texas instruments opt8241€¦ · ©2017 by system plus consulting | texas instruments opt8241 3d...

©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Texas Instruments OPT8241Industrial 3D ToFImaging report by Stéphane ELISABETHJuly 2017


SOMMAIRE

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 6

o Texas Instruments

o Softkinetic PortFolio

o Texas Instruments ToF Solution

o 3D Imaging & Sensing Market

Physical Analysis 13

o Synthesis of the Physical Analysis

o Package 15

Package Views: Dimensions, Marking, Block Diagram

Package Opening: RDL, Line/Space Width, Optical Filter

Package Cross-Section : RDL, Bumps, Optical Filter

o Die 30

Die View & Dimensions

Delayering & main Blocs

Die Process: Transistor, Pixels technology

Die Cross-Section: Transistor, Metal Layers, Pixels

Die Process Characteristic

Physical Comparison 44

Infineon 3D ToF Image Sensor

STMicroelectronics SPAD technology

Melexis MLX75023

Manufacturing Process 50

o Synthesis of the main parts

o Image Sensor Die Front-End Process & Fabrication Unit

o Glass BGA Packaging Process Flow

Cost Analysis 57

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses 60

o Image Sensor die 62

Die Front-End Cost

Die Wafer Cost

Die Cost

o Packaging 65

Packaging Cost

Packaging Cost per steps

o Component Cost 68

Estimated Manufactured Price 70

Company services 74


Overview / Introductiono Executive Summaryo Reverse Costing

Methodology

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Texas Instruments OPT8241.

The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.

This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.

It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexisautomotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.


Overview / Introduction


Physical Analysis o Synthesiso Packageo Package Openingo Package Cross-Sectiono Image Sensor Dieo Image Sensor Cross-Section

Physical Comparison


Cost Analysis


About System Plus

ToF Process Flow





Physical Comparison


Cost Analysis


About System Plus

Package View & Dimensions





Physical Comparison


Cost Analysis


About System Plus

Package Cross-Section – RDL





Physical Comparison


Cost Analysis


About System Plus

Image Sensor Die Dimensions





Physical Comparison


Cost Analysis


About System Plus

Image Sensor Die – Pixels





Physical Comparison


Cost Analysis


About System Plus

Image sensor Die Cross-Section – Pixels




Physical Analysis

Physical Comparison o Infineon CISo STMicro. SPADo Melexis MLX75023


Cost Analysis


About System Plus

Comparison With ST ToF Detector using SPAD technology




Physical Analysis

Physical Comparison

Manufacturing Process Flowo Synthesiso Front-End Process &

Fabrication Unito Packaging Process Flow

Cost Analysis


About System Plus

Global Overview




Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Front-End Cost &

Wafer/Die Costo Packaging Costo Component Cost


About System Plus

ToF Imager Front-End Cost




Physical Analysis

Physical Comparison





About System Plus

Packaging Cost




Physical Analysis

Physical Comparison





About System Plus

Component Cost




Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financial o Manufacturer Price

About System Plus

Estimated Manufacturer Price




Physical Analysis

Physical Comparison


Cost Analysis


About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal

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COMPANYSERVICES




Physical Analysis

Physical Comparison


Cost Analysis



Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis

Physical Comparison


Cost Analysis



Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

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