[email protected] eudet annual meeting, munich, october 2006 1 eudet beam telescope:...
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EUDET Annual Meeting, Munich, October 2006
EUDET Beam Telescope: status of sensor’s PCBs
Wojciech Dulinski on behalf of IPHCWojciech Dulinski on behalf of IPHC
Outline Short presentation of the system Status of PCB’s Proposed test scheduleConclusions
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EUDET Annual Meeting, Munich, October 2006
Strasbourg MicroTelescope: a simplified Strasbourg MicroTelescope: a simplified version of EUDET telescope…version of EUDET telescope…
- 4 reference planes- DUT- Si trigger plane- Ltot = 10 cm
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EUDET Annual Meeting, Munich, October 2006
Beam area Control room
MimoTel (or HRTracker) on proximity PCB
Auxiliary PCBClock Tree Clock Root
Trigger PCB
PP
USB
Telescope PCBs and cablesTelescope PCBs and cables
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EUDET Annual Meeting, Munich, October 2006
-Only passive components (mainly capacitors), except for first buffering of analog signals -Allows for precision alignment on the telescope mechanics (marks for chip gluing, holes for precision pins)
MimoTel (Mimo*3M) and HR-Tracker (Mimosa18) proximity PCBs
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EUDET Annual Meeting, Munich, October 2006
-Second buffering of analog signals (unipolar-differential) -Buffering of digital signals LVDS/CMOS, LVDS/LVDS, CMOS/LVDS-Power supply regulators-RJ45 connectors for analog and digital signals to external world-Flat cable connector (ERNI 50p) for proximity boards
MimoTel (Mimo*3M) and HR-Tracker (Mimosa18) auxiliary PCB
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EUDET Annual Meeting, Munich, October 2006
-Second buffering of analog signals (unipolar-differential) -Buffering of digital signals LVDS/CMOS, LVDS/LVDS, CMOS/LVDS-Power supply regulators-RJ45 connectors for analog and digital signals to external world-Flat cable connector (ERNI 50p) for proximity boards
Distribution of the clock and the JTAG(“Clock Tree”)
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EUDET Annual Meeting, Munich, October 2006
-Translation PC-ParallelPort LVDS for JTAG-Interconnection and buffering of fast digital signals (sensor clock, syncro, ADC clock…)-RJ45 connectors compatible with that on the Clock Tree board
Assembling of the clock and the JTAG(“Clock Root”)
First version: development board
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EUDET Annual Meeting, Munich, October 2006
PCB’s for EUDET: first setCurrent status: 5 sets assembled and tested, 15 sets to be assembled at DESY
One set of PCB’s contain:
• Proximity board for Mimo*3M (MimoTEL):• Proximity board for HiRes Tracker• Auxiliary board for MimoTEL
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EUDET Annual Meeting, Munich, October 2006
PCB’s for EUDET: second setCurrent status: 5 sets in production, shall be assembled at Strasbourg in November
One set of PCB’s contain:
• Clock and JTAG distribution (“Clock Tree”)• Clock and JTAG assembling (“Clock Root”)
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EUDET Annual Meeting, Munich, October 2006
AMS 0.35 µm OPTO engineering run submission (June/July 2006)Current status: ready, delivery in this days
Structures of direct interest for EUDET
• Mimo*3M (MimoTEL): 256x256 pixels, 30µm pitch, 1KHz frame rate
• High Resolution Tracker: 512x512 pixels, 10 µm pitch, 300 Hz frame rate
• Mimosa16, the second prototype with a binary readout: 128x24 pixels, 25 µm pitch, on-chip column-level discriminator
• ADC: 5 bits• TS1819: on-pixel amplifiers & clamping
circuits
Final layout of the reticle
Two types of wafers with epitaxy layer thickness of 14 µm and 20 µm are used
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EUDET Annual Meeting, Munich, October 2006
Wafers delivery schedule
• Firs wafer (14 µm epi) to be used for yield study (Mimo*L) at the probe station
• Second wafer (20 µm epi) is cut at CMP and individual chips (non-thinned) ready to be used
• There is an open option for the purchase of four remaining wafers, if the first test results positive…
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EUDET Annual Meeting, Munich, October 2006
Sensors test status/scheduleSensors test status/schedule
Spatial resolution @30 µm pitch: 2 µmSpatial resolution @30 µm pitch: 2 µm
Mimosa9 beam tests spatial resolution, after recent data re-analysis:Mimosa9 beam tests spatial resolution, after recent data re-analysis:
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EUDET Annual Meeting, Munich, October 2006
High-precision tracker tests
• Few proximity boards with bonded chips should be available in October. Other system components (auxiliary board, DAQ) available and used already in the past for Mimosa15 tests.
• Detailed laboratory test results (calibration using Fe55 source) of at least one prototype expected before the end of 2006
• Beam test shall follow, schedule to be defined
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EUDET Annual Meeting, Munich, October 2006
Mimo*3M (MimoTEL) tests schedule(at Strasbourg)
• Chips available from mid-October on• Proximity boards populated and chips bonded before the end of
this year• JTAG programming model expected mid-January• Test results expected before March 2007
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EUDET Annual Meeting, Munich, October 2006
Mimosa16 tests schedule
• Chips available before end of October• Bonding PCB (relatively simple, daughter card for existing
Mimosa8 Proximity PCB) designed and fabricated (?)• Tests of analog part shall start at DAPNIA soon after bonding,
using existing Mimosa8 set-up• Laboratory tests of digital part expected to start at Strasbourg
from March on• Beam test in second half of 2007?
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EUDET Annual Meeting, Munich, October 2006
Implementation plans: phase 2 (“the ultimate device”)
Serious discussion of the schedule and intermediate milestones should happen during this meeting
Shall we foresee one intermediate step more, i.e. full size, fast, binary readout chip? I believe yes; such a chip will be very useful for testing
of almost all building blocks of ILC detector, except for very high precision sensors
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EUDET Annual Meeting, Munich, October 2006
ConclusionsConclusions
Sensor production and delivery follows the original Sensor production and delivery follows the original schedule. All demonstrator components shall be schedule. All demonstrator components shall be
easily available several months before June 2007.easily available several months before June 2007.
For the second stage (digital readout sensor) the For the second stage (digital readout sensor) the preparatory work (see Marc’s talk) is progressing. preparatory work (see Marc’s talk) is progressing.
The detailed planning should be discussed soonThe detailed planning should be discussed soon
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EUDET Annual Meeting, Munich, October 2006
Appendix: latch-up Appendix: latch-up test structuretest structure
Simple circuit: four shift registers with slightly Simple circuit: four shift registers with slightly different digital cell layoutdifferent digital cell layout
Each shift has its own power supplyEach shift has its own power supplyThe goal is to measure latch-up cross section versus The goal is to measure latch-up cross section versus
LET (Linear Energy Transfer, or dE/dx)LET (Linear Energy Transfer, or dE/dx)Possible place (in Europe): Louvain (Belgium) or Possible place (in Europe): Louvain (Belgium) or
Jyvaskyla (Finland) Jyvaskyla (Finland)