zen voce pcb presentation
DESCRIPTION
We are professional PCB design & fabrication in Taiwan and India. We manufacture high precision, high density, and high reliability PCB up to complex multi-layered boards. We PARTNER with our customers and suppliers to provide a total test/design solution.TRANSCRIPT
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PCB Products & Services
ZEN VOCE CORPORATION
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1. Product Line-up & General Capability
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We define the PCB design and production considerations. This includes the signal type, calibration capability, speed, resolution, and interconnect configuration for power supply, I/O channels, and control signals. These considerations and requirements are factored into fabrication decisions including the selection of a dielectric material, the various metals that will be deposited, and optimum layer stack up.
PCB (Printed Circuit Board)
High Frequency Multi-Layered PCB
- Customized High Technology products , High Frequency & Impedance Controlled Product
- Required short delivery (One Device – Multi designer System)
- Massive product library & Experienced in major test systems / Interfaces
▶We design and plan products considering the degree of noise and produce High Multi
site Probe Card PCB through High Multi Layer technology.
PCB Specification & Core Technology- CAD/CAM Design Tool & PCB Software - Design & Manufacturing capability of Multi Layered PCB (up to 52 layers) - Signal matching technology for high frequency
Product Line Up
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Test Load Board & Probecard PCB
Offer full range of PCB design services, Digital Analog Mixed signalMemory boardsMulti-layer PCB
Provide design & fabrication solution on probe card PCB, load board and PRVX motherboards.
Provide full turn-key solution with componentassembly solution according to customer’s
request.
Very competitive pricing with fast delivery time.
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High Technology PCB- Multi Layer (More than 52Layer)
- High Frequency (Mobile Base Band)
- High Speed Interface (USB2.0 , S-ATA)
- Controlled Impedance PCB (50Ω±5Ω, Custom Spec :±10% , Special Spec :±5%)
Design CAD TOOLS- Mentor Graphics, Power PCB(PADS) - Accel (P-CAD)- Cadence, Allegro, Orcad Capture- CAM350 - Auto CAD
PCB Design Capability
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Product Line Up
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Product Line Up
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Layers : 14 – 52Materials : FR-4, FR-5, Polymide, PPE, BT Thickness : 3.2T - 7.0TImpedance matching : 50 ± 5ohmMemory (DRAM & FLASH & WFBI) , Non Memory
2-2. PCB For Probe Card
WFBI ø440DRAM ø440 DRAM ø305
PCB For Probe Card
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Configuration - Motherboard PCB- Pogo Mold & Pin - Upper Base & Down Base- Other Tools
Product Item (PRVX III)- Teradyne Catalyst - Teradyne Flex - Teradyne Tiger - Yokogawa ST6730 - Advantest T6372 - Advantest T6673 - HP 93000 - Fostes SF3000
3. Mother Board (PRVX)
Motherboards
We designs and manufactures a diversified product of line of motherboards. Motherboards used in conjunction with probe card analyzing equipment are a critical and necessary component to measure probe card correlation and performance prior to production wafer testing.
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50Ω±5ΩCustomer Spec : ±10%(Special Spec : ±5%)
50Ω±5ΩCustomer Spec : ±10%(Special Spec : ±5%)
Impedance
FR-4
FR-4Polyimide
PPEBT
Rogers
FR-4Polyimide
PPEBT
Rogers
Material
LogicMixed
2~6.352~48Load Board
580x725.5470 x 730 x 75
4.86~26Mother Board (PRVX)
Memory DD ILogicMixed
3.2 ~7.02~52Probe Card
비고ThicknessLayer제품명
PCB Specification
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Specifications
ITEM Standard Special
Material Board Material FR4,FR408,N4000-13 Getek, Polyimide, Ceramic
Structure Flatness/Warpage ±5 mil/in ±2 mils/in
Layers Max. 24 Layers Max. 52 Layers
B/d Thickness Tol. +/- 10% +/- 5%
Hole Drilled Hole Size Min. Finish 6milsψ Min. Finish 4milsψ
Aspect Ratio 10 32
Design Rule
Trace Width 3mils 2mils(Internal),3mils (external)
Line Spacing 3mils 2mils(Internal),3mils (external)
Annular Ring 2.5mils 1.5mils
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PCB Material Applications in different Temperature
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Our Major Performance
Item Para Layer Remark Memory 16~256 16~52 T5365,T5371,T5375,T5377,AL6050,FOS8000
DDI 1~12 10~48 T6700,T6371,T6372,ST6730 and etc.CIS 1~32 10~32 J750,IP750,MAGNUM
LOGIC 1~4 4~24 T3324,T6682,ITS9000,VERSA and etc.MIXED 1~4 4~30 FLEX,HP93K,SHAPPHIR,FUSION and etc.
PROBE CARD PCB
Item Tester RemarkR/F Catalyst, U-Flex Mobile Bandwidth
High Speed Tiger, Fusion USB2.0, S-ATALOGIC T3324,T6682MIXED CATALYST,FLEX,HP93K, SHAPPHIR ADC,DAC
LOAD Board
Item Tester RemarkMother Board PRVXⅡ, PRVXⅢ HP93K,T5375,ST6730 and etc.
PRVX Mother Board
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Platform Supported (LCD & Memory)
• Universal Probe Card<For LCD Driver>
TS6700-B Type T7315-A TypeT7315-B Type (No GND)T6371 (ND-1)ST6730
<For Memory >T5335P-8DUTs-HorizonT5335P-8DUTs-VerticalT5335P-4DUTsT5335P-1DUT-T10514T5363 V3300-8DUTsV3300-4DUTsV3300-4DUTs-Diagonal
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Platform Supported (Mixed signal/RF)
Load BoardHP93000TigerUflexIFLEXChroma 3600SC312HP83000V7100J750Catalyst
Universal Probe Card<For Logic >
HP83000HP93000DUO 9”KALOSJ750CatalystTiger
SC312
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Customized PCBAll Teradyne platformAll HP/Verigy platformAll Credence platformAll LTX platform
PRVX Mother BoardHP93KJ750CatalystTigerUflexKALOSDUO6”DUO9”
Platform Supported (Mixed signal/RF)
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▣ PROBE CARD & TEST B/D LIBRARY
Product Line-up
ADVANTESTT3324T5365T5335T5371T5581T5377T6371T6372
TERADYNE
J750
J937
J994
J995
J996
J997
Catalyst
FLEX
A565
A580
LTX SystemDelta 50Delta trillium
YOKOGAWAYOKOGAWA
TS6700
TS6730
MOSAIDMOSAID
MS3400
MS4155
MS4205
HPHP
HP 83K
HP 93K
HP 4062
HP 4071
HP 4072
CREDENCE
QUARTET
KALOS
SC312
SC212
DUO
ASIAA7160A7162A7163A7164
VERSAV2000V3000V3300
SCHLUMBERGERITS9000
EAGLEETS364
ITS9000
J750
FLEX
SAPPHIRE
T6372
T6371
HP93K
HP94K
KALOS
TS6700
▣
PRVX II & III M/B LIBRARY
CATALYST
T5371
T5377
AL6050
FOS7000
HF3000
SF3000
T3326
VALSTAR
VLCT
ST6730
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PCB Manufacture Capability
Description Korean Fab. Japanese Fab. American Fab.
Mechanical spec.
Material FR4, Polymide, Nelco, Roger's ,BT, Polymide, etc.. FR-5, Polymide, Megtoron6, etc..
GETEK, Nelco, Roger's, Polymide, Cyanate Ester, ARLON, Hybrid Construction
Combinations
Pannel Size 770 x 580 mm 500 x 720 mm 660 x 890 mmLayer (6.35mm) 60 lyrs 58 lyrs 60 lyrs
Min Copper weights 1/2 oz (18 micron) 1/2 oz (18 micron) 1/4 oz (9 michron)
Min. Drill hole diameter
6.35T: ∮0.3 6.35T: ∮0.3 6.35T: ∮0.25
6.2T:∮0.3 6.2T:∮0.25 6.2T:∮0.20
4.8T: ∮0.25 4.8T: ∮0.25 4.8T: ∮0.15
3.2T: ∮0.20 3.2T: ∮0.20 3.2T: ∮0.15
2.0T:∮0.20 2.0T:∮0.20 2.0T:∮0.10
1.6T: ∮0.15 1.6T: ∮0.15 1.6T: ∮0.10
Plating thicknessNormal: NI 4㎛, AU 0.05㎛ Normal: Ni 3㎛, AU0.05㎛ Normal: Ni 5.08㎛, AU0.076㎛
Max: NI 8㎛, AU 0.09㎛ Max: NI 7㎛ , AU 3㎛ Max: NI 7.62㎛, AU 1.27㎛
T 6.35mm (P/C)
Min pitch 0.9 mm pitch 0.8 mm pitch 0.8 mm pitchMin. Pad size 0.50 mm 0.45 mm 0.45 mm
Clearance 0.20 mm 0.20 mm 0.20 mm
T 4.8mm (L/B)Min pitch 0.6 mm pitch 0.5 mm pitch(developing 0.4pitch) 0.4 mm pitch
Min. Pad size 0.3 mm 0.30 mm 0.20 mmClearance 0.15 mm 0.1 mm 0.1 mm
AdvanceQuick turn delivery Hiper Via Low DK speciall material
Laser Via for pine pitch, Excelent plating High Thickness of plating
ApplicationLow layer product / stable quality Fine pitch BI Board Low DK Load board
Probe Card / Load Board High performance probe card High performance Load Board
Lead time 7 days 2 weeks 2~3 weeks
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MLC Design / Manufacture Capability
Property LTCC HTCC
Dielectric Ceramic Material
Dielectric Constant 5.1±0.2 8.8±0.2
Fired Density 3.10 g/cm3 3.54 g/cm3
Flexural Strength 203 Mpa 435 Mpa
Thermal Conductivity
200℃ 2.56 9.23
400℃ 2.41 9.62
Thermal Expansion Coefficient
RT~200℃ 6.245×10-6/℃ 7.527×10-6/℃
RT~400℃ 6.237×10-6/℃ 7.592×10-6/℃
RT~500℃ 6.308×10-6/℃ 7.462×10-6/℃
Conductor Metal
Conductor Ag Ag W W
Metal Contents 85±1% 90±1% 85±1% 90±1%
Firing Temp. 850~900℃ 850~900℃ 1,500~1550℃ 1,500~1550℃
UsageSignal Line Inner GND
Power PlaneVia Filling
Signal Line Inner GND
Power PlaneVia Filling
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2. Software
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EDA Simulation Tools
Enough Engineering of of EDA Tool Expertise Background
Allegro PCB SI
Allegro PCB PI
Allegro Package SI
Hyper-lynx
Paksi-E and Tm
PowerGrid
Hspice
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Advantest Schlumberger Teradyne Credence Yokokawa Mosaid Verigy Versa Nextest TIT5335 ITS9000 J973 SC212 TS6700 MS3440 HP83000 V1000 M1 VLCT 8"T5365 ITS9000EX J993 SC312 TS6700A MS3480 HP93000 V2000 M2 VLCT12"T5371 DX2000 J994 Kalos TS6700B MS3485 HP94000 V3300 Maveric RASPT5375 DX2001 J995 KalosII TS6700C MS40xx HP95000 V4400 All series SPREADT5377 DX2200 J996 KalosXW AL6050 V5400
T5377(250mm) DX3000 J997 VV AL6060T5363 J971 Duo CatalystT5581 Tiger QuartetT5591 J750 OctetT5592 IP750 SapphireT5595 CatalystT6371 Flex SeriesT6372T7315T5771T5575LM4
Library
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Library
Teradyne J750-1024 / 512
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3. Equipment
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Equipment
<1> TDR SystemBrand : Tektronix Model : TDS8000Function : Impedance Check
<2> Digital Dial GaugesBrand : SylvacModel : S229Spec : 12.5 mm – 0.001 / 0.5” – 0.00005Function : Flatness/Thickness Check
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Equipment
<3> 2 Dimensions Coordinate Measuring Machine
Brand : ChienWeiModel : PJG-600 DVFunction : Dimension/Mechanical Hole Check
<4> Flying Probe
Brand : MicroCraftModel : ELX6146Function : Leakage/Open/Short Test
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4. Special Capabilities
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RF Capability
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Actual Tester EnvironmentVerigy, Teradyne,Credence,etc..
RF Test Capability
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Design Signal Integrity (SI) Capability
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Design SI Simulation
Load Board Design – Micro strip Implementation – Single ended
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Design SI Capability
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• Rise time becoming more rapid (bandwidth increasing)– Reflection and Ringing– Crosstalk– SSN– Skew– Jitter– Loss & ISI
• Lower power-supply voltage and High current– Power supply droop and ground bounce– Adequate power plane decoupling is the key– Power delivery impedance is frequency dependent– Common-mode radiated noise (EMI)
CROSSTALK INTERCONNECT DELAYGROUND BOUNCE
ATTENUATION
REFL
ECTI
ON
RADIATIONEMI SUSCEPTIBILITY THERMAL NOISE
Design SI Capability
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Signal Integrity Analysis Flow
MeetSpec.MeetSpec.
FabricationFabrication
Yes
No
Driver ModelsPre-layoutAnalysis
Schematic
Constraint DrivenLayout
Constraint DrivenLayout
Post LayoutAnalysis
Post LayoutAnalysis
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• Define Specification & Verification• Schematic & Topology Optimization • Stack-Up & Floor Planning
Pre Layout Analysis
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Pre Layout Analysis
• Reflection and Ringing Analysis• Propagation delay variations (skew)• Crosstalk Analysis• Single-ended I/O supply noise (SSN)
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Power Layout Analysis
• Power supply droop and ground bounce• De-coupling Capacitors Estimation• Common-mode radiated noise (EMI)
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RF Capability
Teradyne Catalyst
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RF Capability
Integraflex
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5. Process Flow
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Artwork Flow
Getting Design Info.
Verify Design Info.
Registration of Library
Sch. (Net_list)Import
Part Placement
PCB Art-Work
Design Verification Plot (.DXF)
CAM OUT
PCB FAB
PCB Inspection
Assemble of Parts
Delivery
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Working Procedure
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Load Board Design Request
•Tester Data •Tester Mechanic Drawing
•Tester Channel Mapping
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Load Board Design Request• Schematic
• IC Datasheet
Critical Line SPEC Socket Drawing
IBIS(IC/Component)
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7. Quality
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Quality Policy
Our goal is to provide the highest quality our item available anywhere. We guarantee the customer's satisfaction.
Prompt delivery is our objective of production. Our experienced engineers guarantee the quality and schedule production. So that you can catch up on challenging market.
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Quality Assurance
• by SMD system.
• TDR , L R C Check in House ( Not depend on third party )
• Repair Service in Local
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* All signal ( Leakage / Short ) being guaranteed by QA system for Probe card PCB
Quality Assurance
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• External Check• Dimension • Thickness• Flatness• Bending• Open/Short Test• Leakage Test• TDR for Impedance Test
Outgoing QC Inspection System
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Quality Assurance
•All signal ( TDR / Impedance ) being guaranteed
by QA system for all product
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7. Contacts
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Contact us
Zen Voce Manufacturing Pte Ltd
5004 Ang Mo Kio Avenue 5 #04-06 TECHplace II Singapore 569872
Tel: 65 6319 9991 Fax: 65 6319 9997
www.zenvoce.com
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Thank You