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©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Texas Instruments OPT8241Industrial 3D ToFImaging report by Stéphane ELISABETHJuly 2017
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 2
SOMMAIRE
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Texas Instruments
o Softkinetic PortFolio
o Texas Instruments ToF Solution
o 3D Imaging & Sensing Market
Physical Analysis 13
o Synthesis of the Physical Analysis
o Package 15
Package Views: Dimensions, Marking, Block Diagram
Package Opening: RDL, Line/Space Width, Optical Filter
Package Cross-Section : RDL, Bumps, Optical Filter
o Die 30
Die View & Dimensions
Delayering & main Blocs
Die Process: Transistor, Pixels technology
Die Cross-Section: Transistor, Metal Layers, Pixels
Die Process Characteristic
Physical Comparison 44
Infineon 3D ToF Image Sensor
STMicroelectronics SPAD technology
Melexis MLX75023
Manufacturing Process 50
o Synthesis of the main parts
o Image Sensor Die Front-End Process & Fabrication Unit
o Glass BGA Packaging Process Flow
Cost Analysis 57
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses 60
o Image Sensor die 62
Die Front-End Cost
Die Wafer Cost
Die Cost
o Packaging 65
Packaging Cost
Packaging Cost per steps
o Component Cost 68
Estimated Manufactured Price 70
Company services 74
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodology
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Texas Instruments OPT8241.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexisautomotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 4
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Openingo Package Cross-Sectiono Image Sensor Dieo Image Sensor Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
ToF Process Flow
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Openingo Package Cross-Sectiono Image Sensor Dieo Image Sensor Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package View & Dimensions
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Openingo Package Cross-Sectiono Image Sensor Dieo Image Sensor Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – RDL
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Openingo Package Cross-Sectiono Image Sensor Dieo Image Sensor Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Image Sensor Die Dimensions
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Openingo Package Cross-Sectiono Image Sensor Dieo Image Sensor Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Image Sensor Die – Pixels
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Openingo Package Cross-Sectiono Image Sensor Dieo Image Sensor Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Image sensor Die Cross-Section – Pixels
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Infineon CISo STMicro. SPADo Melexis MLX75023
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Comparison With ST ToF Detector using SPAD technology
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Synthesiso Front-End Process &
Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Global Overview
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Front-End Cost &
Wafer/Die Costo Packaging Costo Component Cost
Selling Price Analysis
About System Plus
ToF Imager Front-End Cost
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Front-End Cost &
Wafer/Die Costo Packaging Costo Component Cost
Selling Price Analysis
About System Plus
Packaging Cost
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Front-End Cost &
Wafer/Die Costo Packaging Costo Component Cost
Selling Price Analysis
About System Plus
Component Cost
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Definition of Priceso Manufacturer Financial o Manufacturer Price
About System Plus
Estimated Manufacturer Price
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
Related Reports
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REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING• Lenovo Phab2Pro – Google Tango project – Time of Flight• STMicroelectronics ToF Sensor• Melexis Automotive 3D ToF Imager
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 17
COMPANYSERVICES
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2017 by System Plus Consulting | Texas Instruments OPT8241 3D ToF 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
Contact
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