uyemura evf-r presentation
DESCRIPTION
Uyemura EVF-R Copper Via Fill PresentationTRANSCRIPT
Thru-cup EVF-R
Technical Development Department
Central Research Laboratory
C. Uyemura & Co., Ltd.
Additive for Acid Copper Via Filling Plating
Thru-cup EVF-R
• Microvia Technology - Originally Driven by the Cell Phone Markets - has Spread to Automotive, Consumer & Military Markets
• The Drivers are Chip on Board, Flip Chips and BGA Components. As Well as a General Need for More Real Estate
• New Components with more Connections and Tighter Pitches Require the use of Micro Vias
Microvia Technology
• Conventional Drilled Vias have a Pitch Limit of ~0.80mm (31.5 mils)
• New Processors w/ Increased Pin Densities have a Pitch of 0.65mm (25.5 mil), Requiring Filled Micro Vias and Via-in-pad or Landless Via Technology
• Filled Vias have Increased Reliability for Thermal Cycling & IST
• More Reliable Lamination for Buried Vias
Thru-cup EVF-R
Via Fill Microvia Technology
Thru-cup EVF-R (1)
Chemicals Component at make-up while plating AnalyzeEVF-1A Brightener 1 mL/L 50 mL/KAH CVSEVF-B Carrier 10 mL/L 100 mL/KAH CVSEVF-R Leveler 2 mL/L 250 mL/KAH CVS
Features
1. Suited for Via Filling panel plating process in DC Mode. 2. Excellent blind via hole filling characteristics for holes with diameters larger
than 80 micro meters.3. Additive concentration controlled by CVS.4. Via Filling performance is not influenced by bath aging and can be
controlled easily.
Additives
Thru-cup EVF-R (2)
Mechanism of Via Filling
Brightener
Suppressor (Carrier,Leveler)
Brightener SuppressorSurface much low
Via Bottom little highuniform
Adsorption Deposition rate Bottom up fill
Thru-cup EVF-R (3)
Via Filling for Panel Plating
20 ASF-43 min.(19 micron )
20 ASF-43 min.(19 micron )
Via Filling (EVF-R)Via Filling (EVF-R)
PolishingPolishing
PatterningPatterning
StackStack
Process Flows
Button Plate
Laser Drill
Coat/Expose/Develop Resist
Resist Strip
Planarize
Panel Plate
Laser Drill
Via Fill Plate
Planarize
Thru-cup EVF-R
Electroless Copper
Electroless Copper
Via Fill Plate
Thru-cup EVF-R (4)
Cross SectionCross Section Laser Micro ScopeLaser Micro Scope
1.8 micron 1.8 micron
20 ASF-45 min.(20 micron )20 ASF-45 min.(20 micron )
Diameter: 80 micron Depth: 40 micron
Diameter: 80 micron Depth: 40 micron
Thru-cup EVF-R (5)
Via Filling for Panel Plating
20 ASF-34 min.
(15 micron )20 ASF-34 min.
(15 micron )
Diameter: 80 micron Depth: 35 micron
Diameter: 80 micron Depth: 35 micron
20 ASF-45 min.
(20 micron )20 ASF-45 min.
(20 micron )
Diameter: 145 micron Depth: 50 micron
Diameter: 145 micron Depth: 50 micron
20 ASF-45 min.
(20 micron )20 ASF-45 min.
(20 micron )
Diameter: 120 micron Depth: 55 micron
Diameter: 120 micron Depth: 55 micron
Thru-cup EVF-R (6)
Running Test
0
0.55
1.1
1.65
0.0 200.0 400.0 600.0 800.0 1000.0
(AH/L)
D (m
icro
n m
)
20 ASF-43 min.(19 micron )
20 ASF-43 min.(19 micron )
Diameter: 93 micronDepth: 60 micron
Diameter: 93 micronDepth: 60 micron
D
49AH/L49AH/L 307AH/L307AH/L
Tank Volume : 230LTank Volume : 230L
599AH/L599AH/L 994AH/L994AH/L
Anode maintenance
Thru-cup EVF-R (7)
A
B
C
Panel PWB board
500
400
(mm)
20 ASF-43 min.(19 micron)
20 ASF-43 min.(19 micron)
Diameter: 93 micron Depth: 60 micron
Diameter: 93 micron Depth: 60 micron
Tank Volume : 230LTank Volume : 230L
A B C
Thru-cup EVF-R (8)
Tensile Test
20 ASF-113 min.(50 micron )
20 ASF-113 min.(50 micron )
Tank Volume : 230LTank Volume : 230L
0
10
20
30
40
50
0.0 200.0 400.0 600.0 800.0 1000.0
Quantity of Electrolysis (AH/L)
Elon
gatio
n (%
)
0
10
20
30
40
50
Tens
ile s
tren
gth
(kg/
mm
2)
Elongation Tensile strength
Baking : 120oC – 2HrBaking : 120oC – 2Hr
Anode maintenance
Thru-cup EVF-R (9)
Equipment
Air agitation
About 40L/min air for 500 X 400mm board
Additive for Acid Copper Via Filling Plating
Parameter Operating RangeCuSO4.5H2O 190 - 220g/L
H2SO4 45 - 60g/L
Cl- 30 - 60mg/L
CD 1.5 - 3.5A/dm2
Temperature 22 - 28oC
Thru-cup EVF-R
Bath Compositions and Operating Conditions
Additive for Acid Copper Via Filling Plating Features
Suited for Via Filling panel plating processes.
Plating is DC no Pulse Plating required
Excellent blind via hole filling characteristics for holes with diameters larger than 80 micro meters.
Additive concentration controlled by CVS.
Via Filling performance is not influenced by bath aging and can be controlled easily.
Thru-cup EVF-R
Additive for Acid Copper Via Filling Plating
• Suited for Via Fill Panel Plating or Button Processes.
• Plating is DC no Pulse Plating required• Short Plating Cycle Times (Less than 120 min.)• Excellent blind via hole filling characteristics• Additive concentration controlled by CVS• No Excessive Carbon Treating• No Pre-Dips or Flash Plating Required• Via Filling performance is not influenced by bat
h aging and can be controlled easily.
Thru-cup EVF-R
Additive for Acid Copper Via Fill Plating