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WP02 / WP18 Hardware Overview Frank Ludwig – DESY Michael Fenner – DESY for the LLRF, WP18, HVF Team

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Page 1: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

Frank Ludwig – DESY

Michael Fenner – DESY

for the LLRF, WP18, HVF Team

Page 2: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

WP02 / WP18 Hardware Overview (05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

Content

- WP02 Hardware Summary

- WP02 Projects (mainly skipped)

- WP18 Hardware Summary I,II,III

- WP18 Projects (mainly skipped)

- Conclusions

Page 3: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

WP02 / WP18 Hardware Summary (05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 (current revision, total 33)

AMC / RTM:

AMC / RTM (others):

Crate / RF-Backplane:

External 19" Modules:

DAMC-TCK7 (DM)

DAMC-DS800 (SH)

DRTM-KLM1300 (SH)

DRTM-HOM1300 (SH)

DRTM-VM2LF (MG)

DAMC-SIS8300L2 (FL)

DRTM-DWC10 R11 (DS)

DRTM-DWC8VM1 (MH)

DRTM-2TCAL (SH)

CPU (JB, UM)

MCH (JB, UM)

uPWS (JB, UM, FL)

DAMC-X2Timer (KR, MCS)

DRTM-X2Timer (KR, MCS)

eRTM-uLOG1300 (TR, UM)

MCH-RTM-BM (AR)

NAT-RTM-PSC (AR)

RF Backplane (TL, CZ)

Crate (CZ, UM)

LOGM13 (MZ)

LOGM39 (MZ)

DCM13 (JP)

DCM39 (JP)

REFM-OPT13 (EJ)

REFM-OPT39 (EJ)

REFM-INJ (DS)

PZ16M (KP, BS)

PWSM (DK, JB)

FRED2 (MFE, EJ)

FRED2 LED Panel (SHA)

TMCB2 (I-Tech)

TMCB2 Fixture (DK, ELMA)

TMCB2 Backplane (STH)

WP18 (current revision, 17 total)

AMC / RTM:

FMCs:

Non-standard:

RF-Synch, Optics, HVF not included

Legend: Not started

Specification

Re/Design

Prototype

Debugging needs redesign

Debugging needs no redesign

Licensing

Pre-production

Documentation

Mass-production

DAMC-FMC25 (JS)

DAMC-FMC20 (HTD)

DRTM-PZT4 (KP)

DRTM-AD84 (RW)

DRTM-LASY (EJ)

DFMC-AD16 (RW)

DFMC-MD22 (RW)

DFMC-LASIO (MFE)

DFMC-DSBAM (JS)

DFMC-SFP4 (MFE)

Balanced Detector (SY, CS)

Link Electronic (SY)

LDD_MEZ (SR)

LDD_ES (SR)

LDD_MB2 (SR)

LDD_MBL (SR)

LDD-Box (MF, CS)

Page 4: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

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WP02 Hardware Summary (Status 05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 - Module Responsible

PersonR

evis

ion Main reason for delay Project Status

Final RevisionSpecification

Design

Prototype

Debugging

Licensing

Pre-production

Documentation

M ass-production 05

/20

14

06

/20

14

L1 (

Pri

ori

ty L

evel

)

07

/20

14

XTI

N (

Gu

n)

08

/20

14

09

/20

14

L2 10

/20

14

11

/20

14

12

/20

14

01

/20

15

L3 02

/20

15

03

/20

15

04

/20

15

05

/20

15

06

/20

15

XTI

N (

Gu

n, 3

9, A

CC

1)

MTCA.4

DAMC-TCK7 (DM) 2.1a XTIN L1 L2 L3 Pre-production

DAMC-DS800 (SH) 1.0 Man-power problems

No desgin review

Needs new revision of board

XTIN L1 L2 L3 Debugging

DRTM-KLM1300 (SH) XTIN L1 L2 L3 Prototype

DRTM-HOM1300 (SH) XTIN L1 L2 L3 Prototype

DRTM-VM2LF (MG) 2.2 Assembly problems

Requirements changedXTIN L1 L2 L3 Debugging

DAMC-SIS8300L2 (FL) L2 MMC V1.0 Integration too late

Achieving signal integrity in a standard was complicatedXTIN L1 L2 L3 Redesign

DRTM-DWC10 R11 (DS) 2.4 Requirements changed

Testing phase party done

Achieving signal integrity in a standard was complicated

XTIN L1 L2 L3 Pre-production

DRTM-DWC8VM1 (MH) 1.2 XTIN Licensing

DRTM-2TCAL (SH) 1.0 L3 Specififcation

MTCA.4 (other)

CPU (JB) XTIN L1 L2 L3 can go for CFT ?

MCH (JB) XTIN L1 L2 L3 can go for CFT

uPWS (JB, UM, FL) XTIN L1 L2 L3 can go for CFT

DAMC-X2Timer (KR, MCS) XTIN L1 L2 L3 Pre-production

DRTM-X2Timer (KR, MCS) XTIN L1 L2 L3 Debugging

MTCA.4 eRTM

eRTM-uLOG1300 (TR, UM) Underestimation of complexity L3 Debugging Upgrade (Temp Stabilization) + Testing + Pre-Production + Documentation + Mass-Production

MCH-RTM-BM (AR) 1.0 Man-power problems

Requirements changedL3 Design

NAT-RTM-PSC (AR) 1.0 Man-power problems

Requirements changedL3 Design

RF Backplane (TL, CZ) 3.2 L3 Pre-production

Crate (CZ, UM) mechanical + EMI issues XTIN L1 L1 L3 Pre-production

19" Modules

LOGM13 (MZ) 2.0 Incomomplete Specifcation

Unclear Interfaces (RF-Power levels, timing)

Man-power problems

XTIN L1 L2 Prototpye

LOGM39 (MZ) XTIN Not started

DCM13 (JP) 2.0 Man-power problems

Requirement changed

TMCB2 delay, FRED2, Temp Controller was not available

Underestimation of complexity

Needs new revision of small changes

XTIN L1 L2 Debugging

DCM39 (JP) SMD FBM not available XTIN Not started

REFM-OPT13 (EJ) 1.0 Man power problems

Requirements changedXTIN L1 L2 L3 Debugging

REFM-OPT39 (EJ) XTIN Not used ? ?

REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design ?

PZ16M (KP, BS) 1.1 Main PCB needs another revison XTIN L1 L2 L3 Pre-production

PWSM (DK, JB) XTIN L1 L2 L3 CFT - test phase

FRED2 (EJ) 2.0 Requirements changed XTIN L1 L2 L3 Pre-production

FRED2 LED Panel (SHA) 2.0 XTIN L1 L2 L3 Design

TMCB2 (I-Tech) 2.0 XTIN L1 L2 L3 Prototype

TMCB2 Fixture (DK, ELMA) 1.0 Not highest priority at ELMA

Inefficient communicationXTIN L1 L2 L3 Specififcation

TMCB2 Backplane (STH) 1.0 Man power problems

Inefficient comunication

Requirements changed

XTIN L1 L2 L3 Design

Testing + Documentation + Part of 19" Module

Testing + Documentation + Part of 19" Module

Testing + Documentation + Part of 19" Module

Testing + Documentation + Part of 19" Module

Pre + Mass-production

Pre + Mass-production

Debugging + Licensing + Pre-production Pre-production + Documentation + Mass-production

Validation + Ordering or CFT

Validation + Ordering or CFT

Testing + Documentation + Part of 19" Module

Debugging + Licensing + Pre-production

Redesign + Prototype + Debugging + Licensing + Pre-production + Mass-production

Pre-production + Documentation + Mass-production

Debugging + Licensing + Pre-production Pre-production + Documentation + Mass-production

Redesign + Prototype + Debugging + Licensing + Pre-production + Mass-production

Testing + Licensing + Ordering with Crate

Testing + Ordering or CFT Testing + Ordering or CFT

Testing + Ordering or CFT

Testing + Pre-production

Debugging + Licensing + Pre-production

Design + Debugging Licensing + Pre-production + Mass-production

Design + Prototype + Debugging Licensing + Pre-production + Mass-production

SMD FBM Revision ? + Debugging + Pre-production + Documentation

Design + Prototype + Debugging + Licensing + Pre-production + Mass-production

Ordering or CFT

Ordering or CFT

Testing + Ordering or CFT

Testing + Pre-production

Documenatation - Mass-production

Debugging + Licensing + Pre-production Documenatation - Mass-production

Debugging + Licensing + Pre-production Documenatation - Mass-production

Validation + Ordering or CFT Testing + Mass-production + FBM SMD Revision ?

Module Usage XFEL

Validation + Ordering or CFT

Documenatation - Mass-production Debugging + Licensing + Pre-production

Redesign + Protottype + Debugging Pre + Mass-production

Debugging + Licensing + Pre-production

Page 5: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

WP02 / WP18 Hardware Details (05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 – Projects

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 AMC/RTM Board Details (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 AMC/RTM Board Details (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 AMC/RTM Board Details (Status 05/2014)

Page 9: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 AMC/RTM Board Details (Status 05/2014)

Page 10: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 AMC/RTM Board Details (Status 05/2014)

Page 11: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 AMC/RTM Board Details (Status 05/2014)

Page 12: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 RF-Backplane Details (Status 05/2014)

Page 13: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 RF-Backplane Details (Status 05/2014)

Page 14: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 RF-Backplane Details (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 RF-Backplane Details (Status 05/2014)

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WP02 / WP18 Hardware Overview

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Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 19“ Modules Details (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 19“ Module Details (Status 05/2014)

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WP02 / WP18 Hardware Overview

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Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 19“ Module Details (Status 05/2014)

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WP02 / WP18 Hardware Overview

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Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 19“ Sub-Component (Status 05/2014)

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WP02 / WP18 Hardware Overview

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Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 19“ Sub-Component (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 19“ Sub-Component (Status 05/2014)

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WP02 / WP18 Hardware Overview

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WP18 Hardware Summary I (Status 05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

AD84 3.0: 6x produced and assembled. Ready to use.

FMC25 3.0: 6x produced and assembled. No serious mistakes found.

This week assembly of few missing components

FMC20 2.0: 10x produced, 5x assembled.

Small mechanical issue, tests on-going

PZT4 2.0: 5x produced, 3x assembled.

No major mistakes found, tests on-going

RTM housing is missing

AD16 1.0: 5x produced and assembled.

Functioning, performance test needed.

Redesign after performance test for 2.5 V version.

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WP02 / WP18 Hardware Overview

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WP18 Hardware Summary II (Status 05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

MD22 2.0: 5x produced and assembled. Ready to use on FMC20.

Redesign for 2.5 V version ready, but not produced.

DFMC-SFP4: Design started, Commercial 900,-€

DFMC-LASIO: Design just started

DRTM-LASY: Design just started

DFMC-DSBAM: 8x produced, one broken, Tests started just before WS ?

Page 24: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

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WP18 Hardware Summary III (Status 05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

Balanced Detector: ?x produced. Ready to use

Link Electronic: ?x produced. Ready to use

LDD_MEZ: 4x V0.0 produced, 1 tested successfully in 26a .

Ready to use. Components for 50 pieces existing.

LDD_ES: 36x V1.0 produced and tested. Ready to use.

LDD_MB2: 8x V1.0 produced and tested. Ready to use.

LDD_MBL: not yet designed, discussion/meeting for specs done.

Concept clarified and open questions identified.

Board will be designed by Sergej.

LDD-Box: not yet designed, discussion/meeting for specs done.

Concept clarified and open questions identified.

Box designer unclear – Matthias, Cezary

Page 25: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

FIL

WP02 / WP18 Hardware Details (05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP18 – Projects

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP018 AMC/RTM (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP018 AMC/RTM (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP018 AMC/RTM (Status 05/2014)

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WP02 / WP18 Hardware Overview

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Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP018 FMC (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP018 FMC (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP018 LDD_MEZ (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP018 LDD_ES (Status 05/2014)

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WP02 / WP18 Hardware Overview

FIL

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP018 LDD_MB2 (Status 05/2014)

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WP02 / WP18 Hardware Overview

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WP02 / WP18 Hardware Summary (05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

Conclusions for HW development (05/2014)

Management problems:

- Insufficient specification caused by not detailed high level system planning

- Last-minute requirements change

- No consequent bug/failure tracking

- Missing Board reviews (we are changing this)

Lack of time:

- 19” module development and finishing needs more resources

- Too many projects simultaneously

- Top down working plan and guidelines are ignored

- Missing documentation

- No clear fabrication information

- Mechanics not checked carefully enough

Bad habits:

- Too many Library Sources

- PCB and Schematic checks are partially ignored

Page 35: WP02 / WP18 Hardware Overview - DESYwof-cluster.desy.de/sites2009/site_msk/content/... · REFM-INJ (DS) 1.0 XTIN L1 L2 L3 Design? PZ16M (KP, BS) ... - Insufficient specification caused

WP02 / WP18 Hardware Overview

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WP02 / WP18 Hardware Statistics (05/2014)

Collaboration Workshop 2014

Frank Ludwig (DESY) Michael Fenner (DESY)

WP02 (statistics)

Delay caused by:

10 of 16 marked: “Changing requirements during design flow”

09 of 16 marked: “Man-power problems”

Documentation status:

6 of 16 did no failure in entry Redmine or FailureReport.docx

Working Style:

10 of 16 did not follow the PCB working plan or PCB guidelines

03 of 16 used the PCB working plan

03 of 16 used the PCB guidelines

WP18 (statistics)

Delay caused by:

00 of 8 marked: “Changing requirements during design flow”

00 of 8 marked: “Man-power problems”

Documentation status:

6 of 8 did no failure entry in Redmine or FailureReport.docx

Working Style:

05 of 8 did not follow the PCB working plan or PCB guidelines

00 of 8 used the PCB working plan

03 of 8 used the PCB guidelines

Thanks for your attention!