ust company profile eng 201304semi-ust.com/file/work/ust_company_profile_eng_201304.pdf ·...
TRANSCRIPT
Universal Semiconductor Technology
WWW.SEMI-UST.COMServices provide by UST CO.,LTD
UST Co.,Ltd will put customer' need before us andpromise that all UST staffs will do their best for maximization of satisfaction
Head Office and R&D CenterTechno Park D-908, Yatap-Dong 151,Bundang-Gu, Seongnam-City,Gyeonggi-Do, KOREA (463760)
TEL : +82-31-604-1004FAX : +82-31-711-6344E-mail : [email protected]
Clean Room & Facility150-1, Seongju-ri, Wongog-myeon,Anseong,Gyeonggi-do, KOREA (456-812)
E-mail : [email protected]
Yatap Subway Station
Head Office and R&D CenterTechno Park D-908, Yatap-Dong 151, Bundang-Gu, Seongnam-City, Gyeonggi-Do, KOREA (463760)
Clean Room & Facility150-1, Seongju-ri, Wongog-myeon, Anseong,Gyeonggi-do, KOREA (456-812)
CEOCEO
AccountingTeam
Sales TeamSales Team
R&D Dept.R&D Dept.
TRACK Dept.TRACK Dept.
CMP Dept.CMP Dept.
Engineering Team
Engineering Team
EquipmentTool Dept.EquipmentTool Dept.
We’ve got your solution Semiconductor Equipment toolUST supplies FAB, SUB/FAB of semiconductor equipment and specialize refurbishment.
TEL MARK-7,8 and ACT-8,12 Modification, Up-grade and Overhaul System Configuration Free change, Modification and up-grade.Open Cassette Type to SMIF Type modification and Size conversion
6inch and 8inch Multi FlowCassette Unit and Robot modificationMapping Sensor Block modificationMain Robot Arm modificationCOAT Unit and Cup modificationDEV Unit and Cup modificationWDS/Plate modification
TEL MARK-II,V,VZ,7,8 & ACT-8,12 inch Conversion (2,4,5,6,8 inch)
TEL MARK-II,V,VZ,7,8 and ACT-8,12 의 2nd Source Parts and Unit Fast delivery and low-cost and same condition with OEM partsCassette stage assembly manufactureC/S Arm, Main Arm (Ceramic, Vacuum Arm, Aluminum and Anodizing Type) manufacturePlate (LHP, HHP, CPL, HCP, ADH, HEL and CP Power Supply) manufactureFan Filter Unit A,B Type (Include HEPA Filter)Oven Central Stack manufacture of TEL ACT 8,12
L/E Tank (45cc, 100cc, 150cc, 200cc, etc) manufactureTEL MARK and ACT SMIF Type Unit manufacture of same condition with OEMCOAT Nozzle Assembly (EBR, Back Side Rinse and Photo Resist Nozzle Tip) manufactureDEV Nozzle Assembly (H, SH, Spray and Stream type) manufacturePlasma to TFT LCD modification and upgrade for TEL Mark on Low Cost
2nd Source parts Unit of TEL Mark-II, V, Vz, 7,8 and ACT-8,12
Chemical Cabinet / Auto Chemical Supply System Overhaul and upgrade
CSS or Manual Supply or Both supply modificationBuffer Tank Auto Exchange Type System modificationSolvent/Develop/HMDS Chemical Supply System modification and productionResist Cabinet Photo Resist Auto-Exchange modification and productionAuto Drain Controller and Tray modification and production
TEL Clean Track Mark and ACT-8,12 Hot and Cooling Plate
Hot / Cooling Plate ProductionCPL, HCP, ADH, LHP, HHP Assembly ProductionHot Plate Modification (LHP ⇔ HHP, CPL ⇔ HCP)Thermo Controller ProductionSame condition with OEMThermo Controller and SMC 200mm / 300mm ‘s Circulator Repair
TEL/DNS/SEMES Spin Scrubber Refurbishment and Overhaul
6inch and 8inch Multi flowCassette Unit and Robot modificationMapping Sensor Block modificationConsumable Parts Support2nd Source Parts SupportController up-grad and changeLabor and Service Support
Stepper HP Laser 5711X Series Repair
MODEL MACHINEG Line I Line
5517A NSR-G6 , G7 , G8 NSR-I6 , I7 , I8 5517B NSR-I9 , I10 , I11 5517C NSR-I12, NSR-I14
REFERENCEFREQUENCY BEAM DIAMETER POLARIZATION INDICATORS SHUTTER
5517A 1.5 MHz to 2.0 MHz 6mm f1 Horiz f2 Vert LASER ON READY
Open,Reduced, Closed
5517B 1.9 MHz to 2.4 MHz 6mm f1 Horiz f2 Vert
+15V POWER ON -15VPOWER ON LASER ON READ
Y
Open, Reduced,
Closed
5517C 2.4 MHz to 3.0 MHz
6mm(std) 3mm(5517C-003) 9mm(5517C-009)
f1 Horiz f2 Vert+15V POWER ON -15V
POWER ON LASER ON READY
Open, Reduced,
Closed
5517D 3.4 MHz to 4.0 MHz 6mm f1 Horiz f2 Vert
+15V POWER ON -15V POWER ON LASER ON READ
Y
Open, Reduced,
Closed f1 is the lower frequency, and f2 is the higher frequency. The Agilent 5517A is the basic head.
The HP Laser’s Model with Machine
The HP Laser 5517x Specification
Stepper LSA (Laser Step Alignment) / LIA Repair
LSA(LIA) Model Out Put Polarization Mode Wavelength
LSA(5mW) ≥ 5mW 500:01:00 TEM00 632.8nm
LIA(10mW) (Option) ≥ 10mW 500:01:00 TEM00 632.8nm
LAS (5mW)
LIA (10mW)Repair
LSA and LIA Specification
EPO2226/EPO2228Trouble Shooting and Labor serviceFree conversion between 6inch and 8inchI-Head repair and change2nd Source Parts support-Rotary Joint production and modification-I-Head production and modification-Consumable Parts support
EBARA EPO2226,2228 modification, up-grade and Overhaul
Single/Double-Layer PCBMulti-Layer PCB (4Layer ~ 26Layer)P.C.B Art WorkMetal / Flexible PCBMicom Firmware DevelopWire DesignBuild up etc.
P.C.B (Printed Circuit Board) Art-work and Assembly Support
OEM / ODM R&D Service
We are provide the special and improved semiconductor machine which has applied creative controller and developed by ourselves
Development process chartDevelopment Planning and Review - Item Concept arrangement - technology deployment for Item and Review - Making a Development PlanProduct Design - Product Features- 3D Rendering or Make a Design Mock-up and AssemblyThe design and mold development- Product Features- Make a each Standard Plane for Mechanism,
Electronic and Circuit- 3D modeling design and 2D drawing - Mold supplier selection and order - Parts assembly, test and review- Written specifications of Product and Parts
Product Design and Development Support
OEM / ODM R&D Service
Wafer Pre-Aligner- Wafer Size (2inch ~ 18inch)- Notch, Flat Wafer, Ring Type, Thin Wafer (50um)- Si, Glass, Film, Sapphire - Compact Size- Fast Alignment (< 3.5sec)- High Performance Accuracy and Repeatability- Easy to use and Install- Ethernet , RS-232 Communication- Auto Detect function of Notch and Flat Type - Si, Glass, Sapphire Type Simultaneous use - Wafer Edge Crack and Broken Detect - 2inch ~ 12inch Simultaneous use (CCD Stage Moving Type)- Poor Coating and Cracked wafer support alignment - Crack Point's degree and quantity information output function (max. 500ea)- Covered Tape at Notch point by Laminator support alignment - Wafer Serial Number Reading, Detect by OCR and output information
Wafer Pre-AlignerNormal Type Wafer Pre Aligner Feature
Edge Crack Detect
Compact Embedded System
Wafer Vision Function by CCD- Compact Embedded System (Window XP OS)
Auto Track Spinner System2~4inch, 6~8inch, 12inchInch Multi Flow ProcessCompact and Small Size Sapphire, Glass, SiPSS, MEMS, Bumping processProgrammable EBR, Back Rinse Bar Code System (Optional) and USB connection
Auto Track Spinner SystemGeneral Specification 1) Main frame with system controllera) System Controller
- User Friendly Software Based on PC Windows XP- User Interface : 15” LCD Touch Screen
b) Program Recipes- Recipe Editing / Storage: Process, Flow, Dummy Dispense and Recipe can be made and modified by Operation Panel
- Flow Recipe: Almost Operation of Machine can done by Recipe on Touch Panel
- Recipe Capacity: Unit Recipe : 50 sets each of 20 step
c) Throughput: > 60 wafers, depend upon process2) System lay-outa) 2~4inch Main Body Size : 1,700(W) X 1,400(D) X 1,600(H)b) 12inch Main Body Size : 2,100(W) X 2,000(D) X 2,100(H)
NEW Miracle 4-Spin Auto Track Spinner SystemGeneral Specification 1) 2COAT 2DEV SYSTEM2) High Throughput3) More Compact Size 4) 2~4inch Main Body Size :1370 x 1340 x 1580
NEW Miracle 4-Spin Auto Track Spinner System
BLDC (BRUSHLESS DC) MOTOR FAN FILTER UNIT
BLDC MOTOR1.Excellent Speed, Toque and Safety2. Compact and High Powerful Speed3. energy-saving4. High Strength and Long life Gear Head5. Low noise6. High Effectiveness7. Strong against Particle induction by FAN
Analog Control AC MOTOR FAN FILTER UNIT
New Digital Type BLDC FFU
- Support Chemical Filter- Installed ULPA Filter- Various Size and Option- Provide the Aging Test Data- Quickly Response- Remove the Particle induction by BL Motor
Application Machine- Track System. Etcher, Spotter, EEPM, Etc
Test Room for FFU (Fan Filter Unit)
DIGITAL CONTROLLER1.RS- 485 Communication2. Remote Controller3. Wide and Fan Speed Range (0~100 Step)4. Monitoring Lamp
Manual Spinner Coater / Develop / StripperThe machine has designed and manufactured a compact and easy-to –use spin coater.The process recipe can saved 20ea and provide the simple GUI
Application- University, R&D center and etc. Chip processing, PR Coating / Developing / StrippingWafer- FPD / GaAs / GaNi / OLEDSpecification- Substrate Manual Loading, up to 12inch- Operation : Manual operation switch (Tachometer, Timer), Micom or PLC