the institute for special textiles and flexible materials · the global smart textile market was...
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The Institute for Special Textiles
and Flexible Materials
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Automated Manufacturing of Textiles
with Integrated Electronic
Components
Uwe Möhring, Kay Ullrich
2
Textile International Forum and Exhibition 20155.-7. October 2015 Taipei, Taiwan
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Outline
3
• Short Introduction of TITV
• Textiles and Electronics on the Market
• Background of Interconnection
• Types of Interconnection
• Automated Mounting of Components
- Perspective of Electronics
- Perspective of Textiles
• Summary
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Short Introduction of TITV
4
Founded 1992 in Greiz, Germany
Team 60 experts (e.g. textile engineers, physics,
chemistry, medical engineering, electro technology)
Funded research projects approx. 25 p.a.
- BMBF (growth cores, supporting programmes)
- BMWi (IGF-AiF, Inno-Watt, Inno-Kom-Ost, ZIM)
- EU
- Federal state
Tailor-made research and development activities
on request of clients
Topics of research
- Smart textiles
- Functional surfaces
- Special textiles
Accredited testing laboratory
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Technology available at the TITV Greiz
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Textile Construction
Special thread technology
Weaving including narrow fabrics
Spacer fabrics, Warp Knitting
Braiding
Surface technology
Physical / Chemical Vapour
Deposition (PVD/CVD)
Modular coating, laminating
Electroplating of textile materials
Dying / finishing
Digital printing
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Technology available at the TITV Greiz
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Embroidery
Multi-head and large-scale embroidery
Special embroidery technology for the
production of circuit boards and
the assembly of components
Laser technology
Sewing technology, CAD
Electronics
Measurement and control technology
Testing technology for smart textiles
Technology for the assembly of components
on textile surfaces and threads
Bonding technology for textiles
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Accredited testing laboratory
Accredited acc. to
DIN EN ISO/IEC 17025:2005
Physical tests for textiles
Material testing
Pollutant analysis
Testing of reliability of
smart textiles
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Research Focus
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Outline
9
• Short Introduction of TITV
• Textiles and Electronics on the Market
• Background of Interconnection
• Types of Interconnection
• Automated Mounting of Components
- Perspective of Electronics
- Perspective of Textiles
• Summary
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Grupo Antolino
PHILIPS
© GERMENS; TITV Greiz FORSTER ROHNER AG
TITV Greiz
Interactiv Wear AG
Electronic Components for Luminous Textiles
Adam Opel AG
IAC Group GmbH
Nike
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Porsche
AG
warmX GmbH
Electronic Componentes for Textile Heating
Alpenheat
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BMW
TITV Greiz Hexoskin Wearable Body Metrics
Electronic componentes for Textile - Human -
Interaction
Touch Glove Ally SeeleySwany
Studio (n-1) Architects
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Electronic Components in Textiles for Pain
Therapy
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PHILIPS
TITV Greiz
PHILIPS
Bomedus GmbH
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The global smart textile market was estimated to be
USD 289.5 million in 2012 and expected to exceed
USD 1,500 million by 2020.
The main growth sector in the last 3 years has been
in the protection and military clothing sector
and it is estimated to remain the largest market segment in the next six years.
Sport and fitness applications are predicted to see the fastest growth along
with health and medical applications.
References:
http://www.grandviewresearch.com/industry-analysis/smart-textiles-industry
http://www.ohmatex.dk/pdfer/whitepaper_smart_textiles.pdf
Smart Textiles Market
14
What are the barriers and opportunities in the smart textiles market ?
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Outline
15
• Short Introduction of TITV
• Textiles and Electronics on the Market
• Background of Interconnection
• Types of Interconnection
• Automated Mounting of Components
- Perspective of Electronics
- Perspective of Textiles
• Summary
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Interconnection / Assembly of Electronic
Components
State of the art
The established connection technology is highly
tailored to conventional systems and solutions, like
cabling.
Main application
Main application at the moment is the assembly of
electronic components.
Challenge
Extension and adaptation on textile requirements.
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• Intelligent clothing (luminescent textiles, energy- and
data transmission)
• Heating textiles (heatable fabrics, medical devices)
• Electronic machinery (flexible interconnections in
household applications, security systems,
instrumentation etc.)
• Automotive (integration of heating systems and
miniaturized electronic components)
• Sports-, leisure and wellness products
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New interconnection technologies are
necessary for textile applications
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- Low Cost
- Time efficient
- Compact design
- Safe and reliable under using conditions
- Permanence of the properties
- Textile like properties (e.g. Flexibility)
- Process capability
Requirements
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• Short Introduction of TITV
• Textiles and Electronics on the Market
• Background of Interconnection
• Types of Interconnection
• Automated Mounting of Components
- Perspective of Electronics
- Perspective of Textiles
• Summary
Outline
19
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• Crimping
• Piercing
• Winding technology
• Velcro / metallized burdock
• Snap fastener
• Embroidery
• Weaving
• Soldering / gluing in combination with textile processes
Types of Interconnection
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Types of Interconnection – Crimping
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Interconnection ELITEX-I / wire
4 mm
Interconnection ELITEX-I / ELITEX-I
Interconnection thread / wire
For compounds of thread-like structures and components with linear
expansion is the crimping technique well suited as a base technology
and ensures high reliability and effectiveness.
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Types of Interconnection – Crimping
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Interconnection thread or wire / surface
For wires, cords, conductive threads and wired components the method can
be regarded in principle.
For interconnections in areas where both contact points are already fixed (for
example stitching by Soutage-technology) there are fundamental problems.
The damage of the textile by the crimping tool can not be avoided (upper and
lower tool meet in a mechanical way).
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Types of Interconnection – Piercing
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Source: Catalogue Nicomatic
Piercing: Usually in one step a cutting tip is generated by a preform, punched
in the contact area and then closed at the bottom of the structure by an anvil.
• Used in microelectronics for embossing of connector pins, connecting
flexible printed circuit boards or other conductive foil, linking between
flexible and rigid circuit boards
• Allows the penetration of a contact in conductive (textile) areas and fits
well with textile behaviour. There are conventional technologies available
• Machines and processes still need to be adapted for textile use.
Interconnects only on one side
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Types of Interconnection – Piercing
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Textile bus-system with 4 conductive lines
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Types of Interconnection – Winding
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Preparation with
conductive varnishwinding,
Cut off remains
Secure the connection
Winding and Wire-Wrap technology was used in automation and computer
technology in the 1960s and 1980s.
• Corresponds very well to the conditions of conductive textile fibers (soft,
gentle and flexible connection)
• High manual effort if any small machinery (wrap gun) is not available and
high demands on the skill and practice of the performer
• Superseded in favor of soldering
• For the connection of conductive threads each other or threads with
metallic strands there are almost no reliable alternatives
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Metallized burdocks are newly developed and still an issue in
research. They were originally intended for the mechanical fastening
of sheet metal parts for quick assembly.
Two-piece construction similar to Velcro (hook and loop), but much
more stable than Velcro
Types of interconnection – Metallized burdock
26
The hooks (about 2 mm in height)
reach into the metallic Velcro.
By pressing the two joint partners
they get hooked up there.
source: Christoph Hein
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Interconnection between conductive surfaces
Types of Interconnection – Velcro
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1 3
46
2
13
57
2
1 3
1 3
2
2
4
5
67
< 0,5 W
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Types of Interconnection – Snap Fastener
Embroidery / weaving of conductive area
for attachment of snap fasteners
conductive yarn ELITEX® 235 dtex /
ELITEX® 110 dtex x 2 is used
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Therapy glove for electromyostimulation
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Type of Interconnection - Weaving
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Textile Circuits – Woven Circuits
Woven textile multilayer structure
for a RFID antenna
Integration of
circuit layout
source: www.lumalive.com
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Types of Interconnection – Embroidery
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Types of Interconnection – Embroidery
Various layouts
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Textile Circuits – Embroidered Circuits
Sample
measuring of skin resistance by textile electrodes
measuring of skin temperature by common electronic devices
Types of Interconnection – Embroidery
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Outline
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• Short Introduction of TITV
• Textiles and Electronics on the Market
• Background of Interconnection
• Types of Interconnection
• Automated Mounting of Components
- Perspective of Electronics
- Perspective of Textiles
• Summary
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Standard machines in the electrical industry
• Optical recognition
• Accuracy
• Reproducibility
• Textile has different dimensions
• Defined shapes «» flexibility
• Textile handling
• Reel to reel
Pick and Place Technique for
Electronic Components on Textiles
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• Realized ribbon handling
• Mounting on textile substrate
• Cutable
• Easy assembly into textiles
TITV‘s Pick and Place for Textile Ribbons
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Outline
36
• Short Introduction of TITV
• Textiles and Electronics on the Market
• Background of Interconnection
• Types of Interconnection
• Automated Mounting of Components
- Perspective of Electronics
- Perspective of Textiles
• Summary
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Mounting Devices and interconnection by using
solder / conductive glue at a embroidery machine
solutions for mounting devices on textile fabrics
1. Integrating pick and place
2. Using standard embroidery technology
Pick and Place and Embroidery
To our solution
Tajima TCWM TRIPPLE-QUATTRO
From the vision
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Mounting devices on textile fabrics using 4 different heads
1. Embroidery with conductive thread material
2. Dispensing of solder
3. Pick and Place of components
4. Hot air / laser soldering
5. Functionality test
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Pick and Place and Embroidery
Embroidery- head
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1. Embroidery with conductive thread material
2. Dispensing of solder
3. Pick and Place of components
4. Hot air / laser soldering
5. Functionality test
Dispenser-head
Pick and Place and Embroidery
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1. Embroidery with conductive thread material
2. Dispensing of solder
3. Pick and Place of components
4. Hot air / laser soldering
5. Functionality test
Pick and Place-head
Pick and Place and Embroidery
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1. Embroidery with conductive thread material
2. Dispensing of solder
3. Pick and Place of components
4. Hot air / laser soldering
5. Functionality test
Laser-head
Pick and Place and Embroidery
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1. Embroidery with conductive thread material
2. Dispensing of solder
3. Pick and Place of components
4. Hot air / laser soldering
5. Functionality test
Mounting devices on textile fabrics is a combination of
electronic and textile technology.
Pick and Place and Embroidery
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Outline
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• Short Introduction of TITV
• Textiles and Electronics on the Market
• Background of Interconnection
• Types of Interconnection
• Automated Mounting of Components
- Perspective of Electronics
- Perspective of Textiles
• Summary
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Mounting components – Sequin Technology
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Functional Sequin Device Technology
Functional Sequin Device - FSD
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FSD - Functional Sequin Device Technology
Mounting devices on textile fabrics using 1 head and 1 process step
1. Fixation of sequins including the component with normal thread
2. Interconnection with conductive thread
3. Functionality test
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1. Fixation of sequins including the component with normal thread
2. Interconnection with conductive thread
3. Functionality test
FSD - Functional Sequin Device Technology
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1. Fixation of sequins including the component with normal thread
2. Interconnection with conductive thread
3. Functionality test
FSD- Functional Sequin Device Technology
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Outline
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• Short Introduction of TITV
• Textiles and Electronics on the Market
• Background of Interconnection
• Types of Interconnection
• Automated Mounting of Components
- Perspective of Electronics
- Perspective of Textiles
• Summary
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Pick and Place machine with textile handling
Investment: Machine
Additional module for textile handling (prototype)
Industrial Benefits: Optical recognition is a challenge
Quantity and quality
Flexibility: Very high due to a variety of components
many textile substrates (thread, ribbon, fabric)
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Adaptation of Pick and Place in to textile machines
Pick and Place with an embroidery machine
Investment: Novel embroidery head (prototype)
Software modification
Industrial Benefits: Combination of two effective technologies
For large-scale circuit boards
Flexibility: Very high due to a variety of components
Modular expandable
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Use of components mounted to FSD`s
Conventional Embroidery Machine to
mounted electronic Components
Investment: processing head with minimal modifications
depending of the embroidery machine
Industrial Benefits: First applications deducible
Standard textile process
Flexibility: Lower (one component on FSD reel)
Quick exchangeable FSD reel
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Thank you for your attention!
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We clear the way for the
automated manufacturing
of textiles & electronics!
Textilforschungsinstitut
Thüringen – Vogtland e. V. (TITV)
Zeulenrodaer Straße 42
07973 Greiz
Phone.: +49 (0) 3661 – 611 0
Fax: +49 (0) 3661 – 611 222
www.titv-greiz.de
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Trade Fair For All Funktional Textiles – mtex+
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6th International Trade Fair For Technical Textiles
31. May to 02. June 2016 Chemnitz, Germany