um10395 uba2014 evaluation board - nxp semiconductorsdocument information um10395 uba2014 evaluation...

UM10395UBA2014 evaluation boardRev. 2 — 16 September 2010 User manual

Document informationInfo ContentKeywords UBA2014, evaluation board, TL, CFL

Abstract This user manual describes the UBA2014 evaluation board, which is designed to be a flexible tool for demonstrating the many UBA2014 fluorescent tube driver applications.

NXP Semiconductors UM10395UBA2014 evaluation board

Revision historyRev Date Description

v.2 20100916 • Illustrations amended to new standard• Section 11 “Legal information” amended to include new items

01 20091014 First issue

UM10395 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.

User manual Rev. 2 — 16 September 2010 2 of 25

Contact informationFor more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]


1. Introduction

This document describes the UBA2014 evaluation board. The board is designed to be a flexible tool that demonstrates the many different applications that are possible with the UBA2014 fluorescent tube driver. Please note that this board is not a complete ballast design for fluorescent tubes. The default setup is made such that a T5 HE 35W fluorescent lamp can be demonstrated.

2. Safety warnings

The board is intended as an evaluation board to build different TL and or CFL applications. To optimize flexibility, almost no protection is built in (except for IC internal protection). The board does not conform with any safety norm.

WARNINGS:

• Do not supply voltages to the board without a daughter board correctly inserted. Failing to do so may damage the board.

• Always operate with burner (lamp) connected to the board and connected to the resonant circuit. Failing to do so may damage the board.

• Many parts contain dangerous high voltages. It is necessary to take relevant safety precautions before using this board.

• Do not touch any part of the board during or shortly after operation of the board.

WARNING

Lethal voltage and fire ignition hazard

The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. This product shall never be operated unattended.




3. Board description

The board consists of two separate Printed-Circuit Boards (PCBs). The main board with the resonant circuit and a small daughter board with the UBA2014 IC.

3.1 Daughter boardThe daughter board contains the UBA2014 IC with the preheat, sweep and oscillator capacitor, the VDD generation and some other low voltage components.

The daughter PCB can be easily replaced in case of damage. Care should be taken that the board is inserted properly. Pin 11 has been removed from the daughter board to prevent the board being inserted incorrectly.

Fig 1. Daughter board

019aaa720




3.2 Main boardThe main board has all the other necessary circuit to make a Tubular Lamp (TL) or Compact Fluorescent Lamp (CFL) application. The board consists of the following:

• DC and AC input connector• Dimming input • 2 sockets for FETs• 2 different transformers• Area for experiments• Connections for up to 4 burners.

Fig 2. UBA2014/21 main board with UBA2014 daughter board inserted

019aaa721




4. Schematics

The schematics of the daughter board with the UBA2014 IC can be found in Figure 3. The settings for the oscillator and sweep are R1 = 33 kΩ (to pin IREF), C3 = 100 pF (to pin CF) and C1 = 330 nF (to pin CT). This will provide a minimum oscillator frequency of 40.5 kHz and a preheat time of 1.8 s.

Fig 3. Daughter board with UBA2014 circuit (version R1B)

019aaa273

33 kΩ

R61 kΩ

C1

330 nF/16 VCSN 1

21

1 15CT CSP

CSP

2CSW

3CF

4IREF

14VREF

7VDD

C2

C910 nF

220 nF/16 V

21

C5 2DNP

1

C6

1 nF/500 V

21

C4

100 nF

21

Vref

C3

A1

R1

100 pF

21

2

R2240 kΩ

1

2

R42.2 Ω

1

2

R510 kΩ

2

1

R3240 kΩ

1

2

Vbrg

1

2

C81 μF/25 V

1

2

C75.6 nF/50 V

1

2

C1056 nF/50 V

1

2

C11100 nF

1

2

V46.8 V

1

2

1

V1

BAS29

V5

BAS29

21

21

21

33 kΩ

R7 21

UBA2014

V26.8 V

1

213.6 V

V312 V

1

2

5GND

CSP 2Vref 3LVS 4SH 5GH 6

PCS 7Vbrg 8

GL 91011

VDD 12

16CSN

CSN

10GH

GH

11SH

9FVDD

6GL

GL

13LVS

8PCS

PCS

PCS

12ACM

X1

header 12



xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

UM

10395

User m

anual

NXP Sem

iconductorsU

M10395

UB

A2014 evaluation board

019aaa254

43 kΩ

R221 2

0 Ω

R22 1

1X90 TP

1X92 TP

1X94 TP

1X96 TP

0 Ω

R42

12

10

9

7

1

43 kΩ

R231 2

47 kΩ

R241 2

C1

c68 nF/400 V

1 2

C4

33 nF/100 V

0 870 401

T1

1 2

C5

33 nF/100 V

1 2

47 kΩ

R251 2

r

C17680 nF50 V

R1033 Ω2 W

1

2

1

1

2

2

V121N4937

V11

1N4937

r

Y10jumper

LCS

mp current sense circuit

220 kΩ

R201

VDC

Vbrg2

connection for daughter board

X89

1 X39

header 3

2

3

All information provided in this docum

ent is subject to legal disclaimers.

© N

XP B.V. 2010. All rights reserved.

Rev. 2 —

16 September 2010

7 of 25

Fig 4. Main board half-bridge and resonant circuit - (version R1C)

X78 TP

2

1

1

2

1

2

1

6

5.6 kΩ

R381 2

0 Ω

R391.2 kΩ

R371

1

LVS2

Cd

76

X114header 2

X115header 2

X2

socket 3

Dplaced in header

V62SK3569

S

G

Dplaced in header

V32SK3569

S

G

Y5jumpe

C64.7 nF2000 V

1

2

C19470 nF63 V

1CSN

1 2 3

2

1

2

C121 nF100 V

1

2

C1110 nF100 V

1

2

C182.2 nF100 V

1

2

1

2

R3656 kΩ

1

2

R3556 kΩ

1

2

R91 Ω2 W

1

2

R81 Ω2 W

1

2

R61 Ω2 W

1

2

1

2

R32100 kΩ

R311 kΩ

1

2

V161N4937

Y6jumpe

Y8jumper

Y9jumper

PCS_2021

PCS

la

GL

SH

GH

33 Ω

R31 2

33 Ω

R11 2

8.2 kΩ

R51 2

1 kΩ

R71 2

2

3

1 X14

socket 3

2

3

1CSN

ground connections foroscilloscope probes

1

socket 13

header 2

X341

2

Y7jumper

header 2

X321

2X33

header 3

X79 TP2CSP1

X80 TP3Vref1

X81 TP4LVS1

X82 TP5SH1

X83 TP6GH1

X84 TP7PCS1

X85 TP8Vbrg1

X86 TP9GL1

X87 TP101

1

X104TP

11

X88 TP12VDD

connector position 11glue sealed to preventerroneous insertion ofdaughter board

1

X120 TP13PCS_20211

1

X105TP

1

X106TP

1

X107TP

1

X102TP

1

X108TP

1

X103TP

1

X109TP


Fig 5. Main board input section

019aaa253

R2775 kΩ

C1647 μF/350 V

1N4937

V1

1.5 mH

L1

Fuseholder 5x20

F1

2 A

F2 Y12Cover

X3

MKDS 2.5/2-5.08

V2GBU8K

C1547 μF/350 V

VDC

2

1

R3375 kΩ

2

1

R2975 kΩ

2

1

R3475 kΩ

2

1

1

2

1

12

14

2

3

2

C347 nF/305 Vac

1

2

C247 nF/305 Vac

11

1

2

2

2

X1

VAC In = 230 V 50 Hz

VDC In = 400 V

MKDS 2.5/2-5.08

1

2

Fig 6. Main board dimming input

019aaa252

R1911 kΩ

33 kΩV15DNP

C1410 nF/100 V

R18

75 kΩ

R40

X68

MKDS 2.5/2-5.08

Externaldimming voltage

0 V to 10 V

1

1

1 2

2

1

2

1

2

1 2

2

VDD

CSP

Fig 7. Main board transformer T2/T3

019aaa274

11

1

1

1

1

1

1

1

1

1

10X70 TP

X67 X70

9X72 TP

X72

8X74 TP

X74

7X76 TP

X76

X67 TP

SH

2X69X69 TP

3X73X73 TP

4X75X75 TP

5X77

2 mH

T2

DNP

15 μH

15 μH

2.5 mH

3 mH

3.5 mH

4 mHX77 TP

6X91X91 TP

21

X117header 2

Y11jumper




Fig 8. Main board lamp connectors and experimenting area

019aaa255

X110header 2

1 2

X111header 2

1 2

X112header 2

1 2

X113header 2

X8LAMP 4

EX

PE

RIM

EN

TIN

G A

RE

AE

XP

ER

IME

NT

ING

AR

EA

MKDS 2.2/4-5.08

1

1 1X6 TP

2Y3jumper

Y1jumper

Y4jumper

Y2jumper

1 2X9 TP

1 3X11 TP

1 4X13 TP

X21LAMP 3

MKDS 2.2/4-5.08

1 1X20 TP

1 2X24 TP

1 3X27 TP

1 4X30 TP

X42LAMP 2

MKDS 2.2/4-5.08

1 1X38 TP

1 2X41 TP

1 3X46 TP

1 4X49 TP

X56LAMP 1

MKDS 2.2/4-5.08

1 1X55 TP

1 2X59 TP

1 3X62 TP

1 4X65 TP

1X90 TP

1X92 TP

1X94 TP

1X96 TP

1X19 TP

X17 TP1

SH

1X23 TP

1X26 TP

1X29 TP

X31 TP

X18 TP

X22 TP

X25 TP

X28 TP1

X15 TP1

1X37 TP

X35 TP1

SH

1X40 TP

1X45 TP

1X48 TP

X50 TP

X36 TP

X43 TP

X44 TP

X47 TP1

1X54 TP

X52 TP1

SH

1X58 TP

1X61 TP

1X64 TP

X66 TP

X53 TP

X57 TP

X60 TP

X63 TP1




5. Connectors

5.1 Power supply connectorsThe board can be supplied by either a high voltage DC or a mains AC input. For most applications the high voltage DC input should be used. In the final product, a Power Factor Correction (PFC) of choice may be used to replace the high voltage DC supply.

For some applications (such as CFL applications) the rectified mains is sufficient. In these cases a mains input of 230 V AC may be used.

5.2 Dimming inputThe UBA2014 has dimming functionality. An input with a voltage divider has been provided so that a 0 V to 10 V signal can be used. If no voltage is supplied to the dimming input, the lamp operates at approximately 50 % of its nominal power.

Please note that there is no galvanic isolation between the dimming input and the rest of the circuit, it is therefore advisable to use a mains isolation transformer to separate the board ground from the mains. If required, a Zener diode (V15) can be used as protection against input voltages that are too high.

5.3 Lamp connectorsThere are connections for four lamps on the board. In the following tables, the connectors are listed together with the names of the test points connected to them.

Table 1. DC high voltage input connector X1Connector Signal CommentX1-1 + + 400 V (DC) in

X1-2 GND ground

Table 2. AC input connector X3Connector Signal CommentX3-1 ~ mains 230 V (AC)

X3-2 ~ mains 230 V (AC)

Table 3. Dimming input connector X68Connector Signal CommentX68-1 + 0 V to 10 V dimming input (max 10 V)

X68-2 GND ground

Table 4. Lamp 1 (X56)TP CommentX55 connection for filament 1

X59 connection for filament 1






5.4 Test pointsEight ground pins are distributed over the board so that (oscilloscope) probes can be grounded without the need for long grounding wires.

Remark: A test pin is available for each pin of the daughter board.













Table 8. Ground test pointsTP Color SignalX102 black GND

X103 black GND

X104 black GND

X105 black GND

X106 black GND

X107 black GND

X108 black GND

X109 black GND

Table 9. Daughter board connectionsTP Name CommentX78 CSN negative input for the average current sensor [1]

X79 CSP positive input for the average current sensor [1]

X80 Vref reference voltage output [2]

X81 LVS lamp voltage sensor input [1]

X82 SH source for the high-side switch




[1] For UBA2014 daughter board.

[2] From UBA2014 daughter board.

5.5 Transformer T1Transformer T1 is used In the default setup, and it is connected with jumpers to lamp connector 4 (X8). The transformer specifications are listed in Section 6.1.

5.6 FETTwo NMOST FETs should be placed in X2 and X14. The supplied NMOSTs are Toshiba 2SK3569 (VDS = 600 V; ID = 10 A; RDSon = 0.54 Ω). When using different NMOS types, the values of gate resistors R1 and R3 (default 33 Ω) can be changed.

5.7 Current sense selectionThere are two ways to use current sensing. Sensing of the half-bridge current or sensing of the lamp current.

X83 GH gate output for the high-side switch

X84 PCS preheat current sensor input [1] (also connected to LVS via V5, R7/C11, R5/C10)

X85 Vbrg connection to VDC via R20 (220 kΩ)

X86 GL gate output for the low-side switch

X87 GND ground

X88 VDD low voltage supply

X120 PCS_2021 preheat current sense for the UBA2021 daughter board

Table 9. Daughter board connections …continued

TP Name Comment

Table 10. Default connection transformer T1Header CommentX110 insert to connect T1 to filament 1, lamp 4

X111 insert to connect T1 to filament 1, lamp 4



X114 insert to connect SH to transformer T1

X115 insert to connect T1 to resonant capacitor C6 (4.7 nF; 2000 V)

Table 11. Current sensing selectionX33 Pins 1 to 2 Pins 2 to 3half-bridge shorted open

lamp current open shorted




5.7.1 Half-bridge current sensingPins 1 and 2 of jumper X33 should be shorted in order to connect the sense resistor network in the half-bridge to the CSN pin of the UBA2014. With jumpers X32 and X34, different values of the sense resistor can be selected. In this case, X39 should be shorted between pins 2 and 3 in order to connect the lamp to ground.

5.7.2 Lamp current sensingPins 2 and 3 of jumper X33 should be shorted to connect the lamp current sense network to the CSN pin. X39 should be shorted between pins 1 and 2 to connect the lamp to the sensing circuit.

5.8 Using transformer T3To use the flexible transformer T3, jumper X117 should be inserted. This connects SH to pin 1 of the transformer. Table 13 shows the different inductance values that can be made with this transformer. The specifications of the transformer are listed in Section 6.2.

Two secondary connections are available for filament (pre-)heating, as shown in Table 14

Transformer T3 has a double footprint that enables the use of different types of transformers. The transformers are named “T2” and “T3” on the schematic drawings.

Table 12. Current sensing selectionX32 X34 Resistance (Ω)short short 0.5

short open 1.0

open short 1.5

open open 2.0

Table 13. Transformer T3 primary connectionsConnection InductanceX69 2.0 mH

X73 2.5 mH

X75 3.0 mH

X77 3.5 mH

X91 4.0 mH

Table 14. Transformer T3 secondary connectionsConnection InductanceX70 to X72 15 μH

X74 to X76 15 μH




6. Transformer specifications

6.1 Transformer T1

6.1.1 Schematic diagram

• Manufacturer: Würth Elektronik• Part number: 760870401

6.1.2 Electrical properties

6.1.3 Core and bobbin T1

• Core: RM-8 (Ferroxcube RM/I or equivalent)• Core material: 3F3, N87 or equivalent• Bobbin: RM-8 (12 pin, vertical type)

Fig 9. Transformer T1 schematic diagram

019aaa277

N3

10

12

7

96

1

N2

N1

Table 15. Electrical characteristics of transformer T1Properties Test conditions Value Unit ToleranceInductance N1 50 kHz/0.1 V L0 2.9 mH ±5 %

Turns ratio N1 to N3 N1: N2: N3 TR 26.1 : 1 : 1 ±3 %

DC-resistance N1 at 20 °C RDC1 2.7 ? maximum

DC-resistance N2 at 20 °C RDC2 180 m? maximum

DC-resistance N3 at 20 °C RDC3 180 m? maximum

Saturation current N1 dL / L = 20 % ISAT 1.6 A typical

Leakage inductance N1 200 kHz/0.1 V other windings shorted

LS 350 μH maximum

Coupling capacitance 20 kHz/1 V all windings CWW 11.0 pF typical

Hipot test 3 mA, 1s all windings HV 1.2 kV




6.2 Transformer T3

6.2.1 Schematic diagram

• Manufacturer: Würth Elektronik• Part number: 760870402

Fig 10. Pin out and dimensions of Transformer T1

019aaa251

21.59 mm(max)

21.59 mm(max)

17.27 mm(max)

121110 1

23

456

7

8 9

Fig 11. Transformer T3 schematic diagram

019aaa278

N7

9

10

7

8

6

1

2

N6

N1

N23

N34

N45

N5

Table 16. Electrical characteristics for transformer T3Properties Test conditions Value Unit ToleranceInductance N1 to N5 50 kHz/0.1 V L0 4.0 mH ±5 %

Turns ratio N1 to N5 N1: N2: N3: N4: N5: N6: N7 TR 12 : 1.33 : 1.25 : 1.17 : 1.17 : 1 : 1 ±3 %

DC-resistance N1 to N5 at 20 °C RDC1-5 1.85 ? ±20 %

DC-resistance N6 at 20 °C RDC6 135 m? ±20 %

DC-resistance N7 at 20°C RDC7 140 m? ±20 %

Saturation current N1 to N5 dL / L = 20 % ISAT 1.0 A typical

Leakage inductance N1 to N5

200 kHz/0.1 V other windings shorted

LS 275 μH typical

Coupling capacitance 20 kHz/1 V all windings CWW 30.0 pF typical

Hipot test 3 mA, 1 s all windings HV 3.0 kV




6.2.2 Core and bobbin T3

• Core: E30/15/7• Core material: ferrite• Air gap in center leg: 1100 μm• Bobbin: CSH-E30/7-1S-10P

7. Application example

7.1 Default application T5 HE 35 WThe default settings of the board are for a T5 HE 35 W burner.

When no external dimming voltage is supplied, the lamp power is 20 W.

Fig 12. Transformer T3

019aaa279

31.5 mm(max)

31.5 mm(max)

21 mm(max)

10

6

1

5

Table 17. Default settingsJumper Position CommentX32 shorted half-bridge sense resistor 1 Ω (used for PCS)

X34 open -

X33 1 to 2 open, 2 to 3 shorted

use lamp current sensing

X114 shorted connect transformer T1

X115 shorted -

X39 1 to 2 shorted, 2 to 3 open

connect lamp to lamp current sense circuit

X110, X111, X112, X113 shorted connect to lamp 4

X117 open do not connect transformer T3

Table 18. External connections for T5 HE 35 WJumper Position CommentX1 VDC 400 V (DC)

X68 external dimming 10 V for full power

X8 burner T5 HE 35 W burner




8. Bill of Materials (BOM)

Table 19. BOM daughter boardReference Value ComponentA1 UBA2014T NXP

C1 330 n /16 V capacitor ceramic X7R, 16 V, 10 %

C2 220 nF/16 V capacitor ceramic X7R, 16 V, 10 %

C3 100 pF capacitor ceramic C0G, 50 V, 5 %

C4, C11 100 nF capacitor ceramic X7R, 50 V, 10 %

C5 not mounted

C6 1 nF/500 V capacitor ceramic 500 V NP0 5 %

C7 5.6 nF/50 V capacitor ceramic 50 V X7R 10 %

C8 1 μF/25 V capacitor ceramic X7R 25 V 10 %

C9 10 nF capacitor ceramic X7R, 50 V, 10 %

C10 56 nF/50 V capacitor ceramic 50 V X7R 10 %

R1, R7 33 kΩ resistor 1 % 0.125 W 100 ppm RC12H

R2, R3 240 kΩ resistor 1 % 0.125 W 100 ppm RC12H

R4 2.2 Ω resistor 1 % 0.125 W 0 to + 500 ppm RC12H

R5 10 kΩ resistor 1 % 0.125 W 100 ppm RC12H

R6 1 kΩ resistor 1 % 0.125 W 100 ppm RC12H

V1, V5 BAS29 NXP, diode, 50 ns 90 V 250 mA

V3 BZX84C12V NXP, Zener, 250 mW, 5 % [Y2t/Y2p/Y2W]

V2, V4 BZX84-B6V8 NXP, Zener, 250 mW, 2 % [Z61 or R6]

Table 20. BOM Main boardReference Value ComponentC1 68 nF/400 V capacitor, MKP Class X2, 20 %

C2, C3, C4, C5 47 nF/305 V (AC) capacitor, MKP Class X2, 20 %

C4, C5 33 nF/100 V capacitor, MKT 100 V (DC), 5 %

C6 4.7 nF/2000 V capacitor MKP radial potted, 5 %

C11, C14 10 nF/100 V capacitor ceramic disc X7R, 10 %

C12 1 nF/100 V capacitor ceramic disc X7R, 10 %

C15, C16 4.7 μF/450 V cap. elco rad 450 V 105C 20 %

C17 680 nF/50 V capacitor ceramic disc X7R, 10 %

C18 2.2 nF/100 V capacitor ceramic disc X7R, 10 %

C19 470 nF/63 V capacitor, MKT 63 V (DC), 5 %

F1 fuse holder 5 mm x 20 mm fuse holder for 5 mm x 20 mm

F2 2 A fuse 5 mm x 20 mm time lag

L1 1.5 mH inductor choke current rating = 850 mA, R = 580 mΩ

R1, R3 33 Ω resistor 1 % 0.6 W 50 ppm MRS25

R2, R4 0 Ω zero ohm link, current rating = 25 A at 25 °C

R5 8.2 kΩ resistor 1 % 0.6 W 50 ppm MRS25

R6, R8, R9 1.2 Ω resistor power 5 % 2 W 100 ppm/°C MFP




R7 1 kΩ resistor 1 % 0.6 W 50 ppm MRS25

R10 33.2 Ω resistor Power 5 % 2 W 450 ppm/°C Carbon Film




R22, R23 43 kΩ resistor 1 % 0.6 W 50 ppm MRS25


R27, R29, R33, R34 75 kΩ resistor 1 % 0.6 W 50 ppm MRS25




R37 0 Ω Zero ohm link Im = 25 A at 25 °C




T1 760870401 Würth Elektronik: part number 760870401

T3 760870402 Würth Elektronik: part number 760870402

V1, V11, V12, V16 1N4937 diode, fast-recovery, 600 V, 1 A

V2 GBU8K bridge 800 V 8 A TH

V3, V6 2SK3569 FET MOS N-ch 600 V, 10 A 0,54E

V15 not mounted

X1, X3, X68 MKDS 2,5/2-5,08 terminal block (screw) 2-p, p = 2e, 2.5 mm2

X2, X14 Socket 3 socket straight p = 2.54 mm, h = 7 mm

X8, X21, X42, X56 MKDS 2,5/4-5,08 terminal block (screw) 4-p, p = 2e, 2.5 mm2

Table 20. BOM Main board …continued

Reference Value Component




9. Layout

Top view Bottom view

Fig 13. UBA2014 daughter board layout

019aaa276 019aaa275

7022.000.00022

Top view Bottom view

Fig 14. UBA2014 daughter board silk screen

019aaa292

R2

C8

R3

C11

3

1

V5R7R5C10R6

C9

X1

C2C1 C3 R1

1

019aaa296

R4

3

21

3V2 2 V4 3

V3V1

3

1

C7 C6 C5

A1C4




Fig 15. UBA2014/21 main board PCB layout top

019aaa295

TOP SIDE

3322 029 91481 UBA2014EB R1C




Fig 16. UBA2014/21 main board PCB layout bottom

019aaa293

BOTTOM SIDE

B



xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

UM

10395

User m

anual

NXP Sem

iconductorsU

M10395

UB

A2014 evaluation board

019aaa294

X65

X56

1

LAMP 1

X66EXPERIMENTING AREA

15 μH

SHGND

High VoltagesOn This Board !

X64X63

X61X60

X70

X67

X117

1 T2

T3

L1V2

X62

X59

X55

X49

X42

1

LAMP 2

X46

X41

X38

X30

X21

1

LAMP 3

X27

X24

X20

X13

X8

1

LAMP 4

X11

X9

X6

All information provided in this docum

ent is subject to legal disclaimers.

© N

XP B.V. 2010. All rights reserved.

Rev. 2 —

16 September 2010

22 of 25

Fig 17. UBA2014/21 main board silk screen top

15 μH

4 mH

2 mH

2.5 mH

3 mH

3.5 mH SH

GND

GND

SH

SHSH

TRAFO 1

LAMP CURRENT SENSE

PR

EH

EA

T C

UR

RE

NT

SE

NS

E

GND

GNDP

CS

2021

VC

C

GN

D

GL

VB

RG

PC

S

GH

SH

LVS

VR

EF

CS

P

CS

N

UBA20 (14/21) Daughter Board

HighSideFET

LowSideFET

HALFBRIDGE

WWW.NXP.COMUBA20 (14/21)DEMO BOARDV1.2

GND

GND

GND

X58X57

X54X53

X52

X72

X74

X76

X91

X50

X69

X73

X75

X77

X48X47

X45X109 X44

X43X40

X37X36

X35

X31

X29X28

X26X25

X23X22

X19X18

X17

X15

X105

X113

1

1 1

2 2

3 3

4 4

5 5

10 10

9 9

8 8

7 7

6 6

X106

X107 X108

X96

X103

X103

V16X115

R37

R39

R38

12

11

1

11

1

1

1

2

R9

V1

X1

C16

C15

R33

R27

R29

R34

R8

C14

R40

V15

R19

R18

X68

X34

X32

R6

R32 R31

6

5

X39

78T1

R4X114

R7

V11

V12

C12

C17

R10

X33C11

C18R5

R3

X14

R36

X2R35

1

1

1g

d

s

g

d

s

R20

R1

C3

C2

X3

F1

X120X88

X87 X85 X83 X81 X79X89

X104

X78

X80

X82

X84

X86

C5

C4

R22 R24 R2

R23 R25

C1

C6

GNDWW/YY

ANALOG DIM IN

VDC_IN = 400 V

230 VAC 50 Hz

2 A/T

0 - 10 V

X102

X94

X92

X90

11

X112

1

X111

1

X110

1


10. Glossary

CFL — Compact Fluorescent LampFET — Field-Effect TransistorNMOST — Negative channel Metal–Oxide–Semiconductor TransistorTL — Tubular Lamp




11. Legal information

11.1 DefinitionsDraft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

11.2 DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer.

In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages.

Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.

Safety of high-voltage evaluation products — The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel that is qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits.

The product does not comply with IEC 60950 based national or regional safety standards. NXP Semiconductors does not accept any liability for damages incurred due to inappropriate use of this product or related to non-insulated high voltages. Any use of this product is at customer’s own risk and liability. The customer shall fully indemnify and hold harmless NXP Semiconductors from any liability, damages and claims resulting from the use of the product.

11.3 TrademarksNotice: All referenced brands, product names, service names and trademarks are the property of their respective owners.




12. Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Safety warnings . . . . . . . . . . . . . . . . . . . . . . . . . 33 Board description . . . . . . . . . . . . . . . . . . . . . . . 43.1 Daughter board. . . . . . . . . . . . . . . . . . . . . . . . . 43.2 Main board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Schematics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . 105.1 Power supply connectors . . . . . . . . . . . . . . . . 105.2 Dimming input. . . . . . . . . . . . . . . . . . . . . . . . . 105.3 Lamp connectors . . . . . . . . . . . . . . . . . . . . . . 105.4 Test points. . . . . . . . . . . . . . . . . . . . . . . . . . . . 115.5 Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 125.6 FET. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125.7 Current sense selection . . . . . . . . . . . . . . . . . 125.7.1 Half-bridge current sensing . . . . . . . . . . . . . . 135.7.2 Lamp current sensing . . . . . . . . . . . . . . . . . . . 135.8 Using transformer T3 . . . . . . . . . . . . . . . . . . . 136 Transformer specifications. . . . . . . . . . . . . . . 146.1 Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 146.1.1 Schematic diagram. . . . . . . . . . . . . . . . . . . . . 146.1.2 Electrical properties . . . . . . . . . . . . . . . . . . . . 146.1.3 Core and bobbin T1 . . . . . . . . . . . . . . . . . . . . 146.2 Transformer T3 . . . . . . . . . . . . . . . . . . . . . . . . 156.2.1 Schematic diagram. . . . . . . . . . . . . . . . . . . . . 156.2.2 Core and bobbin T3 . . . . . . . . . . . . . . . . . . . . 167 Application example . . . . . . . . . . . . . . . . . . . . 167.1 Default application T5 HE 35 W . . . . . . . . . . . 168 Bill of Materials (BOM). . . . . . . . . . . . . . . . . . . 179 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1910 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2311 Legal information. . . . . . . . . . . . . . . . . . . . . . . 2411.1 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2411.2 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 2411.3 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 2412 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

© NXP B.V. 2010. All rights reserved.For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: [email protected]

Date of release: 16 September 2010Document identifier: UM10395

Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.

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