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iNEMI Flexible Electronics Roadmap- Enabled by Nanotechnology and Roll-To-Roll Manufacturing -
From Concept
to Product
Daniel Gamota, Chair
Margaret Joyce, Co-Chair
Jie Zhang, Co-Chair
to Product … many routes can be taken and
a roadmap simplifies the process
Nanotechnology, Roll-to-Roll, and Flexible
Electronics Materials, Processes, and Structures
Roadmap Definition
Purpose: To support the development,
communication, implementation, and
execution of strategy.
Applications
• Product Planning
• Services/Capability Planning
• Strategic Planning
• Program Planning
• Knowledge Asset Planning
• Process Planning
Formats
• Bars
• Tables
• Graphs
• Flow Charts
• Text
• Single/Multiple Layers
R2R Nanomanufacturing Roadmap – Strategic Planning
Enabling Technology Roadmap
2007 ITRS
Lithography
Lithography
Roadmap for
Semiconductors
Moore’s Law –
A self-fulfilling prophecy
Enabling Technology Roadmap
ATTRIBUTES ASSESSMENT EXPECTATIONS
IPC International Technology Roadmap for Electronic Interconnections 2006 - 2007
Strategic Planning Roadmap Format
CU
RR
EN
TGAPS/
NEEDS
Markets
Products
Partners
Skills/Talent
Assets
VIS
ION
CU
RR
EN
TNEEDSAssets
Organization
Technologies
VIS
ION
Strategic Dimension – Opportunities and Threats
Software
Build toOrder
Materials
Components
iNEMI Mission
Equipment
MaterialsTransformation
Collaborative Design Life Cycle
SolutionsSoftware
Assure Leadership of the Global Electronics Manufacturing Supply Chain for the benefit of members and the industry
Software Solutions
Marketing Design ManufacturingOrder
Fulfillment
Supply Chain ManagementInformation Technology
LogisticsCommunications
Business Practices
Materials
Customer
Equipment Software Solutions
Product Needs
Technology Evolution
GAP Research
Methodology
Competitive
Roadmap
GovernmentAvailable
to Market
Place
Global Industry
Participation Disruptive
Technology
GAP
AnalysisResearch
Projects
Competitive Solutions
Industry Solution Needed
Academia
iNEMIMembers
Collaborate
No Work
Required
Statistics for the 2011 iNEMI Roadmap
• > 575 Participants
• > 310 Companies/organizations
• 18 Countries from 4 Continents
• 21 Technology Working Groups (TWGs)
• 6 Product Emulator Groups (PEGs)
• 6 Product Emulator Groups (PEGs)
• Over 1800 Pages of Information
• Roadmaps the needs for 2011-2021
• > 60 Research Needs Identified
• > 155 Technical Gaps Identified
Roadmap Development
Product Emulator GroupsTWGs (21 total)
Med
ical P
rod
ucts
Au
tom
oti
ve
Defe
nse a
nd
Ae
rosp
ace
Semiconductor Technology
Product Sector Needs Vs. Technology Evolution
Business Processes
Prod Lifecycle Information Mgmt.
Po
rtab
le / C
on
su
mer
Syste
ms
Netc
om
Med
ical P
rod
ucts
Au
tom
oti
ve
Defe
nse a
nd
Ae
rosp
ace
Design Technologies
Manufacturing Technologies
Comp./Subsyst. Technologies
Modeling, Thermal, etc.
Board Assy, Test, etc.
Large Area Flexible Electronics,Displays, Packaging, etc.
Po
rtab
le / C
on
su
mer
Off
ice / L
arg
e
Netc
om
Flexible Electronics Roadmap History
09/2005 – iNEMI Stakeholders identify Flexible Electronics as Future Growth Market and authorize formation of TWG
01/2006 – Flexible Electronics TWG formed (25 participants)
09/2006 – 1st Edition submitted for final editing
01/2007 – 1st Edition iNEMI Roadmap released to public
01/2009 – 2nd Edition iNEMI Roadmap released to public (67 participants)
01/2011 – 3rd Edition iNEMI Roadmap released to public
1st Edition Released at APEX 2007
iNEMI Flexible Electronics Roadmap Nanoenabled Platform Technologies
Printing Technologies
Contact
Non-Contact
Materials
Nanoparticle Suspensions
Polymer Blends
Small Molecule Solutions
Processes
Roll to Roll
Roll to Sheet
Sheet
Nanotechnology Enabled Flexible
Electronics Device Structures
Device Performance• Nanomaterials-Interfaces
Compatibility
• Nanoparticle Migration/
Penetration through Layers
• Nanoscale Layer Uniformity
• Nanoscale Layer Uniformity
• Registration
• Resolution
• Solvent Compatibility
• Adhesive/Cohesive
Strength
Several factors determine fabricated flexible device performance.
Nanoenabled Composite Coatings
with Multifunctional Properties
Background• Lotus leaf: Low surface energy material (wax)
combined with hierarchical micro-to-nanoscale texture
• Durable coatings with high repellency to water and/or other liquids (alcohols, oils)
Technology• Imparting micro/ nanoscale hierarchical
roughness to a hydrophobic material (micro/nano fillers)
50 nm
Left: Micro-molded pillars. Right: Nanoparticle spray coating.
Hydrophobicity – Lotus Effect
Micro/Nanoscale Fluid Transport Laboratory
(www.uic.edu/labs/MNFTL)
fillers)
• Solution-processed polymer composite coatings containing one or mixture of micro/nanomaterials
• Coating functionality
– Mechanical and/or chemical durability
– Adhesion enhancement
– Electromagnetic shielding
– Antibacterial/antimicrobial action
• Hydrophobicity , self-cleaning coatings
• Electrically conducting coatings
• Elastomeric (stretchable) coatings
• Icephobic coatings
2 µm
300 nm
Left: Chemically Treated Copper. Right: Nanoturf - Si etching.
Icephobic Coatings – Wind Turbine Blades
R2R “Vision” and Electronics• 1990’s
– Goal: R2R high volume manufacturing of cell phones
– Outcome: flex based engine control units, flex based pagers
• 1990’s
– Goal: R2R high volume manufacturing of Li polymer batteries
– Outcome: supplier reduced price
• 1990’s
– Goal: R2R high volume manufacturing of supercapacitor
– Goal: R2R high volume manufacturing of supercapacitor
– Outcome: supercapacitor on flex qualified for Iridum™ phone
• 2000’s
– Goal: R2R high volume manufacturing of RFID antenna
– Outcome: qualified R2R process for product launch
• 2000’s
– Goal: R2R high volume manufacturing of TFT based products
– Outcome: enabling R2R technologies qualified and in-development
Processing/
Equipment
Platforms
Applications
Shift in Roadmap Topic Participation– Movement Along Supply Chain
Testing
EquipmentMaterials Substrates Packaging
2007 Roadmap greatest participation in “Materials”.
2009 Roadmap greatest participation shifted to “Substrates” and “Processing Equipment”.
2011 Roadmap greatest participation shifted to “Processing Equipment” and “Applications”.
Roadmap Contents
Situation Analysis
• Business Issues & Drivers Overview
• Functional Inks
• Substrates
• Packaging/Barriers
• Manufacturing Platforms and Processing Equipment
• Manufacturing Platforms and Processing Equipment
• Testing and Quality Control Tools
• Large Area Flexible Electronics
• Reliability
• Standards
Roadmap Contents
Roadmap of Quantified Key Attribute Needs, Gaps, and Showstoppers
• Functional Inks: Technology Requirements
• Substrates: Technology Requirements
• Packaging/Barriers: Technology Requirements
• Manufacturing Platforms and Processing Equipment: Technology
Requirements
• In-line Characterization Tools: Technology Requirements
• In-line Characterization Tools: Technology Requirements
• Off-line Characterization Tools: Technology Requirements
• Devices and Circuits: Technology Requirements
• Flexible Electronics: Technology Requirements
• Reliability: Technology Requirements
• Standards: Technology Requirements
Application/Substrate Properties
Sm
oo
thn
ess
Ba
rrie
r P
rop
erti
es
Op
tica
l T
ran
spa
ren
cy
Dim
ensi
on
al
Sta
bil
ity
Th
erm
al
Sta
bil
ity
Mec
ha
nic
al
Str
eng
th/
Fle
xib
ilit
y
RFID tag
Antenna 2 3 3 2 2 2
Circuitry 1 2 3 1 2 2
OLEDs 1 1 DS 1 1 APS
Introduction
1) Polymer (PET, PEN, PI)
2) Metal (Al, SS)
iNEMI Roadmap Format - Substrates
Display
Backplanes
Inorganic
Passive 2 3 DS 2 2 APS
Active 1 2 DS 1 1 APS
Organic Active 1 1 DS 1 2 APS
Organic Photovoltaics 2 1 DS 2 1 2
Batteries 3 2 3 2 2 2
1 – very important, 2 – medium and 3 – less important,
APS – application and product specific and DS – design specific
2) Metal (Al, SS)
3) Paper (natural, synthetic)
4) Textiles (woven, non-woven)
5) Glass (silica)
6) Ceramics (alumina)
Youngs Modulus
at 20oC, GPa
Youngs Modulus
at 150oC, GPa
Shrinkage in MD at
150o C after 30 mins (%)
Upper temperature for processing, oC
180-220oC
0.05%
150oC4GPa
0.1%
5GPaNon stabilised PET
and PEN shrink at Tg
This limits processing
to Tg
Situation AnalysisSubstrates
Status and Current
Developments
Polymer Films
Polyesters: Applications
Properties
iNEMI Roadmap Format - Substrates
Haze %
Moisture pickup
at 20oC, 40%RH
78oC
120oC
18-20ppm/oC
1000ppm
0.7%
1000ppm
0.7%
3GPa20-25ppm/oC 1GPa
Heat stabilised PETHeat stabilised PETHeat stabilised PETHeat stabilised PETHeat stabilised PENHeat stabilised PENHeat stabilised PENHeat stabilised PENProperties
Major Past and Current
Developments
State of the Art (2009) Mid term (2014) Long term (2019)
Attributes Attributes Technology needs Attributes Technology needs
Roadmap of Key Technology Needs for SubstratesRoadmap of Quantified Key Attribute Needs, Gaps, and Showstoppers
Substrates
Polyester
Technology Requirements
Needs, Gaps, and Showstoppers
iNEMI Roadmap Format - Substrates
Attributes Attributes Technology needs Attributes Technology needs
Surface morphology:
roughness – bare foil
50nm RMS
15 nm RMS Development of
advanced foil
manufacturing
technologies
5 nm RMS Development of
advanced, yet low
cost, polishing
technologies
Flatness (per 500mm of
length): 2.0mm
1.0mm Development of
advanced foil
manufacturing
technologies
0.5mm Development of
advanced foil
manufacturing and
inspection
technologies
Coefficient of thermal
expansion: 10ppm/oC
<5ppm Development and
scale-up of
alternative
materials
<5ppm Development and
scale-up of
alternative
materials
Functional Inks
SS
SS
RR
n
Semiconductor Inks
Attributes
• High performance
• Long shelf life and pot life
• Solution processable
• Compatibility with other functional
inks (chemical and electrical
Silver Nanoparticle
Conductive Inks
inks (chemical and electrical
interfacial integrity)
• Robust synthesis/formulating routes
• Materials and device stability in-air
• Compatible with large area scalable
processing platforms
�Thin Film Deposition– Physical Vapor Deposition (sputtering, pulsed laser, etc.)
– Chemical Vapor Deposition (PECVD)
– Molecular Beam Epitaxy (MBE)
– Atomic Layer Deposition (ALD)
– Spin coating
�Pattern Transfer– Photolithography
– Nanolithography
�Gravure
�Flexography
�Screen
�Jetting
Traditional Electronics Processes Emerging Electronics Processes
Manufacturing Platforms and
Processing Equipment
– Nanolithography
– Soft Lithography
– Liquid Imaging
�Implantation– Ion Implantation
– Diffusion Furnace
�Removal– Reactive Ion Etch
– Dry Etch, Wet Etch
– Plasma Ashing
– Chemical Mechanical Planarization
Substrate must be compatible to
fabrication process – temperature,
materials, process environment,
handling, etc.
�Embossing
Manufacturing Platforms and Processing Equipment
Lithography Technology Requirements - Cause and effect diagram for overlay
misalignment in R2R photolithography (Flexible Electronics Roadmap Chapter:
Figure 18).
Manufacturing Platforms and
Processing Equipment
Deposition
Technology
Description Pros Cons
Evaporation Formation of a film by the boiling or
sublimation of a source material
followed by condensation on a target
Wide range of
materials.
Very good for metal
Dissimilar materials
may require markedly
varying source
System Attribute Specification
Reduction ratio 2:1 (reduces reticle image)
Resolution ≤ 4.0 µm line/space pattern
Available depth of focus 25 µm at +/- 10% dose points
Numerical Aperture 0.15
Image field size 80 mm round; 56.5mm square
Image stitching error ≤ ± 1.0 µm
Thin Film Deposition Technologies
Key Technology Needs for Imaging System
followed by condensation on a target
substrate.
Very good for metal
and organic
deposition.
varying source
technology.
Sputtering Ejection of atoms from a target
material via momentum transfer of
bombarding ions to the surface of the
target.
Fast, low temperature
deposition possible.
Wide range of multi-
component materials.
Potential for ion
damage of underlying
films.
PECVD Deposition of thin-films from a gas
state via the reaction of chemical
constituents within a reactive plasma.
Excellent control of
stochiometry. High
deposition rates (esp.
with elevated T)
Requires specialized
precursor materials.
Control of film density
at low T problematic.
ALD Gas phase deposition which breaks the
chemical formation of thin films into
two discrete half reactions.
Exceptional thickness
control and step
coverage. Process T
as low as ambient.
Low deposition rate.
Seshan, K. (2002). Handbook of Thin-Film Deposition Processes and Techniques - Principles, Methods, Equipment and Applications (2nd Edition).
Image stitching error ≤ ± 1.0 µm
Overlay accuracy ≤ ± 1.0 µm
Scale compensation ± 400 ppm
Wavelength G-Line (436 nm)
Power at image plane ≥ 180 mw/cm 2
Uniformity ± 3%
Azores Specification Document..
In-Line/Off-Line Characterization Tools
Critical Parameters
•Resolution
•Registration
•Layer thickness
•Orientation of features
L
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
Source Drain
•Orientation of features
•Dimensions of features
•Processing conditions
•Material quality (pot life)
•In-process electrical testing
•Final product electrical testingb
Gate
Dielectric
Substrate
a
Material
Attributes
Process
Parameters
Deposition
Issues
• Rheology
• Curing/Sintering/Annealing
temperature and schedules
• Solution stability/shelf-life
• Excitation frequency
• Meniscus oscillation
• Droplet pinch-off
• Material/substrate
wettability
• Droplet evaporation
• “Coffee Stain”
phenomena
In-Line/Off-Line Characterization Tools
Development of Characterization Tools and Standard Operating Procedures
based on materials and processes.
In-Line/Off-Line Characterization Tools
System Attributes
• Web scratch identification
• Defect mapping
• Inspection width of 6” (extendable)
• Web handling: widths up to 24”
• Target defect size to detect: ≤ (1 to 5) µm
R2R Defect Inspection System (Flexible
Electronics Roadmap Chapter Figure 13).
• Target defect size to detect: ≤ (1 to 5) µm
• Minimum defect size: 3 µm
• Pass/fail sensitivity parameters automated
• Scratch detection algorithm ( ≥ 1 x 10 µm)
• Interleaf capable web handling
In-Line/Off-Line Characterization Tools
Device Automated Tester Device Electrical Data Distribution
Standard automated equipment, testing fixtures, and methods to increase testing
throughput to establish device performance database. Companies building device
databases and populating with real manufacturing device performance data.
Registration
Test Designs for Process Control
Resolution
Standardized designs for on-press assessment of resolution, registration, overlap,
dot gain, etc in “real-time” at production speed. Leverage microelectronics &
semiconductor process control methodologies (re-use).
Electrical Design, Layout,
and Simulation Tools
Pre-Press Production Systems
RIPing
Imaging device
(CtP, Film setter)
Semiconductor/ Microelectronics
Layout Software
Graphic Arts File
Conversion
CAD file/Gerber file
TIFF file
BIT map file
PDF/JDF
Interface
Potential flow processes for circuit layout data conversion to R2R printing manufacturing (Flexible Electronics Roadmap Chapter: Figure 4).
(CtP, Film setter)
Plate
Cylinder
Film
Common software for microelectroinics, graphic arts, and printing(Flexible Electronics Roadmap Chapter: Table 2).
Process and Device
Modeling
Semiconductor/Microelectronics
Layout Software
Graphic Arts
Software
Pre-Press Production
Systems
CADENCE™
PSPICE™
SUPREM™
FLOOPS™
OrCAD™
L Edit™
GerbTool™
Graphics™
AutoCAD™
Illustrator™
Photoshop™
Quark™
In Design™
Kodak Prinergy
AGFA Apogee
Esko Artwork
Electrical Design, Layout, and Simulation Tools
Circuit Design
Circuit Simulation
Measured
Simulated
Confirmation of Experimental to Simulation
Circuit Simulation
Circuit Layout
Reliability Testing Methods and Equipment
Reliability Testing Parameters• Air to air temperature cycling (-
20°C to +60°C, 30 min dwell)
• Liquid to liquid thermal shock (-20°C to +60°C, 5 min dwell)
• Flexure (30 degree off-axis bend)
• Humidity exposure (60°C at 90%
• Humidity exposure (60°C at 90% R.H.)
• Oxygen exposure
• Solvent resistance (Bleach, water, ammonia, etc.)
• Tearing, crumpling, crushing
�Reliability is application specific
Standards
IPC Printed Electronics Standards Exploratory Group Established in 2010
IPC Printed Electronics Standards Committee and Four Subcommittees Established in 2011
D-60 Printed Electronics Committee
• D61 Subcommittee
Project Title: Printed Electronics Design (IPC-2291)
• D62 Subcommittee
• D62 Subcommittee
Project Title: Printed Electronics Base Material/Substrates
• D63 Subcommittee
Project Title: Printed Electronics Functional Materials
(IPC-4591)
• D64 Subcommittee
Project Title: Printed Electronics Final Assembly
(IPC-6901)
Standards
1620.11620.1--2006™2006™ P1620.2P1620.216201620--2004™2004™
IEEE Printed and Organic Electronics Working Group 1620™ Established in 2003
Device Level Test
http://grouper.ieee.org/
groups/1620/1/
Approved in 2004
2008 update complete
and IEEE-SA approval
received
Approved in 2006
Ring Oscillator Test
http://grouper.ieee.org/
groups/1620/1/Assembling
Working Group
RF Sub-System Test
ü
?
Need for printed RF
measurement standard
ü
Flexible Electronics
“Top Four” Needs and Gaps
#1 In-line inspection and testing equipment
#2 Simulation and design tools
#2 Robust R2R, roll-fed, and large format
#2 Robust R2R, roll-fed, and large format
manufacturing platforms
#4 Higher performance inks (semiconducting,
OLED, PV active, etc.)
www.inemi.org
Daniel Gamota
Daniel Gamota
Chuck Richardson
Bob Pfahl