tutorial 2 heat transfer q5
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Heat Mass Transfer 4e Ch2 TutorialTRANSCRIPT
Question 5
2-101 A silicon Wafer with thickness of 925 mirometer is being heated with a uniform heat
flux at the lower surface. The silicon wafer has a thermal conductivity that varies with
temperature and can be expressed as k(T) = (a + bT + cT2) W/m.K, where a = 437, b = -1.29,
and c = 0.00111. To avoid warping, the temperature difference across the wafer thickness
cannot exceed 2 °C. If the upper surface of the silicon wafer is at a uniform temperature of
600 K, determine the maximum allowable heat flux. Answer: 1.35x105 W/m2