w. albert gu,
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2August, 2020 Analog Power Conversion LLC
W. Albert Gu, Ph.D., President & CEO
BSNE – National Tsing Hua U. (Taiwan); MSNE – U. of New Mexico; Ph.D. Engr. – Kansas State U.
Microsemi, TriQuint, Motorola, Sandia National Lab
Co-Founder of GCT (GaAs Foundry merged with WIN Semiconductor, Taiwan, in 2003)
30+ Years in RF Application Engineering with 15 Issued US Patents
Dumitru G. Sdrulla, CTO
BSEE & MSEE – Polytechnic Institute of Bucharest, Romania
Microchip/Microsemi/APT, IPRS-Baneasa (Bucharest), ICCE-Baneasa (Bucharest)
Key Technologist behind APT/Microsemi’s MOSFET, IGBT, RF MOSFET and SiC MOSFET & SBD
40+ Years in Power Device Design and Fabrication with 13 Issued US Patents & NumerousPublications and Foreign Patents
Sam S. Ochi, SVP – Driver Chain
BSEE & MSEE – University of California at Berkeley, CA
Microsemi, IXYS, Analog Devices, Maxim Integrated Products
Co-Founder of Maxim Integrated Products, and Leading Expert in Analog & Mixed-Signal IC Designspecializes in Driver IC Design for WBG Power Devices and Switch-Mode Full-Bridge Modules
40+ Years in Analog & Mixed-Signal IC Design with 31 Issued US Patents & Numerous Publications
3August, 2020 Analog Power Conversion LLC
Amaury Gendron-Hansen, Ph.D., Technical Lead – SiC
BSEE –College of Engineering, Supélec; MSEE –University of Paris; Ph.D. Microelectronics.– Univ. Paul Sabatier, Toulouse (All in France)
Microsemi/Microchip, GlobalFoundries, Freescale Semiconductor
Leading Expert in Power Device Design & Fabrication, Specializes in 4H-SiC & TCAD Simulations
15+ Years in Power Electronics and ESD Protection with 14 Issued US Patents & Numerous Publications
Les Szepesi, Technical Lead – Silicon
BSEE & MSEE – Massachusetts Institute of Technology, Cambridge, MA
Microsemi, Avago Technologies, Hewlett-Packard, FLIR Systems, Spacelabs, John Fluke Mfg.
Leading Expert in Si and SiC Devices Design & Fabrication including MOSFET, LDMOS, CMOS & HEMT
35+ Years in Electronics Design & Fabrication with 6 Issued US Patents & numerous Publications
Kamrul Russel, Ph.D., PE, Technical Lead – Thermal/Packaging
BSME – Bangladesh Univ. of Eng. and Tech.; MASc & Ph.D. – McMaster Univ., Hamilton, ON Canada
Christie Digital Systems Inc., Cinnos Mission Critical Inc., SmallPC
Leading Expert in Structural & Thermal Simulations, and Packaging & Assembly of Electronic Devices
12+ Years in Thermal/Fluidic/Mechanical Design & Modeling with 9 Peer-Reviewed Journal Publications
4August, 2020 Analog Power Conversion LLC
Silvaco – TCAD Device Design Tool
Victory OMNI 2D – All Silvaco TCAD Tools: Device, Process, Meshing, Solid Modeling, Pre & Post- Processing, Virtual Wafer Fab, Parasitic Extraction,
DeckBuild – TCAD Input Deck and Runtime Environment
TonyPlot – TCAD Visualization Tools
Maskview – TCAD Layout Tools
Cadence –Analog, Mixed-Signal IC Design Tools
Spectre Accelerated Parallel Simulator (APS) – Circuit-, Block- & System-Level SimulationTools at 5X Speed
Virtuoso ADE Explore – Circuit Simulator & Testbench, Parametric, Corners, and MonteCarlo Analyses
Virtuoso Schematic Editor – Multi-Sheet & hierarchical Design Entries at 5X Speed,Comprehensive Component Libraries, and Sophisticated Wire-Routing Capabilities
Virtuoso Layout Suite,
Assura Design Rule Checker (DRC)
Assura Layout vs. Schematic Verifier (LVS)
Analog Power Conversion LLC 52020
ANSYS – Multi-Physics Design ToolsStructural & Fluids Bundle– ANSYS Mechanical Enterprise: AIM Standard, Composite PrepPost, Fatigue Module,
SpaceClaim Direct Modeler, DesignXplorer, Rigid Body Dynamics– ANSYS CFD Enterprise: Fluent AND ANSYS CFX, PolyFlow, AIM Standard, DesignXplorer
SpaceClaim Direct Modeler, DesignXplorer, Chemkin Pro and FORTE
Electromagnetics BundleANSYS Alinks for EDA, ALinks for MCAD, ALinks for MCAD Parasolid, Distributed Solve
(DSO), Electronics HPC Pack, Electronics Desktop, HFSS (Includes EMIT & Savant), HFSS-IE Solver, HFSS-TR Solver, HFSS SBR+Solver, RF Option, SI Option, Icepak,DesignModeler 2, Maxwell 3D (Includes RMxprt PExprt), Optimetrics (For HFSS,Q3D Extractor, Maxwell), Q3D Extractor, Simplorer Advanced, ANSYS Siwave,SpaceClaim Direct Modeler
Other Design ToolsSolidWorks – Solid Modeling & CAD Tools
MathCAD – Engineering Calculation Tools
SPICE – General-Purpose Analog Circuit Simulator Tools
ADS – RF/Microwave Circuit Simulator (To be Acquired in 2021)
Analog Power Conversion LLC 62020
SiCAMORE Semi (Bend, Oregon)
SiC MOSFET and Schottky Barrier Diode
Silicon MOSFET, IGBT, FRED Diode
RF Silicon VDMOS with Al and Plated-Au Metallization
Radiation-Hardened Semiconductor Device
Episil Technologies Inc. (Taiwan)
SiC MOSFET and Schottky Barrier Diode
Silicon MOSFET, IGBT, Super-Junction MOSFET, FRED Diodes
GaN FET
X-FAB Semiconductor Foundries (Lubbock, Texas)
Silicon Analog IC
Silicon-on-Insulator (SOI) Analog IC
SiC MOSFET and Schottky Barrier Diode
Analog Power Conversion LLC 72020
APC’s Core Businesses are in Power Devices for RF &
Microwave Applications
APC’s Wide Expertise ( >160 Years, Combined) Spans:
Silicon – SBD, FRED, MOSFET, IGBT and Super-Junction MOSFET
SiC – SBD, MOSFET and MOSFET with Integrated SBD
Gate Driver IC for Si and Wide-Bandgap Semiconductor (SiC & GaN) Devices
Radiation-Hardened Semiconductor Devices
APC Has No Intention and/or Plan to Get into Switching
Power Electronic Businesses (Switching Speed < 500 kHz)
APC Only Offers Design Services to Customers of Switching
Devices for Non-RF&Microwave Applications
APC Never Competes against Its Design-Service Customers
Analog Power Conversion LLC 82020
Deep Knowledge on IP Landscape by Incumbents
APC’s Own IPs Offer to Design-Service Customers
Peace of Mind – Free from IP Infringement Concerns
APC Combined Design Experiences > 160 Years
Established Relationships with Wafer Foundries
Leveraging Economy-of-Scale in APC’s Supply Chain
Leveraging APC’s Deep Knowledge on Marketing in
Power Electronics
Leveraging APC’s Deep Knowledge on Long-Term
Reliability and Failure Analyses
Analog Power Conversion LLC 92020
Complete Ownership Model
Complete Design Ownership
Unlimited Global Marketing and Sales
Upfront Payments Include:
1) Design Service Fees and
2) Portion of (Forecasted) Future Profits
Higher Upfront Payments, Lower Overall Costs over Product’s Lifetime
Revenue Sharing Model
Partial Design Ownership with Royalties Levied on Product Sales
Revenue Sharing for 3 Years after Product Launch
Unlimited Global Marketing and Sales
Upfront Payment Covering Design Service Fees Only
Lower Upfront Payments, Higher Overall Costs over Product’s Lifetime
Analog Power Conversion LLC 102020
OTSSign-off
(1 wk)OTS – Objective Target
Specifications
Design Cycle (1)Design ➔ TCAD ➔ Design ➔ Tape-Preview Model Review out
(8 to 12 wks)
Wafer (1)Fabrication
(12 to 16 wks)
Evaluation (1)(2 wks)
Design Cycle (2)Design ➔ TCAD ➔ Design ➔ Tape-outPreview Model Review
(2 to 4 wks)
Wafer (2)Fabrication
(10 to 14 wks)
Packaging (1)
(4 wks)
Packaging (2)
(4 wks)
Evaluation (2)(2 wks)
Final DesignReview & Report
(1 wk)
Product Qualification& 1K Hour Burn-in
(12 wks)
Pilot ProductionWafer Fab & Packaging
(16 wks)
Production ReadinessBOM & Logistics Transfer
(2 wks)
QualificationReport
(2 wks)
After-SaleSupports
Analog Power Conversion LLC 112020
APC Also Offer Design Services for Scientific, Academic and Exploratory
Endeavors
Proof-of-Concept Design Service Includes
Joint Efforts in Determination of the Target Specifications
Single Pass Design Cycle on a Best-Effort Basis
Single Design Pass Consists of 1) TCAD Model, 2) SPICE Circuit Simulation, 3) Design Tape out,
4) Wafer Fabrication via Foundry Partner, 5) Die-Level Evaluation, 6) Device Packaging via
Assembly Partner, 7) Package-Level Evaluation, and 8) Delivery of Engineering Samples along
with Test Results
Sole Ownership of Intellectual Properties Results Independently from
APC Design Efforts
Joint Ownership of Intellectual Properties Results from Collaborative
Efforts between the Two Parties
Flexible Pricing Model
Fixed Design Fees Including Testing/Evaluation Ranges from $50K to $250K USD
Direct Transfer of Wafer Foundry and Packaging/Assembly Costs with 5% Surcharge asProcessing Fees
Analog Power Conversion LLC 122020
APC Headquarter1320 SE Armour Road, Unit B-2,Bend, OR 97702USA
W. Albert Gu, President & CEO
Email: [email protected]: +1 (541) 668-5833
Dumitru G. Sdrulla, CTO
Email: [email protected]: +1 (541) 788-5483
Sam S. Ochi, SVP
Email: [email protected]: +1 (408) 966-2888