Water Usage in the Semiconductor Industry

Jeff Hanson, P.E.Facilities Engineering ManagerTexas Instruments, Inc.May 13th, 2009

Texas Instruments

• Businesses– Semiconductors

• Analog• Digital Signal Processors• Wireless• DLP Technology• DLP Technology

– Education Technology

Semiconductors

Sensor & ControlsEducational &

Productivity Solutions$0.5B

Texas Instruments

Sensors &Controls

Educational &Productivity Solutions

Texas Instruments

Sustainability - The Triple Bottom Line

SocialSustainabilityCultural Identity

Environmental SustainabilityEcosystem IntegrityCarrying CapacityBiodiversity Environment

The balance of People,Profit, and the Planet

Cultural IdentityEmpowermentAccessibilityStabilityEquity

EconomicSustainabilityGrowthDevelopmentProductivity

SocietyEconomy

Human Well-Being

A sustainable system delivers services without exhausting resources. It uses all resources efficiently both in an environmental and economic sense.

Water Optimization Strategy

• Leverage industry associations for best practices and consumption data

• Utilize semiconductor manufacturing equipment data to drive improvements

• Leverage internal consumption data toLeverage internal consumption data to understand gaps and close

• Water Systems Team– Facilities organization which works with fab(s) to

optimize consumption and reduce cost

Industry Facts• Semiconductor Industry Association (SIA)

– Industry trade association representing over 70 US companies– Profile of the U.S. Semiconductor Industry

• U.S. 2008 Sales = $120 Billion • Worldwide 2008 Sales = $249 Billion • 2008 World Market Share = 48 percent of $249 Billion Market • U.S. Jobs = 216,400 • Percent of Sales Outside U S Market = 77 PercentPercent of Sales Outside U.S. Market 77 Percent • Capital Equipment = $13 Billion, 11 Percent of Sales • R&D Investment = $20 Billion, 17 Percent of Sales

• SEMATECH– Industry consortium that reduces the time from device research to

a manufactured product• International subsidiary ISMI (International SEMATECH Manufacturing

Initiative)

• 6 DielectricDeposition Steps

• 12 DielectricEtch Steps

• 6 Ta/Cu PVD Steps• 6 Cu Plating Steps• 6 Cu CMP Steps• 1 W CMP Step• 12 Wet Clean Steps

Interconnect130nm microprocessor

Wafer Processing Technology

Ion Implantation

W-CMPCopper DepositionPVD + ECPDielectric

DepositionDielectric

EtchCopper

CMPMetal

DepositionPVD + WCVD

DielectricEtch

DielectricDeposition

Shallow TrenchIsolation Etch

Shallow TrenchIsolation CMP

Gate OxideGrowth

Poly SiliconDeposition

Poly SiliconGate EtchShallow Trench

Isolation DielectricDeposition

Silicon Wafer • 16 Thermal Steps• 11 Implant Steps• 5 Etch Steps• 2 CMP Steps• 38 Wet Clean Steps

Transistor

Semiconductor Factory Water Consumption

Source: 2006 ISMI Water Balance Survey

Semiconductor Factory Water Production

Source: 2006 ISMI Water Balance Survey

Normalized Water Used

Gallons per cm2 Wafer Outs

Industry Average = 3 91 gal/cm2 wafer outs6

7

8

9

10

Industry Average = 3.91 gal/cm2 wafer outs

0

1

2

3

4

5

1442

2544

9749

5738

9471

3927

6395

3858

5155

7324

8656

3996

3238

3148

2467

3532

3500

5636

1352

5474

3389

6593

2824

3017

8345

8736

8299

7337

3665

5061

5037

4879

4289

Source: Semiconductor Industry Association

Normalized UPW UsedGallons per cm2 Wafer Outs

5

6

7

8

Industry Average = 2.53 gal/cm2 wafer outs

0

1

2

3

4

9471

5738

3927

1442

3858

2544

3532

3148

5155

7324

6395

5636

1352

3500

2467

6593

2824

9749

7337

4879

3389

8656

3996

8736

3238

3017

8345

5061

4289

5474

5037

8299

3665

Source: Semiconductor Industry Association

Equipment Vendor UPW Consumption Data

• Common wet clean hood recipe data shown

• Comparison of UPW rinse time across many companies

• Large variations present

0

100

200

300

400

500

600

Post

SC

1 R

inse

Ti

me

(sec

)

A B C D E F G H I J TI L M

• Large variations present for same process

0

100

200300

400

500

600

Post

SC

2 R

inse

Ti

me

(sec

)A B C D E F G H I TI K

Facilities Water Systems Team• World wide team with members from all major

manufacturing sites• Focus is on cost reduction and learning new water

technologies• Forum for best practice sharing

Develops strategy for recycle and reuse of “waste”• Develops strategy for recycle and reuse of waste streams– 1st cut → Spent rinse water– 2nd cut → “clean” acid waste water– Others

• RO reject• Water system instrumentation consumption

Typical Wet Process Tool Setup

PREFURNACE HOOD

SC-1 1OO:1HF

SC-2IPA

DRYER UPWRinse

SC-1 SC-2IPA

DRYERSC-1

RECYCLE IWW

SOLVENT

RESIST STRIP HOOD

UPWRinse

UPWRinse

UPWRinse

UPWRi

UPWRi

UPWRi

UPWRi

DRAIN TYPE

SC 1 SC 2 DRYERSC 1

IPASPIN

DRYERIPA

SOLVENT HOOD

SOLVENT

IWW

SOLVENT

IWW

Rinse Rinse Rinse Rinse

UPWRinse

UPWRinse

OrganicSolvent

OrganicSolvent

OrganicSolvent

Two Main Water Sources:City

WaterSpentRinseWater

Poor Quality High Quality

Spent Ultrapure Rinsewater

Two Main Water Users: CoolingTowers

UPWPlant

HighestQuality

Requirement

MinimumQuality

Requirement

Which source to send to which user?

DI Recycle System Schematic

R aw Water

S torag e Tank

P rim aryT rea tm ent

R .O. Wate r

S torage Tank

Ion E xchangeTrea tm ent

P olishing Trea tm e nt

P oint of Us e

D.I. R eturn

Recyc le

Rec yc le

Recyc le

Ult rap ure W ater

S to rage

O ther R ec la im

IW

IW

IW

IW

Spent Rinsewater Recycle Benefits:•Improved final UPW quality

• Less demand on the municipal water supply and waste water treatment systems

•Reduced chemical usage for ion exchange regenerations and waste treatment

• Less risk of municipal water supply variations

Risk Analysis

Reward

• City Water Offset• Chemical Savings• Increased savingsby recycling to low

#4

#3

#7

#2

#6

#1

$300,000

$400,000

$500,000

$600,000

Risk

by recycling to low end users• Improve water

quality

• Bio-fouling• Dumping Chemical

other than organics •Project not succeeding

• FAB impact• Equipment Malfunction• Project not succeeding

#5#8

$-

$100,000

$200,000

0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00

Review of Water Demand – 1st Pass

A = 850

B = 1705

City Water Demand

C = 315

A DI R = 250

Internal Re-use

Cooling

DIW Plant

B Brine Recovery = 270

A = 300

D = 150

D DI R = 125

F IWW Re-use = 280

E IWW Re-use = 150

% Water Re-used = 29%

TPU andScrubbers

gTowers

A = 50

D = 125

A Brine = 200

A DI R = 150

Total City Demand = 3495 Total H2O Demand = 4920 Total Internal Re-use = 1425*All values in gpm

Review of Water Demand– 2nd Pass

A = 850

B = 1705

City Water Demand

C = 25

A DI Recycle = 250

Internal Re-use

Cooling

DIW Plant

B Brine Recovery = 270

D DI R = 115A Brine = 130

DIW Plant

D = 35

D IWW Re-use = 250

F IWW Re-use = 280E IWW Re-use = 150

% Water Re-used = 46%

TPU andScrubbers

TowersA = 50

A DI Reclaim =150

Total City Demand = 2665 Total H2O Demand = 4920 Total Internal Re-use = 2255*All values in gpm

E DIR = 175

KFAB DIR = 185

A IWW Re-use = 300

RO Brine Recovery“Winner 2001 “Winner 2001 AWWA Bob AWWA Bob Derrington Derrington Award”Award”

Water Recovered 216 GPMYearly Water Savings $295,000Installation Cost $142,000Yearly Operating Cost $33,500

Conclusion

• The semiconductor industry is actively searching for more ways to optimize water consumption

• Benchmarking with industry and internal data will continue to drive industry water consumption down

• The “low hanging fruit” has been picked; new ideas are needed for existing water reuse barriers (reduce risk)