November 2008 16

1. SMD LED .

2. LED .

LED

1991 () North Carolina State University , . , LED , (EU)THERMINICS

. (mwshin@mju.ac.kr)

. LED . LED . (LED) SMD

. (mold) LED . (Surface Mount Device) (PCB)

. SMD LED .

LED

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, , X-, . LED . , , , LED . LED

. LED LED . LED , , , TEC , heat sink slug . 3

Lens GaN chipSiC substrate

Slug-

November 2008 17

4. .

5. LED .

3. LED (Heat sink).

[1] US Air Force Avionics Integrity Program.

[2] J. Park, M.W. Shin, and C.C. Lee, Optics Letters 29, No.

22 (2004).

heat sink .

LED LED , .

. 55%

, 19%

.[1] LED . 5 LED

.[2] LED LED

.

LED LED . . , , , LED . LED chip .

4 inch 2014 6 inch . GaN GaN

. LED . LED . LED .

6 inch GaN

a/c

LED LED . LED chip 9% . LED . LED .

LED LED

November 2008 18

7. .

300 400 500 600 700 8000

10

20

30

40

50

60

70

80

90

100

% T

rans

mitt

ance

Wavelength (nm)

JCR6175 EG6301 TX2336 IVS2335 DYMAX9617 EPOXY

8. .

6. .

. LED LED

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. / , //Glass ceramic . // // glass ceramic .

. , ,

. LED

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. 8 .

90%

(EG6301, TX2335) .

. LED . . .

November 2008 19

9. . 10. LED ( ).

11. LED ().

[3] Lianqiao Yang, Sun Ho Jang, W. J. Hwang, and Moo Whan

Shin, Thermochimica Acta. 455, 95 (2007).

LED PCB . / . 3D HDI-Via Thin insulator filler Package on Package . 9 . chip de-

lamination .[3] / TIM (Thermal Interface Material) .

LED LED . LED 4 .

LED . epi-up (non-flip chip) epi-down (flip chip) Au . 10 (

) .

.

. (Ag paste)

chip on board . . 11 . . .

PPA . PPA 6 LED .

LED

November 2008 20

13. .

-10 0 10 20 30 40 50 60 70 80 90

15.0

15.5

16.0

16.5

17.0

17.5

18.0

18.5

Rth (K

/W)

Applied force (kgf)

No TIM Thermal tape Thermal grease

14. .

15. LED .

[4] Lan Kim and Moo Whan Shin, IEEE Trans. Component and

Packaging Technology 30, No. 4 (2007).

[5] Lan Kim, Jong Hwa Choi, Sun Ho Jang, and Moo Whan

Shin, Thermochimica Acta. 455, 21 (2007).

[6] Lianqiao Yang, Jianzheng Hu, Lan Kim and Moo Whan

Shin, Phys. Stat. Sol. (c) 3, 2187 (2006).

[7] Lianqiao Yang, Jianzheng Hu, and Moo Whan Shin, Solid

State Phenomena 124-126, 483-486 (2007).

0 1 2 3 4 5 6 7 8 9 10 11

20

40

60

80

100

120T

empe

ratu

re r

ise

(o C)

Chip number

i:0=10:1 i:0=1:1 i:0=1:10

12. .

. LTCC(Low Temp. Cofired Ceramic) thermal via . PCB . .

LED

. , , . 12 LED .

.[4] .

. LED . LED . LED , ( , , ),[5] [6] . LED . JEDEC 51-2 .

[7] LED

. 13, 14 LED . LED LED

. LED DC . LED

AC LED . AC LED LED LED .[8] LED

November 2008 21

17. LED .

16. LED (),

LED ().

[8] Lianqiao Yang, Jianzheng Hu and Moo Whan Shin, IEEE

Electron Device Letters 29, No.8 (2008).

[9] Jianzheng Hu, Lianqiao Yang, and Moo Whan Shin, IEEE

Transactions on Device and Materials Reliability 8, No. 2

(2008).

[10] JianZheng Hu, Lianqiao Yang, Woong Joon Hwang and

Moo Whan Shin, J. Crystal Growth 288, 157 (2006).

[11] Jianzheng Hu, Lianqiao Yang, Moo Whan Shin, Micro-

electronics Journal 38, 148 (2007).

. 15 LED

. LED .

.

Thermo-mechanical

LED thermo-mechanical delamination . Thermo-me-chanical . Thermo-mechanical , , , . LED .[9] 16 LED

. LED .[10] LED LED . Thermo-mechanical .

LED . .[11] 17 . LED LED .

LED . LED

, .

. LED , / , TIM

.