July 2009

Agilent EEsof EDA Overview

Agilent EEsof EDA Todd Cutler

GM Agilent EEsof EDA

From MMIC to Multi-technology design

Electronic

Measurement $3.3B

Chemical

Analysis $1.5B

Life

Sciences $1.8B

Industrial,

Comp/Semi

Comms

Environment Forensics

Petro/chem Food

Pharma/

biotech

Academic/

government

Business Groups

$6.6 billion* revenue in FY 2011

Aero/Defense

Agilent Technologies Solutions that Address Critical Customer Challenges

* Non-GAAP

Agilent EEsof EDA Leading Communications Product Design

• Co-design

• Interoperability

• Design flows

integration

• Design

verification

Agilent EEsof Technology Development Centers A Global Presence to Support You

Ghent, Belgium

Santa Rosa, California

Westlake Village, California

New Delhi, India

Japan

Modeling Center

Beijing, China

Alpharetta, Georgia

Santa Clara,

California

We Go Wherever the Communication Signal Goes

High Speed Design Device Modeling

Electronic System-Level Design RF/Microwave Design

Wireless Verification with SystemVue • Determine system performance of

ADS design with modulated signals

using SystemVue

• Refine system blocks with accurate

models from circuit design, e.g. X-

Parameters or connect to ADS co-

simulation directly

• Incorporate VSA 89601 measurement

software to analyze standard

compliant signal

Visit the SystemVue booth at Poster Session

Agilent EEsof Chip/Module/Package Design Flow

8

3D EM in a Big Picture, Co-Design!

o The old way: the sequential design process or “Throw-The-Die-Over-The-Wall”,

breaks down due to much smaller design form factors of packages, chips, and

substrates in modern high frequency and high speed designs

o Market Trends:

o Much closer proximity, embedded passives – increased parasitics, couplings

o Multichip modules, and stacked die become more common - forcing IC,

package, and board designers to work together more closely

o Challenge: Chip/package/module/board co-design from the

beginning of design process is inevitable!

Board

PoP

Chips

SMD SiP RF SiP

Packages

EMPro Workshop Version 2.0

Agilent RF Chip/Module/Package Investments

• Increasing design tools Integration to serve Multi-

technology IC/Module/Package/Board design

– Integrated multi-solver electromagnetic technologies

– Tight integration with enterprise PCB tools

– OpenAccess support and development for IC interoperability

• Addressing Design Flow Challenges

– integrated 3D EM saves designers hours

– Complete back end design flow through manufacturing, including Desktop DRC &

LVS reduced vendors and support

• Enhancing Simulation Technology Performance

– Broad investments in multi-core, GPU, and distributed simulation for circuit,

system, and EM engines.

– Behavioral modeling: X-Parameters and new FET modeling generate fast,

accurate nonlinear models

Agilent RF Chip/Module/Package Investments

• Key foundries support &

partnership

– GaAs, GaN, SiGe, Si

– Today with us :

• FH IAF

• IHP

• UMS

Gaetec

Knowledge*on

1. The Only Complete MMIC PDK Offering in the EDA Market, that are fully supported, maintained, and regularly updated by the foundries

ADS 2011: The IC/Module/Package/Board Design Solution

Realizing the Multi-Technology Vision

Multi-Technology Circuit Design

• Multiple die (IC and IPD)

• Multiple substrates (die, laminate, LTCC,

package, PCB)

• Multiple process design kits (PDKs)

– GaAs (HBT, pHEMT), GaN, SiGe, Si …

Integrated Electro-Magnetic Solvers

• Multi-Technology EM simulation

• Multi-layer 3D Planar EM simulation

• Easy EM simulation for the every engineer

Common Database : OpenAccess Mounted on Board

Multiple ICs Multiple Technologies

On Laminate &

Packaged

Page 11

3D EM Simulation Technologies

• Frequency Domain EM

• 3D Planar structures

• Full Wave and Quasi-Static

• Dense & Compressed Solvers

• Multiport simulation at no additional

cost

• High Q

• Frequency Domain EM

• 3D Arbitrary Structures

• Full Wave EM Simulation

• Direct, Iterative Solvers

• Multiport simulation at no

additional cost

• High Q

• Time Domain EM

• 3D arbitrary structures

• Full Wave EM simulations

• Handles much larger and

complex problems

• Simulate full size cell phone

antennas

• EM simulations per each port

• GPU based hardware

acceleration

FDTD

(Finite Difference Time Domain)

FEM

(Finite Element Method)

MoM

(Method of Moments)

FDTD

FEM

MoM

Page 12

Visit the 3DEM booth at Poster Session

IC-CAP Device Modeling • Industry leading platform for device modeling

• Powerful characterization and analysis capabilities for

any kind of semiconductor devices and processes

• Linking to Agilent testers, and individual measurement

instruments like DC, CV, S-parameter, NVNA, 1/f

Noise, wafer prober, switching matrix, thermo chuck

• Automated measurement and modeling modules for

BSIM3, BSIM4, BSIM-SOI, PSP, HiSim, HiSim-

HighVoltage

• Agilent Root Model, Agilent HBT Model

• custom solutions for EEHEMT and Angelov modeling,

including nonlinear-RF

• IC-CAP WaferPro: multi-site, multi-wafer, automated

wafer measurements

• Agilent NeuroFET Modeling Package

• DataPro Statistical Analysis

Visit the IC-CAP booth at Poster Session

End-to-end Device Modeling Flow

A Turn-key Solution

Automated

Measurements

IC-CAP Database

Model & PDK

Verification

Data Analysis

& Selection

Model

Extraction

Model Parameter Extraction: MBP IC-CAP WaferPro / DataPro

Model Stability& Quality Test

MQA / PQA

Design Variability