Pads

• Assembly- Zamiatin• Si Detector – ELMA/Dubna/MSU• Interface Board – dubna/baskagiv• Carrier Board -dubna/baskagiv• Pre-Amp –sleniov(analog) Basilev-dubna• FEM – Basilev –-dubna

– Analog(Slepniov)– Digital Basilev– Layout – Baskagiv

Pad assembly

• Assemble– Detector+interface+ceramics (dubna)

• To bnl

– Glue carrier+W (SUNY?)• Attach detector assembly via connectors• To bnl

– Use connector to put together 2 sections! (at BNL)

strips

• Detectors – Elma/Korea

• SRC (stripixel readout card) – BNL/CA

• Bonding svx+pitch adapter –Helsinki

• Assembly - Helsinki

• Then to BNL

Mechanical parts

• Dubna – Litvinenko– Copper boxes etc

Brick Assembly

• Receive– Pad assembly– Strip assembly– Copper boxes

groups

• MSU-Merkin

• 'Nikolai Zamiatin‘

• 'Basilev, Sergey‘

• Analoy Litvinenko

• Andrey Sukhanov

Pad detector

ConnectorConnector

Carrier board (Dubna-layout Baksagiv) traces out to end carrying analog signal to pre amp

Tungsten (USA) brick size

Pre-amp board -

Hybrid pre-amp Slepniov

Layout- Boskakov

Assebled-Dubna

CablePolyamideBoskakov

FEM board 14 bit ADC

Design- Basilev Layout- Boskakov Assembled-Dubna

Or

Chi HBD board

Ass

embl

ed a

t D

ubna

Zam

iatin

Dou

ble

unit

Ass

embl

ed a

t S

UN

Y?

Bric

k si

ze

To DCM

Ceramics (USA) no electronics, with holes for soldering etc

Pad detector (ELMA/ON/SENS)

Interface board (Dubna-layout-Boskakov ) double unit

ConnectorConnector

“Hbd” cable

deco

uplin

g capa

cito

r

Absorber (W)

Sensors carrier board

Layout: BNL/MSU

Implementation: BNL/Komposit (Ekaterinbourg, Russia)

Pad ReadOut Unit

Pad ReadOut Unit

Pad Detector

Interface board

Ceramic

Pad detector unit (close up of connections)

Connector

Carrier

Tungsten

Interface board

Connector

Ceramic

Pad detector

Bonding pad

AnalogSignalsToPre-amp

Grounding foil

Stripixel unit

CableDaisy chainOff the Shelfpolyamide

SVX4 Readout and Control (FPGA)

Design- Sukhanov’s (1 per brick)

Assembled USA

Crate controller – linux to SVX4

Ceramic High Voltage+alignment (Dubna) brick size Ass

embl

ed a

nd

bond

ed a

t he

lsin

ki

To DCM

Stripixel detector (ELMA/SENS)

SRC (stripixel readout card) (USA) double sensor unit

Ceramic (USA)

Ceramic (USA)

Pitch adapter SVX4

Brick

Tungsten (USA) brick size

Pad unit Pad unit Pad unitCarrier To preamp

Tungsten (USA) brick size

Pad unit Pad unit Pad unitCarrier To preamp

Tungsten (USA) brick size

Pad unit Pad unit Pad unitCarrier To preamp

Stripixel unit Stripixel unitStripixel unit

High Voltage ceramic+alignment brick size

To FEMCableDaisy chainOff the Shelfpolyamide

Copper “box”

overview

Pad sensor sub-assembly actually done in double units Dubna

Pad sensor sub-assemblyDubna

Pad sensor sub-assemblyattach to carrier board and W