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    Semiconductor Components Industries, LLC, 2013

    December, 2013 Rev. 15

    1 Publication Order Number:

    2N5194/D

    2N5194G, 2N5195G

    Silicon PNP PowerTransistors

    These devices are designed for use in power amplifier and switching

    circuits; excellent safe area limits.

    Features

    Complement to NPN 2N5191, 2N5192

    These Devices are PbFree and are RoHS Compliant*

    MAXIMUM RATINGS(Note 1)

    Rating Symbol Value Unit

    CollectorEmitter Voltage2N5194G2N5195G

    VCEO6080

    Vdc

    CollectorBase Voltage

    2N5194G2N5195G

    VCB6080

    Vdc

    EmitterBase Voltage VEB 5.0 Vdc

    Collector Current IC 4.0 Adc

    Base Current IB 1.0 Adc

    Total Device Dissipation@ TC= 25CDerate above 25C

    PD40

    320W

    W/C

    Operating and Storage JunctionTemperature Range

    TJ, Tstg 65 to +150 C/W

    Stresses exceeding those listed in the Maximum Ratings table may damage thedevice. If any of these limits are exceeded, device functionality should not beassumed, damage may occur and reliability may be affected.

    1. Indicates JEDEC registered data.

    THERMAL CHARACTERISTICS

    Characteristic Symbol Max Unit

    Thermal Resistance, JunctiontoCase RJC 3.12 C/W

    *For additional information on our PbFree strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.

    http://onsemi.com

    4 AMPERE

    POWER TRANSISTORS

    PNP SILICON

    60 80 VOLTS

    MARKING DIAGRAM

    Y = Year

    WW = Work Week

    2N519x = Device Code

    x = 4 or 5G = PbFree Package

    2N5195G TO225

    (PbFree)

    500 Units / Bulk

    Device Package Shipping

    2N5194G TO225

    (PbFree)

    500 Units / Bulk

    ORDERING INFORMATION

    3

    BASE

    1

    EMITTER

    COLLECTOR

    2, 4

    TO225

    CASE 7709

    STYLE 1

    1 2 3

    YWW

    2

    N519xG

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    ELECTRICAL CHARACTERISTICS (TC= 25C unless otherwise noted) (Note 2)

    Characteristic Symbol Min Max Unit

    OFF CHARACTERISTICS

    CollectorEmitter Sustaining Voltage (Note 3)(IC= 0.1 Adc, IB= 0)

    2N5194G2N5195G

    VCEO(sus)

    6080

    Vdc

    Collector Cutoff Current(VCE= 60 Vdc, IB= 0)

    2N5194G(VCE= 80 Vdc, IB= 0)

    2N5195G

    ICEO

    1.0

    1.0

    mAdc

    Collector Cutoff Current(VCE= 60 Vdc, VBE(off)= 1.5 Vdc)

    2N5194G(VCE= 80 Vdc, VBE(off)= 1.5 Vdc)

    2N5195G(VCE= 60 Vdc, VBE(off)= 1.5 Vdc, TC= 125C)

    2N5194G(VCE= 80 Vdc, VBE(off)= 1.5 Vdc, TC= 125C)

    2N5195G

    ICEX

    0.1

    0.1

    2.0

    2.0

    mAdc

    Collector Cutoff Current(VCB= 60 Vdc, IE= 0)

    2N5194G(VCB= 80 Vdc, IE= 0)

    2N5195G

    ICBO

    0.1

    0.1

    mAdc

    Emitter Cutoff Current(VBE= 5.0 Vdc, IC= 0)

    IEBO 1.0

    mAdc

    ON CHARACTERISTICS

    DC Current Gain (Note 3)(IC= 1.5 Adc, VCE= 2.0 Vdc)

    2N5194G2N5195G

    (IC= 4.0 Adc, VCE= 2.0 Vdc)2N5194G2N5195G

    hFE

    2520

    107.0

    10080

    CollectorEmitter Saturation Voltage (Note 3)

    (IC= 1.5 Adc, IB= 0.15 Adc)(IC= 4.0 Adc, IB= 1.0 Adc)

    VCE(sat)

    0.61.4

    Vdc

    BaseEmitter On Voltage (Note 3)(IC= 1.5 Adc, VCE= 2.0 Vdc)

    VBE(on) 1.2

    Vdc

    DYNAMIC CHARACTERISTICS

    CurrentGain Bandwidth Product(IC= 1.0 Adc, VCE= 10 Vdc, f = 1.0 MHz)

    fT2.0

    MHz

    Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Productperformance may not be indicated by the Electrical Characteristics if operated under different conditions.2. Indicates JEDEC registered data.3. Pulse Test: Pulse Width 300s, Duty Cycle 2.0%.

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    Figure 1. DC Current Gain

    IC, COLLECTOR CURRENT (AMP)

    10

    0.10.004

    7.0

    5.0

    1.0

    0.7

    0.50.3

    0.007 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 4.0

    VCE= 2.0 V

    VCE= 10 V

    2.0 3.0

    TJ= 150C

    - 55C25C

    3.0

    2.0

    0.2hFE

    ,DC

    CUR

    RENTGAIN

    (NORMALIZED)

    VCE

    ,COLLECTOR

    -EMITTER

    VOLTA

    GE(VOLTS)

    Figure 2. Collector Saturation Region

    IB, BASE CURRENT (mA)

    2.0

    00.05

    1.6

    1.2

    0.8

    0.4

    0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 10 500

    IC= 10 mA

    5.0 7.0 20 30 50 70 100 200 300

    100 mA 1.0 A 3.0 A

    TJ= 25C

    2.0

    0.005

    IC, COLLECTOR CURRENT (AMP)

    0.01 0.02 0.03 0.05 0.2 0.3 1.0 2.0 4.0

    1.6

    1.2

    0.8

    0.4

    0

    TJ= 25C

    VBE(sat)@ IC/IB= 10

    VCE(sat)@ IC/IB= 10

    VOLTAGE(VOLTS)

    Figure 3. On Voltage

    0.1 0.5 3.0

    VBE@ VCE= 2.0 V

    + 2.5

    Figure 4. Temperature Coefficients

    IC, COLLECTOR CURRENT (AMP)

    *APPLIES FOR IC/IBhFE@ VCETJ= - 65C to +150C

    V,

    TEMP

    ERATURECOEFFICIENTS(mV/C)

    + 2.0

    + 1.5

    + 0.5

    0

    - 0.5

    - 1.0

    - 1.5

    - 2.0

    - 2.5

    VBfor V BE

    *VCfor V CE(sat)

    + 1.0

    0.005 0.01 0.020.03 0.05 0.2 0.3 1.0 2.0 4.00.1 0.5 3.0

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    RBE

    ,EXTERNALBASE

    -EMITTER

    RESISTANCE(OHMS)

    103

    + 0.4

    Figure 5. Collector CutOff Region

    VBE, BASE-EMITTER VOLTAGE (VOLTS)

    102

    101

    100

    10-1

    ,COLLE

    CTOR

    CURRENT(A)

    IC10- 2

    10- 3

    + 0.3 + 0.2 + 0.1 0 - 0.1 - 0.2 - 0.3 - 0.4 - 0.5 - 0.6

    VCE= 30 Vdc

    TJ= 150C

    100C

    25C

    REVERSE FORWARD

    ICES

    107

    20

    Figure 6. Effects of BaseEmitter Resistance

    TJ, JUNCTION TEMPERATURE (C)

    40 60 80 100 120 140 160

    106

    105

    104

    103

    102

    VCE= 30 V

    IC= 10 x I CES

    IC= 2 x I CESIC ICES

    (TYPICAL ICESVALUES

    OBTAINED FROM FIGURE 5)

    Figure 7. Switching Time Equivalent Test Circuit

    APPROX

    -11 V

    TURN-ON PULSE

    Vin

    t1

    VBE(off)

    TURN-OFF PULSE

    Vin

    t3

    t2

    APPROX

    -11 V

    VCC

    SCOPERB

    Cjd

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    10

    1.0

    Figure 11. Rating and Thermal Data

    ActiveRegion Safe Operating Area

    VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)

    5.0

    2.0

    1.0

    0.5

    0.12.0 5.0 10 20 50 100

    SECONDARY BREAKDOWN LIMIT

    THERMAL LIMIT @ TC= 25CBONDING WIRE LIMIT

    0.2IC,

    COLLEC

    TOR

    CURRENT(AMP)

    CURVES APPLY BELOW RATED VCEO

    TJ= 150C

    2N5194

    dc

    5.0 ms1.0 ms

    100 s

    2N5195

    Note 1:

    There are two limitations on the power handling ability of

    a transistor; average junction temperature and second

    breakdown. Safe operating area curves indicate IC VCElimits of the transistor that must be observed for reliable

    operation; i.e., the transistor must not be subjected to greater

    dissipation than the curves indicate.

    The data of Figure 11is based on TJ(pk)= 150C. TCis

    variable depending on conditions. Second breakdown pulselimits are valid for duty cycles to 10% provided T J(pk)150C. At highcase temperatures, thermal limitations

    will reduce the power that can be handled to values less than

    the limitations imposed by second breakdown.

    Figure 12. Thermal Response

    t, TIME OR PULSE WIDTH (ms)

    1.0

    0.010.01

    0.7

    0.5

    0.3

    0.2

    0.1

    0.07

    0.05

    0.03

    0.02

    0.02 0.03

    r(t)

    ,EFFECTIVETRANSIENT

    THERMALRESISTANCE(NORMALIZ

    ED)

    0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 300 1000500

    JC(max)= 3.12C/WD = 0.5

    0.2

    0.05

    0.02

    0.01SINGLE PULSE

    0.1

    DESIGN NOTE: USE OF TRANSIENT THERMAL RESISTANCE DATA

    tP

    PP PP

    t1

    1/f

    DUTY CYCLE, D = t1f =t1tP

    PEAK PULSE POWER = PP

    Figure 13.

    A train of periodical power pulses can be represented by

    the model shown in Figure 13. Using the model and the

    device thermal response, the normalized effective transient

    thermal resistance of Figure 12was calculated for various

    duty cycles.

    To find JC(t), multiply the value obtained from Figure 12

    by the steady state value JC.

    Example:The 2N5193 is dissipating 50 watts under the following

    conditions: t1= 0.1 ms, tp= 0.5 ms. (D = 0.2).

    Using Figure 12, at a pulse width of 0.1 ms and D = 0.2,

    the reading of r(t1, D) is 0.27.

    The peak rise in junction temperature is therefore:

    T = r(t) x PPx JC= 0.27 x 50 x 3.12 = 42.2C

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    PACKAGE DIMENSIONS

    TO225CASE 7709

    ISSUE AC

    DIM MIN MAX

    MILLIMETERS

    D 10.60 11.10E 7.40 7.80

    A 2.40 3.00

    b 0.60 0.90

    P 2.90 3.30L1 1.27 2.54

    c 0.39 0.63

    L 14.50 16.63

    b2 0.51 0.88

    Q 3.80 4.20

    A1 1.00 1.50

    e 2.04 2.54

    E

    1 2 3

    NOTES:1. DIMENSIONING AND TOLERANCING PER

    ASME Y14.5M, 1994.2. CONTROLLING DIMENSION: MILLIMETERS.3. NUMBER AND SHAPE OF LUGS OPTIONAL.

    2X

    2X

    Q

    D

    L1

    P

    b2

    be

    c

    L

    A1

    A

    FRONT VIEW BACK VIEW

    FRONT VIEW SIDE VIEW

    12 3

    3 2 1

    4

    PIN 4

    BACKSIDE TAB

    STYLE 1:PIN 1. EMITTER2., 4. COLLECTOR

    3. BASE

    ON Semiconductorand are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,copyrights, trade secrets, and other intellectual property. A listing of SCILLCs product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLCreserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

    particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including withoutlimitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applicationsand actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLCdoes not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended forsurgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation wherepersonal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC andits officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufactureof the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

    PUBLICATION ORDERING INFORMATION

    N. American Technical Support: 8002829855 Toll FreeUSA/Canada

    Europe, Middle East and Africa Technical Support:Phone: 421 33 790 2910

    Japan Customer Focus CenterPhone: 81358171050

    2N5194/D

    LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone: 3036752175 or 8003443860 Toll Free USA/CanadaFax: 3036752176 or 8003443867Toll Free USA/CanadaEmail: [email protected]

    ON Semiconductor Website: www.onsemi.com

    Order Literature: http://www.onsemi.com/orderlit

    For additional information, please contact your localSales Representative

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