안현옥 [email protected]/sub08/sub08_data/안현옥.pdf · 2013-10-24 · low power dram...
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New Applications, new systems , new challenges
Smart Devices at the Heart of Our Lives
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Mobility is Reshaping Behavior
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Memory is more important than everBut the market drivers are changingg g
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Mobile Device Market Continue to Grow
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Mobile comes with different requirements
B d idth P C t C itBandwidth Power Cost Capacity
Mobile ●● ●●● ●● ●●Mobile ●● ●●● ●● ●●
Consumer ● ●● ●●● ●
PC/Server ●●● ●● ● ●●●
Networking ●●● ● ● ●
Therefore interface technology is changing fastgy g g
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Non- monolithic integration on the way
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Today’s memory market Characteristics
● Accelerating – faster adoption● Fragmenting more new standards● Fragmenting – more new standards● Multiplying – multiple types in systems
LPDDR
DDR●
●
UFS
3D
●
●
HS NAND●
SSD●
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Low Power DRAM Bandwidth Roadmap
Power Efficiency[mW/GB/s] is more important than Chip size.
That’s consensus of Mobile Industry!
51.2
Bandwidth[GB/s] WIO2
x512x512
Futuresolution
25.6 LP3_4ch
WIO2x256 LP4_4ch
solution
LP3_2chLP3E_2ch
WIO_SDR x512
12 8
17.1
3_ c
LP2_1ch LP2_2ch
LP2_4ch12.8
Power500 1000 1500 2000 Power[mW]
<출처 Mobile Forum 2013>
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Changes in the form of Business
- 기존 OEM biz.중심 → 향후 SoC 협업 중심으로 변화
LPDDR2/3/4Wid I/O WIO2
Heat SlugPoP
Discrete
Wide I/OUFS
WIO2UFS
g
ControllerWIO2 / high stack
Multiple SourceOEM
CollaborationSingle Source
SoC Collaboration
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Mobile Device, Today & Tomorrow
Tremendous growth driving demand for Low-power DRAM Solutions
LPDDR & eMMC emerged as a mainstream choice for most mobile device
Multimedia applications continues to drive usage models & memory BW
LPDDR & eMMC emerged as a mainstream choice for most mobile device
- LPDDR4 natural migration from LPDDDR2/3- UFS is target as a replacement for eMMC
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So, Mobile Revolution needs Storage like
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Past, Present & Future for NAND
Flash storage has been improved with managed concept
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Why UFS?
• Fast Communication Speed. UFS communication speed is fast enough to access host memory from device; which is up to 5.8 Gbps for a single lane.
• Rich Features. . Full duplex. . SCSI compliant commands. M lti l t t di. Multiple outstanding.
• Cost-Sensitive Mobile Devices. SSD for PC hich has eno gh de iceSSD for PC; which has enough device-integrated RAM as working memory
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What is UFS?
• High performance • Mobile usages friendlyg p• Serial interface• Command queuing
• Mobile usages friendly• Flash memory oriented• Low power
Universal Flash Storage• Embedded & Removable devices• 300MB/s with future scalability 300MB/s with future scalability• Employ a multi-device chain topology• Flexible protocol• Leverage existing standards or works
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UFS, Small SSD for Smartphone !!
UFS = virtues of eMMC+ virtues of SSD + Low Power consumption + Mobile Centricp
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eMMC vs UFS
Single-threaded vs. Concurrent and out-of-order executing
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Standardization 협의체 (JEDEC)
JEDECJEDEC
JC-42Solid State Memories
JC-64Embedded/Removable
Memory
JC-11Mechanical (Package)
Non-Volatile Memory Device (42.4)ONFI JEDEC TG
eMMC Elec.& Mech. TG (64.1& 64.2)
Memory
ONFI-JEDEC TG
UFS Elec.& Mech. TG (64.1&64.2)
SSD TG (64.8)
UFSA (Universal Flash Storage Association)
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Summary : Challenges for Future Devices
폭발적인 S t 기기의 성장이 이제 정체되고폭발적인 Smart 기기의 성장이 이제 정체되고
경쟁이 심화되어, 차별화되는 Device가 요구됨.
Four kinds of Challenges
1 High Performance High Density Low Power1. High Performance, High Density , Low Power
- Various Serial interface (PCIe, M-PCIe, MIPI, SCSI..etc)
- Increase # of I/O , Power Count ,
- Upgradable DRAM Speed (4.2G,8G.. )
- Flexible # of Stack
2. Improved Memory Bandwidth (Wide IO / newer LPDDR tech/ UFS)- Fine Pitch(0.3mm이하) , Thermal Response
3. Hardware-enabled Security Scheme
4. Total System Optimization (다양한 반도체 Component)4. Total System Optimization (다양한 반도체 Component)- Optimization (AP + Hardware + Software)된 Reference Hardware 제공