tutorial 2 heat transfer q5

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Question 5 2-101 A silicon Wafer with thickness of 925 mirometer is being heated with a uniform heat ux at the lower surface. The silicon wafer has a thermal conductivity that varies with temperature and can be expressed as k(T) = (a + bT + cT 2 ) W/m.K, where a = 437, b = -1.29, and c = 0.00111. To avoid warping, the temperature difference across the wafer thickness cannot exceed 2 °C. If the upper surface of the silicon wafer is at a uniform temperature of 600 K, determine the maximum allowable heat ux. Answer: 1.35x10 5 W/m 2

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Heat Mass Transfer 4e Ch2 Tutorial

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Page 1: Tutorial 2 Heat Transfer Q5

Question 5

2-101 A silicon Wafer with thickness of 925 mirometer is being heated with a uniform heat

flux at the lower surface. The silicon wafer has a thermal conductivity that varies with

temperature and can be expressed as k(T) = (a + bT + cT2) W/m.K, where a = 437, b = -1.29,

and c = 0.00111. To avoid warping, the temperature difference across the wafer thickness

cannot exceed 2 °C. If the upper surface of the silicon wafer is at a uniform temperature of

600 K, determine the maximum allowable heat flux. Answer: 1.35x105 W/m2