1 from logic to hardware ellen spertus mcs 111 november 25, 2003

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1

From logic to hardware

Ellen SpertusMCS 111

November 25, 2003

2

Solderless breadboard

http://www.robotroom.com/Infrared555.html

3

Wire wrap

http://philip.greenspun.com/humor/eecs-difference-explained

http://www.okindustries.com/products/4.1.1.10.htm

4

Point-to-point solder board

http://happybob.com/marc/diy.htm

5

Printed circuit boards

• More robust than other techniques– Less subject to jostling– Able to handle higher frequency signals

• Easier to mass produce– Setup cost: create initial artwork– Marginal cost: print board, solder in chips

6

Steps

• Choose technology

• Create schematic diagram

• Create artwork

• Transfer artwork to board

• Drill and solder

7

Chip packaging

Surface mount technology (SMT)

Dual inline package (DIP)

8

9

Artwork

10

Silkscreen and top mask

11

Silkscreen and bottom mask

12

Notes

• Blue silkscreen layer is just for decoration

• Red lines represent top traces

• Green lines represent bottom traces

• Lines don’t intersect

• Circles represent– holes– vias (to carry signal from top to bottom)

13

Etching artwork onto board

• Subtractive processes– Begin with copper board– Mask where you want traces– Remove the exposed copper– Wash off mask

• Additive processes– Begin with nonconductive board– Add conductive traces

14

Transferring artwork to board

• Press-on or rub-on traces

• Special markers

• Iron-on transfers

• Photographic transfers

• Direct plotting onto board

15

Silkscreen and mask

16

Mask

17

Remainder of lecture

• From switches to gates

• Implementing switches

• Transistors

• Building gates from transistors

• Integrated circuits

18

From switches to gates

• Innovators– Konrad Zuse (Germany, 1935) – Claude Shannon (United States, 1940)

19

Computer hardware

• Mechanical relays– Z1 (1938)

• Electromagnetic relays– Z3 (1938-1941)– Mark 1 (1944)

• Vacuum tubes– Colossus (1943)– ENIAC (1946)

• Transistors (1947)

20

Conductors and insulators

• Conductors– Copper– Water

• ____________– Silicon– Germanium

• Insulators– Rubber

21

Faucet analogy

Pictures copyright © 1995 by Azer Bestavros

GateGate

Source Source

Sink Sink

22

Two types of transistors

Current flows when gate high Current flows when gate low

Pictures copyright © 1995 by Azer Bestavros

23Pictures copyright (c) 1995 by Azer Bestavros

24Pictures copyright (c) 1995 by Azer Bestavros

25Pictures copyright (c) 1995 by Azer Bestavros

26

What other gates can we build?

27

Integrated circuits

• Integrating multiple components (resistors, transistors, and capacitors) onto a single semiconductor chip

• Inventors 1958-1959– Jack Kilby, TI– Robert Noyce

• Fairchild Semiconductor• Intel

28

Microprocessors

• Intel 4004 (1971)– 2300 transistors– 4-bit processor– 108 KHz

• Intel Pentium 4 EE (2003)– 169 million transistors– 32-bit processor– 3.2 GHz– Cache (L1: 8 KB, L2: 512 KB, L3: 2 MB)

29

Creating silicon wafers

30

Opto-lithography and die separation

31

Packaging

32

Moore’s Law• The number of transistors that can be placed on the

same area of a microprocessor doubles every 1-2 years – Gordon Moore, 1965/1973

• Has held true ever since 1965!• In 2003, Intel predicted a billion transistors in 2007!

http://www.physics.udel.edu/wwwusers/watson/scen103/intel-new.gif

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