theon sensors s.a. - corallia€¦ · design develop and integration of mems 3. sales for 2007 €...

PRIVATE & CONFIDENTIAL 14-17/11/2007

MEMS Business Unit

December 2007

THEON SENSORS S.A.


Company Profile

1.

HELLENIC COMPANY-ESTABLISHED IN 1997

2.

SCOPE OF BUSINESS DESIGN DEVELOP AND MANUFACTURE OF

ELECTRO-OPTICAL SYSTEMS

DESIGN DEVELOP AND INTEGRATION OF MEMS

3.

SALES FOR 2007 €

12 M, PROJECTED SALES FOR 2008 €

15 M

4.

SALES ΒΑCKLOG (for the next 3 years) AS OF 31-12-2007: €

70

M

5.

NATO/NATIONAL SECRET CLASSIFIED

6.

ISO 9001:2000 CERTIFIED


Company's Operating Activities


Design and Simulation of Silicon sensing elements

• Design and simulation of signal conditioning electronics for Micro –Systems

• Design of multilayer PCB

• Design of electronic interface to the overall system

• Micro Assembly / Packaging (Wire and Die Bonding)

• Design of Systems Housing (Mechanical Designs)

• Testing & Characterization

Products / Capabilities• Mass Air Flow Sensing Systems (Capability of measuring other media like water)• Capacitive pressure sensor

• Capacitive accelerometer


MEMS advantages

•

Size reduction (cm to μm)MEMS fit into any products compared to macro devicesReduced weight critical for many applications

•

Price reduction Adoption of IC fabrication process led to high volume

production (million devices) Due to reduced size more dies per wafer

•

Increased performance Integration with IC allows new functionalities Reduced power consumption ideal for all modern applications Better resolution, response timeIncreased reliabilityVersatility


Product Development Process

• Design and simulation of MEMS sensor

• Design and simulation of electronics

• Design of electronic interface


Product Development Process

• Design of multilayer PCB

• Design of mechanical housing


In-House Development Infrastructure •10000 class Cleanroom

(50 m2)

Intended for Packaging and TestingOf MEMS components

• Die Bonder (FINEPLACER®

Pico MA)5 µm (0.2 mil) placement accuracy

Eutectic Soldering AuSn SolderingThermo CompressionThermo-/ Ultrasonic BondingAdhesive TechnologiesACP (Anisotropic Conductive Paste)Chip On Glass (ACF)

• Wire Bonder (Kulicke

& Soffa

)4500 Series Ball Bonder


In-House Development Infrastructure • PCB Rapid Prototyping

ProtoMat®

C100 HF Circuit Board PlotterBoardMaster®

control software

Through-Hole PlatingMultilayer

• Multi-axis CNC lathes• Machine center of the latest technology


In-House Testing / Characterization Infrastructure

• Characterization of pressure sensors

• Probe Station for on die/waferelectrical tests

• Climatic chamber for environmental tests

• Characterization of air flow sensors


MASS AIR FLOW SENSING SYSTEM

• SENSOR DIE (HOT WIRE ANEMOMETER)

• SIGNAL CONDITIONING ELECTRONICS

• MECHANICAL HOUSING (Rapid prototype) Medical applications

Characteristics

Weight : 40gSize : 70mm(L), 50mm(W), 30mm(H)Calibration Gas : AirFlow range : Bidirectional (+/-200SLPM)Power Supply : 12VOutput signal : Analog voltageResponse time : <5msPressure drop : 1mbar@200SLPMExtremely good tolerance in condensation

•

Capability of adapting the characteristics to customer needs

•

Same sensor capable of measuring other media, like gas, water, oil

mailto:1mbar@200SLPM


Capacitive Pressure SensorPRINCIPLE OF OPERATION

CAPACITANCE CHANGE BETWEEN MOVABLE MEMBRANES

ADVANTAGES OVER OTHER TECHNOLOGIES

LOW POWER CONSUMPTIONSMALL DIMENSIONS (0.8mm X 0.8mm)

THERMAL STABILITY

SENSORS CAN BE DESIGNED & MANUFACTUREDUNDER CUSTOMER SPECIFICATIONS

SOLUTIONS BASED ON FULL CUSTOM ASICSCAN BE PROVIDED

Available pressure sensor chips

Range: 1-5BarResolution: 20mbar

Accuracy: ±1%

C-P characteristic of the pressure sensor


MEMS Capacitive AccelerometerSANDIA SUMMiT

V® Microfabrication

process

for inertial sensors (accelerometers, gyros)

Typical Specifications: 2-axisHigh G (shock), >±100GLow G , <±1GResolution, <0.5mg

Polysilicon Surface Micromachining Novel SOI Surface Micromachining(wafer level packaging)

Signal Conditioning ElectronicsFull Custom ASIC solution provided by THEON


Product development roadmap

Identify

customer needs & priorities

Feasibility Stage

Development Stage

Pre-production Stage

Production Stage

• Understand the application and the required specifications

• Emphasize the technological challenges• Propose a scope of work• Propose suitable design solutions• Proof of concept

• System optimization and characterization• Environmental tests (temperature, humidity, etc)• Crucial parameters and test methods are fixed

in agreement with the client and according tothe production requirements.

• Determination of the engineering-production process• Determination of the Qualification tests• Determination of the Outsourcing parts & suppliers• Fix Pricing

• Delivery schedule

theon sensors s.a. - corallia€¦ · design develop and integration of mems 3. sales for 2007 €...

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