univacco alh series metal core ccl (english) temp · mm 1.6±10% univacco method 絕緣層厚度 um...
TRANSCRIPT
-
ALH系列金屬芯銅箔層壓板ALH系列金屬芯銅箔層壓板ALH Series Metal Core CCLALH Series Metal Core CCL
岱稜科技股份有限公司
UNIVACCO TECHNOLOGY
-
PCB OverviewPCB Overview
-
Classification• By layer
• Single-layer• Multi-layer
• By shape• Rigid• Rigid• Flexible• Rigid-flexRigid flex
• By forming• Cordwood (堆積式)
複線板• Multiwire (複線板)• SMT (表面黏著技術)
-
Classification• By base
• FR-4• Metal Core (金屬芯)• Ceramics (陶瓷)
PI (聚醘亞胺)• PI (聚醘亞胺)• PET
-
Metal-core PCB
• 傳統線路板Conventional PCB
Copper 銅箔FR-4
• 傳統鋁基板Metal-core PCB
Copper 銅箔FR-4PP sheet 接著片Metal-core 金屬板Metal core PCB
• 金屬芯基板 Copper 銅箔Thermal epoxy 導熱膠
Metal core 金屬板
Metal-core PCB Thermal-epoxy 導熱膠Metal-core 金屬板
-
Why Metal-core?
• Excellent thermal conductivity best• Excellent thermal conductivity, bestfor heat dissipation
• Extending life-span of electronic • Extending life-span of electronic device
• Space saving• Space saving• Reduce the high frequency
interferenceinterference• Increase mechanical strength
-
Univacco Position
Copperpp
Diele t i MC CCL MC PCB M d l (OEM)Dielectric MC-CCL MC-PCB Module (OEM)
AluminumEnd customerConsumers
-
U i ALH S iUnivacco ALH Series
-
Overview
銅箔 Copper Clad Circuit,pp ,Heat conductance
d導熱膠 Adhesive Heat conductance,
Dielectric, Adhesive
鋁板 AluminumHeat dissipation,Support ReinforceSupport, Reinforce
-
Structure• 單面鋁基板
Aluminum base CCL銅箔 Copper Clad
導熱膠 AdhesiveAluminum base CCL
單面銅基板
鋁板 Aluminum
• 單面銅基板Copper base CCL
銅箔 Copper Clad
導熱膠 Adhesive
銅板 Copper Plate
• 雙面銅箔基板 銅箔 Copper Clad• 雙面銅箔基板Double side CCL
導熱膠 Adhesive
銅箔 Copper Clad
-
Combination原材料 類別 厚度原材料
Material類別
Type厚度
Thickness銅箔
Copper Clad 電解 1oz, 2oz, 3ozCopper Clad , ,
絕緣導熱膠Dielectric 改良型環氧樹脂 60um, 120um, 180um
鋁板鋁板Aluminum Plate 5052 1.0mm, 1.5mm, 2.0mm
銅板C Pl t 壓延 1.0mmCopper Plate 壓延 0
Standard size600mm x 480mm520mm x 340mm480mm x 300mm
Standard packing 20pcs/box
-
Product Code
-
RecommendedRecommendedMaterial
應用Application
需求Requirement
建議選用Recommended
高亮度 LED 照明 Hi h th l d t 1 C 60 Ad 高亮度 LED 照明HB LED Illumination
High thermal conductance,Moderate breakdown voltage
1oz Cu, 60um Ad, 1.5mm AL or 1.0mm Cu
LED 路燈HB LED Street Lamp
High thermal conductance,Excellent reliability
1oz Cu, 超高導熱 60um Ad, 2 0mm ALHB LED Street Lamp Excellent reliability 2.0mm AL
LED 背光模組LED Backlight Module
High thermal conductance,Light & small shape
1oz Cu, 60um Ad, 0.8~1.0mm AL
電源供應模組 High heat capacitance 1 3oz Cu; 120 180um Ad 電源供應模組Power Module
High heat capacitance,High breakdown voltage
1~3oz Cu; 120~180um Ad, 2.0mm AL
太陽能板Solar Panel
High heat capacitance,Large conductivity area
1oz Cu, 60um Ad,2 0~3 0mm ALLarge conductivity area 2.0~3.0mm AL
中功率 LED 模組Medium Power LED
Low cost,Performance above PP
1oz Cu, 一般導熱 60um Ad, 1.0mm AL
-
Th l dh i i d d f U i lf
Thermal Adhesive• Thermal adhesive is produced of Univacco self-
developed formula to be distinguished from conventional PP containing glass-fiber
• Chemical formula and precision coating is core-technology of Univacco
調配 收捲調配 收捲
攪拌 塗佈
• For the best quality standard adhesive
攪拌 塗佈
• For the best quality standard, adhesivecoating to be done in clean room
-
Process FlowAdhesive Adhesive cutting
Pre-laminate
Aluminumcutting
Surfacetreatment
laminate
Piling Pressing Coldpressing
Coppercutting
Coldpressing Trimming
Protectionfilm
Finalcutting
FinalProduct Packing
-
Characteristic自有配方 單價低• 自有配方、單價低Competitive price
• 絕佳熱傳導表現絕佳熱傳導表現Low thermal impedance
• 無塵室塗佈Processed in cleaning room
• 精密塗佈技術、厚度均勻Hi h i i thi kHigh precision thickness
• 良好信賴性Good reliabilityGood reliability
• 符合 RoHSRoHS Compliance
-
Specification測試項目
Test Item單位Unit ALH-SAG-100615
測試規範Test Method
總厚度Total thickness mm 1.6±10% Univacco Method
絕緣層厚度 um 60±3 Univacco MethodDielectric thickness um 60±3 Univacco Method
拉力Peeling strength kgf/cm ≧2.0 IPC TM-650 2.4.9
耐熱測試Solder float ℃
300, passed after 60sec IPC TM-650 2.4.13
耐燃測試 V0 UL94Flammability V0 UL94
熱阻抗Thermal resistance ℃/W 0.20 ASTM D 5470
-
S ifi tiSpecification測試項目 單位 測試規範測試項目
Test Item單位Unit ALH-SAG-100615
測試規範Test Method
熱傳導率Heat transfer rate W/m.K 2.0 ASTM D 5470Heat transfer rate玻璃轉換溫度Tg point ℃ 105 TMA Method
耐化性耐化性Chemical resistance Passed IPC TM-650 2.3.2
表面阻抗Surface resistance Ω ≧1.0x10
14Surface resistance體積阻抗Volume resistance Ω.cm ≧1.0x10
15
破壞強度破壞強度Dielectric voltage kV ≧3 IPC TM-650 2.5.6
The above specification is based on testing result, not a guaranteed specification
-
Reliability Test
• Peeling strength maintained above 80% fromthe initial value after 240hrs under 85℃/85%RHthe initial value after 240hrs under 85℃/85%RH
• 300℃, 30sec solder float testing result is OK after a period of 240hrs
-
Technical Comparison
測試項目Test Item Unit Univacco NRK Bergquist LairdTest Item gq
Dielectric thickness um 60~120 80~200 75~150 100~300
Peeling Peeling strength kgf/cm 2.05 1.60~2.10 1.78 0.80~1.20
Thermal Conductivity W/m.K 1.5~3.0 1.8~6.5 2.2 1.0~3.0
Thermal Resistance ℃/W 0.20 0.24 0.45 0.35
Tg Point ℃ 105 100~180 90~150 105
Solder float 300, passed after 30sec300, passed after 30sec
300, passed after 30sec
300, passed after 30sec
-
Technical Comparison
測試項目Test Item Unit Univacco NRK Bergquist LairdTest Item gq
Dielectric Strength kV/mil 2.0 2.1 2.0 0.8
Dielectric Dielectric Constant 5.2 7.0 7.0 4.1
Surface Resistivity Ω 1.0x10
15 3.5x1014 1.0x1013 1.0x1013
Volume Resistivity Ω.cm 1.0x10
16 2.5x1015 1.0x1013 1.2x1014
Flame Resistance UL94 V0 V0 V0 V0Resistance
Note: Laird acquired Thermagon on April 2004
-
Thermal ConductivityThermal conductivity is capability of a material that indicates its ability to conduct heat.
It is defined as the quantity of heat (Q), transmitted during time Δt through a thickness L, in a direction normal to a surface of area A, due to a temperature difference ΔT, under steady state conditions
Q
T1 T2A
Q
A
L
-
Thermal ConductivityMaterial 材料 k Value
熱傳導率 (W/m.K)Copper 銅 400
Metal 金屬
Copper 銅 400Aluminum 鋁 150 ~ 237
Silver 銀 429Silver 銀 429Iron 鐵 71
Thermal-epoxy 導熱膠 0.8 ~ 6.0Resin 樹指 FR-4 0.36
PP 0.22Ai 空氣 0 025
Others 其他Air 空氣 0.025
Pure Water 純水 0.6
-
Thermal Resistance
Thermal resistance is temperature diff t t h it difference across a structure when a unit of heat energy flows through it in unit time.
Q
T1 T2A
L
-
Thermal Resistance Test
• Based on ASTM D 5470• Sample dimension 31mm x 31mm• Specimen placed at the centre• Stress force 30kgf• Stress force 30kgf• Cooling by air/water with
1500cc/min volume• Measure for 200 minutes average
result
-
Test Result Comparison
測試產品 單位測試產品Test Item
單位Unit
Univacco TCP 60um NXX-8
Univacco TCP 120um
Q (Heat) Watt 84 9 85 0 85 1Q (Heat) Watt 84.9 85.0 85.1
ΔT (Temp Difference)
℃ 17.0 20.7 41.7
R (Thermal Resistance)
℃/W 0.20 0.24 0.49
-
General Application
• 高亮度 LED 模組High brightness LED moduleHigh brightness LED module
• 電源供應器 (轉換器)Power module (conversion device)Power module (conversion device)
• 汽車電器系統、ABS系統Automobile electrical system ABS systemAutomobile electrical system, ABS system
• 馬達控制模組 (變頻器)M t t l d l (i t )Motor control module (inverter)
• 電腦伺服器C t Computer server
-
General Application
-
LED Application
• 建築照明,藝術照明Architecture and decorative illuminationArchitecture and decorative illumination
• 車頭燈Vehicle head-lightinge c e ead g t g
• 路燈,街燈Street lamp平面顯示器背光模組• 平面顯示器背光模組FPD Backlight module
• 一般照明 (家用照明)• 一般照明 (家用照明)General lighting (home appliance)
-
Production Capacity
-
Potential Competitor
Item Unit FR-4 MC-CCL CeramicsItem Unit FR 4 MC CCL Ceramics
Price Low Moderate High
Process Ability OK OK BadProcess Ability OK OK Bad
Thermal Conductivity W/m.K 0.36 1.5~12.0 70~200
Thermal Resistance ℃/W 3.2 0.2~0.5 0.03
Dielectric um 75~160 60~300 800umThickness um 75 160 60 300 800um
-
LET’S TALK MORE