thermal simulation module
TRANSCRIPT
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Title: XXXXXXXX module Thermal Analysis Report
DescriptionThis document contains the pre layout analysis results of the thermal analysis simulation that was
performed on the xxxxxxxxxx module.
Project: xxxxxxxxxx moduleDocument ID: DocIDDocument Version: 1.0Status: FinalAutho Alexander KarasDate: 18-10-2013
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Version History
Version Date Author Changes/Remarks
1.0 18-10-2013 Alexander Karas
Author
Name Company Date Signature
Alexander Karas xxxxxxxxxx 18-10-2013
Reviewed
Name Company Date Signature
Approved
Name Company Date Signature
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xxxxxxxxx module thermal analysis
Introduction
A post layout SI analyses was performed on the xxxxxxxxxx board. This documentdescribes the results of the SI analyses.
Notification: If another stack-up than given in this document is used to produce the board,than this SI simulation is no longer valid, as ICX/Hyperlynx needs the stack-up in order tocalculate characteristic impedance, trace velocity, capacitive coupling and inductivecoupling. The board stack-up directly influences reflection and crosstalk.
Project activities and deliverables
For the SI analysis the following tasks and activities had to be done:
1. Creation/validation of missing IBIS models
2. Convert the databases to the analysis database
3. Collect board stack-up information
4. Collect signal integrity constraints
5. Building the database for performing a signal integrity analysis
6. Analyze for Signal Integrity
7. Signal Integrity analysis document
1.1 Analysis software information
MGC FloThermPCB x32 v6.4 (build 13.34.2)
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Board info
Note: a few discrete components was removed due the Error message of the analysis software.Problem is outline intersections with another components or board edge.
Stackup information
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Critical component list
REF.DES PART NUMBER PACKAGE TYPE POWER DISSIPATION NOTE
U100 xxxxxxxx TBGA 12.2W CPU
U200- MT41K1G8TRF-125 TBGA 1.2W SDRAM
-U116
1.2 Thermal models
Component Model Manufacturer
Processor xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx FreescaleSDRAM Not available MicronPMIC Not available unknownHeatsink 780_23x23_fcbga_1040_no_lid_050613r1.docx
(page 2)unknown
Note: MGC FloThermPCB cant use any external thermal models for simulation; so all power dissipationrates will be borrowed from component datasheet or will be calculated from thermal resistance andtemperature values.
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Conclusion
Thermal analysis
Module should be cooled with forced airflow at least 3m/s, additional heatsinks on theCPU and SDRAM chips at both sides. Probably also using a lockal coler. See Run 6.For more accurate analysis board simulation must be runned using backplane board.
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Simulation results
Run 1 (for information)
Conditions:
: 12 4 ()
:
: 20
: : 3.0, 1.2 (
) :
:
Top layer
7mm above top
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Bottom layer
4mm below bottom
Conclusion: CPU and SDRAM are too hot. SDRAM chips temperature is over than working rate.
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Run 2 (for information) - decrease environment to 0 degree
Simulation conditions:
:
: 0 : : 3.75, 1.6 (
)
:
:
Top layer
7mm above top
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Bottom layer
4mm below bottom
Conclusion: CPU and SDRAM are too hot. SDRAM chips temperature is over than working rate.
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Run 3 Test with airflow 3m/s, use real power dissipation of CPU
Conditions:
: 12 4 () :
: 20
: , 3/,
: 12.2 ( ), 1.2 (
)
:
:
Top layer
7mm above top
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Bottom layer
4mm below bottom
Conclusion: CPU and SDRAM are too hot. SDRAM chips temperature is over than working rate.
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Run 4 Test with HEATSINK, airflow 0m/s, 20 degree
Conditions:
: 12 4 ()
: : 20 : , 0/
: 12.2, 1.2 (
)
: , 30309.4
:
Top layer
7mm above top
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Run 5 Tesw with HEATSINK, airflow 3 m/s, 20 degree
Conditions:
: 12 4 ()
: : 20 : , 3/,
: 12.2 ( ), 1.2 (
)
: , 30309.4
:
Top layer
7mm above top
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Bottom layer
4mm below bottom
Conclusion: CPU temperature is better. SDRAM chips are still too hot. SDRAM chips temperature is over thanworking rate.