advanced polymer materials for mass production of biomems … r van roosbroek jsr... ·...
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Advanced polymer materials for mass production of BioMEMS devices
IMAPS workshopNovember 25, 2015
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From car tyres to …
It all started in 1957
We are a $4 billion leading supplier of advanced polymer materials with close to 6000 employees.
JSR Confidential
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Life Sciences
Energy
Petrochemicals
Fine Chemicals
…materials for everyday use
JSR Confidential
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Fine Chemicals
Fine Chemicals
Petro-Chemicals
Petro-ChemicalsCore Business
Life Sciences
Life SciencesEnergyEnergyStrategic Business
JSR business sectors
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� Exchange of material knowledge for new applications� Extended expertise to design and to develop materials for emerging
technologies� Good network to evaluate and test our materials� High volume manufacturing facilities� Quality performance is a top priority
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New material solutions for wafer-scale packaging
Life Science MaterialsSemiconductor & Packaging Materials
Magnetic beads
Porous beads
Combining our polymer expertise
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40 um
10 um
Micro-bump [THB-S392N]
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Thick resist for plating [THB series]
Micro-bump [THB-S392N]
Thickness: 25um
20um Via Hole
Photo sensitive insulator [WPR series]
� Nega type photo resist
� Good sensitivity and resolution
� Good plating performance
� Nega / Posi type lithography available
� Low residual stress (less bowing than PI)
� Lower elastic modulus
� Lower curing temp (lower than PI)
Film thickness: 10um
Pattern size: 25um
After Dev. After Cure
Positive type [WPR-S395P]@200C
Temporary bonding material [TA series]
� Room temperature de-bonding type
� Higher adhesion force for horizontal direction, and
lower for vertical direction
� Easily cleaning
� Available for 12 inch wafers
CSAM:
No void
Photo-sensitive adhesive [PA series]
Chip to chip Wafer to chipWafer to wafer
� Nega type lithography
� Strong adhesion
� Great bonding properties
Proposed
applications
40 um
10 um
Under development
JSR advanced packaging materials
MEDICAL APPLICATIONS
JSR Confidential
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Photo sensitive insulator [WPR series]
� Nega / Posi type lithography available
� Low residual stress (less bowing than PI)
� Lower elastic modulus
� Lower curing temp (lower than PI)
Film thickness: 10um
Pattern size: 25um
After Dev. After Cure
Positive type [WPR-S395P]@200C
Photo-sensitive adhesive [PA series]
Chip to chip Wafer to chipWafer to wafer
Proposed
applications
JSR advanced packaging materials
MEDICAL APPLICATIONSWafer-scale chip embedding
Wafer-scale microfluidics
Driver applications
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� Nega type lithography
� Strong adhesion
� Great bonding properties
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Material requirements
�Direct contact
�Extraction
cell culture medium
material under test
cells
• Morphology observation
• Fluorescent viability staining
Biocompatibility = key requirement for medical packaging applications
No cytotoxic effects on cells
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Control PI HD WPR PA HS
Cytotoxic effect on cells
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Viability staining using fibroblast cells
Focus materialsResults:•PA and WPR series were observed to be non-cytotoxic (> 90% cell viability)•HS resulted in 50% decrease in cell viability � new grades formulated
ISO10993
vs.
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Material requirements
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Control HS-1201 HS-1401 HS-1601
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Control HS-1201 HS-1401 HS-1601
Optimization of HS material resulted in improved cytotoxicity results
Summary
CONTROL WPR PA HS
Exposure None None Yes None
Development None None Yes None
Cure Temp. - 200C 200C 350C
Cytotoxicity - Pass Pass Pass
• WPR, PA and HS series were proven to be non-cytotoxic
• Applied process conditions and material composition determines in great extent the biocompatibility of the materials for medical applications
Biocompatibility = key requirement for medical packaging applications
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Chip Adhesive PA-series
Chip EmbeddingMaterial WPR-series
JSR Material Recommendations
Release Layer Material HS-series
Material Requirements
Wafer-level packaging of Si chips
PDMS WPR.............. PIPU PA
Molding Wafer Process....... ......Pick & Place
Materials
Process & Tools+
Silicone elastomer packaging approach
JSR wafer-scale approach
JSR chip embedding materials
In Collaboration with Imec
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i) HS material on substrate
ii) Base layer embedding material and patterning
iii) Application of adhesiveand patterning
iv) Thin chip placement
v) Coating of subsequent embedding layer and patterning
vi) Release of embedded dies
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JSR chip embedding materialsProcess overview
Wafer-scale embedding (v)
Chip release (vi)
Sensors Microfluidics
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� Bridge the gap between prototyping and mass fabrication
� Merging sensors with microfluidics
� Easy integration of active components (mixers, pumps, sensors, actuators) & biological components (surface chemistry, biomolecules)
� Wafer-scale bonding-packaging
Wafer-scale fabrication of lab-on-chip devices
JSR microfluidics materials
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SiO2 Bondpad
Polymer
Glass cover (pre-punched)
Sensor
Silicon wafer
A typical polymer fluidics process flow for silicon biochips
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Channel patterning & bonding
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SiO2 Bondpad
JSR
Glass cover (pre-punched)
Sensor
Silicon wafer
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Wafer-scale polymer channel (FT: 3 µm – 100 µm)
Wafer-scale Bio-functionalization
Glass cover (pre-punched)
Bonding of microfluidic channel
A typical polymer fluidics process flow for silicon biochips
Channel patterning & bonding
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• Photopatternable, negative tone adhesive with low cure temperature
• Biocompatible, transparent material
• Fine microfluidic structures can be generated using CMOS compatible processing
• Direct & strong bonding in mild conditions
• Fulfil the demand for increased microfluidic complexity at low cost
• Easy and fast prototyping (e.g. Maskless UV Laser Direct Imaging) BUT can easily be upscaled to wafer-scale production
Heat + Pressure
Bonding
PAsolution
Lithography AlignmentSpin-coat PA
i-lineGlass cover
Process flow
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Channel patterning & bonding
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(Line width 60um)(50um x 250um)
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• Constant improvement of the material to achieve the desired specs• Thickness: 10-100 µm• Resolution: > 10 µm
(200um X 200um)
20100 um
Capillary microfluidic structuresSimple structures
Patterning properties
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Microscopic top view through glass
Designed Line
(Line width 60um)
• 1-step bonding / no surface pre-treatment necessary• Straight profile & no channel deformation• No delamination• Can potentially bond to different substrates (e.g. PDMS, PET, COC,
PMMA...)
X-SEM image of the PA bonded channel
Strong Glass-Si bond for microfluidic packaging > 2bar
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(Bonded at 200ºC and 1 Mpa) (Bonded at 200ºC and 1 Mpa)
Bonded capillary µµµµ-fludic device
Capillary flow was demonstrated after bonding
(Bonded at 200ºC and 1 Mpa)
Bonding properties
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PA
Glass
200ºC 150ºC 100ºC
• Bonding strength at 100 ̊C sufficient for most microfluidic applications• New material to bond at room temperature under deve lopment
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Bonding properties
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Cell sorter chips Biosensors
Capillary microfluidics
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Wafer-scale production of µµµµ-fluidic devices
In Collaboration with Imec
Many applications …
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JSR ConfidentialIn Collaboration with Imec
Cell sorter
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30um channel
Wafer-level fabricated and bonded cell-sorter devic es
• Direct on-chip microfluidic patterning using PA
• Pressure driven device in which high pressures are induced
JSR ConfidentialIn Collaboration with Imec
Capillary Microfluidics
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Wafer-level fabricated capillary flow devices
Capillary microfluidics demonstrator
outlet
inletGlass bonded to PA capillary structures
Filling of capillary flow demonstrator device
• Perfectly bonded capillary flow devices with high yield
• Capillary flow through devices is demonstrated
• More complex structures such as pumping/mixing units, trigger valves and multiple channel devices have been successfully introduced
• Very promising alternative for Si capillary microfluidics
Coating Exposure Development Bonding
Chem
ical Reaction
Exposure Dose
1st X-linkingPatterning
2nd X-linkingBonding
1st UV X-link= Patterning
2nd UV X-link= Bonding
UV bonding & Patterning =Dual X-link or DXL material
• Biocompatible / non cytotoxic• Excellent patterning & bonding properties• Limited autofluorescence (no fluorescent backbone)• Low temperature bonding material
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New material developments
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Low temperature bonding material
New material developmentsSolution for bio-applications
PA DXL
Bond by heat Bond by exposure
• Resolution similar to PA
• Good bonding performance to glass at room temperature• Biomolecules can be coupled to sensor prior to bonding
10 um dense pillars and lines
Conclusion
Using the strong expertise in semiconductor JSR is developing a wide variety of materials to support specific medic al applications
Chip embedding – Bonding – Surface modification
Bridge the gap between prototyping and mass-fabrica tion&
Facilitate full integration
PA film properties after final cure
Appendix
JSR Confidential
Pattern and Bonding stability
= less than 5% film thickness change
20 um 20 um
Control
Toluene
Stability Study
Bonding stability
No Film thickness loss Stable bond after 5d storage
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• Long term storgage tests are scheduled
Patterning stability
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Material Biocompatibility
Cytotoxicity evaluation
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• Non-cytotoxic according to ISO-10993 standards• Cell viability evaluation of primary mouse fibroblast cells using Calcein AM • Good cell adhesion and cell growth onto PA layer
Cell growth on glass
Cell growth on PA
(Polystyrene)
PA film properties
Appendix
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