techshanghai2016 - 依靠dfm的可制造性分析软件解决pcb生产制造上的隐患
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依靠DFM的可制造性分析软件解决PCB生产制造上的隐患
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Agendag
Introduction to Zuken
Introduction to CR-8000
Overview and Demonstration of DFM Center
Summary and Next Steps
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Zuken Corporate ProfileWhat We DoWhat We Do
ZUKENZUKEN
先进的电子产品的开发/设计/数据管理CAE 平台
针针对于:
PCB 系统的开发/设计/数据管理
IC封装设计IC 封装设计
线束,流体,控制系统的开发/设计/数据管理
元器件库/设计数据的综合管理元器件库/设计数据的综合管理
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Zuken Corporate ProfileSummarySummary
1976成立 1976
$231,500,427*
成立
2013营收
Yokohama, Japan
Munich Germany
总部
欧洲总部 Munich, Germany
Westford, Massachusetts
欧洲总部
北美总部
Tokyo Stock Exchange Level‐1
1 191
上市
员工数 1,191
Profitable, no debt
员工数
财务状况
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* using the original currency and the average exchange rate for the period.
Engineering Organizationg g g
• 全球5大研发部门
R&D Headquarters: Yokohama, JapanSI and EMC R&D:Paderborn, GermanyR&D and Support:Ulm Germany
Engineering Resources
R&D and Support:Ulm, GermanyR&D:Bristol, United KingdomR&D:San Jose, California, USA
40%
• 专业R&D研发工程师
Worldwide staffing:325平均资历:12 years
• 售后及服务工程师
R&D Investment
25%
Worldwide staffing:400平均资历:11 years
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• 每年25%的研发投入
5
研发,销售,售后网络More Than 30 Offices WorldwideMore Than 30 Offices Worldwide
Zuken USA Inc.North AmericanHeadquarters
Zuken Inc.WorldwideHeadquarters
Zuken GmbHEuropean Headquarters
Zuken SOZO Center
Headquarters
Zuken GmbHEuropean Headquarters
Zuken Inc.Worldwide Headquarters
Zuken USA Inc.North American Headquarters
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Munich, Germany Yokohama, Japan Westford, Massachusetts
Zuken’s VisionRequirements Management to Design RealizationRequirements Management to Design Realization
Topology and Functional Planning Circuit Engineering Panel Layout
Requirements
Functional Planning Circuit Engineering Panel Layout
qManagement
e-PLM Library and Design Data Management
Platform Standardization
System Planning Circuit Engineering PCB and Package
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System Planning Circuit Engineering PCB and Package Layout
依靠DFM的可制造性分析软件解决PCB生产制造上的隐患解决PCB生产制造上的隐患
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前言
• 现在市场上主流安卓手机基本上都是使用两大主流手机芯
前言
现在市场上主流安卓手机基本上都是使用两大主流手机芯片厂商高通和联发科的芯片解决方案,两家公司提供的Turn-Key公板设计给国内手机厂商或者ODM设计公司,客户根据对手机的性能定义再稍作相应改动,然后就可以进行手机生产了,这样极大的缩短了手机研发设计周期,让新产品上市变的越来越快让新产品上市变的越来越快。
• 事实上,PCB设计对生产的影响是非常大的,而提供公板设计的厂商他们对生产上可能产生的因素并不在意 如果设计的厂商他们对生产上可能产生的因素并不在意,如果手机厂商在研发设计过程中对DFM问题没有足够认识,导致隐患的积累越来越多。
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一般小规模手机公司PCB设计流程般小规模手机公司PCB设计流程
布局布线
版外形调整
DR
C
输出数据
原理图修改
项目评审
OK小批量试产 量产
唯一的出路:引入DFM设计
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引入 设计
的瓶颈
人工检查的局限性
DFM的瓶颈
人工检查的局限性用人的目视方法去检查PCB的设计问题,工作量相当大,缺陷检查的遗漏不可避免
信息的传达方法低效(基本用传统纸质方式) 信息传达的手段落后也必然造成内容损失和偏差 很难) 信息传达的手段落后也必然造成内容损失和偏差,很难
共享企业Know-How,相同的问题可能反复重现人工检查的低效、
知识经验储备不足!
“设计完成后再检查” 实在太慢有些缺陷根本没办法到设计完成后来纠正!设计返工不可避免!这样设计时限无法保证。
如何跨越以上DFM 设计的瓶颈呢?
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M 设计的瓶颈呢?
引入DFM检查流程前移
ne sttt
引入DFM检查流程前移
Plac
emen
t
Impo
rt O
utlin
Wiri
ng
Sold
er R
esis
Assi
gn
Com
pone
n t
Inpu
t Circ
ui OK Manufacture / AssemblingManual CheckManual Check
边设计边检查设计检查前移将尽早发现问题、解决问题于前端,避免设计完成再检查出问题是很难纠正。避免设计完成再检查出问题是很难纠正。
将DFM 检查过程嵌入系统内部将DFM检查过程嵌入到系统里,是个有效的方法来
kt e st
将 检 过程嵌入到系统 ,是个有效的方法来减轻工作量和减少人为的疏漏,另外,know-how 的积累能快速得反映在新的规格要求中,并得到有效执行。
Man
ual C
hec
OK!
Assi
gn
Com
pone
nt
Inpu
t Circ
uit
Plac
emen
t
Impo
rt O
utlin
Wiri
ng
Sold
er R
esis
Manufacture / AssemblingA
DM
ADM
ADM
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ADMADM SystemSystem
Zuken’s DFM 方案Zuken s DFM 方案
nual
Che
ck OK!
Assi
gn
ompo
nent
put C
ircui
t
M
lace
men
t
port
Out
line
Wiri
ng
lder
Res
ist
ADM
ADM
ADM
ADM
ManC
o
Inp PImp W
Sol
ADMADM SystemSystemADMADM SystemSystem
加工设备要求的检查项目 布线和测试点要求的检查项目基板布局布线要求的检查项目 丝印、阻焊、锡膏要求的检查项目
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DFM的意义DFM的意义
降低 本 提高产 竞争力• 降低成本、提高产品竞争力
• 优化生产过程,提高生产效率优化生产过程,提高生产效率
• 利于技术转移,加强公司协作
• 新产品开发及测试的基础
• 适合电子组装工艺新技术• 适合电子组装工艺新技术
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DFM Check rulesDFM Check rules
O• Board Outline and Hole• Antenna Wiring
S N t Cl• Same Net Clearance• Pad on Via• Clearance between Non Plated Through Hole and Copper• Clearance between Non Plated Through Hole and Copper
Foil• Line Neck Down• Build-up Via• Exposing Copper Foil• Resist Opening Rule• Resist Clearance
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三个设计的Check Results三个设计的Check Results三个设计规则不一样的设计使用相同最小线宽线间距规则来检查的结果如下如下:
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板厂反馈的DFM问题实例板厂反馈的DFM问题实例1,PCS外形存在多处內R角为直角,我司无法制作,建议R0.5mm,请确认是否OK?
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元器件的MARK点元器件的MARK点• 引线中心距≤0.5 mm的QFP以及中心距≤0.8 mm的BGA等器件,应在通过该元件中心点对角线附近的
对角设置局部Mark点,以便对其精确定位。
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大面积净空区的处理大面积净空区的处理
在PCB板的天线净空区 往往没有任何走线以及铜箔 如果是这个区域超过5 *5 的大小 那么在• 在PCB板的天线净空区,往往没有任何走线以及铜箔,如果是这个区域超过5mm*5mm的大小,那么在PCB制板过程中可能会有气泡产生,这个气泡在STM高温的时候会使板子内层鼓包或者其他隐患产生。处理方法可以放置一些小方块的孤铜或者在板子上钻一些过孔。
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Introduction to CR-8000
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最新一代最新 代
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Design Products ‐ not just PCBs
Zuken SolutionCR 8000 Multi board System level DesignCR-8000 Multi-board System-level Design
System Planner Design Gateway
DESIGNPLAN
完整的系统级平台级平台
IMPLEMENTMANUFACTURE
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Design ForceDFM Center
DFM Center通用性平台通用性平台
针对PCB板实施全面的可制造性分析,进而改善产品品质及设计效率
Rigid Board(One Side/Both Sides)Rigid Board
(Multi Layer)
Ri id B d
HIC
SiPRigid Board(Buildup)
SiP
FPC(One Side/Both Sides)
CeramicPackage
Data importand check
Manufacturingdesign
optimizationTool Design Check
Output draws for
each process g
OrganicFPC(M lti L )
optimization
OrganicPackage(Multi Layer) COF Rigid FPC
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DFM Center高度客户化定制功能高度客户化定制功能
配备客户化定制功能,检查硬板、柔性板和高级封装设计
ACF 设计
Overcoat 设计
h i /fl ibilit
柔性板包括特殊板(HIC, etc.)
硬板高级封装
Die 数据设计
Registry Guide design
Coverlay design
屏蔽设计
印刷电阻设计
hygroscopic/flexibility
Correction by Dry-film Elasticity
钻孔误差
线宽修正
刀具槽误差
加强板设计印刷电阻设计
WB 盘设计
Metal Bridge design
Frame 设计
线宽修正V Cut 误差
测试数据生成
丝印误差阻抗匹配
Metal Bridge design
间距修正
Plated Lead/Tie Bar design
Chip-Up 功能Silver Through design
高精度
Tolerance Correction in Each Area
外观检查设备数据生成
导体工具数据生成
Length Measurement Drawing design
间距修正
Build-in 器件支持
Carbon design
g g
UL 标准支持
Measure for
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阻焊设计
单元设计
Measure for Environmental problem
Lead-free support Halogen-free support
Warp support
32
Zuken SolutionDS 2 Library and Work in Progress Data ManagementDS-2 Library and Work-in-Progress Data Management
第三方PDM / PLM 系统
ZUKEN公司的管理平台可以无缝在线管理PCB,封装,线束的整个设计制造流程PCB,封装,线束的整个设计制造流程
实时在线的物料管理 实时在线的BOM管理 实时在线的数据管理实时在线的元器件管理
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WIP
Workflow and Process Support
QuestionsQuestions
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