uponor pex production underfloor heating wooden suspended floors · 2018-10-04 · uponor...

Wooden suspended fl oors

U P O N O R P E X

P R O D U C T I O N

U N D E R F LO O R H E AT I N G

W O O D E N S U S P E N D E D

F LO O R S

08 | 2006

2 U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s

Wooden suspended fl oors

The term suspended fl oors in this

brochure refers to a fl oor construc-

tion mainly consisting of wood

products where a load-bearing fl oor

surface of wood, chipboard, etc.

rests on wooden fl oor joists, either

solid wood or I-beams with fl anges

of wood, board etc.

The dimensions and recommen-

dations are according to common

use in the Nordic countries. Local

standards and regulations must

always be considered.

How to heat a suspended fl oor

Underfl oor heating in timber joist

fl oors generally requires more

thorough planning than instal-

lations in concrete. In concrete

screeded fl oors or wet installations,

the screed spreads the heat and

provides an even fl oor surface

temperature. Wooden suspended

fl oors do not conduct heat as

effi ciently. Heat diffusion plates

are required in order to distribute

the heat from the pipe to the fl oor

surface. In order to prevent the

surface temperature of the fl oor be-

ing uneven and to keep the supply

water temperature at a reasonable

level, the plates must have good

contact with the fl oor surface, and

as large a proportion of the fl oor as

possible must be covered by plates.

Uponor Underfl oor Heating in Wooden suspended fl oors

The loops are to be laid in sinuous

pattern and the temperature drop

in the loops at calculated tempe-

ratures should be no more than

5°C. The space between the fl oor

joists should be insulated to limit

downward heat loss through the

void below the joists.

In certain cases underfl oor heating

alone will not be adequate and

some form of supplementary hea-

ting may be required. Where high

heat fl ow density is required, the

surface temperature to obtain the

desired effect may be far too high.

A fl oor surface temperature of up

to 29°C is generally accepted, but

materials used in suspended fl oor

constructions may require lower

temperatures. Thick fl oor materi-

als with low heat conductivity will

require high fl ow temperatures.

Temperatures exceeding 60°C

should be avoided.

General information on wood

materials and

underfl oor heating

Wood is a hygroscopic material,

so its dimensions fl uctuate with

variations in atmospheric humi-

dity. When the humidity increases,

moisture is absorbed and the wood

swells. High moisture content may

also have a negative effect on the

adhesives used, e.g. in the manu-

facture of parquet fl ooring. At low

atmospheric humidity the wood will

shrink and cracks may appear bet-

ween the boards. In order to reduce

these fl uctuations, relative humidity

of 30-60% should be maintained in

the room where the wooden fl oor

is laid, both during and after instal-

lation. Types of wood that display

substantial fl uctuation (e.g. beech

and hard maple) should be avoided

unless they have been specially

treated to reduce this.

If the joists in a timber joist fl oor

have a high moisture content from

the start, the effective dehumidifi -

cation that the underfl oor heating

brings about will mean dimensional

changes in the joists. If under-

fl oor heating has been installed,

we therefore recommend that the

fl oor joists be dried to a maximum

moisture content of 10% before

the fl oor is laid. Measurements are

taken on the top side of the joists.

In newly-built houses, the building

materials normally contain a large

amount of moisture. This moisture

must be dried out as soon as the

house has been insulated. Under-

fl oor heating has been selected

as the heating system, it must be

taken into account that the process

of drying out the joist fl oor is ac-

celerated as soon as the underfl oor

heating is started up. It is necessary

3U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s

for the underfl oor heating to remain

on during the drying-out process,

even in summer.

How to choose an installation

method

Uponor can offer several different

solutions for installing underfl oor

heating in wooden fl oors. Choo-

sing the most suitable system will

depend on factors such as whether

it is a new building or an installation

in an existing fl oor, the distance

between the joists and the fi nal

fl ooring covering material. Descrip-

tion of the various installation met-

hods specifi es the most important

prerequisites for each system. It is

generally a good idea to consult the

structural engineer before choosing

an installation method. If the fl oor

is resting on I-beams, where cutting

notches in the beams’ fl anges is not

normally permitted, it is particularly

important that the installation

be designed correctly from the

beginning in consultation with the

structural engineer and that any

installation work be in line with his

instructions.

When comparing prices for the

various alternatives, always compare

the total installed cost, as the price

of the individual materials for the

underfl oor heating installation does

not generally provide a true picture.

Room regulation

An underfl oor heating system

should ideally be equipped with

room thermostats and actuators to

achieve maximum indoor comfort

in each room or zone. Regulating

the fl ow of warm water in the

underfl oor heating system can then

optimise the room temperature.

Overheating of the room may be

caused by extra heat generated by

sunlight, lighting, heat-generating

equipment and human activity.

Room thermostats maintain the

desired room temperature in a

particular room regardless of fl oor

structure and fl oor type. To protect

sensitive wooden fl ooring from

being exposed to temperatures that

are too high, it may be advisable

to use a room thermostat with an

external fl oor sensor that limits the

maximum permitted temperature

of the fl oor. A comfort controlling

system will reduce the amount of

wasted energy and provide environ-

mental benefi ts.


This alternative can be used regardless of the joist spa-

cing as long as the distance between the joists does not

exceed 600mm. The fl oor surface will be raised and the

pipe direction will be perpendicular to the fl oor joists.

Uponor Heat Emission Plate 20 on fl oor joists

Installation

• Nail or screw the battens (21 x

120 or 28 x 120 mm) using 2 nails

(screws) for each joist. When nailing

use galvanised fl uted wire nails.

The fi rst batten should be nailed

approx. 50 mm from the wall so

that the heat emission plate can be

positioned correctly.

• Leave half the distance between

the last two joists free of battens,

but nail a batten along the crossing

wall to support the chipboard.

Ensure that there is enough room

left to allow for the positioning of

the pipe coils.

• Lay the heat emission plates star-

ting from the outer wall. Leave 300

mm by the cross wall to allow room

for the turning loops. Cover as large

an area as possible with plates (70-

90%). The gap between the plates

must be at least 10 mm but not

more than 100 mm. The plates can

be divided at the break notches to

adapt the plate length to the room

length. Any leftover plates from the

fi rst groove can be used as the fi rst

plate in the second groove to mini-

mise wastage. The plates should be

A = Laminated parquet or laminated fl oor, min 7 mm

B = Chipboard, 22 mm

C = Possible vapour barrier

D = Underfl oor heating plate

E = Underfl oor heating pipes Wirsbo-pePEX, 20 x 2 mm

F = Secondary spaced boarding (battens), 21 x 120 mm or 28 x 120 mm

G = Floor joist

A B C D E GF

Installation with battens fi nishing above the last joist

Note! If the fl ooring is 15 mm laminated parquet

(with-out chipboard), use 28 x 120 mm battens.

The battens should fi nish above the last joist, 3

cm from the cross wall. The battens should not be

nailed to the last joist until the coil has been laid.

The parquet is laid on top, across the battens.

nailed fi rmly to the battens at one

side so the groove for the pipe runs

in a straight line.

• Position the pipes according to

the layout pattern. Mark the rou-

ting of the pipes in order to prevent

accidental perforation with screws.

• Lay vapour barrier as required.

• After pressure testing, the fl oo-

ring material can be laid.


This alternative can be used if the distance between

the joists is 600 or 300 mm. If ceramic tiles are used as

fl ooring, the joists must be at a maximum of 300 mm

c/c. The fl oor surface will not be raised, and the pipe

direction will be the same direction as the fl oor joists.

Installation

• Nail cross bars at intervals of 600

mm between the joists and nail or

screw the battens to these. The

top edge of the secondary spaced

boarding should be on a level with

the top edge of the joists. Leave an

opening for the turning loops for

the underfl oor heating pipes. Make

notches for the pipes where they

cross the joists, next to the crossing

wall. Always consult the structural

engineer before this is done.

Uponor Heat Emission Plate 20 between fl oor joists

• Lay the heat emission plates. Co-

ver as large an area as possible with

plates (70-90%). The gap between

the plates must be at least 10 mm

but not more than 100 mm. The

plates can be divided at the break

notches to adapt the plate length

to the room length. Any plating

remaining from the fi rst groove

can be used as the fi rst plate in the

second groove to minimise wastage.

The plates should be nailed fi rmly

A = Laminated parquet, 22 mm, or chipboard, 22 mm

B = Possible vapour barrier

C = Underfl oor heating plate

D = Underfl oor heating pipes Wirsbo-pePEX, 20 x 2 mm

E = Secondary spaced boarding (battens), 21 x 120 mm or 28 x 120 mm

F = Cross bar, 45 x 45 mm with partition 600 mm

G = Insulation

H = Floor joist

A B C D E GF H

A = Tiles

B = Sealing layer

C = Flooring plaster 13 mm

D = Flooring chipboard 22 mm

E = Underfl oor heating plate

F = Underfl oor heating pipes Wirsbo-pePEX, 20 x 2 mm

G = Secondary spaced boarding, 21 x 95 mm

H = Cross bar, 45 x 45 mm with c/c 600 mm

I = Insulation

J = Floor joist

A B C E F HG I JD

to the battens at one side so the

groove for the pipe is in a straight

line.


the layout pattern. Mark the rou-

ting of the pipes in order to prevent

accidental perforation with screws.





This alternative can be used when the distance between

the joists is 600 mm. It can be combined with heat

emission plates where the distance between the joists

varies. The fl oor surface will not be raised and the pipes

will be in the same direction as the joists.

Uponor Cassettes are not recommended where tile

fl ooring is laid.

Installation

• The cassettes should be laid out

from wall to wall. Cassettes can be

split so that the length is 385 or

770 mm. Cover as large an area as

possible, leaving a gap between

cassettes of at least 10 mm but not

more than 100 mm. The distance

between the wall and the fi rst and

last cassettes in each line must be

at least 250 mm to allow room for

the turning loops.

• After setting out and centring the

cassette, nail one side to the joist.

Then check, using a spirit level, that

the cassette is level with the upper

edge of the joists. Once the cas-

sette is level, nail the other side.

• Make notches for the pipes where

they cross the joists, next to the

crossing wall. Always consult the

structural engineer before this is

done.

• The underfl oor heating pipes

should be laid in the cassette groo-

ves according to the layout pattern.

Uponor Cassette 20 between fl oor joists

The central groove in the cassette is

to allow for movement of the cas-

sette in the event of temperature

variations, and should not be used

for the pipe.




Underfl oor heating in underfl oor

heating cassettes for 20 mm pipes

A = Laminated parquet, 22 mm, or chipboard, 22 mm


C = Underfl oor heating pipes Wirsbo-pePEX, 20 x 2 mm

D = Underfl oor heating cassette

E = Floor joist

A B C D E

Note! The fl ooring should be

nailed or screwed to the fl oor

joists. Some parquet suppliers

recommend laying a fl oating

fl oor, but in this case a

construction with battens and

underfl oor heating plates must

be used.


Installation

• Lay out the panels crosswise to

the direction of the joists. Begin by

laying out the fi rst turning plate at

the furthest point from the under-

fl oor heating manifold. Lay out un-

derfl oor heating chipboard panels

in the fi rst row. Adjust the length

of the panels so that any joints

between two panels are always

exactly above a joist. Crosscut so

that each panel spans at least two

joist voids. If any panel only spans

one void, it must be supported by

an extra cross bar in the middle of

the compartment.

• Begin the next and subsequent

rows with a turning plate in the

same way as the fi rst row. The joint

line between the turning plates and

the fi rst underfl oor heating plate

will be the same, but the underfl oor

heating plates are cut and laid in

Uponor Underfl oor Heating Chipboard 17

This alternative can be used regardless of the joist spa-

cing as long as the distance between the joists does not

exceed 600mm. The board is designed to be used ins-

tead of fl oor boards or fl oor deck and the fl oor surface

will be raised. The pipe direction will be perpendicular to

the fl oor joists.

For ceramic tiles, the joists must be at a maximum of

300 mm c/c.

A lower water temperature than with the other alterna-

tives can be used, as it is possible to use thinner fl oor

coverings, and the turning plate with pre-glued alumi-

nium plates will enlarge the active heated area. On the

other hand, with the 17 mm pipe the fl ow rate and the

pressure drop will be greater than in the 20 mm pipe.

A B C D E F

A = Laminated parquet, chipboard or laminated fl oor


C = Underfl oor heating plate

D = Underfl oor heating pipes Wirsbo-pePEX, 17 x 2 mm

E = Underfl oor heating chipboard, 22 mm

F = Floor joist

such a way that the joints on the

fl oor surface will be offset. (fi g)

• The chipboard panels should be

carefully glued along the tongue

and groove and against joists and

cross bars.

• Glue and screw the panels to

the joists. Countersink the screws

at least 5 mm. Do not fi ll the

countersink hole. Note! Do not glue

chipboard/turning plates where the

pipe passes beneath until the pipe

has been installed. See also the

section on making holes, page 8.

• Carefully clean the chipboard

of all chips and debris. Push the

heat emission plates down into the

chipboard grooves. Cover as large

an area as possible with plates. The

gap between the plates must be

at least 10 mm but not more than

100 mm. The plates can be divided

at the break notches to adapt the

plate length to the room length.

Any plates leftover from the fi rst

groove can be used as the fi rst plate

in the second groove to minimise

wastage.


the layout pattern. Begin by con-

necting one end of the loop to the

underfl oor heating manifold, then

draw the pipe to the beginning of

the loop fi eld. Use the holes in the

turning plate for coming up from

or dropping down into a joist fl oor

compartment.





1 The turning plates must have

support by the wall

2 Plates laid over a single

compartment must be centrally

supported from below by an

extra cross bar

3 The plates should always be

jointed on top of a joist and laid

so that the joints are offset.

Mounting pipeMounting Heat Emission Plate

Uponor underfl oor heating 17 is laid directly onto the fl oor joists and replaces the usual subfl oor.

Mounting underfl oor heating chipboard

3

2

1


When installing underfl oor heating

in timber joist fl oors the work must

be planned so that the loops do not

obstruct subsequent work. Always

begin by installing the underfl oor

heating manifold. Then decide

which loop is to be connected to

each outlet on the manifold and

how the feeder lines to the various

rooms are to be positioned.

In order for pipes to pass crosswise

to the direction of the joist holes

must be made. This must always

be done in consultation with the

structural engineer. In cases where

the underfl oor heating is installed

on top of the fl oor joists, ensure

that the support for each batten

and chipboard is not impaired.

For installations using fl ooring chip-

board that covers the entire fl oor

area, it is particularly important

for all crossing pipes to be in place

before the fl ooring panels are fi tted.

In order to allow a feeder pipe to be

laid under the chipboard, the gap

between the panels and the wall

must be at least 10 mm and the pa-

90 mm

40 mm

130 mm

Max 250 mm

20 mm

Assembly, making holes – general information

nels closest to the wall must remain

loose until installation is complete.

The notch in the joists for the

feeder pipe should be around 40

mm from the wall, with a maximum

width of 50 mm. If space is required

for several pipes, leave a support

under the grooved section of the

chipboard and make a new notch

so that it ends up under the non-

grooved section of the board. (see

fi gure).

1 0 U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s

Before the fl oor surface is laid the underfl oor heating installation must be pressure-tested, and the moisture content

of the fl oor joists checked. Always follow the fl oor manufacturer’s instructions with regard to maximum permitted

fl oor temperature, vapour barrier, installation method, etc.

Flooring

Vinyl or wall-to-wall carpet

If the fi nal surface material is to

be vinyl, wall-to-wall carpet, etc,

chipboard should be laid over the

underfl oor heating system as a bed

for the covering. The chipboard

should be laid across the underfl oor

heating pipes. Tongue and groove

should be fully glued along the

short and long sides. With Uponor

Underfl oor Heating Chipboard 17,

chipboard has to be at least 10 mm.

With 20 mm pipe options, 22 mm

Underfloor heating plate

Underfloor heating pipe

Vinyl or wall-to-wall carpet

Flooring chipboard

Laminated parquet

If parquet is required, 7-15 mm

laminated parquet can be laid direc-

tly on Uponor Underfl oor Heating

Chipboard 17. The boards should

be laid fl oating across the pipes.

Follow the parquet fl oor supplier’s

recommendations regarding pos-

sible gluing or whether the fl ooring

is to be snapped together.

15 - 22 mm laminated parquet can

be used directly on Uponor Heat

Emission Plate 20 on fl oor joists if

battens across the joists are 28 x

120 mm. The parquet is laid on top,

across the battens.

With cassettes or battens between

the joists, 7-15 mm parquet is laid

on 22 mm chipboard.

22 mm laminated parquet fl ooring

can be laid across the joists with

the cassettes or heating plates on

battens between the joists. The

boards should be nailed using gal-

vanized fl uted wire nails 60 x 23. In

addition, the fl oor manufacturer’s

Laminated parquet

Vapour barrier


Flooring chipboard


instructions must be followed regar-

ding gluing of end joints, etc.

Some parquet suppliers recommend

laying a fl oating fl oor on the whole.

As the fl ooring should be nailed or

screwed to the joist if cassettes are

used, a construction with battens

and underfl oor heating plates must

be used in this case.

chipboard should be used, and the

boards should be screwed to the

joists at intervals of approximately

600 mm.

1 1U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s

Tiles

Tile adhesive

Possible sealing layer



Flooring plaster

Flooring chipboard

Uniform timber fl ooring

Uniform timber fl ooring (fl oor-

boards) with a minimum thickness

of 22 mm may be used without

supporting chipboard with all 20

mm suspended fl oor options. With

a heat demand of approx 50 W/m2,

fl oor boards with a thickness up to

30 mm can be used without excee-

ding a water temperature of 60°C,

giving a fl oor surface temperature

of approximately 27ºC. The boards



Floorboard

Vapour barrier

Ceramic tiles

Following installation methods

are used in Sweden, but for more

detailed instructions, we recom-

mend that the tile and plasterboard

suppliers are consulted and that

their instructions are followed.

When tiles are to be used as fl oo-

ring material, Uponor Underfl oor

Heating Chipboard 17 is recom-

mended with a distance of 300 mm

between the fl oor joists. Alternati-

vely, Uponor Heat Emission Plates

20 can be used between fl oor joists

at the same distance. The Uponor

Cassette system should not be used

with tiled fl oors.

When laying ceramic tiles, fl oo-

ring plasterboard should be fi tted

fi rst on, perpendicular to, the

underlying fl ooring chipboard. The

plasterboard should be fully glued

to the fl ooring chipboard. With

the underfl oor heating chipboard

17 the length of the plasterboard

must be adjusted so that all joists

can be screwed to the chipboard

without damaging the pipe. Double

plasterboards facilitate construction

of slopes towards fl oor drains, but

the water temperature has to be

raised. Lay the fl ooring plasterboard

with offset long and short edges.

The two plasterboard layers should

be glued together using a suitable

adhesive.

When installing ceramic coverings

over underfl oor heating, damage to

the adhesive during setting should

be avoided by not allowing any

temperature fl uctuations in the

fl oor material during the fi rst month

after tile laying. If heating from the

underfl oor heating system will be

required before and/or during the

period tile laying is to be carried

out, the fl oor material can be supp-

lied with a maximum temperature

of 20°C. The fl oor material must be

kept at this temperature for at least

24 hours before and up to approx-

imately one month after completion

of tile laying. The heat of the fl oor

can then be increased gradually by

a maximum of 5°C per 24 hours

until normal operating temperature

is achieved.

Altering the temperature too

early or too quickly can reduce the

strength of the adhesive and could

thus shorten the useful life of the

ceramic covering.

should be laid across the underfl oor

heating pipes and fastened to the

joists as per the supplier’s instruc-

tions. Uniform timber must be well

dried out before fi tting.


Technical data

0

2

4

6

8

10

12

20 30 40 50 60 70 80 90 100

Heat demand (W/m2)

Floor temp

Floor cover 14 mm

Chipboard 17

�T

(K

)

Suspended fl oor 17 mm

fi g. 1

0

2

4

6

8

10

12

14

16

18

20

20 30 40 50 60 70 80 90 100

Heat demand (W/m2)

�T

(K

)

Floor temp

Floor cover 22 mm

Cassette 20/ Heat

emission plate 20

Suspended fl oor 20 mm

fi g. 2


Maximum loop length

Large rooms require more than one pipe loop in order to

limit the dimensioning pressure drop of the installation.

Long loops may also cause problems in maintaining an

even fl oor surface, and big differences in loop lengths

make it diffi cult to balance the system. In most installa-

tions, a pressure drop of up to 20 kPa in the underfl oor

heating pipes is acceptable. With a dimensioning water

temperature drop of 5°C, the maximum loop lengths

and the corresponding approximate heated fl oor areas

in the table can be used as a guideline.

Calculation of mean water temperature

Fig 1 and 2 describe the difference in tempera-

ture between the temperature in the room and

the mean water temperature in the pipe. Fig

3 shows how the required water temperature

increases to maintain the heat output with other

fl oor coverings.

Example with Uponor Cassette (Fig 2): A room

with a heat demand of 70 W/m2 and an air tem-

perature of 20°C needs a fl oor temperature of

26.5°C (20 + 6.5°C). The temperature under 22

mm chipboard will be 39.3°C (26.5 + 12.8°C) and

the mean water temperature in a cassette instal-

lation will be 52.0° (39.3 + 12.7°C).

If a plastic carpet is used (Fig 3), an extra tempe-

rature drop of 0.7°C has to be added, resulting

in a mean water temperature of 52.7°C. For a

temperature drop in the loop of up to approx.

5°C, the fl ow temperature can be calculated

as the mean temperature + half the tempera-

ture drop. With a temperature drop of 5° C the

required fl ow temperature will be approx 55.2°C

(52.7+ 2.5°C).

0

2

4

6

8

10

20 30 40 50 60 70 80 90 100

Heat demand (W/m2)

�T

(K

)

Wall to wall

Parquette 7 mm

Tiles

Plastic

Different fl ooring

fi g. 3

Heat demand 17 mm pipe 20 mm pipe

W/m2 l, m area, m2 l, m area, m2

100 75 13.5 80 23

70 90 17 98 29

50 110 21 120 35


Wirsbo-pePEX Underfl oor Heating pipes

Uponor Underfl oor Heating uses Wirsbo-pePEX pipes, a cross-linked poly-

ethylene (PEX) pipe with an oxygen diffusion barrier and the same excellent

characteristics as other Wirsbo-PEX pipes. The oxygen diffusion barrier is

glued to the Wirsbo-PEX pipe using a special adhesive polyethylene fi lm

and prevents oxygen leakage through the pipe walls causing oxidation of

the carbon steel components in the system. The oxygen diffusion barrier in

Wirsbo-pePEX pipes easily complies with the requirements of the applicable

DIN standard (DIN 4726). A mechanical protective layer of PEX is applied to

the outside of the diffusion barrier.

Allow at c/c 200 mm (17x2.0) mm is approx. 6 m/m2.

Allow at c/c 300 mm (20x2.0) mm is approx. 4 m/m2.

Uponor Cassette 20

Uponor Cassettes measure 1150 x 530 (excluding fastening band) x 0.6 mm

and are supplied with break notches for dividing into 380 and 770 mm long

sections.

Allow approx. 1.1 cassettes/m2.

Uponor Heat Emission Plate

The Uponor Heat Emission Plate 17 measures 1150x190x0.5 mm and is

supplied with two break notches for dividing into 190, 390 and 570 mm

long sections. Allow approx. 4 plates/m2 or 6 underfl oor heating plates per

underfl oor heating chipboard panel 2400x600 or 4 underfl oor heating plates

per underfl oor heating chipboard panel 1200x800.

The Uponor Heat Emission Plate 20 measures 1150x280x0.6 mm and is

supplied with two break notches for dividing into 190, 390 and 570 mm

long sections.

Allow approx. 2.5 plates/m2.

Uponor Chipboard 17

Uponor Underfl oor Heating chipboard is chipboard with grooves for instal-

lation of Wirsbo-pePEX pipes 17x2.0 mm. The panels are available in two

sizes, 2400x600x22 mm and 1200x800x22 mm. The grooves have a c/c

distance of 200 mm. Panels are supplied without underfl oor heating plates.

Allow at 2400x600 approx. 0,6 chipboards/m2

Allow at 1200x800 approx. 1,2 chipboards/m2

Uponor Turning Plate 17

The turning plate is equipped with grooves for the underfl oor heating pipes.

Underfl oor heating plates are pre-fi tted (pre-glued) in the groove on the

turning plate.

The grooves have a c/c distance of 200 mm and match the grooves in the

underfl oor heating chipboard. The turning plate constitutes a load-bearing

structure in areas where the underfl oor heating chipboard cannot be laid.

The dimensions of the turning plate are 600x400x22 mm.

Allow 1-2 plates per 2 pipe lengths.

Material data

Uponor AB T +46 (0)223 380 00

Box 101 F +46 (0)223 387 15

SE-730 61 Virsbo W www.uponor.se

Sweden

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