the x-factor -how x-ray technology is improving the

©2018 Creative Electron, Inc.

The X-Factor - How X-ray Technology is Improving the Electronics Assembly Industry

Dr. Bill CardosoCreative Electron, Inc.

+1 760.752.1192 [email protected]

Summary for today

1. Electronic component inspection and failure analysis.2. Component counting and material management.3. Reverse engineering.4. Counterfeit detection.5. Real-time defect verification.6. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D,

and 3D x-ray inspection.7. Design for manufacturing (DFM) and design for x-ray inspection (DFXI).8. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC).9. Artificial Intelligence and x-ray inspection


Where Are Defects Introduced?

Counterfeit Components

Defects associated with paste applicationExcess solderSolder bridgesInsufficient solder

Solder Paste Application Defects

Component Placement Defects

Defects associated with component placementMisalignmentPolarityMissing component

Reflow Oven Defects

Defects associated with the reflow profileVoidingBridgingSolder ballsExcess solderInsufficient solder

Statistical Process Control

Manufacturing process quality assurance.Solder joint measurement data, collected during x-ray test, can be statistically analyzed to identify manufacturing drifts, trends and other relevant process quality issues.

Principles of x-ray inspection

8

X-ray imaging 101: the bottom terminated component, side view

BTC

PCB

Solder Balls Side View

PCB

X-ray imaging 101: the BGA, top view

Solder Balls

BGA

X-ray image of BGA

QFN assembly with excess voiding

Detail of open pin in QFN package

Void Measurement

Solder voids in LED assembly

BGA Inspector

Dual EnergyHigh Energy Image Low Energy Image

Dual Energy Image

PATENT PENDING

The best – and worse – BGA assembly1. COPLANARITY

2. SHORT

3. HEAD IN PILLOW

4. OPEN

9. MISSING

8. SHAPE

7. VOIDS

6. SOLDER MASK 5. SPLATTER

Design For Inspection: Think 3D!n Components on both sides of board align in such a way it’s difficult

to assess defects¨ Overlapping BTC ¨ Caps under QFN and BGA¨ Heat sinks

n How to avoid it¨ ($) Design for Inspection¨ ($$) 2.5 or ($$$$) 3D x-ray inspection

BGA 2D x-ray

BGA 2.5D x-ray

So what’s 3D X-Ray Inspection (Computed Tomography)?

Principle of Planar CT: 3D x-ray

Large AreaDetector

Steer-ableX-Ray Source

Inspection Plane

Multiple Transmission Images

Principle of Planar CT

Use multiple off-axis x-ray images to separate top/bottom overlapping or obscured solder connections

QFP

ResistorPCB

Top Side

Bottom Side

Cross Section x-ray provides the capability to generate un-obscured views of top and bottom side components

2D

2.5D

3D

Design for Inspection

n Think carefully about component placement when designing PCBn Place parts so 2.5 and 3D x-ray are not needed. n Goal is to have the whole board inspected with 2D x-ray

¨ Faster¨ Better quality¨ Cheaper

Power components under BGA

Caps under BGA

Caps under QFN leads

Caps under BGA balls

Sample

Voiding

Complex construction

Caps and QFN

QFN overlap

Heat sink

Heat sink: x-ray

Heat sink removed: x-ray

Think 3D!

n X-rays are a requirement when inspecting BTCn DFM + DFI: Easier to design for inspection n Some applications require 2.5D & 3D x-rayn Miniaturization major driver for high resolution, high

magnification, x-ray inspection

Design for Inspection – DFI

n The right time to think about x-ray inspection is during PCB layout

n After board is assembled is too late to improve x-ray inspection ability

Counterfeit Electronics

Surplus stock of electronic components dumped into the market further establishing the broker and grey marketsHuge amounts of scrap electronicsComponents made obsolete Need for short delivery timeMassive cost reduction pressures on OEM buyers for double digit price reductionsBuying and selling via the internet became common practice

The counterfeit electronics problem

44

Component Harvesting

45

Only expensive parts are counterfeited…

Anything wrong with these caps?

What happens when you got the wrong cap?

Component Counting and Material Management


Material Management 101

n What does a factory do?¨ Moving, Storing, Transforming

n What materials need to be purchased?n Who will supply these materials?n When do these materials need to be purchased?n How much of these materials need to be purchased?


Just-In-Time Inventory vs. Reality

n Too little inventory¨ Results in costly production line stoppages

n Too much inventory¨ Wasted cash sitting on the shelves

n To achieve best balance, real time data counts must be accurate


Part Counting

X-ray image taken of entire reel of components. Image is analyzed and component type, quantity, and defects can be reported back to operator.


X-ray Part Counting Benefits

n Fast (15-30seconds per reel)n Accurate Countbacks (99%+)n Component Type Identificationn Counterfeit Detectionn Integration with MRP System


Artificial Intelligence

30-second intro to artificial intelligence (AI)

X ? YX Y2 40 03 6-5 -1010 20

x2

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the x-factor -how x-ray technology is improving the

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