ude group overview -...

UDE Group Overview

Company Founded: 2005

Chairman /Founder: Gary Chen

President: Chris Chen

Capital: USD23.0M

UDE is a leading supplier of RJ ICM (Integrated Connector Module) in the Global Market of Top Tier equipment developers & manufacturers of OEM/ODM products serving:

- Desktop /Notebook/Server/Storage Networking Solutions

- Consumer-DVD Player & Recorder/Connected TV Networking

Solutions

- Telecom Networking and Wireless Solutions

2005 ： Company Founded, DongGuan Factory Established.

2006 ： DongGuan Factory ISO9001/ISO14001 IECQ-QC080000 Certified.

2007 ： SiChuan Factory Established,ISO9001/14001 Certified.

2008 ： DongGuan-TPS (Toyota Production System) Installed.

2009 ： SiChuan Factory-TPS, Plating Line Installed.

2010 ： PalPilot invested in UDE Corp. Asia, established UDE USA BU, merged UDE USA into PalPilot I/O Group, PalConn USA

2011 ： Stock listed in Emerging market. ( # 3689)

2012： Stock listed in GreTai Securities market. ( # 3689),

2013 ： Merged UDE-Corp USA and PalConn USA Corp to form UDE-PalConn USA Corp.

UDE Company Milestone

UDE Corp. Sales Revenue

USD : M

Year

CAGR : 59.5%

Revenues have increased multiple times since 2005

0

20

40

60

80

100

120

140

160

2005 2006 2007 2008 2009 2010 2011 2012 2013

5 17

32

49 60

98

120 131

155

FCST.

UDE Corp Sales Breakdown

UDE Corp & Mfg. Location(s)

● ●

●

Taiwan ( Taoyuan )

Headquarter

Sales and FAE,CS dept.

Employees : 75

DongGuan Manufacture Plant

Occupied Area : 247,563 Sq.ft.

Employees : 1500

SiChuan Manufacture Plant

Occupied Area : 392,258 Sq.ft.

Employees : 2300

Understanding UDE Products UDE Main product Focus is Integrating Individual Components that are typically used in Ethernet LAN communication ports. The traditional method was using separate components; LAN Magnetics/Capacitors/Resistors between the Ethernet PHY and the external I/O RJ45 Connector. These products are manufactured in accordance with the IEEE802.3 Standard!

Understand UDE? What is an ICM? An ICM Module is a Integrated Connector Module, having Integrated Magnetic Components; Isolation Transformers, Common Mode Chokes, Resistors, & Capacitors into a RJ45 Ethernet Connector. The Connector Module is designed around the Ethernet Standards of IEEE802.3.

10/100 MHz 1G/10G Hz

Module-jack Straight/Vertical

1x1,1x2,1x4

10/100 MHz 1G/10G Hz Module-jack

2x1, 2x4, 2x6, 2x8

10/100 MHz 1G/10G Hz

Module jack RJ45+USB(2.0/3.0)

USB(2.0/3.0) connector

Others

Audio Jack, Sim Card Connector,

LAN X’fmers (NB)

Our Products

STB/Notebook PC/Switch/Router/Printer/Server/Storage/IPC/Game Console

AIO(ALL In One) PC/Connected TV..

xDSL Modem/Switch/Router/Gigabit/Ethernet PON( Passive Optical Network)..

Desktop PC/BD Player (recorder)/Media Storage/Game Console/IPC..

Notebook/ PC/IPC

Our Markets

Automation/Technology/Product

Strong Product Design Concept

Highly Auto-Machine Design

Strict Design QA/DFM Internal Audit

Patents Taiwan China USA Korea Japan Total

Awarded 68 4 8 1 3 84

Under Approval 9 0 4 0 0 13

Total 77 4 12 1 3 97

Patents Awarded

Market Leaders/Valued Partner Intel

IBM

LG

MSI

Pace

Quanta

Samsung

Sony

Unihan

Brocade

Juniper

Accton

Askey

Asustek

Canon

ECS

Fujitsu Siemens

Gigabyte

Humax

HP

Ciena

Extreme Networks

2013 Product Road Map

New Specs of RJ45 Product Application RJ45 Module Jack With

High Frequency Relay Integration

New Specs of RJ45 Product Application

施工示意圖

• 2xN Offset Low Profile

• Used in Server, Blade

Server for 1U Space

saving

RJ45 Module Offset Low Profile

New Specs of RJ45 Product Application 施工示意圖 RJ45 Module Jack With

Surge(6KV) / ESD(15KV) Protector

New T2 RJ45 Product Application 施工示意圖

New T2 RJ45 Advantages

• Fully Automated Assembly & Manufacturing process

• Ability to Manage cost impact VS Manual Labor

• Reliability on Manual Labor & Quality concerns being used for T1 & T2 integration is no longer concern

• Performance in Quality production processes improving cost VS manual labor

• Allows for smaller Mechanical outlines

施工示意圖

10G RJ45 Products Introduction

10 Gigabit Ethernet

Convergence of Applications • 10Gigabit is the next unifying rate – Telecom migration from OC48 towards OC192 – 1 Gigabit aggregation – Decouple requirements between apps, yet provide seamless

integration • LAN Applications – In building networks - data centers, clusters, risers – Campus Interconnects • Cross Over applications – Metropolitan connections to core networks (backhaul) – Intra city private networks over dark fiber • Evolution, outgrowth of 1 Gig applications • Telecom – Core WDM network access rate – Private networks over dark

20

21

• 10G Base-T is defined by IEEE 802.3an. It use 4-pair transmission and is designed to support up to 100meters of Category 6A or higher cabling. The aggregate data rate of 10Gbit/s is achieved by transmitting 2.5Gbits/s over each Cable pair. And duplex full transmission method is adopted .

Electrical Schematic (4Ch 12P) Electrical Schematic (5Ch )

UDE 10G Roadmap New Products Introduction

10 Gigabit 1xN Ethernet

- UDE P/N : GT-1XX - Description : RJ45 1X1 Tab UP - Channels : 5

- Terminal Parts (underplating:50u" min. Nickel overall) - Output Terminal: Selected plating with 30u" min. Gold on Contact Area - RJ45 Cavities conform to FCC Part 68, Subpart F. - Operating Temperature : 0 C to +70 C. - Storage Temperature: -45 C to +85 C. - The Parts are recommended for WAVE soldering process peak temperature 265 C max., 10 sec max.

25

Mechanical Dimension

Electrical Schematic (4Ch 12P)

Electrical Schematic (5Ch 14 or 15P) • Performance:

• Transmitter filter & Receiver filter

• Type : Balance low pass 100Ω impedance

• 1. Insertion Loss (Phy to Line and Line to Phy)

• 400MHZ -1.41 dB max

• 2. Return Loss (Phy side)

• 500MHZ - 8 dB min load 100Ω

• 3. Inductance @ 100KHz, 0.1V 8mA DC BIAS

• Input (R1-R2),(R4-R5),(R7-R8),(R10-R11):160 μH min.

• Input (R13-R14): 40 μH min.

• 4. HiPot Test : 1500Vac 60s or 2250Vdc 60s

• Input(R1-R2) To Output(C1-C2)




Dynamic testing

Tektronix Signal Oscilloscopes Model :DSA71254B Analog Bandwidth : 12.5 GHz Analog Sample Rate 2/4 Channels : 50 GS/s Analog Channels : 4

XGbT 10GBASE-T Automated Compliance Software – Quickly perform 10GBASE-Tmeasurements per the IEEE 802.3an-2006 standard including Power Spectral Density(PSD), Power Level, and Linearity, with a simplified instrument configuration.

10G Magnetic Component Qualification Test

10G Magnetic Component Qualification Test

Agilent Technologies E5071C 4-port vector network analyzer (VNA), which can support 300 kHz to 20 GHz frequency range, and which has more than 60 dB dynamic range.

PCB calibration fixtures

PHY side and line side fixtures

(short, open, load, thru)

performing an S-O-L-T calibration

Static testing

10G Network Card Testing INTEL (X540) BROADCOM (BCM57810) MARVELL (SFT9001)

Bel G05-1GHT-05 Bel G10-1GHN-35 Bel G10-188T-034

UDE & Competitor Comparison

PHY Supplier IC P/N Bel UDE P/N

Intel X540 G05-1GHT-05 GDC-1T2AVK23

Broadcom BCM57810 G10-1GHN-035 GDC-1T2AVK23

Marvell SFT9001 G10-188T-034 GDC-1T2AVK23

-1.60

-1.40

-1.20

-1.00

-0.80

-0.60

-0.40

-0.20

0.00

0 50 100 150 200 250 300 350 400

UDE

intel(G05-1GHT-05)

broadcom(G10-1GHN-035)

marvell(G10-188T-034)

UDE SPEC

Insertion Loss Phy to Line and Line to Phy All values should be above the limit line

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

0

0 50 100 150 200 250 300 350 400 450 500

UDE

intel(G05-1GHT-05)

broadcom(G10-1GHN-035)

marvell(G10-188T-034)

UDE SPEC

Phy Side Return Loss All values should be below the limit line.

GDC-1T2AVK23

GDC-1T2AVK23

10G Valued Partner

Intel

Marvell

Broadcom

AMCC

DELL

Quanta

MSI

Jabil

HP

IBM

Xyratex

UDE MFG. ADVANTAGES

Complete Production Management

Production Capacity K ports/Month

-

2,000

4,000

6,000

8,000

10,000

12,000

14,000

16,000

18,000

20,000

2009 2010 2011 2012 2013

9,000

14,000 15,000

17,000

20,000

Vertical Integrated Production Design

Marketing

Survey

Customer

Sample

Pilot Run

Mass Product

Transfer

Molding Design

Product

Design

Product

Reliability

Testing

Development

Stamping Design

Ass’y M/C Design

Fixture Design

Plastic Part

Injection

Contact Pin/ Shell

Stamping Plating

Product

Ass’y

Electrical

Mechanical

Inspection

Manufacturing

Linear line vs. U line Linear line U line

Linear Line vs. U Line - Continued

OP production

line PPH Capacity/hr

Linear line 80 1 10 pcs 800 pcs

U line 80 10

(8 P/line) 80 pcs 6,400 pcs

OP Daily product

types on

each line WIP PPH

Linear line 70-130 2 types 2000 pcs 10 pcs

U line 6-12 12 types 40 pcs 80 pcs

U Line Improvement Timeline 2008 2009 2010~2012 2013

U line cut in Medium U line： 30 OPs Set production Deploy material

near the line

Small U line： 8-12 OPs Single Set flow Common

transfer fixture

Advanced U line： 3-5 OPs None learning

curve

Advanced U Line

Immerse Soldering

AI capacitor

Modular PCB

Unload fixture HSG

Shell

Packaging test C/T = 5s

Soldering RJ

U Line Advantage

More

Efficiency

Labor &

Space Saving

Sufficient

Flexibility

Less WIP

Waste

Stable

Quality

PAGE：44

Auto

Spot Welding

Auto

Testing

Auto

Soldering

Auto

Winding

Advantage: Why UDE ??

Highly Automation Production Line

Automation Milestone 2008 2009 2010-2012 2013

Auto soldering

U line cut in

RJ terminals Auto welding

Auto winding

Auto spot welding

Auto test

Target : Zero Defect

Study on new technology

Automation Modularization

None NG design

None NG product

Auto soldering for a stable quality level

Auto test for avoiding manual misjudgment

Laser soldering

Automation Equipment

Auto Spot Welding

Auto Core Winding Auto Hi-pot/LCR

Testing

Auto Soldering

Manual VS Auto winding

47

winding T1

choke T2

choke Pulse

Hourly output Defect Rate

Manual winding 50 pcs 2-4%

Auto winding 650 pcs Below 0.2%

FAE (Field Application Engineer) Support

Static Test Item (Component Test) • LCR test

• Insertion Loss test

• Return Loss test

• Cross talk test

• Common Mode Rejection test

• HI-POT test

Dynamic Test Item (System Test) • IEEE: waveform test

• IEEE: Return Loss test

• IEEE: BER or copy files test (with100m cable)

• EMI test

• ESD test

• ISN test

• Surge test

Strong debug support

Professional design support

Process Quality Control IQC

AQL：MIL-STD-105E

Cri : 0.15

Maj : 2.5(D)/0.1(E)

Min : 0.4

MRB

SCAR

IPQC

FAI : 5 pcs

FQC

Electrical : 100%

Hi-pot, IR, TNV, High

frequency : 100%

Appearance : 100%

OQC

Packing and Label

check : 100%

Dimension, Mating

Force, Solder ability : 5

pcs

Soldering Insp.

Electrical Test

Appearance Check

P - Chart

Shipping

PMP

LAB Reliability & Capability

Mechanical

Vibration Force analysis Durability

Electrical

Contact resistance Insulation resistance High voltage High Frequency

Environmental

Thermal shock Salt spray Temperature and humidity Steam aging

Process Simulation

SMT simulation Solder ability

Continuous Improvement

None NG part Target: zero defect Non-stop study on

soldering technology

Quality

Eradicate align、turn、judge、search

Seek for both-hand motion Seek for simplest motion Seek for minimum motion distance

Simplify motions

Common fixture Auto-reset fixture

Reduce transfer & fixture change

Reduce misjudgment Auto injection

Automation

One piece flow (one fixture)

Only transfer or fixture applying motions for OPs

Tact Time oriented production line

None over-production

Improvement

PAGE：52

Quality Certification

PAGE：53

Quality Certification

PAGE：54

Customer GP Certification

GP Certification

Issued by : Accton

GP Certification

Issued by : ASUSTEK

PAGE：55

Customer GP Certification

GP Certification

Issued by : Canon

GP Certification

Issued by : SONY

PAGE：56

Thank You & Question

ude group overview -...

Documents