tsw3003 demonstration kit (rev. d - ti.com

41
User's Guide SLWU029D – October 2006 – Revised August 2007 TSW3003 Demonstration Kit Contents 1 Demonstration Kit Configuration Options ................................................................................. 3 2 Block Diagrams .............................................................................................................. 4 3 Key Texas Instruments Components ..................................................................................... 5 4 Software Installation ......................................................................................................... 5 5 Software Operation .......................................................................................................... 5 6 Board Setup ................................................................................................................. 12 7 Demo Kit Test Configuration .............................................................................................. 13 8 Basic Test Procedure ...................................................................................................... 23 9 Optional Configurations.................................................................................................... 27 10 Filter Specifications ........................................................................................................ 29 11 Bill of Materials and Schematics ......................................................................................... 30 List of Figures 1 System Block Diagram ...................................................................................................... 4 2 Demo Kit Block Diagram.................................................................................................... 4 3 TSW3003 Startup Screen .................................................................................................. 6 4 Default CDCM7005 SPI GUI ............................................................................................... 7 5 TRF3761 GUI - Main Menu ................................................................................................ 8 6 TRF3761 GUI - Advanced Menu .......................................................................................... 8 7 DAC5687 GUI ................................................................................................................ 9 8 Test System Block Diagram .............................................................................................. 13 9 Single-Carrier Test Mode 1 WCDMA, Typical Performance With IF=30.72 MHz, LO=2.14 GHz ............... 15 10 Missing Middle-Carrier Test Mode 1 WCDMA, Typical Performance With IF=30.72 MHz, LO=2.14 GHz ..... 16 11 Four-Carrier Test Mode 1 WCDMA, Typical Performance With IF=153.6 MHz, LO=2.14 GHz ................. 17 12 ACPR Versus Output Power for 1Carrier WCDMA .................................................................... 18 13 ACPR Versus Output Power for 2 Carriers WCDMA .................................................................. 18 14 ACPR Versus Output Power for 3 Carriers WCDMA .................................................................. 19 15 ACPR Versus Output Power for 4 Carriers WCDMA .................................................................. 19 16 Optimum ACPR for 1 Carrier WCDMA, -7-dB Pad .................................................................... 20 17 Optimum ACPR for 2 Carrier WCDMA, -7-dB Pad .................................................................... 21 18 Optimum ACPR for 3 Carrier WCDMA, -7-dB Pad .................................................................... 22 19 Optimum ACPR for 4 Carrier WCDMA, -7-dB Pad .................................................................... 23 20 Default DAC GUI With f DAC /8 Tone From NCO ........................................................................ 25 21 Single Sideband Spectrum Output Before DAC Offset and QMC Adjustments ................................... 25 22 DAC GUI With Typical Settings To Minimize LO and Sideband ..................................................... 26 23 Sideband and LO Compensated Using QMC Settings ................................................................ 27 24 Board Modifications for External LO ..................................................................................... 28 25 Jumper Settings to Disable TRF3761 ................................................................................... 28 26 Jumper Changes for External VCXO .................................................................................... 29 List of Tables 1 Frequency Bands ............................................................................................................ 3 2 CDCM7005 Register Values ............................................................................................... 7 Windows is a trademark of Microsoft Corporation. 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Page 1: TSW3003 Demonstration Kit (Rev. D - TI.com

User's GuideSLWU029D–October 2006–Revised August 2007

TSW3003 Demonstration Kit

Contents1 Demonstration Kit Configuration Options................................................................................. 32 Block Diagrams .............................................................................................................. 43 Key Texas Instruments Components ..................................................................................... 54 Software Installation ......................................................................................................... 55 Software Operation .......................................................................................................... 56 Board Setup................................................................................................................. 127 Demo Kit Test Configuration.............................................................................................. 138 Basic Test Procedure ...................................................................................................... 239 Optional Configurations.................................................................................................... 2710 Filter Specifications ........................................................................................................ 2911 Bill of Materials and Schematics ......................................................................................... 30

List of Figures

1 System Block Diagram ...................................................................................................... 42 Demo Kit Block Diagram.................................................................................................... 43 TSW3003 Startup Screen .................................................................................................. 64 Default CDCM7005 SPI GUI ............................................................................................... 75 TRF3761 GUI - Main Menu ................................................................................................ 86 TRF3761 GUI - Advanced Menu .......................................................................................... 87 DAC5687 GUI ................................................................................................................ 98 Test System Block Diagram .............................................................................................. 139 Single-Carrier Test Mode 1 WCDMA, Typical Performance With IF=30.72 MHz, LO=2.14 GHz ............... 1510 Missing Middle-Carrier Test Mode 1 WCDMA, Typical Performance With IF=30.72 MHz, LO=2.14 GHz ..... 1611 Four-Carrier Test Mode 1 WCDMA, Typical Performance With IF=153.6 MHz, LO=2.14 GHz ................. 1712 ACPR Versus Output Power for 1Carrier WCDMA .................................................................... 1813 ACPR Versus Output Power for 2 Carriers WCDMA.................................................................. 1814 ACPR Versus Output Power for 3 Carriers WCDMA.................................................................. 1915 ACPR Versus Output Power for 4 Carriers WCDMA.................................................................. 1916 Optimum ACPR for 1 Carrier WCDMA, -7-dB Pad .................................................................... 2017 Optimum ACPR for 2 Carrier WCDMA, -7-dB Pad .................................................................... 2118 Optimum ACPR for 3 Carrier WCDMA, -7-dB Pad .................................................................... 2219 Optimum ACPR for 4 Carrier WCDMA, -7-dB Pad .................................................................... 2320 Default DAC GUI With fDAC/8 Tone From NCO ........................................................................ 2521 Single Sideband Spectrum Output Before DAC Offset and QMC Adjustments ................................... 2522 DAC GUI With Typical Settings To Minimize LO and Sideband ..................................................... 2623 Sideband and LO Compensated Using QMC Settings................................................................ 2724 Board Modifications for External LO ..................................................................................... 2825 Jumper Settings to Disable TRF3761 ................................................................................... 2826 Jumper Changes for External VCXO .................................................................................... 29

List of Tables

1 Frequency Bands ............................................................................................................ 32 CDCM7005 Register Values ............................................................................................... 7

Windows is a trademark of Microsoft Corporation.

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3 Jumper List.................................................................................................................. 124 Input/Output Connections ................................................................................................. 125 Demo Kit Typical Specifications.......................................................................................... 146 Frequency Designations................................................................................................... 247 Bill of Materials ............................................................................................................. 30

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1 Demonstration Kit Configuration Options

1.1 DAC Component

1.2 VComm Configuration

1.3 VCXO

1.4 LO Generation

Demonstration Kit Configuration Options

The TSW3003 Demonstration (Demo) Kit can be configured in different ways to evaluate differentcomponents in different frequency bands. This section outlines the various component configurations.Based on the configuration, testing and board setup must be altered to accommodate the givencomponents and features.

The TSW3003 Demo Kit is built for the DAC5687, although this Demo Kit can also support the DAC5686because the two devices are pin compatible. The procedures outlined in this document are primarily suitedfor the DAC5687, but can be modified easily for the DAC5686 if desired.

The analog quadrature modulator requires a common-mode dc voltage of approximately 3.3 V. In order touse the dc-offset adjustment capabilities of the DAC5687 for carrier suppression, it is imperative tomaintain a dc path from the DAC output to the modulator input. The common-mode voltage for themodulator is maintained with a passive resistor network that is designed to provide the proper operationpoint for the DAC5687 and the TRF3703 modulator. By design, in order to preserve the proper dc levels,the DAC coarse gain should be kept at the maximum (15), though deviation by a few steps is generallyacceptable with no degradation in performance.

The CDCM7005 requires a VCXO source to derive its output clock signals. The VCXO is at referencedesignator U1. The frequency of the VCXO can be changed to operate the Demo Kit with differentclocking schemes for different modulation standards or for specific customer requirements. Denote whichVCXO frequency is on the board so that the CDCM7005 part can be set up properly. The followingconventions are typically used:

• WCDMA: Derivatives of 61.44 MHz (i.e., 122.88 MHz, 245.76 MHz, 491.52 MHz)• GSM: Derivatives of 52 MHz (i.e., 104 MHz, 208 MHz)• CDMA2K: Derivatives of 78.6432 (i.e., 157.2864 MHz, 314.5728 MHz)

The integrated VCO of the TRF3761 outputs the RF signal used for the LO drive on the analog quadraturemodulator. The RF output frequency is contingent on the LO frequency value. The default TRF3761-Htypically has a tuning range from 2028 to 2175 MHz. Other frequency bands will require the existingTRF3761 to be changed to another pin-compatible part in a different frequency band. Using the TRF3761internal divider or another TRF3761 part to generate frequencies outside this range requires the outputterminations to be changed. Contact TI for support in this situation.

The RF frequency band of the VCO must be noted in order to know how to program the TRF3761 and atwhat frequency to measure the output RF signal from the modulator. The typical bands of operation areshown in Table 1.

Table 1. Frequency Bands

UMTS PCS GSM900 DCS1800

FREQUENCY 2110-2170 MHz 1930-1990 MHz 935-960 MHz 1805-1880 MHz

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2 Block Diagrams

2.1 System Block Diagram

DAC

I/QModulator90°

LPA TX

Diplexer

ANT

RX

LNA

A/DI/Q

Demod

2.2 Demo Kit Block Diagram

16

DAC5687

16

CLK1

TRF3703I/Q

Modulator

RF Out

TRF3750VCXO

TRF3761PLL

LO Generator

Ref Osc

CDCM7005Clock Gen

CLK2

Block Diagrams

The basic radio system block diagram in Figure 1 demonstrates where the TSW3003 Demo Kit fits in theoverall transceiver. The dash-line box illustrates the components found on the TSW3003 Demo Kit board.

Figure 1. System Block Diagram

The basic Demo Kit block diagram is shown in Figure 2. The shaded boxes illustrate the key TexasInstruments components found on the TSW3003 Demo Kit board.

Figure 2. Demo Kit Block Diagram

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3 Key Texas Instruments Components

3.1 CDCM7005

3.2 DAC5687

3.3 TRF3703

3.4 TRF3761

4 Software Installation

5 Software Operation

Key Texas Instruments Components

The CDCM7005 clock distribution chip is used to generate and synchronize the clock outputs to thesystem. The device has five outputs which can be either LVPECL or LVCMOS and can be divided downby 1, 2, 3, 4, 6, 8, and 16. The divide by 16 can be replaced with a divide by 4 or 8 with a 90 degreephase shift.

The DAC5687 is a 16-bit interpolating dual digital-to-analog converter (DAC). The device incorporates adigital modulator, independent differential offset control, and I/Q amplitude control. The device is typicallyused in baseband mode or in low IF mode with an analog quadrature modulator.

The TRF3703 is a direct upconversion IQ modulator. This device accepts a differential input voltagequadrature signal at baseband or low IF frequencies and outputs a modulated RF signal based on the LOdrive frequency.

The TRF3761 is a family of high performance, highly integrated frequency synthesizers, optimized forwireless infrastructure applications. The TRF3761 includes an integrated VCO and integer-N PLL.Different members of the TRF3761 family can be chosen for application specific VCO frequency ranges.

This section summarizes the installation procedures for the software required to operate the Demo Kit.Once all of the software is loaded, it is recommended to reboot the computer. This software has beenverified to be functional on Win2K and WinXP.

• Execute setup.exe• Reboot computer as required by the Windows™ operating system.• Power up the TSW3003EVM, and plug in the USB cable.• Allow the Windows™ operating system to automatically find and install the TSW3003 USB drivers.• Start the TSW3003 USB Vx.x software.

The following describes the use of the software required to set the TSW3003 Demo Kit in the baselineconfiguration for the CDCM7005, TRF3761, and DAC5687. The software should be configured in theorder presented below. The first step requires starting the TSW3003 software. This opens a window asshown in Figure 3. The tabs on the left side of the window allow selection of different GUI controllers forthe DAC5687, TRF3761, and CDCM7005. The lower left portion of the screen contains links to this user'sguide as well as the data sheets for the DAC5687, TRF3761, and the CDCM7005.

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5.1 CDCM7005 Software

Software Operation

Figure 3. TSW3003 Startup Screen

By using the provided CDCM7005 serial peripheral interface (SPI) software, the user can load settings tothe CDCM7005 internal registers. This must be performed every time the TSW3003 Demo Kit is poweredup, because the CDCM7005 has default settings that are loaded at power up and the settings may beslightly different than the ones required to operate the Demo Kit. Executing the program brings up theinterface seen in Figure 4. The default settings are correct for a VCXO of 491.52 MHz and a 10 MHzreference as on the TSW3003. The CDCM7005 GUI allows register settings to be saved and can beloaded back in afterwards. This can be accomplished with the Save and Load Settings buttons near theright side of the GUI.

It is recommended that any unused output clocks be tri-stated. In this case the TSW3003 only usesOUT_MUX_1 to drive the DAC5687. OUT_MUX_0, OUT_MUX_2, OUT_MUX_3, OUT_MUX_4 should betri-stated unless there is a need to use the other output clocks.

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Software Operation

Figure 4. Default CDCM7005 SPI GUI

The divider parameters, M and N, are determined according to the following equation based on theinternal reference frequency and internal VCXO frequency.

FREF = (FVCXO × M)/(N × P)

The p parameter is the VCXO input divider and set through the FB_MUX value. The M and N countervalues need to be adjusted depending on the board configuration. The M and N counter registers aredetermined by the reference frequency and the VCXO frequency. The OUT_MUX sets the divide ratios forthe individual output clocks. The OUTSEL determines whether the output clocks will be used assingle-ended CMOS or differential LVPECL. With a 10-MHz reference oscillator the CDCM7005 settingsare shown in Table 2 for a variety of common VCXO frequencies. A calculator is included in theCDCM7005 GUI software to calculate the M and N values based on Ref and VCXO frequencies.

Table 2. CDCM7005 Register Values

VCXO Freq. (MHz) 491.52 245.76 122.88 61.44

Divider M 125 125 125 125

Divider N 768 768 768 768

FB_MUX 8 4 2 1

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5.2 TRF3761 Software

Software Operation

The TRF3761 software is used to program the internal PLL chip to lock the integrated VCO onto a desiredfrequency output. The main menu of the program is shown in Figure 5.

Figure 5. TRF3761 GUI - Main Menu

The options in the front panel allow the user to program the desired frequency of the VCO, the desiredfrequency of the PFD, the reference frequency, and the prescaler selection. The software then displaysthe actual VCO frequency, PFD frequency and the R, N, A, and B counter values to be programmed intothe TRF3761. Hitting the Send button writes these values to the TRF3761. In default mode on a defaultboard, only the desired VCO frequency (2028 MHz to 2175 MHz) needs to be changed. For other VCOranges, a different member of the TRF3761 family needs to be selected and other parameters may needto be changed. The Advanced Operation button will bring up another user interface as shown in Figure 6.

Figure 6. TRF3761 GUI - Advanced Menu

This menu allows control of more register settings. For details on these settings, see the TRF3761 data

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5.3 DAC5687 Software

5.4 DAC5687 GUI Register Descriptions

5.4.1 Register Controls

Software Operation

sheet (SLWS181). The register of interest in this menu is the MUXOUT CONTROL which can be used todetermine the function of LED D4. This mode defaults to Digital PLL Lock Detect and causes the LED D4to light up when the PLL successfully locks. Normally, these menu settings do not need to be changed. Ifthe divider ratios are changed, the TRF3761 output termination needs to be modified to accommodate thenew output frequency. Otherwise, the performance may be degraded. Contact TI in this situation.

By using the provided software, the user can write and read control register information to the DAC5687.Once the Demo Kit is powered on and connected properly, then the GUI shown in Figure 7 is displayedwith the default settings read from the device. If there is a problem with the communication, such as theDemo Kit is not powered on or the USB cable is not connected, an error message will be displayedinstructing the user to correct the problem. Once corrected, hit the Read All button to read the defaultsettings of the device.

Figure 7. DAC5687 GUI

For normal operation, the user needs only to select values and switches as desired. The values areautomatically sent to the device and read back to verify their configuration.

• Load Regs – Loads register values from a saved file to the DAC5687 and updates the GUI.• Save Regs – Saves current GUI registers settings to a text file for future use.• Read All – Reads the current registers of the DAC5687. This is used to verify settings on the front

panel.• Send All – Sends the current front panel registers to the device. This is generally only used when the

Demo Kit power has recycled or the device has been reset and the user wants to load the displayedsettings to the device.

• Load Factory Optimization – Load default LO and sideband optimized values for the default boardcondition.

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5.4.2 Configuration Controls

Software Operation

• Full Bypass – When set, all filtering, QMC, and NCO functions are bypassed.• FIR Bypass – Bypass all interpolation filters. QMC INCO functional. Limited to FDAC = 250 MHz• FIFO Bypass – When set to bypass, the internal four sample FIFO is disabled. When cleared, the

FIFO is enabled.• FIR A – A side first FIR filter in high-pass mode when set, low-pass mode when cleared.• FIR B – B side first FIR filter in high-pass mode when set, low-pass mode when cleared.• Dual Clk – Only used when the PLL is disabled. When set, two differential clocks are used to input the

data to the chip; CLK1/CLK1C is used to latch the input data into the chip, and CLK2/CLK2C is usedas the DAC sample clock.

• Interleave – When set, interleaved input data mode is enabled; both A and B data streams are input atthe DA(15:0) input pins.

• Inverse Sinc – Enables inverse sinc filter.• Half Rate Input – Enables half rate input mode. Input data for the DAC A data path is input to the chip

at half speed using both the DA(15:0) and DB(15:0) input pins.• Sif – Sets sif_4-pin bit. A 4-pin serial interface mode is enabled when on, 3-pin mode when off. The

DAC5687 Demo Kit is configured for a 3-pin serial interface, so setting to a 4-bit serial interface makesreading registers impossible with the GUI.

• Inv. PLL Lock – Only used when PLL is disabled and dual clock mode is disabled. When cleared,input data is latched into the chip on rising edges of the PLLLOCK output pin. When set, input data islatched into the chip on falling edges of the PLLLOCK output pin.

• PLL Freq – Sets PLL VCO center frequency to low or high center frequency.• PLL Kv – Sets PLL VCO gain to either high or low gain.• Qflag – Sets qflag bit. When set, the QFLAG input pin operates as a B sample indicator when

interleaved data is enabled. When cleared, the TXENABLE rising determines the A/B timingrelationship.

• 2's Comp – When set, input data is interpreted as 2's complement. When cleared, input data isinterpreted as offset binary.

• Rev A Bus – When cleared, DA input data MSB to LSB order is DA(15) = MSB and DA(0) = LSB.When set, DA input data MSB to LSB order is reversed, DA(15) = LSB and DA(0) = MSB.

• Rev B Bus – When cleared, DB input data MSB to LSB order is DB(15) = MSB and DB(0) = LSB.When set, DB input data MSB to LSB order is reversed, DB(15) = LSB and DB(0) = MSB.

• USB – When set, the data to DACB is inverted to generate upper side band output.• Inv. Clk I(Q) – Inverts the DAC core sample clock when set, normal when cleared.• Sync_Phstr – When set, the internal clock divider logic is initialized with a PHSTR pin low to high

transition.• Sync_cm – When set, the coarse mixer is synchronized with a PHSTR low-to-high transition.• Sync_NCO – When set, the NCO phase accumulator is cleared with a phstr low-to-high transition.• Phstr Clk Div Select – Selects the clock used to latch the PHSTR input when restarting the internal

clock dividers. When set, the full rate CLK2 signal latches PHSTR and when cleared, the divided downinput clock signal latches PHSTR.

• DAC Serial Data – When set, both DAC A and DAC B input data is replaced with fixed data loadedinto the 16-bit serial interface DAC Static Data.

– Counter Mode – Controls the internal counter that can be used as the DAC data source: off; all16b; 7b LSBs; 5b MIDs; 5b MSBs.

– DAC Static Data – When DAC Serial Data is set, both DAC A and DAC B input data is replacedwith fixed data loaded with this value. Range = 0 - 65535.

• Alt. PLLLOCK Output – Can be used to determine alternate outputs on the PLLLOCK pin when usingthe internal PLL mode. The EXTLO pin must be open when using this mode.

• NCO – When set, enables NCO.

– NCO Gain – Sets NCO gain resulting in a 2x increase in NCO output amplitude. Except for Fs/2and Fs/4 mixing NCO frequencies, this selection can result in saturation for full-scale inputs.Consider using QMC gain for lower gains.

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5.4.3 DAC A(B) Gain

5.4.4 NCO

5.4.5 Additional Control/Monitor Registers

Software Operation

• QMC – When set, enables the QMC.

– QMCA Gain – Sets QMC gain A to a range = 0 to 2047. See the data sheet for more information.– QMC B Gain – Sets QMC gain B to a range = 0 to 2047. See the data sheet for more information.– QMC Phase – Sets QMC phase to a range = -512 to 511. See the data sheet for more information.

Used to adjust for I/Q phase imbalance.• Mode – Used to select the coarse mixer mode. See the DAC5687 data sheet for more information.• PLL Divider – Sets VCO divider to div by 1, 2, 4, or 8.• Interpolation – Sets FIR Interpolation factor: X2, X4, X4L, X8. X4 uses lower power than 4xL, but

Fdac = 320 MHz max when NCO or QMC are used.• Phstr Init. Phase – Adjusts the initial phase of the FS/2 and FS/4 CMIP block at PHSTR.• Sync FIFO – Sync source selection mode for the FIFO. When a low to high transition is detected on

the selected sync source, the FIFO input and output pointers are initialized. See the DAC5687 datasheet for source description.

• DAC Coarse Gain – Sets coarse gain of DAC A(B) full-scale current. Range is 0 to 15. See theDAC5687 data sheet for full-scale gain equation.

• DAC Fine Gain – Sets fine gain of DAC A(B) full scale current. Range is -128 to127. See theDAC5687 data sheet for full-scale gain equation. Used to adjust for I/Q amplitude imbalance.

• DAC DCOffset – Sets DAC A(B) dc-offset register. Range is -4096 to 4095. Used to adjust for carriersuppression.

• Sleep – DAC A(B) sleeps when set, operational when cleared.

• NCO DDS – Sets NCO DDS registers. See the DAC5687 data sheet for formula.• NCO Phase – Sets initial NCO phase registers. See the DAC5687 data sheet for more information.• FDAC (MHz), NCO IF (MHz) – Used to calculate the required NCO DDS value.

• Version – Displays the version of the silicon. If a version of 0 is read then the communication is notfunctioning and an error message will be displayed.

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6 Board Setup

6.1 Jumper Settings

6.2 Input/Output Connectors

Board Setup

The TSW3003 Demo Kit has onboard jumpers that allow the user to selectively disengage devices asdesired. The unit is shipped with jumpers in place that activate all of the devices on board. Table 3explains the functionality of the jumpers on the board.

Table 3. Jumper List

Jumper Label Function Condition Default

JP1 VCXOB Choose internal VCXO or external VCXO INB Internal VCXO Pin 1, 2

JP2 VCXO Choose internal VCXO or external VCXO INA Internal VCXO Pin 1, 2

SJP3 SJP3 Choose 1.8 or 2.1 VDD 1.8 VDD Pin 1, 2

JP6 REF CLK Choose internal 10-MHz ref or external ref 10 MHz Pin 2, 3

JP8 DEFAULT 3.3VA Choose 3.3V or 1.8V for IOVDD 3.3 VDD Pin 1, 2

J31-2 PLL_VDD PLLVDD GND (OFF) or 3.3V (ON) GND Pin 1, 2

J31-5 SLEEP SLEEP GND (ACTIVE) or 3.3V (SLEEP) GND Pin 4, 5

J31-8 EXTLO Internal (GND) or external (3.3V) voltage reference GND Pin 7, 8

J31-11 TX_ENABLE High enable data for DAC 3.3 V Pin 11, 12

J31-14 TESTMODE GND GND Pin 22, 23

J31-17 No Connect

J31-20 CDC_PD Low active power down of CDCM7005 3.3 V Pin 20, 21

J31-23 PD_OUTBUF Power down output buffer of TRF3761 GND Pin 22, 23

J31-26 CHIP_EN Enable TRF3761 chip 3.3 V Pin 26, 27

J31-29 RESET Low active reset of DAC5687 3.3 V Pin 29, 30

J31-32 PLLLCK_EN Low active PLLLOCK output buffer GND Pin 31, 32

J31-35 (1) No Connect

(1) VCXO does not have Output Enable control.

The input and output connections are shown in Table 4.

Table 4. Input/Output Connections

Reference Designator Connector Type Description

J1 Power Connector 6 VDC from wall adapter

J4 34-pin header External VCXO connection

J7 SMA Optional input clock from CDCM7005

J8 SMA Optional input clock from CDCM7005

J9 SMA Optional input clock from CDCM7005

J27 SMA PLLLLCK output from DAC5687, used to indicate lock or to drive externaldata source

J29 34-pin header DA input to the DAC5687

J30 34-pin header DB input to the DAC5687

J32 SMA RF output from modulator

J34 USB USB connector for GUI software

J35 SMA External Ref clock input

J37 Banana Plug +6-VDC connector for external DC supply

J38 Banana Plug GND connection for external DC supply

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6.3 USB Port

6.4 DC Power Requirements

7 Demo Kit Test Configuration

7.1 Test Setup Block Diagram

TSW3003EVM DUT

J27Clock

PowerSupply GND

+6 V

16

USB

J32PatternGenerator

16

J38 J37

PC Controller

J30

J29

J34

SpectrumAnalyzer

7.2 Test Equipment

Demo Kit Test Configuration

The TSW3003 Demo Kit contains a 4-pin USB port connector (J34) to interface to a standard computerUSB port. Programming of the CDCM7005, DAC5687, and TRF3761 are accomplished through this port.

The Demo Kit requires a single dc-voltage supply that is nominally 6 V. From that supply, the 5 V, 3.3 V,and 1.8 V required for the devices on the board are generated internally through linear voltage regulators.It is possible to use a higher input voltage; however, care should be taken not to over dissipate theonboard voltage regulators.

The test set up for general testing of the TSW3003 Demo Kit is shown in Figure 8.

Figure 8. Test System Block Diagram

The following is a list of the test equipment required for testing the TSW3003 Demo Kit. Equivalent modelsmay be used for certain applications, but may produce different results due to limitations within theinstrument.

• Dual Power Supply: Any with current readout capability or use the supplied 6VDC 4A wall supply• Spectrum Analyzer: Rhode & Schwartz FSU, Agilent PSA, or equivalent

This particular piece can measure >70-dBc ACPR with the noise cancellation option active. Thisamount of dynamic range is required to accurately measure the ACPR of the Demo Kit. Anotherspectrum analyzer can be substituted if it achieves as good or better dynamic range.

• Pattern Generator: Agilent 16720A• Oscilloscope: Tektronix 650 or equivalent

Used to probe clock output signals and for debugging.• Digital Voltmeter: Agilent 34401A or equivalent

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7.3 Calibration

7.4 Test Specifications

Demo Kit Test Configuration

In order to record proper output power the insertion loss of the output cable must calibrated. Measure theinsertion loss of the cable from J32 to the spectrum analyzer; set the analyzer's reference level offset tothat value.

The test specifications are outlined in Table 5.

Table 5. Demo Kit Typical Specifications

MIN MAX UNITS

CURRENT

+6 V 1.5 A

CW TESTS

Carrier suppression 30 dBc

Sideband rejection 25 dBc

Spurious Output

2nd harmonic 45 dBc

Aliased LSB (pos) 40 dBc

Output clock 40 dBc

Aliased USB 15 dBc

Aliased USB (neg) 8 dBc

WCDMA ACPR

Channel power -14 dBm

ACPR -Low 76 dBc

ACPR -High 76 dBc

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A

Ref -17.5 dBm

*

*

*

CLRWR

RBW 30 kHz

VBW 300 kHz

SWT 5 sAtt 5 dB*

1 RM

NOR

*

Center 2.17072 GHz Span 25.5 MHz2.55 MHz/

EXT

-110

-100

-90

-80

-70

-60

-50

-40

-30

-20

Tx Channel W-CDMA 3GPP FWD

Bandwidth 3.84 MHz Power -11.85 dBm

Adjacent Channel

Bandwidth 3.84 MHzLower -76.67 dB

Spacing 5 MHz Upper -76.59 dB

Alternate Channel

Bandwidth 3.84 MHzLower -77.96 dB

Spacing 10 MHz Upper -77.75 dB

POS -17.512 dBm

Demo Kit Test Configuration

Figure 9. Single-Carrier Test Mode 1 WCDMA, Typical PerformanceWith IF=30.72 MHz, LO=2.14 GHz

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A

Ref -20.1 dBm

*

*

*

CLRWR

RBW 30 kHz

VBW 300 kHz

SWT 5 sAtt 5 dB*

1 RM

NOR

*

Center 2.17072 GHz Span 35.6 MHz3.56 MHz/

EXT

-110

-100

-90

-80

-70

-60

-50

-40

-30

Standard: W-CDMA 3GPP FWD

Tx Channels

Ch1 -16.46 dBm(Ref)

Ch2 -88.87 dBm

Ch3 -16.56 dBm

Total -13.50 dBm

Adjacent Channel

Lower -72.90 dB

Upper -72.69 dB

Alternate Channel

Lower -72.51 dB

Upper -72.55 dB

POS -20.129 dBm

Demo Kit Test Configuration

Figure 10. Missing Middle-Carrier Test Mode 1 WCDMA, Typical PerformanceWith IF=30.72 MHz, LO=2.14 GHz

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A

Ref -25.8 dBm

*

*

*

CLRWR

RBW 30 kHz

VBW 300 kHz

SWT 5 sAtt 5 dB*

1 RM

NOR

*

Center 2.2936 GHz Span 40.6 MHz4.06 MHz/

EXT

-120

-110

-100

-90

-80

-70

-60

-50

-40

-30

Standard: W-CDMA 3GPP FWD

Tx Channels

Ch1 -22.39 dBm(Ref)

Ch2 -22.48 dBm

Ch3 -22.63 dBm

Ch4 -22.72 dBm

Total -16.53 dBm

Adjacent Channel

Lower -64.03 dB

Upper -64.65 dB

Alternate Channel

Lower -65.48 dB

Upper -64.78 dB

POS -25.811 dBm

7.5 WCDMA Output Power Versus ACPR Performance

Demo Kit Test Configuration

Figure 11. Four-Carrier Test Mode 1 WCDMA, Typical PerformanceWith IF=153.6 MHz, LO=2.14 GHz

The ACPR has some dependency on the output power of the TSW3003. The RF output spectrum showssome IMD effects as the output power of the DAC is increased. The optimum ACPR performance occurswhen there is approximately a -6dB attenuation pad between the DAC output and the TRF3703 input. Asthe power is increased the IMD3 effects start to affect the ACPR. As the power is decreased, the ACPRbecomes linear as a function of the signal power and the noise floor.

The ACPR results have been tabulated in Figure 12 through Figure 15 for 1, 2, 3, and 4 WCDMA carrierswith the TM1 signal.

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1 Carrier ACPR vs Pout, Baseband 2.14 GHz

-20 -15 -10 -5 0

Pout dBm/Channel

dB

1 ACPR

1 Alt ACPR

85

80

75

70

65

60

55

50

11 Carrier ACPR vs Pout, Baseband 2.14 GHz

-30 -25 -20 -15 -10 -5

Pout dBm/Channel

dB

11 ACPR

11 Alt ACPR

80

75

65

55

70

60

Demo Kit Test Configuration

Figure 12. ACPR Versus Output Power for 1Carrier WCDMA

Figure 13. ACPR Versus Output Power for 2 Carriers WCDMA

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111 Carrier ACPR vs Pout, Baseband 2.14 GHz

-30 -25 -20 -15 -10 -5

Pout dBm/Channel

dB 111 ACPR

111 Alt ACPR

75

73

71

69

67

65

63

61

59

57

55

1111 Carrier ACPR vs Pout, Baseband 2.14 GHz

-30 -25 -20 -15 -10 -5

Pout dBm/Channel

dB

1111 ACPR

1111 Alt ACPR

75

73

71

69

67

65

63

61

59

57

55

Demo Kit Test Configuration

Figure 14. ACPR Versus Output Power for 3 Carriers WCDMA

Figure 15. ACPR Versus Output Power for 4 Carriers WCDMA

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A

Ref -16.9 dBm

*

*

CLRWR

RBW 30 kHz

VBW 300 kHz

SWT 3 s

*

Att 5 dB*

1 RM

NOR

*

Center 2.14 GHz Span 25.5 MHz2.55 MHz/

EXT

-110

-100

-90

-80

-70

-60

-50

-40

-30

-20

Tx Channel W-CDMA 3GPP FWD

Bandwidth 3.84 MHz Power -12.05 dBm

Adjacent Channel

Bandwidth 3.84 MHzLower -75.95 dB

Spacing 5 MHz Upper -75.70 dB

Alternate Channel

Bandwidth 3.84 MHzLower -78.95 dB

Spacing 10 MHz Upper -79.24 dB

Demo Kit Test Configuration

Typical ACPR results are shown in Figure 16 through Figure 19 for the four cases.

Figure 16. Optimum ACPR for 1 Carrier WCDMA, -7-dB Pad

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Ref -21.6 dBm Att 5 dB*

*

*

*1 RM

CLRWR

A

NOR

RBW 30 kHz

VBW 300 kHz

SWT 3 s*

Center 2.14 GHz Span 30.5 MHz3.05 MHz/

EXT

-120

-110

-100

-90

-80

-70

-60

-50

-40

-30

Standard: W-CDMA 3GPP FWD

Tx Channels

Ch1 -17.55 dBm(Ref)

Ch2 -17.58 dBm

Total -14.56 dBm

Adjacent Channel

Lower -71.99 dB

Upper -72.00 dB

Alternate Channel

Lower -74.53 dB

Upper -73.88 dB

Demo Kit Test Configuration

Figure 17. Optimum ACPR for 2 Carrier WCDMA, -7-dB Pad

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A

Ref -22.6 dBm

*

*

*

CLRWR

RBW 30 kHz

VBW 300 kHz

SWT 3 sAtt 5 dB*

1 RM

NOR

*

Center 2.14 GHz Span 35.6 MHz3.56 MHz/

EXT

-120

-110

-100

-90

-80

-70

-60

-50

-40

-30

Standard: W-CDMA 3GPP FWD

Tx Channels

Ch1 -19.42 dBm(Ref)

Ch2 -19.49 dBm

Ch3 -19.50 dBm

Total -14.70 dBm

Adjacent Channel

Lower -69.45 dB

Upper -69.36 dB

Alternate Channel

Lower -71.60 dB

Upper -71.69 dB

Demo Kit Test Configuration

Figure 18. Optimum ACPR for 3 Carrier WCDMA, -7-dB Pad

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A

Ref -25.2 dBm

*

*

*

CLRWR

RBW 30 kHz

VBW 300 kHz

SWT 3 sAtt 5 dB*

1 RM

NOR

*

Center 2.14 GHz Span 40.6 MHz4.06 MHz/

EXT

-120

-110

-100

-90

-80

-70

-60

-50

-40

-30

Standard: W-CDMA 3GPP FWD

Tx Channels

Ch1 -21.75 dBm(Ref)

Ch2 -21.78 dBm

Ch3 -21.83 dBm

Ch4 -21.75 dBm

Total -15.76 dBm

Adjacent Channel

Lower -68.38 dB

Upper -68.65 dB

Alternate Channel

Lower -69.27 dB

Upper -69.26 dB

8 Basic Test Procedure

8.1 Initial Inspection

8.2 Engage Power Supplies

Basic Test Procedure

Figure 19. Optimum ACPR for 4 Carrier WCDMA, -7-dB Pad

This section outlines the basic test procedure to get the Demo Kit operational. Disconnect the cables atJ29 and J30 that connect to the pattern generator. Connect the power supply cable and the RF output tothe spectrum analyzer.

Inspect the board to determine which devices were used.

• Note the VCXO frequency (U1) that is on the board

Engage 6-V power supply

• Verify the current reading is between 0.8 A to 1.3 A when configured with the DAC5687, if applicable.When using the wall adapter, this may be difficult. In this case, just note that the D12 and D13 are on.

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8.3 Program the CDCM7005

8.4 Program the TRF3761

8.5 DAC5687 Program

8.6 Carrier Suppression

Basic Test Procedure

Use the Default Settings on the CDCM7005 GUI (See Section 5.1). This generates a 491.52-MHz clock.

• Hit the GUI Send button• Verify that LEDs D12, D13, and D14 are illuminated

Use the Default Settings in the TRF3761 GUI (See Section 5.2). This places a carrier at 2.14 GHz

• Hit the GUI send button.• Verify the LED D15 is illuminated. This indicates that a locked LO is present.• Monitor RF output from the spectrum analyzer• Verify a single frequency tone at the default 2.14 GHz.

There may be side tones created by the default complex output of the DAC5687.

Table 6. Frequency Designations

VCO BAND UMTS GSM900 PCS DCS1800

Midband (MHz) 2140 950 1960 1850

Low (MHz) 2110 935 1930 1805

High (MHz) 2170 960 1990 1880

• The DAC PLL mode is disabled as per the default jumper settings on J31. See section 6.• Verify DACA and DACB Coarse Gain is set to 15• Ensure DAC Offsets and DAC fine gain for both A and B are set to 0• Set the spectrum analyzer as follows:

– Center Freq: 2.14 GHz– RBW: 30 kHz, VBW: 300 kHz– Span: 491.52 MHz– Attn: 5 dB– Ref Level: 10 dBm

The carrier suppression can be tuned for better performance by adjusting the dc-offset controls on theDAC5687. The default DAC GUI is shown below with the NCO mixer turned on to output a 61.44-MHztone. The output spectrum is illustrated in Figure 21.

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Basic Test Procedure

Figure 20. Default DAC GUI With fDAC/8 Tone From NCO

Figure 21. Single Sideband Spectrum Output Before DAC Offset and QMC Adjustments

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8.7 Sideband Rejection

Basic Test Procedure

An iterative process is used to achieve the best performance.

• Place a normal marker at the peak upper sideband, place a delta marker at the carrier signal, and notethe initial delta value.

• Set initial DACA offset to 0 and DACB offset to 0.• Change DACA offset by 1000 steps and monitor the output performance change.• If performance gets better, then repeat the process with an additional 1000 steps. If the performance

gets worse or doesn't change, then change the offset in the other direction by 1000 steps.• Once the best performance remains basically unchanged, repeat the process on DACB offset with

1000 step changes.• Once optimized, go back to the A side and repeat the tuning process with a step size of 100.• Continue tuning. After each complete cycle, reduce the step size down (i.e., to 10, then to 1 if desired).• A performance greater that 70 dBc should be achievable.

Sideband rejection is determined by the two quadrature signals to the modulator being exactly 180degrees out of phase and exactly the same amplitude. Amplitude and phase imbalance between the twopaths yield an unwanted lower sideband. The amplitude variation between the two paths can becompensated for by adjusting the DAC fine gain controls or by adjusting the QMC gain controls if thedevice is operating with the QMC on. The phase can be compensated by using the QMC phaseadjustment. Note this is only possible when the coarse mixer is not used in the fDAC/4 mode. Coarsemixing in the fDAC/4 mode causes the relative phase information between I and Q paths to be mixed. In thefDAC/2 mode there are no cross terms (terms are 0) and the relative phase information is maintainedbetween I and Q paths.

• Place marker delta on the lower sideband• Turn on the QMC. Set the Gain of the QMC to 1024 for gain of 0 dB for I and Q paths. Other initial

settings may be needed depending on the state of the NCO gain and signal amplitude.• Change the phase of the QMC by small increments until the sideband is minimized.• Change the QMC A or B gains in increments of 1 until the sideband is minimized.• The overall performance should be greater than 60 dBc from the other sideband with amplitude and

phase corrections.• Re-optimized the dc-offset values as required to maintain carrier suppression performance as

specified.

Figure 22. DAC GUI With Typical Settings To Minimize LO and Sideband

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9 Optional Configurations

9.1 External LO

Optional Configurations

Sideband and LO are reduced significantly. Other spurs can be easily filtered out using an RF filter.

Figure 23. Sideband and LO Compensated Using QMC Settings

To configure the board for external LO implement the following modifications:

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Optional Configurations

• Remove C154, C155; disconnect the TRF3761 from LO path• Install C390, C391, R114 to connect the external LO to modulator, external LO J39• Disable the TRF3761 output by setting J31-23, 24 PD_OUTBUF, J31-25, 26 CHIP_EN

Figure 24. Board Modifications for External LO

Figure 25. Jumper Settings to Disable TRF3761

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9.2 External Reference

10 Filter Specifications

10.1 Baseband Filter

Filter Specifications

To configure the board for external reference, implement the following modifications:

• Change JP1-2,3 and JP2-2,3. Connect external VXCO to J4.

Figure 26. Jumper Changes for External VCXO

The TSW3003 Demo Kit layout provides the opportunity to place components to realize up to a 5th orderLC filter. The Demo Kit is by default populated with a resistive network to provide some attenuation and atwo-inductor network to compensate for the droop caused by the parasitic board capacitance. Thisprovides about 0.5 dB of ripple up to ±200 MHz of bandwidth, followed by a slow, low-pass rolloff.

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10.1.1 RF Filter/Output Match

11 Bill of Materials and Schematics

11.1 Bill of Materials

Bill of Materials and Schematics

The TSW3003 Demo Kit layout also provides the opportunity to place a small 3rd order LC filter on theoutput of the modulator for either filtering or impedance matching purposes. This filter has been disabledby removing the shunt elements.

This section contains the bill of materials and schematics for the TSW3003 Demo Kit.

Table 7 lists the parts used in constructing the TSW3003 Demo Kit.

Table 7. Bill of MaterialsQty Ref Des Value PCB Footprint MFR Name MFR Part Number Note

8 C1 C18 C21 C26 C34 47μF tant_b Kemet T494B476M010ASC39 C41 C46

62 C3 C20 C28 C36 C38 0.1μF 0402 Panasonic ECJ-0EB1C104KC43 C48-C54 C56-C66C70-C72 C74 C75 C78C85-C94 C97-C100C103 C106 C111 C112C115 C118 C120 C121C123 C124 C144 C145C162 C165 C344-C347

2 C4 C109 1μF 0603 Panasonic ECJ-1V41E105M

6 C5 C77 C80-C82 C96 0.01μF 0402 Panasonic ECJ-0EB1E103K

12 C19 C24 C25 C27 C35 10μF 1206 Panasonic ECJ-3YB1C106KC37 C40 C42 C44 C45C47 C348

13 C55 C67-C69 C76 C79 10μF tant_a Kermet T494A106M016ASC83 C84 C101 C116C122 C148 C150

6 C95 C104 C117 C127 0.001μF 0402 Panasonic ECJ-0EB1E102KC163 C164

1 C102 560pF 0402 Panasonic ECJ-0EB1H561K

1 C108 0.47μF 0603 Murata GRM188R71C474KA88D

1 C110 22μF tant_a Kemet T494A226M010AS

2 C119 C343 100pF 0402 Panasonic ECJ.-0EB1E101K

1 C126 680pF 0603 Murata GRM1885C2A681JA01D

1 C128 330pF 0603 Murata GRM1885C2A331JA01D

1 C136 0.033μF 0402 AVX 0402ZC333KAT2A

1 C137 330pF 0402 Panasonic ECJ-0EB1E331K

1 C138 10,000pF 0603 Murata GRM188R71H103KA01D

7 C147 C149 C151 C154 10pF 0402 Murata GRM1555C1H100JZ01DC155 C377 C387

2 C152 C153 22pF 0402 Panasonic ECJ-0EC1H220J

0 C156-C158 C171 2.2pF 0603 AVX 06035A2R2CAT2A_DNI DNI

3 C160 C161 C169 4.7μF tant_a AVX TAJA475K020R

0 C167 C168 DNI 0402 Panasonic ECJ-0EB1E103K_DNI DNI

0 C224-C226 C340 4.7pF 0603 Panasonic ECJ-1VC1H047C_DNI DNI

2 C381 C386 3.3pF 0402 Murata GRM1555C1H3R3CZ01D

2 C383 C384 47pF 0603 Panasonic ECJ-1VC1H470J

1 C385 10nF 0603 Panasonic ECJ-1VB1C103K

0 C390 C391 22pF 0402 Panasonic ECJ-0EC1H220J_DNI DNI

5 D12-D16 LED green LED_0805 Panasonic LNJ306G5UUX

16 FB1-FB16 68Ω at 100MHz 1206 Panasonic EXC-ML32A680U

1 J1 CONN JACK PWR CON_RAPC722_JACK_THVT_3 Switchcraft RAPC722

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Bill of Materials and Schematics

Table 7. Bill of Materials (continued)Qty Ref Des Value PCB Footprint MFR Name MFR Part Number Note

8 J4 J7-J9 J27 J32 J35 SMA_END_RND SMA_SMEL_218x247 Johnson 142-0761-821J39 Components

2 J29 J30 TSM-117-01-S-DV- SAMTEC_TSM_117_01_S_DV_L SAMTEC TSM-117-01-S-DV-LCLC C

1 J31 HTSW-120-07-L-T HDR_THVT_3x12_100_M SAMTEC HMTSW-120-07-G-T

1 J34 USB_B_S_F_B_T CON_THRT_USB_B_F SAMTEC USB-B-S-F-B-THH

1 J37 BANANA_JACK_R JACK_THVT_BANANA_250dia Alectron ST-351A REDED Connectors

1 J38 BANANA_JACK_B JACK_THVT_BANANA_250dia Alectron ST-351B BLKLK Connectors

4 JP1 JP2 JP6 JP8 Jumper_1x3_100_ HDR_THVT_1x3_100_M SAMTEC HMTSW-103-07-G-S-.230430L

10 L19 L21 L22 L25 R179 0 0603 Panasonic ERJ-3GEY0R00VR230 R235-R237 R262

4 L20 L23 L24 L26 33nH 0603 Coilcraft 0603CS-33NX_L

2 L27 L28 8.2nH 0402 Coilcraft or 0402CS-3N3XJL orJohanson L-07C3N3SV6S

3 R13 R18 R21 100K 0603 Panasonic ERJ-3EKF1003V

3 R23 R24 R105 1K 0402 Panasonic ERJ-2RKF1001X

0 R25 R37 R97 R98 130 0402 Panasonic ERJ-2RKF1300X_DNI DNI

14 R26 R31 R45 R46 R67 22.1 0402 Panasonic ERJ-2RKF22R1XR68 R71 R72 R75 R76R90 R91 R101 R108

1 R27 15.8K 0603 Panasonic ERJ-3EKF1582V

1 R28 30.1K 0603 Panasonic ERJ-6ENF3012V

1 R29 10 0402 Panasonic ERJ-2RKF10R0X

11 R32 R33 R82 R86 R88 100 0402 Panasonic ERJ-2RKF1000XR89 R92 R93 R96 R99R125

3 R34-R36 750 0402 Panasonic ERJ-2RKF7500X

8 R39-R44 R47 R49 130 0402 Panasonic ERJ-2RKF1300X

3 R48 R52 R83 150 0402 Panasonic ERJ-2RKF1500X

3 R50 R63 R69 0 0402 Panasonic ERJ-2GE0R00X

8 R53-R56 R58 R59 R70 82.5 0402 Panasonic ERJ-2RKF82R5XR78

8 R61 R65 R77 R79 R81 10K 0402 Panasonic ERJ-2RKF1002XR84 R94 R95

0 R64 1K 0402 Panasonic ERJ-2RKF1001X_DNI DNI

0 R66 22.1 0402 Panasonic ERJ-2GE0R00X_DNI DNI

1 R73 162 0402 Panasonic ERJ-2RKF1620X

3 R74 R106 R107 4.75K 0402 Panasonic ERJ-2RKF4751X

2 R102 R109 300 0603 Panasonic ERJ-3EKF3000V

0 R103 100 0402 Panasonic ERJ-2RKF1000X_DNI DNI

1 R104 7.5k 0603 ROHM MCR03EZPFX7501

1 R110 649 0603 Yageo RC0603FR-07649RL

0 R114 49.9 0402 Panasonic ERJ-2RKF49R9X_DNI DNI

4 R118 R119 R133 R134 634 0603 Yageo RC0603FR-07634RL

4 R120 R171 R180 R184 60.4 0603 Yageo RC0603FR-0760R4L

4 R172 R177 R280 R281 115 0603 Yageo RC0603FR-07115RL

1 R261 93.1 0402 Panasonic ERJ-2RKF93R1X

0 R284 110 0603 Panasonic ERJ-3EKF1100V_DNI DNI

0 R285 221 0603 Panasonic ERJ-3EKF2210V_DNI DNI

1 R287 23.2K 0603 Panasonic ERJ-3EKF2322V

1 R288 6.34K 0603 Panasonic ERJ-3EKF6341V

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11.2 Schematics

Bill of Materials and Schematics

Table 7. Bill of Materials (continued)Qty Ref Des Value PCB Footprint MFR Name MFR Part Number Note

2 R289 R290 90.9 0603 Panasonic ERJ-3EKF90R9V

4 RN1-RN4 4816P-001-220 RNET_16_225x445_50 Bourns 4816P-001-220

1 SJP3 Jumper_1x3_SMT SJP3_JUMPER

1 SW2 SW RESET switch_reset C&K KT11P3JM

2 TP1 TP4 Testloop_Red TP_THVT_060_RND Keystone 5000Electronics Corp

1 U1 2115-491.52MHZ VCXO_6 Toyocom TCO-2111-491.52

1 U6 TPS76733QPWP HTSSOP_20_260x177_26_pwrpa Texas TPS76733QPWPd Instruments

1 U8 HTSSOP_20_260x177_26_pwrpa Texas TPS76701QPWPTPS76701QPWP d Instruments

1 U9 HTSSOP_20_260x177_26_pwrpa Texas TPS76750QPWPTPS76701QPWP d Instruments

1 U10 HTQFP100 Texas DAC5687DAC5687 Instruments

1 U12 CDCM7005 QFN48 Texas CDCM7005RGZTInstruments

1 U16 OSC-VECTRON OSC_4_SM_460x386 VECTRON VTD3-J0BC-10M000

1 U17 TRF3761 PQFP_40_242x242_0p5mm Texas TRF3761Instruments

1 U18 TRF3703-33 QFN24 Texas TRF3703Instruments

1 U47 SN74AHC541PW tssop_20_260x177_26 Texas SN74AHC541PWInstruments

1 U48 SN74HC241PW tssop_20_260x177_26 Texas SN74HC241PWInstruments

3 U49 U51 U52 SN74LVC1G125D SOT_5_120x69_57 Texas SN74LVC1G125DBVRBVR Instruments

1 U50 FT245RL ssop_28_413x220_26 FTDI Chip FT245RL

0 U53 OSC-VECTRON XTAL_4_SM_203x132 Vectron VTC4_DNI DNIInternational

4 SCREW1-SCREW4 SCREW PANHEAD 4-40 x 3/8 Building PMS 440 0038 PHFasteners

4 STANDOFF1- STANDOFF ALUM Keystone 2203STANDOFF4 HEX 4-40 × 0.500

The schematic for the TSW3003 Demo Kit appears on the following page.

32 TSW3003 Demonstration Kit SLWU029D–October 2006–Revised August 2007Submit Documentation Feedback

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5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

DB15DB14DB13

DB12DB11DB10DB9DB8

DB7DB6DB5

DA15DA14DA13

DA12DA11DA10DA9DA8

DA7DA6DA5

DA4DA3DA2DA1DA0

DB4DB3DB2DB1DB0

+3.3VA

+1.8VD

+3.3VA +3.3VA

+1.8VD +3.3VA

+3.3VCLK

IOVDD IOVDD

IOVDD

IOVDD

+1.8VD

+3.3VA

+3.3VA

+3.3VA

+1.8VD

DB[0..15] SH2

IOUTA2 SH3IOUTA1 SH3

IOUTB1 SH3IOUTB2 SH3

DA[0..15]SH2

CLK2CB SH4CLK2B SH4

CLK1CB SH4CLK1B SH4

/RESET SH2,4

TX_ENABLESH2

PLL_VDD SH2

/PLLCK_ENSH2

PHSTR SH2

EXT_LOSH2

SLEEP SH2

QFLAG SH2SDENBSH5SCLKSH5SDIOSH5

Title

Size Document Number Rev

Date: Sheet of

DAC D

TSW3003_EVMB

1 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

DAC D

TSW3003_EVMB

1 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

DAC D

TSW3003_EVMB

1 7Wednesday, March 07, 2007

NOTE: DNI = DO NOT INSTALL

P. LARSON

Engineer:

Drawn By:

J. SETON

FILE:

JP8 - JUMPER PINS 1 & 2

C66.1uFC66.1uF

R98130DNI

R98130DNI

C53.1uFC53.1uF

+ C7610uF10V

+ C7610uF10V

C71.1uFC71.1uF

C51.1uFC51.1uF

JP8DEFAULT +3.3VA

JP8DEFAULT +3.3VA

1

32

C82 .01uFC82 .01uF+ C6710uF10V

+ C6710uF10V

R31

22.1

R31

22.1

C78.1uFC78.1uF

R25130DNI

R25130DNI

C62.1uFC62.1uF

R29

10

R29

10

R33100R33100

R284110DNI

R284110DNI

C70.1uFC70.1uF

C136 .033uFC136 .033uF

C61.1uFC61.1uF

R2622.1R2622.1

+ C7910uF10V

+ C7910uF10V

+ C5510uF10V

+ C5510uF10V C77 .01uFC77 .01uF

M SA

D EN

J27PLL_LOCK

M SA

D EN

J27PLL_LOCK

1

5234

C56.1uFC56.1uF

C58.1uFC58.1uF

C59.1uFC59.1uF

U10DAC5687

U10DAC5687

DA

253

DA

352

DA

451

DGND45

DA550 DA649 DA748

AV

DD

3

IOGND47

DB

172

DB

0(LS

B)

71

DGND38

DGND 81IODVDD 80

AG

ND

17A

VD

D18

AV

DD

23A

VD

D24

DA1041

AG

ND

25

DVDD26 IOU

TB2

6

DGND27SDENB28SCLK29

PLL

LOC

K70

DA1435

RESETB 95SLEEP 96

DGND 88

IOVDD46

IOU

TB1

5

AG

ND

9A

VD

D8

PLL

VD

D67

DA1239

DA1336DVDD37

DA15(MSB)34

AG

ND

4

LPF

66P

LLG

ND

65

CLK

262

CLK

VD

D61

CLK

1C60

DG

ND

69

DB

273

AV

DD

10EX

TIO

11

DB11 86

AV

DD

14E

XTL

O15

DB13 90

AV

DD

16

TXENABLE33

SDIO30

CLK

159

CLK

GN

D58

DB

374

DB

475

DB5 76DB6 77DB7 78IOGND 79

DVDD 82DB8 83DB9 84DB10 85

CLK

2C63

CLK

GN

D64

DV

DD

68

DA

154

DA

0(LS

B)

55D

VD

D56

DG

ND

57

SDO31DVDD32

DA1140

DA942DA843DVDD44

AG

ND

12B

IAS

J13

AG

ND

7

AG

ND

1A

VD

D2

AG

ND

19IO

UTA

220

IOU

TA1

21A

GN

D22

DB12 87

DVDD 89

DB14 91DB15(MSB) 92DGND 93PHSTR 94

TESTMODE 97QFLAG 98DGND 99DVDD 100

+ C11610uF10V

+ C11610uF10V

R241KR241K

C60.1uFC60.1uF

C72.1uFC72.1uF

C80 .01uFC80 .01uF

R2370

R2370

R261

93.1

R261

93.1

C115.1uFC115.1uF

C137 330pFC137 330pF

C52.1uFC52.1uF

C50.1uFC50.1uF

U49

SN74LVC1G125DBVR

U49

SN74LVC1G125DBVR

OE1

A2Y 4

GND3

VCC 5

R32100R32100

+ C6910uF10V

+ C6910uF10V

R97130DNI

R97130DNI

SW2

SW RESET

RESETSW2

SW RESET

RESET12

34

C63.1uFC63.1uF

C74.1uFC74.1uF

C49.1uFC49.1uF

R23

1K

R23

1K

C64.1uFC64.1uF

C81 .01uFC81 .01uF

C65.1uFC65.1uF

C75.1uFC75.1uF

C54.1uFC54.1uF

R285221DNI

R285221DNI

+ C6810uF10V

+ C6810uF10V

R37130DNI

R37130DNI

C57.1uFC57.1uF

Page 34: TSW3003 Demonstration Kit (Rev. D - TI.com

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

DA14DA13DA12DA11DA10DA9DA8

DA7DA6DA5DA4DA3DA2DA1DA0

DA15

DB0

DB15DB14DB13DB12DB11DB10DB9DB8

DB7DB6DB5DB4DB3DB2DB1

DA_7DA_6DA_5DA_4DA_3DA_2DA_1DA_0

DB_0DB_1DB_2DB_3DB_4DB_5DB_6

DB_9DB_10DB_11DB_12DB_13DB_14DB_15

DA_15DA_14DA_13DA_12DA_11DA_10DA_9DA_8

DB_7

DB_8

+3.3VA

DB[0..15] SH1

DA[0..15] SH1PHSTR SH1

/RESET SH1,4

/CDC_PD SH4

TX_ENABLE SH1EXT_LO SH1SLEEP SH1PLL_VDD SH1

QFLAG SH1

PD_OUTBUF SH7CHIP_EN SH7

/PLLCK_EN SH1

Title

Size Document Number Rev

Date: Sheet of

INTERFACE CONTROL D

TSW3003_EVMB

2 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

INTERFACE CONTROL D

TSW3003_EVMB

2 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

INTERFACE CONTROL D

TSW3003_EVMB

2 7Wednesday, March 07, 2007

J31 - JUMPER PINS 1 & 2

JUMPER PINS 7 & 8 JUMPER PINS 11 & 12

JUMPER PINS 22 & 23 JUMPER PINS 26 & 27 JUMPER PINS 31 & 32

JUMPER PINS 20 & 21

JUMPER PINS 4 & 5

R108

22.1

R108

22.1 RN44816P-001-220

RN44816P-001-220

12345678 9

10111213141516

RN34816P-001-220

RN34816P-001-220

12345678 9

10111213141516

RN24816P-001-220

RN24816P-001-220

123456789

10111213141516

RN14816P-001-220

RN14816P-001-220

123456789

10111213141516

J29TSM-117-01-S-DV-LC

J29TSM-117-01-S-DV-LC

13

24

5678910111213141516171819202122232425262728293031323334

J30TSM-117-01-S-DV-LC

J30TSM-117-01-S-DV-LC

13

24

5678910111213141516171819202122232425262728293031323334

R101

22.1

R101

22.1

J31

HTSW-120-07-L-T

J31

HTSW-120-07-L-T

1

2

4 6

8

10 12

14

16 18

20

3

5

7 9

11

13 15

17

19 2122

23

2425

26

2728

29

3031

32

3334

35

36

Page 35: TSW3003 Demonstration Kit (Rev. D - TI.com

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

+5VA

+5VA

+5VA

+5VA

IOUTA2SH1

IOUTA1SH1

IOUTB2SH1

IOUTB1SH1

LONSH7LOPSH7

Title

Size Document Number Rev

Date: Sheet of

MODULATOR D

TSW3003_EVMB

3 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

MODULATOR D

TSW3003_EVMB

3 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

MODULATOR D

TSW3003_EVMB

3 7Wednesday, March 07, 2007

NOTE: DNI = DO NOT INSTALL

L2033nHL2033nH

12

R120

60.4

R120

60.4

C3813.3pFC3813.3pF

R29090.9R29090.9

R171

60.4

R171

60.4

C167DNIC167DNI

C2244.7pFDNI

C2244.7pFDNI

C168DNIC168DNI

C1562.2pFDNI

C1562.2pFDNI

+ C1614.7uF20V

+ C1614.7uF20V

R281115R281115

C1572.2pFDNI

C1572.2pFDNI

C3863.3pFC3863.3pF

R2350R2350

R184

60.4

R184

60.4

R133634

R133634

68 ohm @ 100MHz

FB5

68 ohm @ 100MHz

FB5

C3404.7pFDNI

C3404.7pFDNI

R118634

R118634

R134634R134634

R1790R1790

L2633nHL2633nH

12

R2360

R2360

C2254.7pFDNI

C2254.7pFDNIR119

634R119634

R180

60.4

R180

60.4

R172115

R172115

C162.1uFC162.1uF

C343

100pF

C343

100pF

L22

0

L22

01 2

R177115R177115

68 ohm @ 100MHz

FB4

68 ohm @ 100MHz

FB4

C1631000pFC1631000pF

L25

0

L25

01 2

R280115R280115

C1582.2pFDNI

C1582.2pFDNI

U18TRF3703-33

U18TRF3703-33

NC11GND2LOP3LON4GND5NC26

NC

37

GN

D8

QN

9Q

P10

GN

D11

GN

D12

VCCI 18GND 17

RFOUT 16NC5 15GND 14NC4 13

GN

D19

GN

D20

IP21

IN22

GN

D23

VC

C2

24

R28990.9R28990.9

L21

0

L21

01 2

+ C1604.7uF20V

+ C1604.7uF20V

C1712.2pFDNI

C1712.2pFDNI

L2333nHL2333nH

12

R2300

R2300

M SA

D EN

J32REFOUT

M SA

D EN

J32REFOUT

1

5234

C165.1uFC165.1uF

C2264.7pFDNI

C2264.7pFDNI

L19

0

L19

01 2

L2433nHL2433nH

12

C1641000pFC1641000pF

Page 36: TSW3003 Demonstration Kit (Rev. D - TI.com

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

V_CTRL

V_CTRL

+3.3VCLK

+3.3VCLK AVCC

+3.3VCLK

+3.3VCLK

+3.3VCLK

+3.3VCLK+3.3VCLK

+3.3VCLK

AVCC

+3.3VCLK +3.3VCLK

CTRL_DATA SH5

REF_OSCSH7

CTRL_LE SH5

CTRL_CLK SH5

CLK2CB SH1CLK2B SH1

CLK1B SH1CLK1CB SH1

/RESET SH1,2

/CDC_PD SH2

Title

Size Document Number Rev

Date: Sheet of

CDC D

TSW3003_EVMB

4 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

CDC D

TSW3003_EVMB

4 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

CDC D

TSW3003_EVMB

4 7Wednesday, March 07, 2007

DNI = DO NOT INSTALLJP1 - JUMPER PINS 1 & 2JP2 - JUMPER PINS 1 & 2VCO_EN OPTION NOT AVAILABLE ON U1.

NOTES:

C1091uF20%25V

C1091uF20%25V

D13 LED greenREFD13 LED greenREF

C89.1uFC89

.1uFC92

.1uFC92

.1uF

R744.75KR744.75K

R50

0

R50

0

C103.1uF10%16V

C103.1uF10%16V

C91.1uFC91

.1uF

+ C11022uF20%10V

+ C11022uF20%10V

12

JP1VCXOB

JP1VCXOB1

32

R66

22.1

R66

22.1

R63

0

R63

0

R42130R42130

C102560pF10%50V

C102560pF10%50V R39

130R39130

C90.1uFC90

.1uF

C1041000pF

10%25V

C1041000pF

10%25V

R5982.5R5982.5

R52

150

R52

150R5882.5R5882.5

R47130R47130

R48

150

R48

150

R41130R41130

R7882.5R7882.5

M SA

D EN

J9OUTCLK1

M SA

D EN

J9OUTCLK1

1

5234

C100

.1uF

C100

.1uF

68 ohm @ 100MHz

FB1

68 ohm @ 100MHz

FB1

+C10110uF10V

+C10110uF10V

R40130R40130

JP2VCXO

JP2VCXO

1

32

U1

2111-491.52MHZ

U1

2111-491.52MHZ

V_CTRL1NC2GND3 OUT 4OUTB 5VCC 6

R5682.5R5682.5

R5382.5R5382.5

C94.1uFC94

.1uFC97.1uFC97.1uF

M SA

D EN

J8OUTCLK3

M SA

D EN

J8OUTCLK3

1

5234

C93.1uFC93

.1uF

D14 LED greenLOCK

D14 LED greenLOCK

C98.1uFC98.1uF

C99.1uFC99.1uF

D12 LED greenVCXO

D12 LED greenVCXO

R5582.5R5582.5

C95.001uFC95

.001uF

JP3JP312

C106 .1uF

10%16V

C106 .1uF

10%16V

R44130R44130

R73

162

R73

162

C96.01uFC96

.01uF+C83

10uF10V

+C8310uF10V

MS A

DE N

J4EXT_VCXO

MS A

DE N

J4EXT_VCXO

1

5234

C88.1uFC88

.1uF

R5482.5R5482.5

R6110KR6110K

R83150R83150

R7082.5R7082.5

R43130R43130

R6510KR6510K

C87.1uFC87

.1uF

R35 750R35 750

R641KDNI

R641KDNI

C86.1uFC86

.1uF

R34 750R34 750

+ C8410uF10V

+ C8410uF10V

R69

0

R69

0

C112

.1uF

C112

.1uF

C85.1uFC85

.1uF

R36 750R36 750

R49130R49130

C111

.1uF

C111

.1uF

M SA

D EN

J7OUTCLK2

M SA

D EN

J7OUTCLK2

1

5234

U12

CDCM7005

U12

CDCM7005

VCC 13

Y2B 8Y2A 7VCC 6VCC 5

VCC_CP33

AVCC32

NC34

Y3B 12Y3A 11VCC 10VCC 9

VCC 19

REF_SEL35

AVCC39AVCC38

SEC_REF37PRI_REF36

VCXO_IN43VCXO_INB42VCC41VBB40

/RESET or /HOLD 14VCC 15Y4A 16Y4B 17VCC 18

/PD 1VCC 2Y1A 3Y1B 4

VCC 20VCC 21

STATUS_VCXO or I_REF_CP 22STATUS_REF or PRI_SEC_CLK 23

GND 24

PLL_LOCK 25CTRL_DATA 26

AVCC27

CTRL_CLK28 CTRL_LE29

AVCC30 CP_OUT31

VCC44 VCC45 Y0A46 Y0B47 VCC48

C108.47uF10%16V

C108.47uF10%16V

Page 37: TSW3003 Demonstration Kit (Rev. D - TI.com

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

+3.3VA

+3.3VA +3.3VA

+3.3VA

+3.3VA +3.3VA

CTRL_CLK SH4

CTRL_DATA SH4

CTRL_LE SH4

SCLK SH1

SDIO SH1

PLL_CLK SH7

PLL_DATA SH7

PLL_LE SH7SDENB SH1

Title

Size Document Number Rev

Date: Sheet of

USB INTERFACE D

TSW3003_EVMB

5 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

USB INTERFACE D

TSW3003_EVMB

5 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

USB INTERFACE D

TSW3003_EVMB

5 7Wednesday, March 07, 2007

CLK

DATA

CTRL_LE

PLL_LE

OE

SDEN

SDIO

R88 100R88 100

U48

SN74HC241PW

U48

SN74HC241PW2Y4 3

1A121A241A361A482A1112A2132A3152A417GND10 2Y3 52Y2 72Y1 91Y4 121Y3 141Y2 161Y1 182OE 191OE1 VCC 20

R86 100R86 100

R125 100R125 100

R8410KR8410K

R68 22.1R68 22.1

R92 100R92 100

R67 22.1R67 22.1

R8110KR8110K

R75 22.1R75 22.1

C344.1uFC344.1uF

R82 100R82 100

R72 22.1R72 22.1

U50

FT245RL

U50

FT245RL

USBDM16

USBDP15

VCCIO4

NC18

RESET19

NC224

OSCI27

OSCO28

3V3OUT17

AGND25GND7GND18GND21TEST26 PWREN 12

WR 14

D1 5

D7 6

D5 9

D6 10

TXE 22

D4 2

D3 11

RXF 23

D0 1

RD 13

VCC20

D2 3

68 OHM @ 100MHz

FB6

68 OHM @ 100MHz

FB6

R90 22.1R90 22.1

J34

USB_B_S_F_B_TH

USB_CONNJ34

USB_B_S_F_B_TH

USB_CONN

VCC 1-DATA 2+DATA 3

GND 4

GND15

GND26

R7910KR7910K

R7710KR7710K

C38447pFC38447pF

R71 22.1R71 22.1

C38510nFC38510nF

U47

SN74AHC541PW

U47

SN74AHC541PWY8 11

A12A23A34A45A56A67A78A89GND10 Y7 12Y6 13Y5 14Y4 15Y3 16Y2 17Y1 18OE2 19OE11 VCC 20

R89 100R89 100

C347.1uFC347.1uF

C346.1uFC346.1uF

R76 22.1R76 22.1

+ C1694.7uF20V

+ C1694.7uF20V

C38347pFC38347pF

R99 100R99 100

C345.1uFC345.1uF

Page 38: TSW3003 Demonstration Kit (Rev. D - TI.com

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

+6V_IN

+6V

+6V

+3.3VA

+3.3VCLK

+6V

+5V_PLL

+6V

+5VA

+3.3V_PLL

+1.8VD

Title

Size Document Number Rev

Date: Sheet of

POWER DISTRIBUTION D

TSW3003_EVMB

6 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

POWER DISTRIBUTION D

TSW3003_EVMB

6 7Wednesday, March 07, 2007

Title

Size Document Number Rev

Date: Sheet of

POWER DISTRIBUTION D

TSW3003_EVMB

6 7Wednesday, March 07, 2007

68 OHM @ 100MHz

FB14

68 OHM @ 100MHz

FB14

68 OHM @ 100MHz

FB11

68 OHM @ 100MHz

FB11

SJP31.8/2.1

(1-2)

SJP31.8/2.1

(1-2)

1

32

C38.1uF10%16V

C38.1uF10%16V

12

+C3447uF10V20%

+C3447uF10V20%

C2710uF10%16V

C2710uF10%16V

12

+C2147uF

10V20%

+C2147uF

10V20%D16

LED green

+6VD16

LED green

+6V

C41uF20%25V

C41uF20%25V

+C4647uF10V20%

+C4647uF10V20%

68 OHM @ 100MHz

FB10

68 OHM @ 100MHz

FB10

R2830.1K

R2830.1K

C4710uF10%16V

C4710uF10%16V

12

U6

TPS76733QPWP

U6

TPS76733QPWP

GND/HTSNK22

NC3 17

GND3NC14EN5IN16

NC28

GND/HTSNK5 11

GND/HTSNK11

GND/HTSNK39OUT1 13GND/HTSNK410

IN27 RESET 16

GND/HTSNK6 12

OUT2 14FB/NC 15

NC4 18GND/HTSNK7 19GND/HTSNK8 20

PWRPAD 21

C2410uF10%16V

C2410uF10%16V

12

+C4510uF

16V10%

LOW ESR+

C4510uF

16V10%

LOW ESR

+C4147uF10V20%

+C4147uF10V20%

+C3710uF

16V10%

LOW ESR+

C3710uF

16V10%

LOW ESR

C4210uF10%16V

C4210uF10%16V

12

C43.1uF10%16V

C43.1uF10%16V

12

C1910uF

10%16V

C1910uF

10%16V

12

C36.1uF10%16V

C36.1uF10%16V

12

R21 100KR21 100K

C5.01uFC5

.01uF

R109300

R109300

C3510uF10%16V

C3510uF10%16V

12

+C1847uF

10V20%

+C1847uF

10V20%

R18 100KR18 100K

C34810uF10%16V

C34810uF10%16V

12R27

15.8KR2715.8K

C28.1uF10%16V

C28.1uF10%16V

12

U9

TPS76750QPWP

U9

TPS76750QPWP

GND/HTSNK22

NC3 17

GND3NC14EN5IN16

NC28

GND/HTSNK5 11

GND/HTSNK11

GND/HTSNK39OUT1 13GND/HTSNK410

IN27 RESET 16

GND/HTSNK6 12

OUT2 14FB/NC 15

NC4 18GND/HTSNK7 19GND/HTSNK8 20

PWRPAD 21

C48.1uF10%16V

C48.1uF10%16V

12

+C147uF

10V20%

+C147uF

10V20%

C20.1uF10%16V

C20.1uF10%16V

12

C3.1uF10%16V

C3.1uF10%16V

12

+C3947uF10V20%

+C3947uF10V20%

R13 100KR13 100K

C4410uF10%16V

C4410uF10%16V

12

J1

CONN JACK PWR

J1

CONN JACK PWR321

+C2647uF10V20%

+C2647uF10V20%

R28723.2KR28723.2K

68 OHM @ 100MHz

FB16

68 OHM @ 100MHz

FB16

68 OHM @ 100MHz

FB13

68 OHM @ 100MHz

FB13

J37

BANANA_JACK_RED+6V_IN

J37

BANANA_JACK_RED+6V_IN

+ C4010uF

16V10%

LOW ESR+ C40

10uF

16V10%

LOW ESR

U8

TPS76701QPWP

U8

TPS76701QPWP

GND/HTSNK22

NC3 17

GND3NC14EN5IN16

NC28

GND/HTSNK5 11

GND/HTSNK11

GND/HTSNK39OUT1 13GND/HTSNK410

IN27 RESET 16

GND/HTSNK6 12

OUT2 14FB/NC 15

NC4 18GND/HTSNK7 19GND/HTSNK8 20

PWRPAD 21

+C2510uF

16V10%

LOW ESR+

C2510uF

16V10%

LOW ESR

68 OHM @ 100MHz

FB15

68 OHM @ 100MHz

FB15

68 OHM @ 100MHz

FB12

68 OHM @ 100MHz

FB12

J38

BANANA_JACK_BLKGND

J38

BANANA_JACK_BLKGND

Page 39: TSW3003 Demonstration Kit (Rev. D - TI.com

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

VCO_OUTP

VCO_OUTM

+3.3V_PLL

+5V_PLL

+5VA

+3.3V_PLL+3.3V_PLL

+3.3V_PLL

+5V_PLL

+5V_PLL

LOPSH3

LONSH3

REF_OSC SH4

REF_IN

REF_IN

PLL_CLKSH5PLL_DATASH5PLL_LESH5

PD_OUTBUFSH2CHIP_ENSH2

Title

Size Document Number Rev

Date: Sheet of

VCO D

TSW3003_EVMB

7 7Wednesday, May 09, 2007

Title

Size Document Number Rev

Date: Sheet of

VCO D

TSW3003_EVMB

7 7Wednesday, May 09, 2007

Title

Size Document Number Rev

Date: Sheet of

VCO D

TSW3003_EVMB

7 7Wednesday, May 09, 2007

NOTE: DNI = DO NOT INSTALL

MECHANICAL PARTS

JP6 - JUMPER PINS 2 & 3

C145.1uFC145.1uF

C15110pFC15110pF

SCREW PANHEAD 4-40 x 3/8SCREW PANHEAD 4-40 x 3/8

R114

49.9DNI

R114

49.9DNI

C15510pFC15510pF

M SA

D EN

J39LO_OUT

M SA

D EN

J39LO_OUT

1

5234

68 OHM @ 100MHz

FB9

68 OHM @ 100MHz

FB9

C14710pFC14710pF

R106

4.75K

R106

4.75K

R262

0

R262

0

+ C14810uF

10V

+ C14810uF

10V

U52

SN74LVC1G125DBVR

U52

SN74LVC1G125DBVR

OE1

A2Y 4

GND3

VCC 5

STANDOFF ALUM HEX 4-40 x .500STANDOFF ALUM HEX 4-40 x .500

R45

22.1

R45

22.1

R94

10K

R94

10K

TP4LOCK_DETECT

TP4LOCK_DETECT

C390

22pFDNI

C390

22pFDNI

C15222pFC15222pF

R96100R96100

U51

SN74LVC1G125DBVR

U51

SN74LVC1G125DBVR

OE1

A2Y 4

GND3

VCC 5

SCREW PANHEAD 4-40 x 3/8SCREW PANHEAD 4-40 x 3/8

C37710pFC37710pF

R1047.5kR1047.5k

R93100R93100

C13810,000pFC13810,000pF

R46

22.1

R46

22.1

R103100DNI

R103100DNI

STANDOFF ALUM HEX 4-40 x .500STANDOFF ALUM HEX 4-40 x .500

C126680pFC126680pF

C121.1uFC121.1uF

C15410pFC15410pF

L27

8.2nH

L27

8.2nH1 2

C123.1uFC123.1uF

R95

10K

R95

10K

R107

4.75K

R107

4.75K

U16

OSC-VECTRON

U16

OSC-VECTRON

REF1GND 4VDD8 OUT 5

L28

8.2nH

L28

8.2nH1 2

C120.1uFC120.1uF

SCREW PANHEAD 4-40 x 3/8SCREW PANHEAD 4-40 x 3/8

C119100pFC119100pF R110

649

R110

649

U53

OSC-VECTRONDNI

U53

OSC-VECTRONDNI

REF1GND 2VDD4 OUT 3

R288

6.34K

R288

6.34K

U17TRF3761

U17TRF3761

PD_OUTBUF1CHIP_EN2CLOCK3DATA4STROBE5GND16GND27DVDD18AVDD_PRES9GND310

GN

D4

11G

ND

512

VCO

_OU

TP13

VCO

_OU

TM14

AV

DD

_OU

TBU

F15

GN

D6

16A

VD

D_V

CO

BU

F17

EX

T_V

CO

_IN

18R

BIA

S2

19G

ND

720

AVDD 21GND8 22AVDD_CAPARRAY 23AVDD_BUF 24AVDD_VCO 25VCTRL_IN 26GND9 27RBIAS1 28AVDD_BIAS 29GND10 30

GN

D11

31A

VD

D32

GN

D12

33C

PO

UT

34A

VD

D_C

P35

AV

DD

_RE

F36

GN

D13

37R

EF_

IN38

LOC

K_D

ETE

CT

39D

VD

D2

40

PAD41

C127

1000pF

C127

1000pF

SCREW PANHEAD 4-40 x 3/8SCREW PANHEAD 4-40 x 3/8

C128330pFC128330pF

R1051KR1051K

+ C15010uF10V

+ C15010uF10V

C118.1uFC118.1uF

D15

LED green

LOCK_DETECTD15

LED green

LOCK_DETECT

C144.1uFC144.1uF

68 OHM @ 100MHz

FB3

68 OHM @ 100MHz

FB3

JP6

REF_CLK

JP6

REF_CLK

1

32

C14910pFC14910pF

R102300

R102300

+ C12210uF10V

+ C12210uF10V

C124.1uF

C124.1uF

68 OHM @ 100MHz

FB2

68 OHM @ 100MHz

FB2

STANDOFF ALUM HEX 4-40 x .500STANDOFF ALUM HEX 4-40 x .500

C391

22pFDNI

C391

22pFDNI

68 OHM @ 100MHz

FB7

68 OHM @ 100MHz

FB7

C15322pFC15322pF

68 OHM @ 100MHz

FB8

68 OHM @ 100MHz

FB8

STANDOFF ALUM HEX 4-40 x .500STANDOFF ALUM HEX 4-40 x .500

MS A

DE N

J35EXT_REF_CLK

MS A

DE N

J35EXT_REF_CLK

1

5234

C38710pFC38710pF

C117

1000pF

C117

1000pF

TP1TP1

Page 40: TSW3003 Demonstration Kit (Rev. D - TI.com

EVALUATION BOARD/KIT IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must haveelectronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be completein terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmentalmeasures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit doesnot fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYERAND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and allappropriate precautions with regard to electrostatic discharge.

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TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents orservices described herein.

Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/orsafety programs, please contact the TI application engineer or visit www.ti.com/esh.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used.

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This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radiofrequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which aredesigned to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments maycause interference with radio communications, in which case the user at his own expense will be required to take whatever measures maybe required to correct this interference.

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the input voltage range of 5.75 V to 6.25 V.

Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questionsconcerning the input range, please contact a TI field representative prior to connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than 45°C. The EVM is designed to operateproperly with certain components up to 85°C as long as the input and output ranges are maintained. These components include but are notlimited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identifiedusing the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright 2006, 2007 Texas Instruments Incorporated

Page 41: TSW3003 Demonstration Kit (Rev. D - TI.com

IMPORTANT NOTICE

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.

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Microcontrollers microcontroller.ti.com Security www.ti.com/security

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