twl6032 evaluation module (evm) user s guide · the twl6032 evaluation module ... agnd_smps4...

TWL6032 Evaluation Module (EVM) User’sGuide

User's Guide

Literature Number: SWCU105October 2012

WARNING: EXPORT NOTICERecipient agrees to not knowingly export or re-export, directly orindirectly, any product or technical data (as defined by the U.S., EU, andother Export Administration Regulations) including software, or anycontrolled product restricted by other applicable national regulations,received from Disclosing party under this Agreement, or any directproduct of such technology, to any destination to which such export orre-export is restricted or prohibited by U.S. or other applicable laws,without obtaining prior authorisation from U.S. Department of Commerceand other competent Government authorities to the extent required bythose laws. This provision shall survive termination or expiration of thisAgreement.According to our best knowledge of the state and end-use of thisproduct or technology, and in compliance with the export controlregulations of dual-use goods in force in the origin and exportingcountries, this technology is classified as follows:US ECCN: EAR99EU ECCN: EAR99And may require export or re-export license for shipping it in compliancewith the applicable regulations of certain countries.

Contents

1 Introduction ........................................................................................................................ 51.1 Description ............................................................................................................... 51.2 Applications .............................................................................................................. 61.3 Features .................................................................................................................. 6

2 TWL6032 EVM Resources Summary ...................................................................................... 73 Schematic .......................................................................................................................... 84 Connector and Test Point Descriptions ................................................................................ 11

4.1 Connector Descriptions ............................................................................................... 114.2 Test Point Descriptions ................................................................................................ 13

5 Test Setup ........................................................................................................................ 146 EQUIPMENT SETUP ........................................................................................................... 14

6.1 Input Supply ............................................................................................................ 146.2 Basic Jumper Setting .................................................................................................. 146.3 Load ..................................................................................................................... 156.4 Meter .................................................................................................................... 156.5 Recommended Wire Gauge .......................................................................................... 156.6 Install GUI ............................................................................................................... 15

7 Test Procedure .................................................................................................................. 197.1 EVM Wakeup ........................................................................................................... 197.2 Set Input Voltage ....................................................................................................... 197.3 Enable DUT ............................................................................................................. 197.4 Power Consumption Test ............................................................................................. 207.5 32-kHz Clock Test ..................................................................................................... 207.6 Load Test ............................................................................................................... 207.7 Test Complete .......................................................................................................... 207.8 Final Jumper Connections ............................................................................................ 207.9 Load Test ............................................................................................................... 20

8 EQUIPMENT SHUTDOWN ................................................................................................... 209 EVM Assembly Drawings and Layout ................................................................................... 2110 List of Materials ................................................................................................................. 2611 Revision History ................................................................................................................ 30

3SWCU105–October 2012 Table of Contents

Copyright © 2012, Texas Instruments Incorporated

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List of Figures1 TWL6032 EVM Schematic – TWL6032 Connections .................................................................. 82 TWL6032 EVM Schematic – Power Connections ...................................................................... 93 TWL6032 EVM Schematic – MSP430 Connetions ................................................................... 104 GUI Snapshot – Register ................................................................................................ 165 GUI Snapshot – DUT Control ........................................................................................... 176 GUI Snapshot – BCI ...................................................................................................... 187 TWL6032 EVM Component Placement With Silkscreen Labels .................................................... 218 TWL6032 EVM Internal Layer (L1)...................................................................................... 229 TWL6032 EVM Internal Layer (L2)...................................................................................... 2210 TWL6032 EVM Internal Layer (L3)...................................................................................... 2311 TWL6032 EVM Internal Layer (L4)...................................................................................... 2312 TWL6032 EVM Internal Layer (L5)...................................................................................... 2413 TWL6032 EVM Internal Layer (L6)...................................................................................... 2414 TWL6032 EVM Internal Layer (L7)...................................................................................... 2515 TWL6032 EVM Internal Layer (L8)...................................................................................... 25

List of Tables1 Boot Configuration......................................................................................................... 112 VBAT Minimum and Maximum Levels.................................................................................. 113 VSYS Minimum and Maximum Levels.................................................................................. 114 SMPS Loads .............................................................................................................. 115 LDO Loads ................................................................................................................. 126 GPADC Channels ......................................................................................................... 127 Test Point Descriptions ................................................................................................... 138 VBAT Minimum and Maximum Levels.................................................................................. 149 Input Jumper Settings..................................................................................................... 1410 Input Jumper Settings..................................................................................................... 1411 Electronic Load Connections ............................................................................................ 1512 Electronic Load Connections ............................................................................................ 1513 Expected Voltages ........................................................................................................ 1914 SMPS Register Values ................................................................................................... 2015 SMPS Jumper Measurements ........................................................................................... 20

4 List of Figures SWCU105–October 2012


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User's GuideSWCU105–October 2012

TWL6032 Evaluation Module (EVM) User’s Guide

1 Introduction

1.1 Description

1.1.1 Device DescriptionThe TWL6032 device is an integrated power-management integrated circuit (PMIC) for applicationspowered by a rechargeable battery. The device provides five configurable step-down converters with up to5-A current capability for memory, processor core, I/O, auxiliary, preregulation for low drop-out voltageregulators (LDOs), and so forth. The TWL6032 device also contains nine LDOs for external use that canbe supplied from a battery or a preregulated supply. The power-up and power-down controller isconfigurable and can support any power-up and power-down sequence (programmed in OTP memory).The real-time clock (RTC) provides three 32-kHz clock outputs, seconds, minutes, hours, day, month, andyear information, as well as alarm wakeup and timer. The TWL6032 device supports 32-kHz clockgeneration based on a crystal oscillator.

The TWL6032 device integrates a switched-mode system supply regulator from a universal serial bus(USB) connector. The TWL6032 includes power paths from the USB and battery with supplemental modefor immediate startup, even with an empty battery. The battery switch uses an external low-Ωic PMOStransistor allowing minimal serial resistance during fast charging and when operating from a battery. TheTWL6032 device can also be used without the external PMOS transistor; the battery is then always tied tothe system supply and the switched-mode regulator is used for battery charging.

Project collateral and source code discussed in this application report can be downloaded from thefollowing URL: http://www.ti.com/lit/zip/swcc013.

1.1.2 EVM Kit DescriptionThe TWL6032 evaluation module (EVM) is a stand-alone module that demonstrates the functions of theintegrated PMIC. The EVM uses a USB cable and an MSP430™ device (mounted on the EVM) to controlthe standard inter-integrated circuit (I2C™) interfaces in the TWL6032 device. It includes Windows®-compatible software to interface with the device. The software is a simple graphical user interface (GUI)that simplifies registers access for the IC.

1.1.3 EPROM Power-Up Sequence DescriptionThis user's guide is common for all TWL6032x parts. The only difference in these parts is the EPROMsequence for power up. Each part has a unique EPROM sequence to satisfy the attached applicationprocessor. For details of the EPROM sequence, see the corresponding user's guide in the ApplicationNotes section on the TWL6032x product page.

SmartReflex is a trademark of Texas Instruments.Windows is a registered trademark of Microsoft Corporation.I2C is a trademark of Philips Semiconductor Corp.MSP430 is a trademark of Texas Instruements.SD is a registered trademark of Toshiba Corporation.All other trademarks are the property of their respective owners.

5SWCU105–October 2012 TWL6032 Evaluation Module (EVM) User’s Guide


http://www.ti.com/lit/zip/swcc013

Introduction www.ti.com

1.2 ApplicationsThe TWL6032 device is ideal for the following applications:• Mobile phones and smart phones• Tablets• Gaming handsets• Portable media players• Portable navigation systems• Handheld devices

1.3 FeaturesThe TWL6032 device has the following features:• Five highly efficient buck converters

– One 3 MHz, 0.6 to 2.1 V @ 5.0 A, DVS-capable– One 6 MHz, 0.6 to 2.1 V @ 2.5 A, DVS-capable– Three 6 MHz, 0.6 to 2.1 V @ 1.1 A, one being DVS-capable

• 11 general-purpose LDOs– Six 1.0 to 3.3 V @ 0.2 A with battery or preregulated supply:

One can be used as vibrator driver.– One 1.0 to 3.3 V @ 50 mA with battery or preregulated supply– One low-noise 1.0 to 3.3 V @ 50 mA with battery or preregulated supply– One 3.3 V @ 100 mA USB LDO– Two LDOs for TWL6032 internal use

• USB OTG module:– ID detection, accessory charger adapter (ACA) support– Accessory detection protocol (ADP) support

• Backup battery charger• 12-bit sigma-delta analog-to-digital converter (ADC) with 19 input channels:

– Seven external input channels• 13-bit Coulomb counter with four programmable integration periods• Low power consumption:

– 8 µA in BACKUP state– 20 µA in WAIT-ON state– 110 µA in SLEEP state, with two DC-DC converters active

• Real-time clock (RTC) with timer and alarm wake-up:– Three buffered 32-kHz outputs

• SIM and SD®/MMC card detections• Two digital pulse-width modulation (PWM) outputs• Thermal monitoring:

– High-temperature warning– Thermal shutdown

• Control:– Configurable power-up and power-down sequences (OTP memory)– Configurable sequences between SLEEP and ACTIVE states (OTP memory)– Three digital output signals that can be included in the startup sequence to control external devices– Two inter-integrated circuit I2C interfaces

6 TWL6032 Evaluation Module (EVM) User’s Guide SWCU105–October 2012


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www.ti.com TWL6032 EVM Resources Summary

– All resources configurable by I2C• System voltage regulator and battery charger with power path from USB:

– Input current limit to comply with USB standard– 3-MHz switched-mode regulator with integrated power FET for up to 2.0-A current– Dedicated control loop for battery current and voltage– External low-Ωic FET for power path and battery charging– Boost mode operation for USB on-the-go (OTG)– Supplement mode to deliver current from battery during power path operation– Charger for single-cell Li-Ion and Li-polymer battery packs– Safety timer and reset control– Thermal protection– Input and output overvoltage protection– Charging indicator LED driver– Compliant with:

• USB 2.0• OTG and EH 2.0• USB battery charging 1.2• YD/T 1591-2006• Japanese battery charging guidelines (JEITA)

• Battery voltage range from 2.5 to 5.5 V• Package 5.21 mm × 5.36 mm 155-pin WCSP

2 TWL6032 EVM Resources Summary• LDOs• REGEN1• REGEN2• SYSEN• SMPS regulators• Main bandgap• Comparators• Thermal shutdown• System reset• Clocks (PWM1 and PWM2)

For detailed electrical characteristics of the switched-mode power supplies (SMPSs) and LDO supplies,see the TWL6032 product data sheet.



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AGND_XTAL

AGND_SMPS4

AGND_SMPS1

AGND_SMPS2

AGND_SMPS3

AGND_SMPS5

AGND_CHRG

AGND_CHRG

AGND_CHRG

AGND_CHRG

AGND_CHRG

AGND_CHRG

1

_S

_S

_S

_S

_S

2

2

2 1

2

2

1

1

2 See BOM for part usage

Not Installed

M1 SMPS1_INL1 SMPS1_INK1 SMPS1_IN

H1 SMPS1_FDBK

N2 SMPS1_SWM2 SMPS1_SWL2 SMPS1_SWK2 SMPS1_SW

N3 SMPS1_GNDM3 SMPS1_GNDL3 SMPS1_GNDK3 SMPS1_GND

M13 SMPS2_INL13 SMPS2_IN

K13 SMPS2_FDBK

N12 SMPS2_SWM12 SMPS2_SWL12 SMPS2_SW

N11 SMPS2_GNDM11 SMPS2_GND

N10 SMPS3_INM10 SMPS3_IN

L11 SMPS3_FDBK

N9 SMPS3_SW

M8 SMPS3_GNDM9 SMPS3_GND

J12 SMPS4_INJ13 SMPS4_IN

G11 SMPS4_FDBK

H12 SMPS4_SWH13 SMPS4_SW

G12 SMPS4_GNDG13 SMPS4_GND

N4 SMPS5_INM4 SMPS5_IN

L4 SMPS5_FDBK

N5 SMPS5_SW

M5 SMPS5_GNDM6 SMPS5_GND

L5 VDDB7 VDD

E11 VDDG2 VDD

H10 VIO

A4CHRG_DET_N

F4CHRG_EXTCHRG_ENZ

F3CHRG_EXTCHRG_STATZ

J10BATREMOVAL

F7VBUS_DET

D10GGAUGE_RESN

D9GGAUGE_RESP

D2CHRG_VREF

B13CHRG_VBAT

C13CHRG_GATE_CTRL

C12CHRG_VSYS

A5CHRG_PGND

B5CHRG_PGND

C5CHRG_PGND

D5CHRG_CSOUT

D4CHRG_CSIN

A3CHRG_SW

B3CHRG_SW

C3CHRG_SW

C4CHRG_SW

B4CHRG_SW

E2CHRG_BOOT

C2CHRG_PMID

B2CHRG_PMID

A2CHRG_PMID

G1CHRG_PROT_GATE

D1VBUS

C1VBUS

B1VBUS

C11VSYS_BB

G6VBACKUP

G8

REFG

ND

C8

REFG

ND

F10

VBG

E10

IREF

C10

OSC32KCAP

B9

OSC32KO

UT

A9

OSC32KIN

K8

CLK32KG

C9

CLK32KAU

DIO

K9

CLK32KAO

J4CTLI2

C_SD

A

J3CTLI2

C_SCL

H11

DVSI2

C_SD

A

J11

DVSI2

C_SCL

A13

TESTV

E3

TESTEN

D6

VPRO

G

J5N

RESPW

RO

N

H3

REG

EN

1

J1REG

EN

2

K7

INT

K5

SYSEN

H4

NRESW

ARM

K4

MSECU

RE

H6

PREQ

3

K6

PREQ

2

H7

PREQ

1

H2

RPW

RO

N

J2PW

RO

N

F6

BO

OT2

D3

BO

OT1

E4

BO

OT0

U1-A

TWL6032, A2B4

C13 12pF

C14 2.2uF

C20

100nF

R10 510K

Y1

32.768 KHz

1

TP8

1T

P6

1T

P20

1T

P17

12

JP10

S1

L3

1 uHC38 22uF

C37

4.7uF

L4

1 uH

C41 10uF

L6 1 uH

C23

4.7uF

C9NM

C2 4.7nF

R16100K

1T

P9

Q2

Q1

1

TP1

1 TP10

1

2JP9

L11 uH

1

TP2

1

TP4

R1 20mohm

1TP7

+ C310.08 F

R2

R15

0ohm

C28

1.2uF

C34

4.7uF

C18

100nF

C12 12pF

C5 2.2uF

C44 2.2uF

C40

4.7uF

C35

4.7uF

C39

4.7uF

C16 4.7uF

C33 22uF

L2 1 uH

L5 1 uH

R11 0ohm

R7

0ohm

R5

0ohm

C19 100nF

C32

2.2uF

C51 100nF

C43

10uF

C17

10uF

C36 10uF

C42

10uF

BOOT0

BOOT1

BOOT2AGND

PREQ1

NR

ES

PW

RO

N

PREQ2

RE

GE

N1

PREQ3

RE

GE

N2

MS

EC

UR

E

INT

NR

ES

WA

RM

SY

SE

N AG

ND

I2C

_S

CL_A

I2C

_S

CL_B

I2C

_S

DA

_A

I2C

_S

DA

_B

AGND

AGND

AGND

SMPS1

AGND

SMPS2

AGND

SMPS3

SMPS4

AGND

SMPS5

AGND

AGND

AGND

AGND

AGND

AGND

AGND

PACK+AGND

PACK-

AGND

BATREMOVALVBUS_DET

CHRG_EXTCHRG_STATZCHRG_EXTCHRG_ENZCHRG_DET_N

AGND

AGND

GATE_PROT

VIO VIO

VSYS

VBUS

VSYS

VSYS

VSYS

VSYS

VSYS

VSYSVSYS

SMPS1

SMPS2

SMPS3

SMPS4

SMPS5

Schematic www.ti.com

3 SchematicFigure 1 shows the TWL6032 EVM schematic.

Figure 1. TWL6032 EVM Schematic – TWL6032 Connections



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SF

SFSFSFSF

SFSFSFSFSFSF

SF

SFSF

SCL/SDAIN Config / OUT

LDO

SMPSCONNECTORS BATTERY

BOOT

GPADCCHARGER

USB_MICRO_AB

AG

ND

_S

MP

S5

AG

ND

_S

MP

S1

AG

ND

_S

MP

S2

AG

ND

_S

MP

S3

AG

ND

_S

MP

S4

AG

ND

_C

HR

G

GND

AG

ND

_XTAL

S

F

_SMPS1_S

2

2

2

1

2 See BOM for part usage

Not Installed

F8 VRTC_IN

D7 VRTC

B10 VANA_IN

A10 VANA

F2 LDO1_IN

F1 LDO1

L6 LDO2_IN

N6 LDO2

M7 LDO3_IN

N7 LDO3

L8 LDO4_IN

N8 LDO4

F12 LDO5_IN

F13 LDO5

D12 LDO6_IN

D13 LDO6

B8 LDO7_IN

A8 LDO7

E12 LDOLN_IN

E13 LDOLN

A7 LDOUSB

K12 PWM1K11 PWM2 G4PBKG

N13PBKG

A1PBKG

N1PBKG

H8GND_ANA

C7GND_ANA

L9GND_ANA

E1GND_ANA

L7GND_DIG_VIO

G3GND_DIG_VRTC

F11GPADC_IN6

G10GPADC_IN5

A11GPADC_IN4

B12GPADC_IN3

A12GPADC_IN2

D8GPADC_IN1

D11GPADC_IN0

B11GPADC_VREF

L10GPADC_START

J9SIM

K10MMC

G7ID

B6CHRG_LED_TEST

A6CHRG_LED_IN

C6VAC

U1-B

TWL6032, A1B4

D1

1TP12

1 TP21

1TP181TP14

1

TP5

123456789101112

J7

1 2

JP12

R19 0ohm

R22

2.2

K

R18

2.2

K

1T

P15

1T

P16

1T

P19

1T

P11

1234

J13

1 2

JP3

1 2

JP2

R347K

1 DM

2 DP

3 USB-ID 4NC

5NC

6VBUS

7

GN

D

U2

1T

P3

1T

P13 1

2

3

4

5

6 711

10

J4

1 2 3

JP6

1 23

JP7

JP5

1

2

3

4

J9

C1

47uF

R24 0ohm

R23 0ohm

R21 0ohm

R17 0ohm

R20 0ohm

R6 0ohm

C4100nF

C15 100nF

C10

2.2

uF

C3

2.2

uF

C7

2.2

uF

1 2

JP1

1 2

JP4

1 23

JP8

1234

J6

1234

J10

123456789101112

J12

123456789101112

J2

123456789101112

J5

123456789101112

J11

123456789101112

J1

123456789101112

J3

R4 0ohm

R12 0ohm

C8

2.2

uF

C29

2.2

uF

C26

2.2

uF

C452.2uF

C502.2uF

C252.2uF

C212.2uF

C272.2uF

C24

2.2

uF

C22

2.2

uF

C46

2.2

uF

C47

2.2

uF

C48

2.2

uF

C492.2uF

C62.2uF

C302.2uF

C112.2uF

R25 0ohm

R26 0ohm

R27 0ohm

R13 0ohm

R14 0ohm

R944.2K

R8121K

AGNDID

GPADC_START

ADIN0ADIN1GPADC_IN2

GPADC_IN6

GPADC_IN3

GPADC_IN5GPADC_IN4

AGND

AGND

GPADC_VREF

AGND

AGND

VRTC_OUT

LDO1_IN

LDO1_OUT

LDO2_IN

LDO2_OUT

LDO3_IN

LDO3_OUT

LDO4_IN

LDO4_OUT

LDO5_IN

LDO5_OUT

LDO6_IN

LDO6_OUT

LDO7_IN

LDO7_OUT

LDOLN_IN

LDOLN_OUT

LDOUSB_OUT

LDO1_INLDO7_INLDO2_INLDOLN_INLDO3_IN

LDO1_OUTLDO1_OUTLDO2_OUTLDO2_OUTLDO3_OUTLDO3_OUTLDO4_OUTLDO4_OUTLDO5_OUTLDO5_OUTLDO6_OUT

SMPS2SMPS2SMPS3SMPS3SMPS4SMPS4

AGND

PREQ1NRESPWRONPREQ2REGEN1PREQ3REGEN2MSECUREINTNRESWARMSYSEN

AGND

LDO7_OUTLDO7_OUTLDOLN_OUTLDOLN_OUTLDOUSB_OUTLDOUSB_OUT

AGND

LDO6_OUT

SMPS5SMPS5

AG

ND

I2C_SDA_A

I2C_SCL_A

I2C_SDA_B

I2C_SCL_B

VIOVIOSMPS4SMPS5

LDO4_INLDO5_INLDO6_IN

AGND

AGND

VSYS

AG

ND

VB

US

AG

ND

AD

IN0

AD

IN1

PACK+ PACK-

AGND

VRTC_OUT

BATREMOVALVBUS_DET

AGND

GPADC_STARTADIN0

AGND

AGND

ADIN1

GPADC_IN2GPADC_IN6GPADC_IN3GPADC_IN5GPADC_IN4

AGND

ID

AGND

AGND

AGND

BOOT0

BOOT1

BOOT2CHRG_EXTCHRG_STATZCHRG_EXTCHRG_ENZ

LDOUSB_OUTCHRG_DET_N

VAC

AG

ND

VANA_OUT

GPADC_VREF

VAC

VSYS

VSYS

VIO

VBUS

AGND

AGND

AGND

SMPS1

SMPS1

AGND

SDA_MSP430

SCL_MSP430

www.ti.com Schematic

Figure 2. TWL6032 EVM Schematic – Power Connections



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TRANSCEIVER USB TO I2C3V3 VOLTAGE

OPTION 1

LEDs

Shifters

1V8 VOLTAGE

C62100nF

C5

91

00

pFC

56

22

pF

C581nF

C65470nF

C53

4.7uF

R30

1.5K

R28120K

D6

1 IN

2 GND

3 EN 4NC/FB

5OUT

VR1

Y2

24

MH

z

1 2

JP11

1

2

3

4

5

6

J8

Q5-B

Q4-A

D4D3

Q3-A

D2D5

1 P6.4/CB4/A4

2 P6.5/CB5/A5

3 P6.6/CB6/A6

4 P6.7/CB7/A7

5 P7.0/CB8/A12

6 P7.1/CB9/A13

7 P7.2/CB10/A14

8 P7.3/CB11/A15

9 P5.0/VREF+/VEREF+

10 P5.1/VREF-/VEREF-

11 AVCC1

12 P5.4/XIN

13 P5.5/XOUT

14 AVSS1

15 P8.0

16 P8.1

17 P8.2

18 DVCC1

19 DVSS1

20 VCORE

21

P1.0

/TA0CLK/A

CLK

22

P1.1

/TA0.0

23

P1.2

/TA0.1

24

P1.3

/TA0.2

25

P1.4

/TA0.3

26

P1.5

/TA0.4

27

P1.6

/TA1CLK/C

BO

UT

28

P1.7

/TA1.0

29

P2.0

/TA1.1

30

P2.1

/TA1.2

31

P2.2

/TA2CLK/S

MCLK

32

P2.3

/TA2.0

33

P2.4

/TA2.1

34

P2.5

/TA2.2

35

P2.6

/RTCCLK/D

MAE0

36

P2.7

/UCB0/S

TEU

CA0CLK

37

P3.0

/UCB0SIM

O/U

CB0SD

38

P3.1

/UCB0SO

MI/

UCB0SC

39

P3.2

/UCB0CLK/U

CA0STE

40

P3,3

/UCA0TXD

/UCA0SIM

41P3.4/UCA0RXD/UCA0SOM

42P3.5/TB0.5

43P3.6/TB0.6

44P3.7/TB0OUTH/SVMOUT

45P4.0/PM_UCB1STE/PM_U

46P4.1/PM_UCB1SIMO

47P4.2/PM_UCB1SOMI

48P4.3/PM_UCB1CLK

49DVSS2

50DVCC2

51P4.4/PM_UCA1TXD

52P4.5/PM_UCA1RXD

53P4.6/PM_NONE

54P4.7/PM_NONE

55P5.6/TB0.0

56P5.7/TB0.1

57P7.4/TB0.2

58P7.5/TB0.3

59P7.6/TB0.4

60P7.7/TB0CLK/MCLK

61

VSSU

62

PU

.0/D

P

63

PU

R

64

PU

.1/D

M

65

VBU

S

66

VU

SB

67

V18

68

AVSS2

69

P5.2

/XT2IN

70

P5.3

/XT2O

UT

71

TEST/S

BW

TCK

72

PJ.

0/T

DO

73

PJ.

1/T

DI/

TCLK

74

PJ.

2/T

MS

75

PJ.

3/T

CK

76

NM

I/SBW

TD

IO/R

ST

77

P6.0

/CB0/A

0

78

P6.1

/CB1/A

1

79

P6.2

/CB2/A

2

80

P6.3

/CB3/A

3

U4

MSP430F552XIPN

C61

100nF

1 VCCA

2 1DIR

3 2DIR

4 1A1

5 1A2

6 2A1

7 2A2

8 GND 9GND

102B2

112B1

121B2

131B1

14~2OE

15~1OE

16VCCB

VR3

1 IN

2 GND

3 EN 4NC/FB

5OUT

VR2

Q6

Q7

2 A 4Y

5 VCC

3

GN

D

U3

1 VCCA

2 1DIR

3 2DIR

4 1A1

5 1A2

6 2A1

7 2A2

8 GND 9GND

102B2

112B1

121B2

131B1

14~2OE

15~1OE

16VCCB

VR4

Q4-BQ3-B

C6

01

00

pF

C63100nF

C64100nF

C54

100nF

C52

100nF

C5

72

2p

F

C55

4.7uF

R2

91.5

K

R35

1.5KR36

1.5K

R331.5K

R311.5KR34

1.5KR321.5K

AGND

AG

ND

AGND

AGND

AGND

AGND

AGND

AG

ND

AGND AGND

AGND

AGND

AGNDAGND

AGND

VRTC_OUT NRESPWRON

SCL_M

SP430

SD

A_M

SP430

AGND

AGND

IO_10

IO_11

IO_12

IO_9

IO_9

IO_11

IO_10

IO_12

IO_7 IO_3

AGND AGND

PREQ1

PREQ2

PREQ3

MSECURE

INT

+3V3

+3V3 1V8

+3V3+5V +3V3

+5V1V8

+3V3

1V8

+5V +5V

+5V

+5V

1V8

+5V

+3V3

VIO

AGND

+3V3

AGND

AGND

IO_3

IO_7

INT

NRESPWRON

+3V3 1V8

AGND

AGND

AGND

Schematic www.ti.com

Figure 3. TWL6032 EVM Schematic – MSP430 Connetions



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www.ti.com Connector and Test Point Descriptions

4 Connector and Test Point Descriptions

4.1 Connector Descriptions

4.1.1 Boot PinsJP6, JP7, and JP8 are used to select the boot pin configuration for proper booting of the device. Table 1shows the possible boot options.

Table 1. Boot ConfigurationState Boot0 Boot1 Boot2

1 JP6(1-2) JP7(1-2) JP8(1-2)0 JP6(3-2) JP7(3-2) JP8(3-2)

4.1.2 Backup BatteryJP9 is used for the backup battery connection. The user can use the onboard 0.8-F, 3.3-V capacitor byshorting JP9-1 and JP9-2.

4.1.3 VBAT and VSYSPack+/– (JP2) is the main source input to the PMIC. See Table 2 for the minimum and maximum levelsthat can be applied to this pin. Use JP12 for ground; the power supply V+ is JP2 (1) and V– to JP2 (2).

Table 2. VBAT Minimum and Maximum LevelsMinimum (V) Typical (V) Maximum (V)

VBAT2.7 3.6 5.5

VSYS (JP1) is the main input source to the device. Table 3 lists the minimum and maximum levels thatcan be applied to these pins.

Table 3. VSYS Minimum and Maximum LevelsMinimum (V) Typical (V) Maximum (V)

VSYS2.7 3.6 5.5

VBUS (JP4) plug insertion is one of the power up events for the device; VBUS is set to 5 V. It is notmandatory to plug in VBUS for power up of the PMIC.

4.1.4 SMPSThere are five SMPSs on the TWL6032 device. SMSPs can be loaded by connecting the load onconnectors JP13 and J3. Special consideration must be given to force and sense while loading on SMPS1(JP13).

Table 4 lists the maximum loads of the SMPSs.

Table 4. SMPS LoadsConnector Label Maximum Load

JP9(1-4) SMPS1 5 AJ12(6-1) SMPS2 2.2 AJ12(8-1) SMSP3 1.1 A

J12(10-1) SMSP4 1.1 AJ12(12-1) SMSP5 1.1 A



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Connector and Test Point Descriptions www.ti.com

4.1.5 LDOThere are eleven LDOs on the TWL6032 device. Two LDOs are for internal use and nine LDOs areavailable to supply external power.

Table 5 lists the maximum loads of the LDOs.

Table 5. LDO LoadsConnector Label Maximum Load

J11-2 LDO1 50 mAJ11-4 LDO2 200 mAJ11-6 LDO3 200 mAJ11-8 LDO4 200 mAJ11-10 LDO5 200 mAJ11-12 LDO6 250 mA

J1-2 LDO7 200 mAJ1-4 LDOLN 50 mAJ1-6 LDOUSB 100 mA

4.1.6 GPADCThe TWL6032 device has seven general-purpose ADC channels which are externally available and usedfor various purposes; for example, battery temperature measurement, battery voltage measurement, andso forth. See the TWL6032 data manual for a detailed description about the each channel.

Table 6. GPADC ChannelsConnector Label Function

J3-1 GPADC_VREF Reference voltage for GPADCJ3-2 GPADC_START Start the conversion on ADCJ3-3 ADIN0 Battery detectionJ3-5 ADIN1 Battery temperature measurementJ3-7 GPADC2 General purposeJ3-8 GPADC6 General purposeJ3-9 GPADC3 General purpose

J3-10 GPADC5 General purposeJ3-11 GPADC4 General purpose

JP5(1-2) must be connected to simulate the temperature measurements.

4.1.7 I2C CommunicationThe TWL6032 device has two slave I2C interfaces. One is a general-purpose interface to control theinternal configuration registers. The second is dedicated to SmartReflex™ applications such as dynamicvoltage frequency scaling (DVFS) or adaptive voltage scaling (AVS). J-1 is used to control thecommunication between the GUI and the MSP430, which in turn control the PMIC.



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www.ti.com Connector and Test Point Descriptions

4.2 Test Point DescriptionsTable 7 lists the test point functions.

Table 7. Test Point DescriptionsConnector Label Function

J9-2 SMSP1-OUT Sense for SMPS1J12-5 SMPS 2-OUT Sense for SMPS2J12-7 SMPS3-OUT Sense for SMPS3J12-7 SMPS4-OUT Sense for SMPS4J12-11 SMPS5-OUT Sense for SMPS5

J6-2 VIO-OUT Sense for VIOJ11-1 LDO1-OUT Sense for LDO1J11-3 LDO2-OUT Sense for LDO2J11-5 LDO3-OUT Sense for LDO3J11-7 LDO4-OUT Sense for LDO4J11-9 LDO5-OUT Sense for LDO5J11-11 LDO6-OUT Sense for LDO6

J1-1 LDO7-OUT Sense for LDO7J1-3 LDOLN-OUT Sense for LDOLNJ1-4 LDOUSB-OUT Sense for LDOUSBJ5-1 LDO1-IN Input for LDO1J5-2 LDO7-IN Input for LDO7J5-3 LDO2-IN Input for LDO2J5-4 LDOLN-IN Input for LDOLNJ5-5 LDO3-IN Input for LDO3J5-6 LDO4-IN Input for LDO4J5-7 LDO5-IN Input for LDO5J5-8 LDO6-IN Input for LDO6J2-1 BATREMOVAL Battery removal indicationJ2-2 VBUSDET VBUS detectionJ2-3 CHRG_EXTCHRG_STATZ External charging statusJ2-4 CHRG_EXTZCHRG_ENZ External charging enableJ2-5 VAC VAC detectionJ2-7 LDOUSB-OUT Sense for LDOUSB

J2-8 and J2-10 CHRG_DET_N USB charger detection

J10 and J13 are extra ground connectors used for any purpose.



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Test Setup www.ti.com

5 Test SetupThe following equipment is needed to complete this test procedure.• Power Supplies

A power supply capable of supplying up to 3.8 V @ 10 A and a USB cable• Loads

Three electronic load circuits capable of drawing 5 A• Meters

One DC voltmeter• Oscilloscope

One oscilloscope with 1 probe

6 EQUIPMENT SETUP

6.1 Input SupplyPack+/– (JP2) is the main source input to the PMIC. See Table 8 for minimum and maximum levels thatcan be applied to this pin; use JP12 for ground.

Table 8. VBAT Minimum and Maximum LevelsMinimum (V) Typical (V) Maximum (V)

PACK2.7 3.8 5.5

1. Connect the power supply V+ to JP2 (1) and V– to JP2 (2).2. Connect the USB cable to J8 and the other end to the PC.3. Connect power supply GND to JP12.

6.2 Basic Jumper SettingEnsure that the following jumper settings are done so the setup functions as expected.

Table 9 and Table 10 list the input jumper settings.

Table 9. Input Jumper SettingsJumper ID Device Input Pin UseJP6(2-3) BOOT0 Boot mode selectorJP7(2-3) BOOT1 Boot mode selectorJP8(2-3) BOOT2 Boot mode selectorJP79-2) VBACKUP Backup battery to the device

General-purpose ADC for temperatureJP5(1-2) GPADC1 monitoring

Table 10. Input Jumper SettingsJumper ID Label Use

J6(1-3) SMPS4 VIO follow SMPS4CHRG_DET_N connected LDO USB toJ2(9-10) CHRG_DET_N pull it high

J3(3-4) ADIN0 ADCIN connected to groundADIN connected to resistor forJ3(5-6) ADCIN1 temperature simulations



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www.ti.com EQUIPMENT SETUP

6.3 LoadThe load test for DC-DC is performed on one SMPS at a time is:1. 1. Set the load in 4-W mode.2. Connect the electronic load to the DC-DC outputs at J12 for SMPS2 through SMPS5, as shown in

Table 11.

Table 11. Electronic Load ConnectionsSMPS F+ F– S+ S–SMPS2 J12(6) J12(4) J12(5) J12(3)SMPS3 J12(8) J12(4) J12(7) J12(3)SMPS4 J12(10) J12(4) J12(9) J12(3)SMPS5 J12(12) J12(4) J12(11) J12(3)

3. Connect the electronic load to the DCDC outputs at J13 for SMPS1.

Table 12. Electronic Load ConnectionsSMPS F+ F– S+ S–SMPS1 J9(1) J9(3) J9(2) J9(4)

4. Special attention must be taken of the force and the sense connections marked on the J9. SMPS 1can load up to 5 A.

6.4 MeterA voltmeter is used to measure input and output voltages.

6.5 Recommended Wire GaugeTo reduce voltage drop and improve the accuracy of loads and measurements, use a minimumconnection wire of 22 AWG.

6.6 Install GUIThe GUI accompanying this device is simple and runs on a Windows PC. Ensure that your machinesupports Microsoft .NET Framework 3.5.

6.6.1 Installation InstructionsTo install the GUI perform the following steps:1. Unzip the installable file, SWCC013.zip.2. Create a new folder or unzip it into any appropriate windows folder. By default, the GUI is installed in

C:\Program Files\Texas Instruments\TWL6032EVM.3. Open the GUI by clicking the Setup.exe icon in the folder created in Step 2. The GUI can also be

opened by clicking:Start → All Programs → Texas Instruments → TWL6032Two files are generated: MSP Firmware upgrade utility and TWL6032 EVM

6.6.2 GUI FilesThe GUI software consists of the following files:• .dll• .exe• .xml

The .xml file is the main file that contains all the device registers. The registers in this file are categorizedin blocks according to the functions. The .xml file also specifies the slave I2C address for the device.



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SWCU105-002

EQUIPMENT SETUP www.ti.com

6.6.3 GUI DescriptionThe GUI windows are divided into the following sections:

6.6.3.1 RegisterFollowing are the blocks seen on the GUI on the left side pane under Register.1. POWER2. AUX3. SMART_REFLEX4. TEST5. TRIM6. DEBUG7. BQ_24156_USER

Figure 4 shows a sample snapshot of the Registers panel in the GUI.

Each block can be selected independently so that it appears on the main GUI window. Each registerinstance appears in a separate block.

The user can write to the registers through the I2C bus. Each bit in the 8-bit register can be writtenindependently or the complete register can be written using 8-bit hexadecimal value in the Value field.Individual bits can be toggled by selecting the drop-down menu or by double-clicking the field.

Figure 4. GUI Snapshot – Register



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SWCU105-003

www.ti.com EQUIPMENT SETUP

6.6.3.2 DUT ControlThe DUT control panel is used to control the static on a few pins on the device; for example, PREQ1,PREQ2, PREQ3, and so forth.

Figure 5 shows a sample snapshot of the DUT_Control panel in the GUI.

Figure 5. GUI Snapshot – DUT Control



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SWCU105-004

EQUIPMENT SETUP www.ti.com

6.6.3.3 BCIThe BCI panel is used to control the battery charging interface automatically. The BCI panel has adifferent dropdown to change the charging voltage, charging current, VBUS current, and terminationcurrent. There is a provision to read the status, faults, and interrupts from this control panel.

Figure 6 shows a sample snapshot of the BCI panel in the GUI.

Figure 6. GUI Snapshot – BCI



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www.ti.com Test Procedure

7 Test Procedure

7.1 EVM WakeupFor the first time, the MSP430 firmware must be flashed as follows:1. Set jumper configuration as described in Table 1 and Table 2.2. Plug the USB cable into the PC to flash the MSP430 on the board.3. Load the MSP flash tool on the PC.4. Click on MSP430 firmware upgrade utility.5. Click the Next button.6. Plug the USB cable into the connector on the board.

(a) Press the browse button then select USB2ANY and hit open(b) The Upgrade button should be highlighted

7. Press the Upgrade button.8. Wait for the MSP430 to be flashed.9. Close the tool, then disconnect and reconnect the USB cable. The LED should blink three times then

stay on.10. If a voltage source is used instead of a battery, the source must be able to sink some current.

7.2 Set Input VoltageWith the input supply off or disconnected from the unit under test, adjust the input voltage to 3.8 V. For thesupply connections, see Section 6.1, Input Supply. Ensure that the input power supply current limit is setat 2 A.

CAUTIONDo not exceed an input voltage of 5.5 V at any time during the testing of theUUT.

7.3 Enable DUTWith the power supply connected to the input pins, turn on the power supply.

To power up the UUT, press the POWERON pin for 1 second. Check the following power outputs on theEVM to check if the UUT powered on properly.

Table 13. Expected VoltagesPower Domain TP Expected Voltage Range (V)REGEN1 J7-6 3.77 V to 3.83 VREGEN2 J7-8 3.77 V to 3.83 VSMPS4 J12-9 1.75 V to 1.83 VSYSEN J7-12 1.77 V to 1.83 VSMSP3 J12-7 1.220 V to 1.230 VLDO6 J11-11 1.77 V to 1.83 VSMPS2 J12-5 0.955 V to 0.969 VSMPS1 J9-2 0.955 V to 0.969 VSMPS5 J12-11 0.955 V to 0.969 VLDOLN J1-3 1.77 V to 1.83 VLDO2 J11-3 2.75 V to 2.85 VNRESPWRON J7-4 1.77 V to 1.83 V



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EQUIPMENT SHUTDOWN www.ti.com

7.4 Power Consumption TestWhen the device is powered on, the supply should show the power consumption in the range of 750 µA to1.2 mA.

7.5 32-kHz Clock TestProbe TP20 to check the clock. This should measure a 32-kHz clock.

7.6 Load TestTurn on the electronic loads (see Section 6.3, Load). When the DC-DCs (VDD1, VDD2, and VIO) areloaded, they should regulate at the same voltage as shown in Table 13.

7.7 Test CompleteTurn off the power supply and remove all connections from the UUT.

7.8 Final Jumper ConnectionsLeave the jumper connections as done above for the test setup.

7.9 Load Test

7.9.1 GUI TestConnecting the GUI to the EVM:

If the board is powered on, turn it off. Turn on the EVM supply and power on the board and open the GUI.The GUI can be controlled from a PC or laptop. The cable is connected between the PC or laptop USBslot and connector J8 on the TWL6032 EVM.

Once the GUI is connected to the EVM, the device registers can be written. In the Registers section of theGUI, scroll down to the SMPSx_CFG_FORCE register. Write the values listed in Table 14 to the registers.

Table 14. SMPS Register ValuesRegister Name Hex Values To Be Written Value

SMPS2_CFG_FORCE 0x33 1.35 VSMPS1_CFG_FORCE 0x3C 1.8 VSMPS5_CFG_FORCE 0x01 0.7 V

Measure the SMPS outputs at the jumpers listed in Table 15.

Table 15. SMPS Jumper MeasurementsRegister Name Jumper Value (V) (No Load Needed)

SMPS2_CFG_FORCE J12-5 1.3 V to 1.4 VSMPS1_CFG_FORCE J2-9 1.75 V to 1.85 VSMPS5_CFG_FORCE J12-11 0.65 V to 0.75 V

8 EQUIPMENT SHUTDOWNNo special shutdown procedures are required.



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www.ti.com EVM Assembly Drawings and Layout

9 EVM Assembly Drawings and LayoutFigure 7 through Figure 15 show the design of the TWL6032 EVM printed circuit board.

Figure 7. TWL6032 EVM Component Placement With Silkscreen Labels



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EVM Assembly Drawings and Layout www.ti.com

Figure 8. TWL6032 EVM Internal Layer (L1)




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EVM Assembly Drawings and Layout www.ti.com





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List of Materials www.ti.com

10 List of MaterialsTWL6032 EVM Bill of Materials lists the EVM components as configured according to the schematic shown in Figure 1.

TWL6032 EVM Bill of MaterialsCount Reference Value Description Size Part Number Manufacturer

Designator1 C1 47uF CAP, CER, 10V, X5R, 20% 1210 GRM32ER61A476ME20 MURATA2 C12, C13 12pF CAP,CER,50V,COG,2% 0402 GRM1555C1H120GA01D MURATA2 C16, C23 4.7uF CAP, CER, 16V, X5R, 20% 0603 STD STD5 C17, C36, C41, C42, 10uF CAP,CER,6.3V,X5R,20% 0603 C1608X5R0J106M MURATA

C431 C2 4.7nF CAP, CER, 50V, X7R, 10% 0402 GRM155R71H472KA01D MURATA1 C28 1.0uF CAP, CER, 16V, X7R, 10% 0603 C1608X7R1C105K TDK24 C3, C5, C6, C7, C8, 2.2uF CAP,CER,6.3V,X5R,20% 0402 GRM155R60J225ME15D MURATA

C10, C11, C14, C21,C22, C24, C25, C26,C27, C29, C30, C32,C44, C45, C46, C47,C48, C49, C50

1 C31 0.08 F CAP, DOUBLE LAYER ELEC, 3.3V 4.8 mm Dia. XH414HGII06E SII Micro2 C33, C38 22uF CAP, CER, 6.3V,X5R, 20% 0805 GRM21BR60J226ME39 MURATA1 C34 4.7uF CAP, CER, 6.3V, X5R, 10% 0603 GRM188R60J475KE19D MURATA4 C35, C37, C39, C40 4.7uF CAP, CER, 6.3V, X5R, 20% 0402 GRM155R60J475ME87 MURATA6 C4, C15, C18, C19, 100nF CAP,CER,6.3V,X5R,10% 0402 GRM155R60J104KA01D MURATA

C20, C515 C52, C54, C62, C63, 100nF CAP, CER, 50V, X7R, 10% 0603 C0603C104K5RAC KEMET

C642 C53, C55 4.7uF CAP, CER, 16V, X5R, 10% 0805 C0805C475K4PAC KEMET2 C56, C57 22pF CAP, CER, 50V, NP0, 5% 0603 C0603C220J5GACTU KEMET1 C58 1nF CAP,CER,50V,X7R,10% 0402 GRM155R71H102KA01D MURATA2 C59, C60 100pF CAP,CER,50V,NP0,5% 0402 GRM1555C1H101JD01D MURATA1 C61 100nF CAP,CER, 50V , X7R , 10% 0402 C1005X7R1H104K KEMET1 C65 470nF CAP, CER, X5R, 6.3V, 10% 0402 04026D474KAT2A ARROW0 C9 2.2uF CAP,CER,6.3V,X5R,20% 0402 GRM155R60J225ME15D MURATA5 D1, D2, D3, D4, D5 HSMR-CL25 Diode. LED Blue, 5V, 10mA 0603 HSMR-CL25 Avago1 D6 Yellow_LYT67K- Diode. LED Hyper-Bright Low Current, PLCC-2 LYT67K-K2M1-26-Z Osram

K2M1-26-Z yellow, 12V, 20mA7 J1, J2, J3, J5, J7, PEC06DAAN Header, Male 2x6 pin, 100mil spacing 0.100 inch x PEC06DAAN Sullins

J11, J12 2X61 J4 ZX62-AB-5PA Connector, USB Micro B, 5-pins, SMT 6x8 mm ZX62-AB-5PA Hirose



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www.ti.com List of Materials

TWL6032 EVM Bill of Materials (continued)Count Reference Value Description Size Part Number Manufacturer

Designator3 J6, J10, J13 PEC02DAAN Header, 2x2-pin, 100mil spacing 0.20 x 0.20 PEC02DAAN Sullins

inch1 J8 067068-9000 Connector, USB Upstream (Type B) 0.47 x 0.67 067068-9000 Molex

inch1 J9 ED555/4DS Connector, Male 4 Pole3.5 mm, 6A, 150V 6.5x14 mm ED555/4DS On Shore Tech4 JP1, JP2, JP3, JP4 MKDS3/2 Header, Side Entry 2-pin, 5mm spacing, 0.441 x 0.200 MKDS3/2 Phoenix Contact

inch1 JP12 S1731-46R Jumper, Power SMT 2.3x12.3 mm S1731-46R Harwin4 JP5, JP9, JP10, PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x PEC02SAAN Sullins

JP11 23 JP6, JP7, JP8 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x PEC03SAAN Sullins

32 L1, L4 1 uH Inductor, Chip Coils, LQM32PN1R0 1210 LQM32PN1R0 muRata3 L2, L5, L6 1 uH Inductor, Chip Coils, LQM2MPN1R0NG0L 806 QM2MPN1R0NG0L muRata1 L3 1 uH Inductor, Power, XFL4020-102MEB 0.157 x 0.157 XFL4020-102MEB Coilcraft

inch1 Q1 CSD25201W15 MOSFET, PChan, -20V, 4A, 50 mOhm CSP CSD25201W15 Texas Instruments

1.5x1.5mm0 Q2 CSD25201W15 MOSFET, PChan, -20V, 4A, 50 mOhm CSP CSD25201W15 Texas Instruments

1.5x1.5mm3 Q3, Q4, Q5 Si1912EDH MOSFET, Dual Nch, 20V, 1.28A, 280 mOhm SOT-363 Si1912EDH-T1-E3 Vishay2 Q6, Q7 BSS138 MOSFET, Nch, 50V, 0.22A, 3.5 Ohm SOT23 BSS138 Fairchild1 R1 20mohm RES, 0.5W, 1% 1206 LRC-LRF1206LF-01-R020-F IRCTT1 R10 510K RES, 0.0625W, 1% 0402 STD STD2 R11, R15 0ohm RESISTOR,SMT,5%,1/4W 1206 ERJ-8GEY0R00V PANASONIC0 R16 100K RES, 0.0625W, 1% 0402 0402WGF1003TCE Multicomp2 R18, R22 2.2K RES, 0.0625W, 1% 0402 STD STD0 R2 0ohm_0.5W Not Resistor, 0.5 watt 1206

Mount1 R28 120K RES,0.0625W, 1% 0402 STD STD8 R29, R30, R31, R32, 1.5K RESISTOR,SMT,0.1%,1/16W 0402 PCF0402-R-1K5-B-T1 Multicomp

R33, R34, R35, R361 R3 47K THERMISTOR, NTC, 1% 0402 ERTJ0EP473F PANASONIC16 R4, R5, R6, R7, R12, 0ohm Resistor, Chip, 1/16W 0402 CRG0402ZR TYCO

R13, R14, R17, R19,R20, R21, R23, R24,R25, R26, R27



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List of Materials www.ti.com

TWL6032 EVM Bill of Materials (continued)Count Reference Value Description Size Part Number Manufacturer

Designator1 R8 121K RESISTOR,1%,1/16W 0402 ERJ-2RKF1213X Multicomp1 R9 44.2K RESISTOR,1%,1/16W 0402 ERJ-2RKF4422X Multicomp1 S1 KSR221GLFS Switch, SMT Subminiature Tact , 50v, 50mA 3.8x7.15 mm KSR221GLFS ITT

Max.21 TP1, TP2, TP3, TP4, PEC01SAAN Through Hole, O.040 Dia PEC01SAAN Sullins

TP5, TP6, TP7, TP8,TP9, TP10, TP11,TP12, TP13, TP14,TP15, TP16, TP17,TP18, TP19, TP20,TP21

1 U1 TWL6032YFF IC, Power Management With Power Path uBGA TWL6032A2B4YFF Texas Instrumentsand Battery Charge

1 U2 RCLAMP1654P IC, Low Capacitance TVS Array QFN RCLAMP1654P Semtech1 U3 SN74AUC1G04DCK IC, Single Inverter DCK-5 SN74AUC1G04DCK TI1 U4 MSP430F5529IPN IC, Mixed Signal Microcontroller TQFP-80 MSP430F5529IPN Texas Instruments1 VR1 TPS76333DBV IC, Micro-Power 150 mA LDO Regulator SOT23-5 TPS76333DBV TI1 VR2 TPS76318DBV IC, Micro-Power 150 mA LDO Regulator SOT23-5 TPS76318DBV TI2 VR3, VR4 SN74AVC4T245PW IC, 4-BIT DUAL-SUPPLY BUS TSSOP SN74AVC4T245PW TI

TRANSCEIVER1 Y1 32.768 KHz Crystal, SMT Ceramic , 12.5pF, +/-20ppm 1.8x4.9 mm CM519-32.768KDZF-UT Citizen1 Y2 24 MHz Crystal, SMT Ceramic , 18pF, +/- 30ppm 3.7x12.7 mm 24.000MHZ 49USMX/30/50/40/18PF EuroQuartz6 Keystone Ref 2203 ( 4-40 Threaded Standoffs - .250 [6.4] O.D 2203 Keystone

L= 12.7 mm) Brass Zinc PlateDiameter = 6.4mm

6 WASHER FLAT #4 .120X.250" NYLON 3348 Keystone6 Screw 4-40 thread, .250 NY PMS 440 0025 PH Richco plastic1 PCB PWR122 ANY2 -- Shunt, 100-mil, Black 0.100 929950-00 3M1 -- Label (See note 5) 1.25 x 0.25 THT-13-457-10 Brady

inch



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www.ti.com List of Materials

NOTE:• These assemblies are ESD sensitive. ESD precautions must be observed.• These assemblies must be clean and free from flux and all contaminants. Use of contaminated flux is not acceptable.• These assemblies must comply with workmanship standards IPC-A-610 Class 2. Reference designators marked with an asterisk (**)

cannot be substituted. All other• components can be substituted with equivalent manufacturer's components.



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Revision History www.ti.com

11 Revision HistoryNote: Numbering may vary from previous versions.

Version Literature Number Date Notes* SWCU105 October 2012 See (1)

(1) SWCU105 - initial release.



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