w. kucewicz a, a. a.bulgheroni b, m. caccia b, p. grabiec c, j. marczewski c, h.niemiec a a...
DESCRIPTION
Principle of SOI monolithic detector The idea: Integration of the pixel detector and readout electronics in the wafer-bonded SOI substrate Detector support layer High resistive (> 4 k cm,FZ) 300 m thick Conventional p + -n DC-coupled Electronics device layer Low resistive (9-13 cm, CZ) 1.5 m thick Standard CMOS technologyTRANSCRIPT
W. Kucewicza, A. Bulgheronib, M. Cacciab, P. Grabiecc, J. Marczewskic, H.Niemieca
a AGH-Univ. of Science and Technology, Al. Mickiewicza 30, 30-059 Krakow, Polandb Universita’ dell’Insubria, via Valleggio 11, 22100 Como, Italy
c Institute of Electron Technology, Al. Lotnikow 32/46, 02-668 Warsaw, Poland
This R&D has been undertaken within the SUCIMA project (Silicon Ultra Fast Camera for Gamma and Beta Sources in Medical Applications), supported by European Commission within 5-th Framework Program. One of its goals is the development of a monolithic sensor optimised for medical imaging applications, especially dosimetry of radioactive sources for brachytherapy and beam monitoring for hadrontherapy.
Keywords: silicon detector, active pixel detector, SOI technology
Development of Development of Monolithic Active Pixel Monolithic Active Pixel
Detector in SOI Detector in SOI TechnologyTechnology
Advantages of Advantages of the the SOI detectorsSOI detectors
As a monolithic device eliminates bump-bonding process and allows reduction of total sensor thickness reduction of multiple scatteringAllows using high resistive detector substrates and operation in
fully depleted region good detection efficiency, enables detection of particles with limited range in the silicon without backthinning processGives possibility to use both type of transistors in readout
channels increased flexibility of the design, design optimisation for different application
The SOI sensor may merge the advantages of the monolithic and hybrid detectors
Principle of SOI monolithic Principle of SOI monolithic detectordetector
The idea: Integration of the pixel detector and readout electronics in the wafer-bonded SOI substrate Detector support layer
High resistive (> 4 kcm,FZ)
300 m thick Conventional p+-n DC-coupled
Electronics device layer Low resistive
(9-13 cm, CZ) 1.5 m thick Standard CMOS technology
Tests with laser light and ionising Tests with laser light and ionising particles particles
W.Kucewicz SUCIMA 4
Sensitivity to laser lightGood linear response as a function of the charge generated by laser pulses (1 pulse corresponds to 3 MIP charge)
Sensitivity to beta particles Red histogram and line indicate cluster noise and its Gaussian fit, blue histogram and line indicate the signal from 90Sr beta source and its Landau fit
Sensitivity to alfa particles (short range particles)The average cluster pulse hight corrensponds to 25 MIP
Applications of the SOI detectorsApplications of the SOI detectors
SOI detectors: High charge signals corresponding to
minimum ionising particles (about 22000 e+e-), fully depleted
Attractive solutions for low energy radiation detection
Monolithic, flexibility of the readout electronics design (NMOS and PMOS in readout channel)
Possible option for vertex detectors
One of possible applications:Beam monitor in hadrontherapy
System basing on secondary electrons emission from a thin aluminium foil.
Kinetic energy of electrons = 20 keV particle range in silicon = 3 m
Detection of such electrons is possible in SOI detector without any backthinning process.
Beam monitor
Fully functional SOI detectorFully functional SOI detector in in production production
Optimised for medical imaging applications and high particle fluxOptimised for medical imaging applications and high particle flux Dimensions: 24x24 mm2, 128 x 128 = 16 384 channelsDimensions: 24x24 mm2, 128 x 128 = 16 384 channels 4 sub-segments with independent parallel analogue outputs4 sub-segments with independent parallel analogue outputs Cell dimensions: 150 Cell dimensions: 150 m x 150 m x 150 m m Signal per MIP: ~6 mV; Dynamic range: 300 MIPSignal per MIP: ~6 mV; Dynamic range: 300 MIP The basic detectors may be extended to the ladder, but with small dead area betweenThe basic detectors may be extended to the ladder, but with small dead area between
Functionally Functionally independent quarter independent quarter
of the detectorof the detector
9.6 mm
9.6 mm
Matrix of channels
Digital blocks
9.6 mm
9.6 mm
Matrix of channels
Digital blocks
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ConclusionsConclusions
An alternative solution of a monolithic active pixel detector, which allows efficient detection in high resistive substrate, has been proposed.First small area SOI pixel sensors have been fabricated.Preliminary tests with a laser light and a radioactive source
have indicated detector sensitivity for the ionising radiation. Satisfactory results of the tests of the small readout matrices
on the SOI test structures and prototype chips are a starting point for the design of the fully functional and large area SOI sensor.The layout and readout scheme of the detector with the
active area of 2 cm x 2 cm and consisting 4 independent by operation sub-segments has been proposed .The realization of the final SOI sensor will be completed this
year.