platform Technologies

Printing Technologies

Contact

Non-Contact

Materials

Nanoparticle Suspensions

Polymer Blends

Small Molecule Solutions

Processes

Roll to Roll

Roll to Sheet

Nanotechnology Enabled Flexible

Electronics Device Structures

Device Performance• Nanomaterials-Interfaces

Compatibility

• Nanoparticle Migration/

Penetration through Layers

• Nanoscale Layer Uniformity

• Registration

• Resolution

• Solvent Compatibility

• Adhesive/Cohesive

Strength

Several factors determine fabricated flexible device performance.

Nanoenabled Composite Coatings

with Multifunctional Properties

Background• Lotus leaf: Low surface energy material (wax)

combined with hierarchical micro-to-nanoscale texture

• Durable coatings with high repellency to water and/or other liquids (alcohols, oils)

Technology• Imparting micro/ nanoscale hierarchical

roughness to a hydrophobic material (micro/nano fillers)

Left: Micro-molded pillars. Right: Nanoparticle spray coating.

Hydrophobicity – Lotus Effect

Micro/Nanoscale Fluid Transport Laboratory

(www.uic.edu/labs/MNFTL)

fillers)

• Solution-processed polymer composite coatings containing one or mixture of micro/nanomaterials

• Coating functionality

– Mechanical and/or chemical durability

– Adhesion enhancement

– Electromagnetic shielding

– Antibacterial/antimicrobial action

• Hydrophobicity , self-cleaning coatings

• Electrically conducting coatings

• Elastomeric (stretchable) coatings

• Icephobic coatings

300 nm

Left: Chemically Treated Copper. Right: Nanoturf - Si etching.

Icephobic Coatings – Wind Turbine Blades

R2R “Vision” and Electronics• 1990’s

– Goal: R2R high volume manufacturing of cell phones

– Outcome: flex based engine control units, flex based pagers

• 1990’s

– Goal: R2R high volume manufacturing of Li polymer batteries

– Outcome: supplier reduced price

• 1990’s

– Goal: R2R high volume manufacturing of supercapacitor

– Outcome: supercapacitor on flex qualified for Iridum™ phone

• 2000’s

– Goal: R2R high volume manufacturing of RFID antenna

– Outcome: qualified R2R process for product launch

• 2000’s

– Goal: R2R high volume manufacturing of TFT based products

– Outcome: enabling R2R technologies qualified and in-development

iNEMI Large Area Flexible Electronics Roadmap

Processing/

Equipment

Platforms

Applications

Shift in Roadmap Topic Participation– Movement Along Supply Chain

Testing

EquipmentMaterials Substrates Packaging

2007 Roadmap greatest participation in “Materials”.

2009 Roadmap greatest participation shifted to “Substrates” and “Processing Equipment”.

2011 Roadmap greatest participation shifted to “Processing Equipment” and “Applications”.

Roadmap Contents

Situation Analysis

• Business Issues & Drivers Overview

• Functional Inks

• Substrates

• Packaging/Barriers

• Manufacturing Platforms and Processing Equipment

• Testing and Quality Control Tools

• Large Area Flexible Electronics

• Reliability

• Standards

Roadmap Contents

Roadmap of Quantified Key Attribute Needs, Gaps, and Showstoppers

• Functional Inks: Technology Requirements

• Substrates: Technology Requirements

• Packaging/Barriers: Technology Requirements

• Manufacturing Platforms and Processing Equipment: Technology

Requirements

• In-line Characterization Tools: Technology Requirements

• Off-line Characterization Tools: Technology Requirements

• Devices and Circuits: Technology Requirements

• Flexible Electronics: Technology Requirements

• Reliability: Technology Requirements

• Standards: Technology Requirements

Working Group Key Takeaway -

Substrate Performs the “Heavy Lifting”

Application/Substrate Properties

RFID tag

Antenna 2 3 3 2 2 2

Circuitry 1 2 3 1 2 2

OLEDs 1 1 DS 1 1 APS

Introduction

1) Polymer (PET, PEN, PI)

2) Metal (Al, SS)

iNEMI Roadmap Format - Substrates

Display

Backplanes

Inorganic

Passive 2 3 DS 2 2 APS

Active 1 2 DS 1 1 APS

Organic Active 1 1 DS 1 2 APS

Organic Photovoltaics 2 1 DS 2 1 2

Batteries 3 2 3 2 2 2

1 – very important, 2 – medium and 3 – less important,

APS – application and product specific and DS – design specific

2) Metal (Al, SS)

3) Paper (natural, synthetic)

4) Textiles (woven, non-woven)

5) Glass (silica)

6) Ceramics (alumina)

Youngs Modulus

at 20oC, GPa

Youngs Modulus

at 150oC, GPa

Shrinkage in MD at

150o C after 30 mins (%)

Upper temperature for processing, oC

180-220oC

150oC4GPa

5GPaNon stabilised PET

and PEN shrink at Tg

This limits processing

Situation AnalysisSubstrates

Status and Current

Developments

Polymer Films

Polyesters: Applications

Properties

Haze %

Moisture pickup

at 20oC, 40%RH

18-20ppm/oC

1000ppm

3GPa20-25ppm/oC 1GPa

Heat stabilised PETHeat stabilised PETHeat stabilised PETHeat stabilised PETHeat stabilised PENHeat stabilised PENHeat stabilised PENHeat stabilised PENProperties

Major Past and Current

Developments

State of the Art (2009) Mid term (2014) Long term (2019)

Attributes Attributes Technology needs Attributes Technology needs

Roadmap of Key Technology Needs for SubstratesRoadmap of Quantified Key Attribute Needs, Gaps, and Showstoppers

Substrates

Polyester

Technology Requirements

Needs, Gaps, and Showstoppers

Attributes Attributes Technology needs Attributes Technology needs

Surface morphology:

roughness – bare foil

50nm RMS

15 nm RMS Development of

advanced foil

manufacturing

technologies

5 nm RMS Development of

advanced, yet low

cost, polishing

technologies

Flatness (per 500mm of

length): 2.0mm

1.0mm Development of

advanced foil

manufacturing

technologies

0.5mm Development of

advanced foil

manufacturing and

inspection

technologies

Coefficient of thermal

expansion: 10ppm/oC

<5ppm Development and

scale-up of

alternative

materials

<5ppm Development and

scale-up of

alternative

materials

Functional Inks

Semiconductor Inks

Attributes

• High performance

• Long shelf life and pot life

• Solution processable

• Compatibility with other functional

inks (chemical and electrical

Silver Nanoparticle

Conductive Inks

inks (chemical and electrical

interfacial integrity)

• Robust synthesis/formulating routes

• Materials and device stability in-air

• Compatible with large area scalable

processing platforms

�Thin Film Deposition– Physical Vapor Deposition (sputtering, pulsed laser, etc.)

– Chemical Vapor Deposition (PECVD)

– Molecular Beam Epitaxy (MBE)

– Atomic Layer Deposition (ALD)

– Spin coating

�Pattern Transfer– Photolithography

– Nanolithography

�Gravure

�Flexography

�Screen

�Jetting

Traditional Electronics Processes Emerging Electronics Processes

Manufacturing Platforms and

Processing Equipment

– Nanolithography

– Soft Lithography

– Liquid Imaging

�Implantation– Ion Implantation

– Diffusion Furnace

�Removal– Reactive Ion Etch

– Dry Etch, Wet Etch

– Plasma Ashing

– Chemical Mechanical Planarization

Substrate must be compatible to

fabrication process – temperature,

materials, process environment,

handling, etc.

�Embossing

Manufacturing Platforms and Processing Equipment

Lithography Technology Requirements - Cause and effect diagram for overlay

misalignment in R2R photolithography (Flexible Electronics Roadmap Chapter:

Figure 18).

Manufacturing Platforms and

Processing Equipment

Deposition

Technology

Description Pros Cons

Evaporation Formation of a film by the boiling or

sublimation of a source material

followed by condensation on a target

Wide range of

materials.

Very good for metal

Dissimilar materials

may require markedly

varying source

System Attribute Specification

Reduction ratio 2:1 (reduces reticle image)

Resolution ≤ 4.0 µm line/space pattern

Available depth of focus 25 µm at +/- 10% dose points

Numerical Aperture 0.15

Image field size 80 mm round; 56.5mm square

Image stitching error ≤ ± 1.0 µm

Thin Film Deposition Technologies

Key Technology Needs for Imaging System

followed by condensation on a target

substrate.

Very good for metal

and organic

deposition.

varying source

technology.

Sputtering Ejection of atoms from a target

material via momentum transfer of

bombarding ions to the surface of the

target.

Fast, low temperature

deposition possible.

Wide range of multi-

component materials.

Potential for ion

damage of underlying

films.

PECVD Deposition of thin-films from a gas

state via the reaction of chemical

constituents within a reactive plasma.

Excellent control of

stochiometry. High

deposition rates (esp.

with elevated T)

Requires specialized

precursor materials.

Control of film density

at low T problematic.

ALD Gas phase deposition which breaks the

chemical formation of thin films into

two discrete half reactions.

Exceptional thickness

control and step

coverage. Process T

as low as ambient.

Low deposition rate.

Seshan, K. (2002). Handbook of Thin-Film Deposition Processes and Techniques - Principles, Methods, Equipment and Applications (2nd Edition).

Image stitching error ≤ ± 1.0 µm

Overlay accuracy ≤ ± 1.0 µm

Scale compensation ± 400 ppm

Wavelength G-Line (436 nm)

Power at image plane ≥ 180 mw/cm 2

Uniformity ± 3%

Azores Specification Document..

In-Line/Off-Line Characterization Tools

Critical Parameters

•Resolution

•Registration

•Layer thickness

•Orientation of features

Source Drain

•Orientation of features

•Dimensions of features

•Processing conditions

•Material quality (pot life)

•In-process electrical testing

•Final product electrical testingb

Dielectric

Substrate

Material

Attributes

Process

Parameters

Deposition

Issues

• Rheology

• Curing/Sintering/Annealing

temperature and schedules

• Solution stability/shelf-life

• Excitation frequency

• Meniscus oscillation

• Droplet pinch-off

• Material/substrate

wettability

• Droplet evaporation

• “Coffee Stain”

phenomena

Development of Characterization Tools and Standard Operating Procedures

based on materials and processes.

System Attributes

• Web scratch identification

• Defect mapping

• Inspection width of 6” (extendable)

• Web handling: widths up to 24”

• Target defect size to detect: ≤ (1 to 5) µm

R2R Defect Inspection System (Flexible

Electronics Roadmap Chapter Figure 13).

• Target defect size to detect: ≤ (1 to 5) µm

• Minimum defect size: 3 µm

• Pass/fail sensitivity parameters automated

• Scratch detection algorithm ( ≥ 1 x 10 µm)

• Interleaf capable web handling

Device Automated Tester Device Electrical Data Distribution

Standard automated equipment, testing fixtures, and methods to increase testing

throughput to establish device performance database. Companies building device

databases and populating with real manufacturing device performance data.

Registration

Test Designs for Process Control

Resolution

Standardized designs for on-press assessment of resolution, registration, overlap,

dot gain, etc in “real-time” at production speed. Leverage microelectronics &

semiconductor process control methodologies (re-use).

Electrical Design, Layout,

and Simulation Tools

Pre-Press Production Systems

RIPing

Imaging device

(CtP, Film setter)

Semiconductor/ Microelectronics

Layout Software

Graphic Arts File

Conversion

CAD file/Gerber file

TIFF file

BIT map file

PDF/JDF

Interface

Potential flow processes for circuit layout data conversion to R2R printing manufacturing (Flexible Electronics Roadmap Chapter: Figure 4).

(CtP, Film setter)

Cylinder

Common software for microelectroinics, graphic arts, and printing(Flexible Electronics Roadmap Chapter: Table 2).

Process and Device

Modeling

Semiconductor/Microelectronics

Layout Software

Graphic Arts

Software

Pre-Press Production

Systems

CADENCE™

PSPICE™

SUPREM™

FLOOPS™

OrCAD™

L Edit™

GerbTool™

Graphics™

AutoCAD™

Illustrator™

Photoshop™

Quark™

In Design™

Kodak Prinergy

AGFA Apogee

Esko Artwork

Electrical Design, Layout, and Simulation Tools

Circuit Design

Circuit Simulation

Measured

Simulated

Confirmation of Experimental to Simulation

Circuit Simulation

Circuit Layout

Products and Applications

Lighting & Displays RF Enabled Sensors Photovoltaics

Reliability Testing Methods and Equipment

Reliability Testing Parameters• Air to air temperature cycling (-

20°C to +60°C, 30 min dwell)

• Liquid to liquid thermal shock (-20°C to +60°C, 5 min dwell)

• Flexure (30 degree off-axis bend)

• Humidity exposure (60°C at 90%

• Humidity exposure (60°C at 90% R.H.)

• Oxygen exposure

• Solvent resistance (Bleach, water, ammonia, etc.)

• Tearing, crumpling, crushing

�Reliability is application specific

Standards

IPC Printed Electronics Standards Exploratory Group Established in 2010

IPC Printed Electronics Standards Committee and Four Subcommittees Established in 2011

D-60 Printed Electronics Committee

• D61 Subcommittee

Project Title: Printed Electronics Design (IPC-2291)

Project Title: Printed Electronics Base Material/Substrates

Project Title: Printed Electronics Functional Materials

(IPC-4591)

Project Title: Printed Electronics Final Assembly

(IPC-6901)

Standards

1620.11620.1--2006™2006™ P1620.2P1620.216201620--2004™2004™

IEEE Printed and Organic Electronics Working Group 1620™ Established in 2003

Device Level Test

http://grouper.ieee.org/

groups/1620/1/

Approved in 2004

2008 update complete

and IEEE-SA approval

received

Approved in 2006

Ring Oscillator Test

http://grouper.ieee.org/

groups/1620/1/Assembling

Working Group

RF Sub-System Test

Need for printed RF

measurement standard

Flexible Electronics

“Top Four” Needs and Gaps

#1 In-line inspection and testing equipment

#2 Simulation and design tools

#2 Robust R2R, roll-fed, and large format

manufacturing platforms

#4 Higher performance inks (semiconducting,

OLED, PV active, etc.)

www.inemi.org

Daniel Gamota

Chuck Richardson

chuck.richardson@inemi.org

Bob Pfahl

bob.pfahl@inemi.org

from concept to product - inemithor.inemi.org/.../pres/nano_2011/nist_nnn_ws_gamota_sept2011.pdf ·...

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