×
Log in
Upload File
Most Popular
Study
Business
Design
Technology
Travel
Explore all categories
The top documents of poore120
A More Business-centric Approach to help Reduce Business Continuity Risk
99 views
Siebel Analytics in IBM: Building a Sense & Respond Solution
236 views
OBI Analytics in IBM
620 views
US Patent 4862322 - Improved Semiconductor Device Packaging Structure
79 views
US Patent 5132351 Chemical Solder et. al
36 views
Multi-level circuit card structure - US Patent 5786986
60 views
SecureTech 2014: Risk, Business Continuity and Cybersecurity - A Resiliency Perspective
174 views
Bonding Method Employing Organometallic Inerconnectors (SuperConductivity Bonding Method) United States 5,503, 698 Pat5503698
67 views