01-mstp+ product overview

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www.huawei.com INTERNAL HUAWEI Confidential HUAWEI TECHNOLOGIES Co., Ltd. 22/4/23 MSTP+ Product Overview MSTP Product Team, Network Product Service Dept.

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Page 1: 01-MSTP+ Product Overview

www.huawei.com

INTERNAL

HUAWEI Confidential HUAWEI TECHNOLOGIES Co., Ltd.

23/4/28

MSTP+ Product Overview

MSTP Product Team, Network Product Service Dept.

Page 2: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 3

With NG-SDH V100R009C03 as the first version, the MSTP+ products have the packet switching feature and support the smooth upgrade of MSTP equipment to MSTP+ equipment.

Preface

Page 3: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 4

Before taking this course, you should have the following knowledge: Basics on SDH, Ethernet, and MPLS Related knowledge on MSTP products

Guidance

Page 4: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 5

After taking this course, you are supposed to reach the following objectives: Be familiar with orientation and features of the MSTP+

products. Understand networking application scenarios and service

features of the MSTP+ products. Understand the hardware features of the MSTP+ products.

Objectives

Page 5: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 6

Part I Features of MSTP+ ProductsPart I Features of MSTP+ Products

Part II Application Scenarios of MSTP+ Products

Part III Feature Overview of MSTP+ Products

Page 6: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 7

What Is MSTP+? MSTP+ = MSTP + PTN

MSTP equipment can be smoothly upgraded to MSTP+ equipment, which has the PTN features. That is, MSTP can be smoothly upgraded to PTN.

The focus of the upgrade is to reconstruct the cross-connects for MSTP equipment.

With the TDM features unchanged, the new cross-connect boards integrate the core chips used for the PTN equipment. Then, one cross-connect board has dual cores. This enables profound evolution of MSTP.

MSTP+ equipment derives from MSTP equipment and is compatible with all the features currently available on MSTP .

MSTP equipment can be upgraded to MSTP+ equipment by alternatively upgrading the active and standby cross-connect boards. In addition, MSTP+ equipment supports the packet plane, where the data services can be directly added. This solves the problem of inability to multiplex SDH rigid channels.

Dual-core: TDM core + PTN core, processing TDM and packet services at the same time .One-heart (EOD): Data services freely flow. During upgrade, the TDM plane and packet plane can seamlessly interoperate.

Page 7: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 8

Values of MSTP+ Products

• Provides and optimizes the IP RAN solution.– Is oriented to broadband on mobile networks.

• Transports data services, which require high bandwidth, with low costs.

• Realizes carrier-class transport on mobile networks in aspects such as clock and

QoS.

• Inherits years of maintenance experience of carrier networks.

– Realizes evolution of carrier networks towards all-IP and achieves sharing of 90% 2G,

3G, and LTE sites.

• Realizes evolution towards all-IP through the MSTP equipment in large-scale

deployment and protects existing investment.

• What architecture should the MSTP products to be purchased have to support

evolution to all-IP?

• Integrates the PTN features on the traditional MSTP products to support smooth evolution of MSTP products.

Page 8: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 9

Native packetNative TDM

End-to-end management and control

Low TCO in the entire life cycle

Dual cores (TDM and packet)

Supports smooth upgrade Is compatible with MSTP

End-to-end management TDM plane and packet plane

Uniform control platform based on GMPLS Uniform NMS

PTN features of MSTP +

Completely compatible with NG-SDH, embedded microwave, and embedded WDM

Smooth upgrade

A packet core is added on the basis of the original TDM core. The former can process packet services based on MPLS.

The TDM and packets services can be groomed through either core.

Supports native FE/ GE/10GE. Supports MPLS and improves efficiency by packet

transport. Supports the packet synchronization clock solution. Achieves the best cost-effectiveness of packet transport.

Supports native E1, T1, STM-1, STM-4, STM-16, and STM-64

Achieves the lowest TCO for TDM transport

TDM + packet switching

PWE3

ATM/EOS

Ethernet

Architecture of MSTP+ products PTN features of MSTP+ products:

TDM/packet dual cross-connect matrixes Uniform platform, synchronization of dual

clocks, and access of multiple clocks End-to-end ASON/GMPLS

TDMATM/EOS

Features of the MSTP+ Products

Page 9: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 10

Version Orientation and Roadmap of NG-SDH Products

NG-SDH V1R9C02

2008.12 2010.05 2011.06

NG-SDH V1R10

2010.01

NG-SDH V2R11 Full series of NG-SDH products: global version with the MSTP+ features

NG-SDH V2R12

NG-SDH V1R9C03 OptiX OSN1500/3500: global version with the MSTP+ features

2009.06

V1 software platform

V2 software platform

In-development version

Planned version

Sales of V1R9C03 is restrained and V1R9C03 is to be substituted by V2R11.

Page 10: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 11

Smooth Upgrade (Example: OptiX OSN 3500)

TDM

TDM

P&T

P&T

GSCC

GSCC

E1

EOS

GE

FE

FE

GE

10GE

10GE

CES

SMARTE1

PIU

PIU

AUX

WPWP

GE

10GE

Step 1 Replace the standby TDM cross-connect board with a dual-core cross-connect board. Then, switch the services from the active TDM cross-connect board to the dual-core cross-connect board.

Step 2 Replace the active TDM cross-connect board with a dual-core cross-connect board. Then, switch the services from the standby dual-core cross-connect board to the active dual-core cross-connect board. The switching time is less than 50 ms.

When configured with PTN service processing boards, the equipment can be used to build a PTN network without any impact on the existing TDM services.

STM-n

STM-n

SMARTE1

STM-n

STM-1/4

STM-

16/64

1. After replacing the cross-connect boards, upgrade the software of all the boards housed on the NE to version R9C03.

2. The SCC boards of the OptiX OSN 3500 can be replaced or not. If they are replaced, the product specifications are different.

3. Replace the PIU boards with ones of large power consumption (optional).

Page 11: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 12

Part I Features of MSTP+ Products

Part II Application Scenarios of MSTP+ Part II Application Scenarios of MSTP+ ProductsProducts

Part III Feature Overview of MSTP+ Products

Page 12: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 13

Overview of MSTP+ Networking - Coexistence of TDM and Packet Planes

10GE

STM-16/64

STM-1/4

BTS

E1

OSN 3500 OSN 3500

When IP-orientation of the entire network is complete, the MSTP equipment can be further transformed into packet-only equipment to meet the transport requirements of new services.

Aggregation node

OptiX OSN 3500/1500/M1000

Packet XC

TDM XC

STM-1/4/IMA E1/Native E1

STM-16/64

GE/10GE

TDM&packet dual-plane cross-connect board

FE/GE

OSN 1500 Metro1000

OSN 1500 Metro1000

NodeBFE

GE Ring

RNC BSC

BTS E1

NodeBFE

NodeBFE

RN

C

New packet services raise new requirements on the transport network with respect to bandwidth utilization, service management, protection, and equipment maintenance. Hence, the traditional network has to be re-constructed for packet services.

For co-existence of new and old services, the MSTP equipment on the existing network should be upgraded to the MSTP+ equipment with dual planes. Then, the SDH services on the existing network are not affected and a better bearer can be provided to the new packet services.

Page 13: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 14

If certain equipment on the existing network is not suitable for upgrade, the other equipment can be upgraded for hybrid networking with PTN products.

At the aggregation layer, the equipment can be upgraded to MSTP+ equipment and the capacity can be expanded by using 10GE boards. Then, the equipment can be networked with the OptiX PTN 3900 to build a 10GE ring network.

At the access layer, the OptiX OSN 1500 or OptiX Metro 1000 can be networked with the OptiX PTN 910/950/1900 to build a GE ring network, which is connected to the aggregation layer.

The T2000 can manage both the PTN and MSTP+ products.

MSTP+ Product Networking – Hybrid Networking with PTN Products

10GE

STM-1/4

STM-16/64

BTS

E1

GE Ring

NodeB

FE

OSN 3500

PTN 3900

NodeB

FE

OSN 1500 Metro1000

PTN 950/1900

PTN 910/950/19000

RNC BSC

OSN 3500OSN 1500

Metro1000

BTS

E1

NMS/T2000

NodeB

FE

OSN 1500 Metro1000

Page 14: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 15

Part I Features of MSTP+ Products

Part II Application Scenarios of MSTP+ Products

Part III Feature Overview of MSTP+ Part III Feature Overview of MSTP+ ProductsProducts

Page 15: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 16

Hardware Structure of the MSTP+ Products

Page 16: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 17

SynchronizationModule

System Control

TDM

& Packet

Switch Fabric

Overall Hardware Structure of the MSTP+ Products

TDM

& Packet

switch fabric

TDM/ATM

EoS TDM

TDM

TDM/ATMPWE3

Ethernet

Ethernet

Ethernet

Synchronizationmodule

TDM-only processing board

Packet-only processing board

Packet & TDM processing board

The cross-connect boards with dual planes can be used to cross-connect TDM services and switch packet services at the same time.

Time synchronization and frequency synchronization can be performed on the TDM plane and packet plane.

System control

Auxiliaryunit

Page 17: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 18

Inter-Connections of the Boards with Packet Features

Packet

TDM

Switch fabric

PEFS8

PEGS2

PEG16PETF8

EOD41

GE

FE

STM-1/STM-4

PEX110GE

GE

FE

PEX1

PEG16

PEGS2

10GE

GE

GE

Client network

Carrier network

OSN 1500

OSN 3500

Page 18: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 19

Interconnections of the Boards with TDM Features

Switch fabric

TDM

SL1/SLQ4

EAS210GE

STM-16/STM-64

STM-1/STM-4

SL64

SL4

STM-64

STM-16

STM-4SL16/64

SL16EFF8

FEEMS4

FE

GE

ETF8

D12S

E1PQ1E1

D75S

PKT

Client network

Carrier network

Page 19: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 20

Specifications of the OptiX OSN 3500

Page 20: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 21

Slot Configuration of the OptiX OSN 3500

GSCC

AUX

PIUA

PIUA

200GTDM

&80G

Packet

Service processing board•PEG16•PEX1

Cross-connect board

Interface board•EOD41•EFT8

System control board•GSCC

Service processing board with interfaces

Service processing board with interfaces

Page 21: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 22

Slot Capacity of the OptiX OSN 3500

P&T

P&T

GSCC

GSCC

SLOT2

SLOT1

SLOT3

SLOT4

SLOT

13

SLOT

11

SLOT

12

SLOT

14

SLOT

15

SLOT

16

SLOT5

SLOT6

SLOT7

SLOT8

PIUA

PIUA

AUX

SLOT19

SLOT20

SLOT21

SLOT22

SLOT23

SLOT24

SLOT25

SLOT26

SLOT29

SLOT30

SLOT31

SLOT32

SLOT33

SLOT34

SLOT35

SLOT36

200G 200G

5G5G 5G 5G10G 10G 20G 20G 20G 20G 10G 10G 5G5G

TDM

TDM

GSCC

GSCC

SLOT2

SLOT1

SLOT3

SLOT4

SLOT

13

SLOT

11

SLOT

12

SLOT

14

SLOT

15

SLOT

16

SLOT5

SLOT6

SLOT7

SLOT8

PIUA

PIUA

AUX

SLOT19

SLOT20

SLOT21

SLOT22

SLOT23

SLOT24

SLOT25

SLOT26

SLOT29

SLOT30

SLOT31

SLOT32

SLOT33

SLOT34

SLOT35

SLOT36

P&T

P&T

80G 80G2.5G2.5G2.5G5G 5G 5G 5G 5G 5G 5G 5G 5G 5G

2.5G

Packet switching capacity: 80G TDM cross-connect capacity: 200G

Page 22: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 23

Specifications of the OptiX OSN 3500 (I)

5G 5G 5G 10G 10G10G 40G 40G

XCS

200G

XCS

200G

40G 40G 10G 10G10G 5G

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16SC

C

SCC

17 18

5G 7.5G 10G 10G 10G 7.5G

10G

1 2 3 4 5 6 7 8 11 12 13 14 15 16

PSCC

PSCC

17 18

21 22 25 26 29 30 33 34

Data board

TDM board

Cross-connect board

Data interface board

• TDM cross-connection

• Packet switching

9 10

PSXCS

60G

PSXCS

60G

Page 23: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 24

Specifications of the OptiX OSN 3500 (II)

•List of new boards

•Specifications of the OptiX OSN 3500

Board Name Slot Type Valid Slot Specification

SSN1PSXCS 9/10 Dual-plane cross-connect board: 200G higher order capacity + 20G lower order capacity + 60G packet switching capacity

SSN4GSCC 17/18 High-performance SCC: memory increased from 256M to 512M

SSN1PEG16 Dual slots 1-2, 3-4, 5-6, 13-14, 15-16 16 x GE processing board, the first two ports on which support the IEEE 1588v2 function.

SSN1PEX1 Dual slots 1-2, 3-4, 5-6, 7-8, 11-12, 13-14, 15-16 1 x 10GE processing board, which supports the IEEE 1588v2 function

SSN1PETF8 21/22/25/26/29/30/33/34 8 x FE interface board, which is used with the PEG16. On ports on the board support the IEEE 1588v2 clock.

SSN1EOD41 21/22/25/26/29/30/33/34 2 x 155M/622M interface board, which works with the PEG16 to classify E1 and Ethernet service flows.

Maximum Configuration

Product SSN1PEG16 SSN1PEX1 SSN1PETF8 SSN1EOD41 10GE GE FE EOS Switching Capacity

3500 5 5 8 8 5 80 64 16Switching capacity: 80GAccess capacity: 60G

Page 24: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 25

Typical Configuration of the OptiX OSN 3500

ConfigurationApplication

Scenario Typical Configuration Front View

Configuration for TDM + packet switching

Single 10GE ring

Data board: 2 x 10GE + 32 x GE +32 x FETDM board: Housed in slots 1, 2, 7, 8, 11, and 12, the TDM boards can be used to build a 10G SDH ring and to add/drop services.

Data board: 2 x 10GE + 16 x GE +16 x FETDM board: Housed in slots 1, 2, 7, 8, 11, 12, 15, and 16, the TDM boards can be used to build a 10G SDH ring and to add/drop services.

Configuration for packet-only switching

Single 10GE ring

Data board: 2 x 10GE + 48 x GE +48 x FE

Dual 10GE rings

Data board: 4 x 10GE + 16 x GE +16 x FE

10G

5G

15

16

40G

40G

11

12

40G

40G

7 87.5G

10G

PSXCS

60G

PSXCS

60G 10G

3 4 5 69 1

013

14

PSCC

PSCC

17

18

21 22

PEX1 PEX1PEG16

PETF8

PETF8

5G 5G

1 2

40G

40G

11

12

40G

40G

7 8

7.5G

10G

PSXCS

60G

PSXCS

60G 7.5G

10G

3 4 5 69 1

013

14

15

16

PSCC

PSCC

17

18

21 22 33 34

PEX1 PEX1PEG16 PEG16

PETF8

PETF8

PETF8

PETF8

5G 5G

1 2

10G

10G

PSXCS

60G

PSXCS

60G 10G

7.5G

10G

1 2 3 4 5 6 7 89

10

11

12

13

14

15

16

PSCC

PSCC

17

18

33 34

PEX1 PEX1PEG16 PEG16

PETF8

PETF8

PEG16

25 26

PETF8

PETF8 29 30

PETF8

PETF8

Data board TDM board Cross-connect board

Data interface board

10G

10G

PSXCS

60G

PSXCS

60G 10G

7.5G

10G

1 2 3 4 5 6 7 89

10

11

12

13

14

15

16

PSCC

PSCC

17

18

33 34

PEX1 PEX1PEX1 PEG16

PETF8

PETF8

PEX1

Page 25: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 26

Structure of the Dual-Plane Cross-Connect Board (SSN1PSXCS)

Packet cross-connect module

Synchronization timing module

Control information processing

Module

Backplane

PSXCS

CELL

TDM cross-connect module

PEG16 Card

SL16 Card2.5G

Communication and control

module

Page 26: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 27

Specifications of the Dual-Plane Cross-Connect Board for the OptiX OSN 3500

Key specifications:

– Performs 200 Gbit/s VC-4 higher order cross-connection, 20

Gbit/s VC-3/VC-12 lower order cross-connection, and 60

Gbit/s packet cross-connection.

– Supports the synchronous Ethernet clock.

– Supports the IEEE 1588V2 clock.

– Consumes a maximum of 90 W power.

For smooth evolution of the MSTP equipment, the original cross-

connect board needs to be replaced.

– For details on the restrictions, see the Services and

Networking Application of MSTP+ Equipment.

Page 27: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 28

Specifications of the SSN1PEX1 Board

Key specifications:– Provides one 10GE optical interface, which can be a colored optical

interface and can access or process 1 x 10GE services. The board processes the 10 Gbit/s services in full-duplex mode.

– Supports three types of Ethernet services, E-Line, E-LAN, and E-AGGR.– Supports synchronous Ethernet and IEEE 1588V2.– Supports ETH-OAM, MPLS-OAM, and H-QoS– Supports spanning tree and IGMP Snooping.– Supports 1+1/1:1 MPLS tunnel protection and LAG protection.– Consumes a maximum of 107 W power in room temperature (25 )℃

Slot restrictions:– Two slots house one SSN1PEX1 board. The logical slot of the

SSN1PEX1 board is the slot with an odd number.

Valid Slot Slots 1-2 Slots 3-4 Slots 5-6 Slots 7-8 Slots 11-

12

Slots13-

14

Slots 15-16

Logical Slot Slot 1 Slot 3 Slot 5 Slot 7 Slot 11 Slot 13 Slot 15

Page 28: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 30

Specifications of the SSN1PEG16 Board

Key specifications:– Provides 16 GE ports and supports colored interfaces. One PEG16

board can work with two PETF8 boards.

– Supports three Ethernet service types, that is, E-Line, E-LAN, and E-

AGGR.

– Supports synchronous Ethernet and IEEE 1588V2 (first two GE ports).

– Supports ETH-OAM, MPLS-OAM, and H-QoS.

– Supports spanning tree and IGMP Snooping.

– Supports 1+1/1:1 MPLS tunnel protection and LAG protection.

– Consumes a maximum of 137 W power at room temperature (25ºC).

5G 7.5G 10G 10G PSXC

S 60G

PSXC

S 60G

10G 7.5G10G

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

PSCC PSCC

17 18

21 22 25 26 29 30 33 34

Page 29: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 31

Specifications of the SSN1PETF8 Board

Key specifications:– Accesses 8 x FE services and works with the PEG16 board to

process services.

– Supports three Ethernet service types, that is, E-Line, E-LAG, and E-

AGGR.

– Supports synchronous Ethernet and IEEE 1588v2.

– Supports ETH-OAM, MPLS-OAM, and H-QoS.

– Supports spanning tree, and IGMP Snooping.

– Supports 1+1/1:1 MPLS tunnel protection and LAG protection.

– Consumes a maximum of 13 W power at room temperature (25ºC).

Page 30: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 32

Specifications of the High-Performance SCC Board (N4GSCC) for the OptiX OSN 3500

To upgrade the MSTP equipment to MSTP+ equipment, the SCC board does not need to be replaced. The differences of the specifications of the N1/N3GSCC and N4GSCC are as follows:

Number of PWs/Tunnels

N1/N3GSCC 

N4GSCC

L2VPN N1/N3GSCC  N4GS

CCQoS N1/N3

GSCC  N4GSCC

Max. number of QinQs supported by equipment (NNI side)

1024 1024Number of VUNIs 2K 8K Number of CARs for flow

classification

2K 8192

Number of MPLS tunnels 1K 4096 Number of VNNIs 3216 17552 Max. number of ACLs 1K 8192

Max. number of PWs supported by equipment 2048 16384 Number of VUNI groups 1024 1024 Number of port WRED

policies

7 7

Number of tunnel OAMs 512 2048 Number of E-LINE

services

2K 4096 Number of service WRED

policies

127 127

Number of APS protection groups 256 1024 Number of E-LAN

services

512 1024 Number of WFQ templates 256 256

ETH-OAMN1/N3GSCC 

N4GSCC

Number of E-AGGR

services

4 4 Number of VUNI egress

policies256 256

Number of MDs 64 64Number of multicasts 1024 4096 Number of VUNI ingress

policies256 256

Number of MAs 1024 1024Number of multicast

members

4K 24K Number of port policies 100 100

Number of MPs 1024 2048 Number of PW policies 256 256

Number of port flow

classifications

1600 1600 Number of QinQ policies 256 256

VUNI ingress flow

classifications4K 8K

Number of DiffServ

domains

8 8

Page 31: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 33

Specifications of the PIUA Board

The PIUA board is not a new board for the OptiX OSN 3500

V100R009C03. From February 2008, the delivery switchover started. On

the existing network, 60% of the power boards are the PIUA boards.

To upgrade the OptiX OSN 3500 to MSTP+ equipment, the PIU board

must be replaced with the PIUA board.

Restrictions:Neither the PIU nor the PIUA supports remote identification. Hence, they

need to be identified on site.

Product Power Consumption PIU Type Backplane Version Remarks

OptiX

OSN

3500

650 W N1PIU

(650 W)

N1AFB VER.B (1100 W) Old version on the

existing network

1100 W N1PIUA

(1100 W)

N1AFB VER.C (1400 W) New version on the

existing network

Page 32: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 35

Specifications of the OptiX OSN 1500

Page 33: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 36

Slot Configuration of the OptiX OSN 1500

AUX

PIU

PIU

20G TDM & 8G packet

Service sub-board:•PEFS8

AUX

PIU PIU

20G TDM & 8G Packet

Service sub-board:•PEFS8

Cross-connect board:•PCXLN

Interface board

OptiX OSN 1500B

OptiX OSN 1500A

Service board (one slot dividable to two sub-slots):•PEGS2

Cross-connect board:•PCXLN

Service board (one slot dividable to two sub-slots):•PEGS2

Page 34: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 37

Slot Capacity of the OptiX OSN 1500A

Slot 20FAN

Slot 1 PIU Slot 11 PIU Slot 6 1.25G

Slot 7 1.25G

Slot 8 1.25G

Slot 9 1.25GSlot 10 AUX

Slot 2/12 2.5GSlot 3/13 2.5G

P&T 20GP&T 20G

Slot 20FAN

Slot 1 PIU Slot 11 PIU Slot 6 1G

Slot 7 1G

Slot 8 1G

Slot 9 1GSlot 10 AUX

Slot 2/12 2GSlot 3/13 2G

P&T 8GP&T 8G

Packet switching capacity: 8G

TDM cross-connect capacity: 20G

Page 35: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 38

Slot Capacity of the OptiX OSN1500B

Slot20FAN

Slot 6 622MSlot 7 622MSlot 8 622MSlot 9 622MSlot 10 AUX

Slot 2/12 2.5GSlot 3/13 2.5G

P&T Slot 4 20GP&T Slot 5 20G

Slot 1/11 2.5G

Slot 17

Slot 16

Slot 15

Slot 14

Slot 19 PIU

Slot 18 PIU

Slot 20FAN

Slot 6 1GSlot 7 1GSlot 8 1GSlot 9 1G

Slot 10 AUX

Slot 2/12 2GSlot 3/13 2G

P&T Slot 4 8GP&T Slot 5 8G

NA

Slot 17

Slot 16

Slot 15

Slot 14

Slot 19 PIU

Slot 18 PIU

Packet switching capacity: 8G TDM cross-connect capacity: 20G

Page 36: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 39

Specifications of the OptiX OSN 1500 (I)

Slot capacity of the OptiX OSN1500A Slot capacity of the OptiX OSN1500B

XCS A XCS B

20

1 11 6

2/12 7

3/13 8

4 9

5 102.5G

2.5G

2.5G ( 2GE)2.5G ( 2GE)

1.25G ( 1GE)PIU PIU

FAN

AUX

1.25G ( 1GE)1.25G ( 1GE)1.25G ( 1GE)

Slot for a packet and TDM cross-connect board

Slot for a TDM board Slot for an integrated board of cross-connect, SCC, and line units

1418 PIU

15

16

17

Slot 20

FAN

1/11

2/12

3/13

4

19 PIU

6

7

8

9

10 AUX5

2.5G

2.5G

2.5G

622M ( 1GE)2.5G ( 2GE)2.5G ( 2GE)

622M ( 1GE)622M ( 1GE)622M ( 1GE)

TDM interface board

TDM interface board

TDM interface board

TDM interface board

Page 37: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 40

Specifications of the OptiX OSN 1500 (II)

List of new boards:Board Size Valid Slot Specification

SSR1PCXLN 6U 4/5 Dual-plane cross-connect board: 20G higher order + 20G lower order +

8G packet

SSR1PEGS2 6U 2/3 2 x GE processing board (full slot): supporting the IEEE 1588v2 function

at two ports

SSR1PEFS8 3U 12/13, 6/7/8/9 8 x FE processing board (sub-board): supporting the IEEE 1588v2

function at all the eight ports

SSR1PEGS1 3U 2/3/12/13,

6/7/8/9

1 x GE processing board (sub-board): supporting the IEEE 1588v2 clock.

Maximum Configuration/Product SSR1PEGS2 SSR1PEGS1 SSR1PEFS8

GE Interface

FE Interface Packet Switching Capacity

OptiX OSN 1500 A/1500B 2 8 6 8 48

Switching capacity: 8G

Access capacity: 7G

Specifications of the OptiX OSN 1500:

Page 38: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 41

Typical Configuration of the OptiX OSN 1500

Type ScenarioTypical

ConfigurationFront View of the OptiX OSN

1500AFront View of the OptiX OSN

1500B

TDM + packet cross-connection

Single GE ring

2 x GE + 16 x FE +10G TDM service (1500A) or 2.5G TMD service (1500B)

Dual GE rings

4 x GE + 16 x FE + 17.5G TDM service (1500A) or 10G TDM service (1500B)

Packet-only cross-connection

Dual GE rings

4 x GE + 32 x FE + 5G TDM service (1500A) or 7.5G TDM service (1500B)

Common slot for packet and TDM TDM only

XCS B

Slot20

6

7

8

9

10

1GEXCS A 1 11

2/12

3/13

4

5 2.5G

2.5G

2.5G

2.5G

PIU PIU

FAN

AUX

1GE

1GE

1GE PEGS1

PEGS1

PEFS8

PEFS8

Slot 20

FAN

6

7

8

9

10 AUX

1/11

2/12

3/13

4

5

2.5G

2.5G

2.5G

2.5G

2.5G

18 PIU

19 PIU

14151617

TDM interface boardTDM interface board

TDM interface boardTDM interface board

PEGS1

PEGS1

PEFS8

PEFS81GE

1GE

1GE

1GE

XCS B

Slot20

6

7

8

9

10

1GEXCS A 1 11

2/12

3/13

4

5 2.5G

2.5G

2.5G

2GE

PIU PIU

FAN

AUX

1GE

1GE

1GE PEGS1

PEGS1

PEFS8

PEFS8

PEGS2Slot 20

FAN

6

7

8

9

10 AUX

1/11

2/12

3/13

4

5

2.5G

2.5G

2.5G

2.5G

2GE

18 PIU

19 PIU

14151617

TDM interface boardTDM interface board

TDM interface boardTDM interface board

PEGS1

PEGS1

PEFS8

PEFS81GE

1GE

1GE

1GE

PEGS2

XCS B

Slot20

6

7

8

9

10

1GEXCS A 1 11

2/12

3/13

4

5 2.5G

2.5G

2GE

PIU PIU

FAN

AUX

1GE

1GE

1GE PEFS8

PEFS8

PEFS8

PEFS8

PEGS2

2GE PEGS2

Slot 20

FAN

6

7

8

9

10 AUX

1/11

2/12

3/13

4

5

2.5G

2.5G

2.5G

2GE

18 PIU

19 PIU

14151617

TDM interface boardTDM interface board

TDM interface boardTDM interface board

PEFS8

PEFS8

PEFS8

PEFS81GE

1GE

1GE

1GE

PEGS2

2GEPEGS2

Page 39: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 42

Structure of the Cross-Connect Board for the OptiX OSN 1500

Packet cross-connect module

Synchronization timing module

Communication and control

module

Backplane

CXLNP

CELL

TDM cross-connect module

PEG2

SL162.5GO/E

O/E

SDH processing

module

STM-1/4/16

STM-1/4/16

Other boards

Page 40: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 43

Specifications of the Integrated Board (SSR1PCLN) for the OSN 1500

Key specifications:– Line unit, which receives and transmits 1 x STM-1/STM-4/STM-16

optical signals.

– SCC unit, which supports the packet feature.

– Cross-connect unit, which has the packet and TDM dual planes and

performs 40 Gbit/s VC-4 higher order cross-connection, 20 Gbit/s VC-

3/VC-12 lower order cross-connection, and 8 Gbit/s packet switching.

– Supports synchronous Ethernet and IEEE 1588V2.

Board Logical Board Logical Slot

PCXLN Q2SLN Slots 4 and 5

PCXL Slots 80 and 81

GSCC Slots 82 and 83

Page 41: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 44

Specifications of the SSN1PEGS2 Board

Key specifications:– Provides two GE optical interfaces, which can be colored optical

interfaces.

– Supports two Ethernet service types, that is, E-Line and E-AGGR.

– Supports synchronous Ethernet and IEEE 1588V2.

– Supports MPLS-OAM and QoS.

– Supports 1+1/1:1 MPLS tunnel protection and LAG protection.

– Consumes a maximum of 9 W power at room temperature (25ºC).

The PEGS2 can be used to build a GE ring network and also to add

or drop GE services.

Note:The PEGS2 board is not a switching board. “S’ in the board name indicates a processing board.

Page 42: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 45

Specifications of the SSN1PEFS8 BoardKey specifications:

– Provides one Delander high-density interface to input/output 8 x FE signals.

– Supports two Ethernet service types, that is, E-Line and E-AGGR.

– Supports synchronous Ethernet and IEEE 1588V2.– Supports MPLS OAM and QoS.– Supports 1+1/1:1 MPLS tunnel protection and LAG

protection.– Consumes a maximum of 12 W power at room temperature

(25ºC). Note: The length of the Delander connection cable depends on the site

survey and is 1 m by default.

Page 43: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 46

Service Types and Service Carrying Mode of MSTP+ Equipment

Page 44: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 47

Metro Ethernet Service (I)

• Metro Ethernet forum (MEF) defines two Ethernet service types:– Ethernet line service: E-LINE

– Ethernet LAN service: E-LAN

E-Line service: point-to-point Ethernet service

P2P EVCs

E-LAN service: multi-point-to-multi-point Ethernet service

MP2MP EVC

Page 45: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 48

Metro Ethernet Service II

• Ethernet aggregation service: E-AGGR

E-AGGR service: multi-point-to-point Ethernet service

UNIs NNIsUNI

Page 46: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 49

PSN

Ethernet Service Carrying Modes on PSN

• On a PSN, Ethernet services can be carried by ports, by PWs, or by QinQs.

• The following shows the application of carrying Ethernet services by PWs.

MPLS tunnel

PW1PW2

Port

MPLS tunnel

PW2

PW1

E-LINE service

The Ethernet protocol data units (PDUs) are transported on PSN (Layer 2 MPLS) through pesudo wires (PWs).

Page 47: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 50

Comparison of Ethernet Service Models

Service TypeService

Multiplexing (Access Side)

Transmission Tunnel

(Network Side)IETF Model ITU-T Model MEF Model

P2P service

Line Physical isolation Physical isolation — EPLE-Line     

Virtual Line

Physical isolationVLAN —

EVPL

MPLS VPWS

VLAN

Physical isolation —

VLAN —

MPLS VPWS

MP2MP service

LAN Physical isolation Physical isolation — EPLAN

E-LANVirtual LAN

VLAN

Physical isolation —

EVPLANS-VLAN —

MPLS VPLS

S-VLAN B-MACB-VLAN —

P2MP service

Tree Physical isolation Physical isolation — EPLAN

E-TreeVirtual Tree VLAN MPLS VPLS multi-cast EVPLAN

Page 48: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 51

Software Features of the OptiX OSN 1500/3500

Page 49: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 52

Features of the Common Software

Product Feature DescriptionCommon Protection on the

packet planeSupports 1+1/1:1 LSP protection with the switching time less than 50 ms.

MPLS control plane The MPLS (MPLS-TP) control plane supports static configuration.

QOS The OptiX OSN 3500 supports MPLS-based DiffServ , H-QoS, and the ability to configure priorities based on tunnels.The OptiX OSN 1500 supports MPLS-based DiffServ.

MPLS OAM Checks connectivity of LSPs by performing connectivity verification (CV) and fast failure detection (FFD) and performs switching within 50 ms in case of a fault.

ETH-OAM Supports 802.1ag and 802.3ah (not supported by the OptiX OSN 1500).

Packet clock Supports synchronous Ethernet clock and IEEE 1588v2 packet clock.

Page 50: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 53

Carrier-Class End-to-End Network-Level APS Protection(1+1/1:1 LSP Protection) )

• The fault detection and protection switching are based on hardware. The OAM packets are inserted every 3.3 ms. A fault can be detected within 10 ms and the protection switching can be completed within 50 ms.

• The hardware-based OAM enables multiple LSPs to be switched within 50 ms.

RNC/BSCRNC/BSC

SRSR

PSN WorkingProtection

2G/3G

NGN

VIP private line BRASBRAS

Page 51: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 54

H-QoS Based on Users and Services

• UNI side: The H-QoS controls small tunnels to ensure QoS for each user and each service.• NNI side: The H-QoS controls large tunnels according to the planning and provides QoS

similar to that of SDH.

Data

Voice

VideoPIR = 6 Mb/sCIR = 6 Mb/s

User VLANCIRPIRCIR = 512 kb/s

PIR = 16 Mb/s

CIR = 2 Mb/sPIR = 2 Mb/s GE

10GESDHOTN

Voice (COS = EF)

Video (COS = AF4)

Data (COS = BE)

UNI: H-QoS

NNI: DS-TE

PTN

NodeB

BTSPTN

SR

RNC

MSCGVIP

Page 52: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 55

End-to-End OAM Based on Hardware

• End-to-end by-layer monitoring ensures quick fault identification.• The hardware OAM (CPU not involved) avoids software performance

degrade in case of an increase in the OAM services.

Service-layer OAM ( UNI to UNI)

IEEE 802.3ah EFM

ITU Y.1731 OAM Connectivity-layer OAM

IEEE 802.1ag/ITU Y.1731

ITU Y.1730/ITU Y.1711 OAM LSP

PW

PTN

PTN

PTN PTN

NodeB

BTS PTN

SR

RNC

MSCGVIP

EFM

Page 53: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 56

Clock/Time Synchronization Solution

• The clock/time synchronization solutions are as follows:– IEEE 1588V2 clock, which is co-frequency and in-phase. All the nodes that the

IEEE 1588V2 clock signals traverse must support the IEEE 1588V2 clock.– Synchronous Ethernet clock, which is co-frequency and stable, and is similar to the

SDH clock. All the nodes that the clock signals traverse must support the synchronous Ethernet clock.

FE/GEGE/FE

NodeB

RNC

PTNNodeB

FE/GE

FE/GE BITS

Page 54: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 57

Appendix I: Service Specifications of Boards

Specification Board

Service Type QoS IEEE1588V2

OAM Spanning

Tree

IGMPSnoopi

ng

Number of 1+1/1:1 MPLS

TunnelProtection

Groups

LAG

E-Line E-LAN E-AGGR

Eth MPLS

OptiX OSN 3500

PEX1 √ √ √ H-QoS √ √ √ √ √ 1k √

PEG16 √ √ √ H-QoS First two

ports

√ √ √ √ 1k √

PETF8 √ √ √ H-QoS √ √ √ √ √ 1k √

OptiX OSN 1500

PEGS2 √ × √ Simple √ × √ × × 128 √

PEFS8 √ × √ Simple √ × √ × × 128 √

Page 55: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 58

Appendix II: Usage Restrictions on Boards with Packet Features

• The ports on the PETF8/PEFS8 do not support the 10M rate or half-duplex mode.– The NE software suppresses such configuration.

• The following Ethernet ports do not support the function of setting or querying flow control:– IP1/IP2 ports on the PEG16– All ports on the PEX1– All ports on the PETF8– All ports on the PEGS2 and PEGS1– All ports on the PEFS8

• The preceding ports support RMON statistics only on good packets and errored packets.

• In the case of the PEGS1/PEGS2/PEFS8 , the load sharing algorithm does not support the source IP address.

• In MPLS service-carrying mode, the PEG16/PEX1 does not support transparent transmission of BPDUs.

Disclosu

re only to Huaw

ei engineers

Page 56: 01-MSTP+ Product Overview

HUAWEI TECHNOLOGIES CO., LTD. Page 59

Appendix III: New Maintenance Features of MSTP+ Equipment

• Currently, the MSTP equipment of version V100R009C03 does not support the fiber auto-

search function.

• The MSTP+ equipment does not support the function of uploading or downloading

configuration data to or from the NMS, or pre-configuration. Similar to the ASON features,

only the database upload/download function can be used for disaster tolerance.

• Multiple dynamic protocols are new for the packet features. Hence, in case of a warm

reset, the active and standby SCC boards are switched to reduce impacts on packet

services.

• To upgrade the equipment on the existing network to V100R009C03, which supports the

IEEE 1588 feature, by means of package loading, select proper package files. In addition,

the equipment of version V100R009C03 does not support the license control on the IEEE

1588 feature. Instead, you need to manually control the IEEE 1588 feature.

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