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UV LED is ideal UV light source for

Z-Power LED X10490Technical Data Sheet

Features

Applications

Description

High power UV LED series are designed

for high current operation and high power

output applications.

It incorporates state of the art SMD

UV LED is ideal UV light source for

curing, printing, and detecting applications.

• Super high power output

• Designed for highcurrent operation

• Low thermal resistance• SMT solderable• Lead Free product• RoHS compliant

• UV Curing• Printing • Coating• Adhesive• Counterfeit Detection/Security

• UV Torch• Fluorescence Photography

• Dental Curing• Crime Inspection• Oil leak Detection

NUV Z5

SHANGHAI YULITECH CO., LTD

YLUV-395-SNYLUV-395-SN

Z-Power LED X10490Z-Power LED X10490

Technical Data Sheet

Outline dimensions

Notes :

[1] All dimensions are in millimeters. [2] Scale : none[3] Undefined tolerance is ±0.2mm


Characteristics of



1-1 Electro-Optical characteristics at 350mA

1-2 Absolute Maximum Ratings

Notes :1. Peak Wavelength Measurement tolerance : ±3nm2. Radiant Flux Measurement tolerance : ± 10%

3. Φe is the Total Radiant Flux as measured with an integrated sphere.4. Forward Voltage Measurement tolerance : ±3% 5. RθJ-s is the thermal resistance between chip junction to package bottom.

(Ta=25, RH=30%)

Parameter Symbol Value Unit

Peak wavelength [1] Λp 395 nm

Radiant Flux @ 350mA[2] Φe[3] 500 mW

Radiant Flux @ 500mA Φe 720 mW

Forward Voltage [4] VF 3.4 V

Spectrum Half Width Δ λ 12 nm

View Angle 2Θ1/2 125 deg.

Thermal resistance RθJ-s[5] 7 ºC /W

Parameter Symbol Value Unit

Forward Current IF 700 mA

Power Dissipation PD 3.5 W

Junction Temperature Tj 125 ºC

Operating Temperature Topr -10 ~ +85 ºC

Storage Temperature Tstg -40 ~ +100 ºC




2.0 2.5 3.0 3.5 4.0 4.5 5.010

100

1000

300

500

395 nm

Forw

ard

Cur

rent

[mA

]

Forward Voltage[V]

700

1. Relative Spectral Power Distribution

250 300 350 400 450 500 550

0.0

0.2

0.4

0.6

0.8

1.0 395nm

Rel

ativ

e Sp

ectr

al P

ower

Dis

trib

utio

n

Wavelength[nm]

(IF=350mA, Ta=25, RH=30%)

Characteristic Diagrams

2. Forward Current VS Forward Voltage(Ta=25)




0 100 200 300 400 500 600 700385

390

395

400

405 395 nm

Peak

Wav

elen

gth

[nm

]

Forward Current[mA]

0 100 200 300 400 500 600 7000

20

40

60

80

100

120

140

160

180

200 395 nm

Rel

ativ

e R

adia

nt F

lux

[%]

Forward Current [mA]

3. Relative Radiant Flux VS Forward Current

4. Peak Wavelength VS Forward Current

(Ta=25)

(Ta=25)




30 40 50 60 70 80375

380

385

390

395

400

405

410

415 395 nm

Peak

Wav

elen

gth

[nm

]

Ambient Temperature [? ]

30 40 50 60 70 800

20

40

60

80

100

120

140 395 nm

Rel

ativ

e R

adia

nt F

lux

[%]


5. Relative Radiant Flux VS Ambient Temperature

6. Peak Wavelength VS Ambient Temperature

(IF=350mA)

(IF=350mA)




30 40 50 60 70 802.8

3.0

3.2

3.4

3.6

3.8 395 nm

Forw

ard

Volta

ge [V

]


0 20 40 60 80 1000

100

200

300

400

500

600

700

800

900

Rj-a=30oC/WRj-a=25oC/WRj-a=20oC/W

Max

imum

Cur

rent

[mA

]

Ambient Temperature [oC]

7. Forward Voltage VS Ambient Temperature

8. Allowable Forward Current VS Ambient Temperature

(IF=350mA)

(Tjmax = 125 IF=700mA)




0

30

60

90

-80 -70 -60 -50 -40 -30 -20 -10 00.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Rel

ativ

e R

adia

nt F

lux

Viewing Angle [? ???[deg.]

9. Radiation pattern

(IF=350mA)




Recommended solder pad

Notes :

[1] All dimensions are in millimeters. [2] Scale : none[3] This drawing without tolerances is for reference only




Pre-heating

200

180

150

~

0

[°C]

220

240

260

Rising5 °C/sec

Tm : Reflow machine setting temp (max 30 sec.)

Ts : Surface temp of PCB (min)

Ts : Surface temp of PCB (max)Ts : Surface temp of PCB (recommend)

Cooling-5 °C/sec

Time

[Hr]

Reflow Soldering Profile

* Caution1. Reflow soldering should not be done more than one time.2. Repairs should not be done after the LEDs have been soldered. When

repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered.4. When soldering, do not put stress on the LEDs during heating.5. After soldering, do not warp the circuit board.6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.




Reliability

1. Relative Spectral Power Distribution

2. Failure Criteria

Test Item Test Condition Note# Failed/Tested

High Temp. Operational Life

Ta=85, IF=350mA 1000hrs 0/5

Low Temp. Operational Life

Ta=-40, IF=350mA 1000hrs TBD

Room Temp.Operational Life

Ta=25, IF=350mA 1000hrs 0/5

High Humidity High Temp.

Operational Life Ta=60, RH=90%, IF=350mA 1000hrs 0/5

High Temp. Storage Ta = 100 1000hrs TBD

Thermal shockTa max=120, Ta min=-40

30min dwell/transfer time : 10sec, 1 cycle=1hr

200 cycles 0/10

Resistance to Soldering Temp=260±5, Time : 10±1 sec 1 time 0/10

Solderability Temp=260±5, 95% Coverage 1 time 0/10

Vibration Variable Frequency

100~1000~100Hz, 20G, Sweep 4 min,

3 directions, 4 cycles48min. TBD

ESDR=1.5kΩ, C=100pFVoltage level=2kV

3 times Negative/positive

0/10

Parameter Symbol Test ConditionsMax. or Min.

allowable shift value

Forward Voltage VF IF=500mA Max. Initial measurement x 1.2

Radiant Flux Φe IF=500mA Min. Initial measurement x 0.7

Notes :1. The value is measured after the test sample is cooled down to the room temperature.


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