FORTHCOMING EVENTS CONFERENCES [ ] CORIOLIS MASS FLOWMETERING SEMINAR

London, 14 December 1989

[ ] FIBRE OPTICS AND OPTO-ELECTRONICS London, 24-26 April 1990

[ ] INFRARED TECHNOLOGY AND APPLICATIONS London, 25-28 June 1990

COURSES

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[ ] OPTICAL ENGINEERING I Foundation course Chislehurst, 13-15 February 1990 [ ]

[ ] HUMIDITY AND MOISTURE MEASUREMENT Chislehurst, 20-21 February 1990

[ ] INTRODUCTION TO MILITARY THERMAL [ ] IMAGING, Chislehurst, 27 February-1 March 1990

For further details please contact the Sira Conference Of f i ce

SIRA LTD • SOUTH HILL • CHISLEHURST • KENT • BR7 5EH TELEPHONE 01 -467 2 6 3 6 . TELEX 8 9 6 6 4 9 . FAX (01 )4676515

AUTOMATIC ON-LINE INDUSTRIAL INSPECTION, Chislehurst, 7-8 March 1990

SAFETY OF ELECTRICAL EQUIPMENT IN POTENTIALLY EXPLOSIVE ATMOSPHERES Chislehurst, 12-15 March 1990

VIBRATION MEASUREMENT USING LASER TECHNOLOGY, Loughborough, 3-5 April 1990

UNDERSTANDING ADAPTIVE AND SELF TUNING CONTROLLERS, Chislehurst, 19 April 1990

TESTING THERMAL IMAGING COMPONENTS AND SYSTEMS, Chislehurst, 16-17 May 1990

OPTICAL ENGINEERING II Chislehurst, 13-14 June 1990

Ultrasonic inspection system for electronic components

An ultrasonic inspection system from Toshiba, the UTMAC-8800, enables flaws in electronic components, such as semiconductors, to be detected, it is claimed, at twice the accuracy of existing systems.

It consists of a detection unit incorporating an ultrasonic flaw detector, an oscilloscope, an XY scanner, a probe and a control unit incorporating a personal computer and XY scanner controller. The ultrasound generated by the probe is directed towards the object to be measured, such as a semi- conductor placed in a water tank, and the difference in the reflection from the water tank's bottom and target object are amplified electrically to detect the existence of any flaw in the object from the changes in the waveforms displayed on the oscilloscope.

Compared with flaw detection systems using X-rays, the object's lateral and cross-sectional faces are displayed much more clearly, so the system's worth is apparent when inspecting semiconductor packages for the existence of voids or when checking for exfoliation that occurs between a chip and its lead frame.

By increasing the amplification rate of the reflected ultrasound by about 30% and the gain width by 80 dB, it is possible to set the flaw standard value to as fine as 0.05 mm, a two-fold improvement in accuracy compared with the company's existing systems. Thus, fine flaws, characteristic of semiconductor packages, which have eluded discovery, can now be accurately detected.

Toshiba Corporation, Public Communications Office, 1- 1, Shibaura 1-chome, Minato-ku, Tokyo, Japan

Piezo plastic accelerometers for condition monitoring A range of accelerometers using enhanced piezo plastic technology has been designed to meet the requirements of the condition monitoring market. The frequency range of the ACH-01 from Hakuto International is from 1 Hz to 20 kHz, which covers the standard requirements for condition monitoring.

The transducer was designed to operate over a wide temperature range, - 4 0 to +85°C, meeting all reasonable climatic conditions. The unit has built in electronics providing a low impedance output which permits simple interfacing with other equipment. The standard output is 10 mV G -1, but this can be supplied with up to a 2V G -1 if required.

Hakuto International (UK) Ltd, 33-35 Eleanor Cross Road, Wal- tham Cross, Herts EN8 7LF, UK

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