built-in self-test and calibration of mixed-signal devices

Built-In Self-Test and Calibration of Mixed-signal Devices

Wei JiangPh.D. Dissertation Proposal

June 11, 2009Advisor: Vishwani D. Agrawal

Committee Members: Fa F. DaiVictor P. NelsonAdit D. Singh

Outline• Overview• Background• Built-in Test and Calibration Approach• Current Progress• Future Work• Conclusion

2Wei Jiang General Oral Examination

Overview• Issues

– Parameter deviation– Process variation

• Problem– Design variation-tolerant process-independent

technique for mixed-signal devices

• Approach– Test and characterization of mixed-signal

devices– Output calibration

Wei Jiang General Oral Examination 3

Mixed-signal Device• Analog and digital circuitry• Digital controllable• Typical devices

– Converters, digital-to-analog/analog-to-digital

– Amplifier

Wei Jiang 4General Oral Examination

Testing of Mixed-signal Devices• Defects and faults

– Catastrophic faults (hard faults)– Parametric faults (soft faults)

• Test approaches– Functional test (specification oriented)– Structural test (defect oriented)

Challenges• Analog circuitry

– No convincing fault models– Difficult to identify faults– Device parameters more susceptible to

process variation than digital circuitry– Fault-free behavior based on a known range

of acceptable values for component parameters

• Large statistical process variation effects in deep sub-micron MOSFET devices

Process Variation• Parameter variation in nanoscale process• Yield, reliability and cost• Feature size scaling down and performance

improvement• Effects on digital and analog circuitry

– Analog circuitry more affected by process variation– Parameter deviation severed in nanoscale process– System performance degraded when parameter

deviation exceeds beyond tolerant limits

Typical Mixed-Signal Architecture

Mixed-Signal System Test Architecture

Wei Jiang 10

* F. F. Dai and C. E. Stroud, “Analog and Mixed-Signal Test Architectures,” Chapter 15, p. 722 in System-on-Chip Test Architectures: Nanometer Design for Testability, Morgan Kaufmann, 2008.

General Oral Examination

Mixed-Signal System Test Architecture• Digital system

– Digital I/O– Digital signal processor (DSP)– TPG and ORA and test control unit– Digital loopback

• Mixed-signal system– DAC and ADC– Analog loopback

• Analog system– Analog circuitry– Analog signal I/O– Analog I/O loopback

Test Criteria• Digital circuitry test

– Defect-oriented test– Defects cat be detected by wrong

output response for specific test pattern• Analog circuitry test

– Specific-oriented test– Parameter deviations vs. the acceptable

tolerant limit

Typical Mixed-Signal Devices• DAC – digital-to-analog converter

– Digital inputs; analog outputs• ADC – analog-to-digital converter

– Analog inputs; digital inputs• Digital Controlled Amplifier

– Analog inputs/outputs with digital controlling inputs

– Analog transfer function controlled by digital device, e.g. microcontroller

– Gain/distortion/nonlinearity respond to digital controlling signal

Existing Testing Approach• Oscillation BIST• LFSR-based TPG• FFT-based BIST

Linearity Problem• LSB – least significant bit

– The minimum measurement for of analog value

– Represented by 1 digital bit• Non-linearity Error

– DNL – differential non-linearity

– INL – integral non-linearity

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LSBDNL kk

DNLINL kk

Analog input

ital c

Actual (νK)

Digital code inputNon-linearity error of ADC Non-linearity error of DAC

Non-linearity Error of ADC/DAC

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Non-linearity error

Non-linearity

Other Characteristics• Frequency response

– Bandwidth• Noise

– SNR – signal-to-noise ratio– SINAD – signal-to-noise and distortion

ratio• Offset, gain, harmonic distortion• Intermodulation distortionWei Jiang 17General Oral

Examination

Outline• Overview• Background• Built-in Test and Calibration

Approach• Current Progress• Future Work• Conclusion

Typical Mixed-Signal System with DAC/ADC

Proposed Test and Calibration Architecture

Components Description• Digital circuitry (including DSP) as BIST control unit

– Test pattern generation (TPG) and output response analysis (ORA)

• Measuring ADC– First-order 1-bit Sigma-Delta modulator– Digital low-pass filter– Measuring outputs of DAC-under-test

• Dither DAC– Low resolution DAC– Generating correcting signal for calibration– Calibrated DAC for test of ADC-under-test

• ADC Polynomial Fix– Digital process to revise ADC output codes

Testing Procedure• Self-test of testing and calibrating components

– Self-test of BIST control unit (including DSP, TPG/ORA)

– Self-test of measuring ADC– Test of dithering DAC by measuring ADC

• Test of On-chip DAC– Ramp test of on-chip DAC– Characterizing on-chip DAC by DSP– Calibration of on-chip DAC by dithering DAC

• Test of on-chip ADC– Ramp test of on-chip ADC– Characterizing and fixing on-chip ADC outputs by

Faulty Mixed-Signal Circuitry• Good circuitry

– All parameters and characteristics are within pre-defined specified range

• Fault-tolerant factor– Post-fabrication and software-controllable– Fault-tolerant factor varies for different

application– Trade-off between fault-tolerance of

parameter deviation and calibration resolution

Determine Faulty DAC/ADC• Coefficients representing offset, gain

and harmonic distortion exceeding specific limit

• Maximum INL error exceeding calibration range (depending on fault-tolerant factor)– ±4LSB for fault-tolerant factor 3

• INL errors of all calibrated outputs must be within ±0.5LSB

Device Test and Calibration• During BIST

– Test DAC/ADC with ramp signals– Measure response of each test code– Obtain INL error for each code– Characterize device by INL error

• After BIST– Determine faulty devices by deviation of

parameters– Generate correcting signal/data (identical to

INL error) for each code– Calibrate DAC/ADC output using correcting

signal/data by removing INL errorWei Jiang 25General Oral

Examination

The ONLY Problem• Storing all INL errors for every input

code of DAC/ADC is impossible– Requiring huge amount of memory– Needing lots of access time to retrieve

specific data from memory– Prohibiting cost

• Solution– Polynomial fitting– Storing several coefficients instead of all

dataWei Jiang 26General Oral

Examination

Test Pattern• Test pattern

– Ramp code– Least value to most value– Testing time for each pattern depends

on the converting speed of measuring ADC

• Single-tone and multi-tone test patterns can also be used

Test of Digital Circuitry• Conventional digital BIST technology• LFSR-based random test; Scan-based

deterministic test• Digital loopback conducted• Fault-free digital circuitry then used

for mixed-signal test• May be hardware- or software-based

Measuring ADC• First-order 1-bit sigma-delta ADC• Perform self-test before any other

mixed-signal test• Make sure each components of

sigma-delta ADC working• Quantization noise• Bit-stream output pattern

Sigma-Delta Modulator

Sigma-Delta Modulator (cont.)• Advantage

– Oversampling and noise-shaping– High resolution and linear results– Resolution depends on OSR (oversampling

ratio)– Simple structure and low cost

• Disadvantage– Very slow converting speed– Bit-stream output pattern issue for low-order

modulation– Requiring high-speed clock

• Higher order and/or multi-bit modulationWei Jiang 31General Oral

Examination

Selection of Sigma-Delta Modulator

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First-order

Second-order

Third-order

17-bit ENOB104.1LSB

Oversampling ratio (OSR)General Oral Examination

Digital Filter• Sigma-delta ADC consists of sigma-

delta modulator and digital filter• Low-pass filter (LPF)• Integrator• Comb filter

Dithering DAC • Low-cost low-resolution DAC• Better linearity output with DEM

technique• Must be tested by measuring ADC

before test of on-chip mixed-signal devices

Resolution of Dithering DAC

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17bits

Resolution of dithering-DAC (bits)

Polynomial Fitting Algorithm• Introduced by Sunter et al.

in ITC’97 and A. Roy et al. in ITC’02

• Summary:– Divide DAC transfer

function into four sections

– Combine function outputs of each section (S0, S1, S2, S3)

– Calculate four coefficients (b0, b1, b2, b3) by easily-generated equations

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2210 xbxbxbby

Third-order Polynomial

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16344341

SSSSBSSSSBSSSSBSSSSB

xbxbxbby

Adaptive Polynomial Fitting• Dynamically choose polynomial degree• Low-order polynomial

– Simple to design and implement– Less area and performance overhead– Large fitting error

• High-order polynomial– Better fitting results– More coefficients to store– Much more complicated polynomial

evaluation circuitry design and heavy area and performance overhead

Test and Calibration of On-Chip DAC

BIST CONTROL

DACunder-test

1st-order 1-bit ΣΔ Modulator

LPFDigital Filter

Ramp code generator

Characteristics analysis

Pass/fail indicator

Offset,Gain,2nd and 3rd harmonic distortion

Coefficientsfor polynomial evaluation

ΣΔ ADC

Polynomial evaluation

Dithering DAC

Test and Calibration of On-Chip ADC

ADCunder-test

DACunder-test

Polynomial Fix

Polynomial evaluation

Dithering DAC

coefficients

BIST CONTROL

Pass/fail indicator

Offset,Gain,2nd and 3rd harmonic distortion

Coefficientsfor polynomial fit

Ramp code generator

Characteristics analysis

General Mixed-Signal Test• Variation-tolerant design• Digital controlled BIST• Digitalized TPG/ORA• Self-testable measuring components• Characterization of device-under-test by

DSP• Faulty circuitry determined by

characterized parameters• Coefficients of output fix/correction signals

calculated by DSPWei Jiang 41General Oral

Examination

Publications• W. Jiang and V. D. Agrawal, “Built-In Test and Calibration of DAC/ADC Using A Low-Resolution Dithering DAC,” NATW’08, pp. 61-68.

• W. Jiang and V. D. Agrawal, “Built-in Self-Calibration of On-Chip DAC and ADC,” ITC’08, paper 32.2.

• W. Jiang and V. D. Agrawal, “Built-in Adaptive Test and Calibration of DAC,” NATW’09, pp. 3-8.

• W. Jiang and V. D. Agrawal, “Designing Variation-Tolerance in Mixed-Signal Components of a System-on-Chip,” ISCAS’09, pp. 126-129.

Progress• Presenting a novel approach to test and

calibration DAC/ADC• Presenting a method to dynamically

determine the order of curve fitting polynomial for INL errors

• Proved by Matlab simulation theoretically

• Applicable for digitally controllable mixed-signal devices

Simulation of DAC Test

General Oral Examination 45

• 14-bit DAC• 16K ramp

codes• INL error up

to ±1.5LSB

Indices of 14-bit DAC-under-test

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Simulation (Cont.)

General Oral Examination 46

• Fitting results by different order polynomial

Indices of 14-bit DAC-under-test

Wei Jiang

Best-matching Polynomial

General Oral Examination 47Wei Jiang

Fitting Algorithm• Third-order polynomial fitting

algorithm• Adaptive polynomial fitting algorithm• Determination of best matching

polynomial degree

Measuring ADC / Dithering DAC• Measuring ADC

– First-order 1-bit Sigma-Delta ADC– Higher-order multi-bit Sigma-Delta ADC– Non-Sigma-Delta ADC– Digital low-pass filter

• Dithering DAC– Binary weighted DAC

Current Tasks• Modeling and hardware verification

of proposed testing approach• Programming of third-order

polynomial fitting algorithm• Implementation and optimization of

digital polynomial evaluation circuit• Design and verification of the whole

test and calibration systemWei Jiang General Oral

Examination 50

Future Tasks and Schedule• Testability of measuring ADC (~2 months)• Best matching polynomial (~2 months)• At-speed characterization (~1 month)• Dynamic Element Matching (~1 month)• Other testing techniques (~2 months)• Dissertation and defending (~2 months)

Testability of Measuring ADC• Measuring ADC must be self-testable• Testability of Sigma-Delta modulator• Problem

– Using digital circuitry and DSP to test analog circuitry

– Measuring ADC must tell faulty or healthy by itself

– Test of measuring ADC must be done before test of all other mixed-signal components

Best Matching Polynomial• Degree determination of best

matching polynomial• Problem

– Find cut-off degree of INL errors– Higher-order polynomial brings heavy

hardware overhead– Lower-order polynomial gives more

fitting error

At-Speed Characterization• An approach to utilize idle time of DSP to

re-calibrate mixed-signal devices• Performance of analog components varies

by environment, i.e. temperature, usage time

• Characterization during boot time may be inaccurate and need continuous revision during its lifetime

• Dynamic re-characterization of mixed-signal devices may reflect real condition of the devices and generate better results

Dynamic Element Matching (DEM)• Reduce non-linearity error of DAC/ADC• Fault-tolerant for analog elements• Approaches

– Dynamically change/rotate matching elements to generate desired outputs for specific inputs

– Reduce non-linearity of mismatching elements

• Disadvantage– Output pattern issue for low-order matching

algorithm– Requiring high-speed clock

Other Things…• Frequency response test• Noise test and removal• Delay test• Single-tone and multi-tone test

Conclusion• A post-fabrication built-in test and calibration

approach for mixed-signal devices is proposed• This approach relies on digital circuitry and DSP for

TPG/ORA and BIST control• Digital circuitry is testable by conventional digital

testing approaches and therefore guarantee the testability of analog circuitry

• The approach has been applied to test of DAC/ADC• The same idea can be widely used for other

digital-controlled mixed-signal devices• Calibration on mixed-signal devices will

significantly reduce defects, improve die yield and lower manufacturing cost

Q&ATHANKS

built-in self-test and calibration of mixed-signal devices

signal devicesdac digital

signal devicesdefects

signal architecturewei

digital device

signal deviceswei jiangph

calibration of mixed

chip test architectures

builtin selftest

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