tdk ambient light sensor

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    Visible Radiant Optical Sensor /Data Sheet BCS2015A1

    Shapes and dimension Equivalent circuitGlass SubstrateBCS2015A1

    Electrical Characterisic Temperature= 25deg.C

    Item ValueUnits Min. Typ. Max.

    Output current 100Lux*1 Vop=5V A 6.0 8.0 10.0Operation voltage (Vop) 100Lux*1 V 1.2 --- 5.0Dark current Vop=5V nA --- --- 10

    *Initial valueAbsolute Maximum Ratings Temperature= 25deg.C

    Item ValueUnits

    Operation voltage V 8Reverse voltage V -1Output current mA 1

    Optical Characteristic Temperature= 25deg.CItem Value

    Units

    Spectral sensivty area nm 350 to 750Peak of sensivity nm 58020

    OthersItem Value

    UnitsOperating temperature deg. C -20 to 85Keep and transfer temperature deg. C -40 to 85Dimensions mm 2.01.50.6tWeight g 0.004

    *1 White Fluor Light (color temperature=4200K)51101

    *All specifications are subject to change without notice.

    Application

    Brightness control for LCD, EL and CRT

    Brightness control for Keypads (e. g. Mobile Phones)

    Positioning scanline for Rear Projecton TV

    Exposure adjust for Compact Camera

    Sub exposure adjust for Digital Camera

    Dimensions in [mm]

    ( ) : Typical value

    TDK Visible Radiant Optical Sensor is the photo-IC which uses an amorphous

    silicone semiconductor technology. It is the most suitable for Brightness

    Adjustment, Control of the Lighting systems. BCS2015A1 has current-

    amplifire in it. BCS2015A1 is for surface mounthing.

    Features

    Highly receptive to visible light but not receptive to infrared light (close to

    Human eye visibility).

    Accurate illumination measurement can be taken without the use of an

    infrared filter.

    ( Phototransistors and photodiodes that use crystal- silicon semiconductors

    typically require this filtering.)

    High output (Built-in current amplifire)

    Surface mounting can be used in lead- free reflow soldering.

    Lead- free, Cadmium-free

    +

    _

    0.6

    0.5

    0.6

    1.

    2 t=0.6(typ.) 0.7(Max.)

    Photo acceptance area

    - Electrode + Electrode

    1.

    5

    2

    (0.

    825)

    (1.325)

    (0.

    55)

    (0.55)

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    Output characteristic(typical):BCS2015A1

    Measuring circuit diagram

    1.E-07

    1.E-06

    1.E-05

    1.E-04

    1.E-03

    1.E-02

    1 10 100 1,000 10,000 100,000

    Illuminance(Lx)

    OutputCurrent(A)

    Vop=3V

    Vop=4V

    Vop=5V

    Optical sensor

    Light

    +

    A

    V

    I-meter

    V-meter-

    Vop

    2

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    BCS2015A1Characteristic of Output Voltage (Typical)

    Measuring circuit

    Photo-IC

    Vo

    RL

    Vcc

    Illuminance dependency of Max. Vo (Typical)

    0

    0.5

    1

    1.5

    2

    2.5

    3

    3.5

    4

    4.5

    100 1000 10000

    Illuminance(Lx)

    Max.

    Vo(V)

    Vcc=5V

    Vcc=3V

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    Vcc=3V

    1.E-03

    1.E-02

    1.E-01

    1.E+00

    1.E+01

    1.E+00 1.E+01 1.E+02 1.E+03 1.E+04

    IlluminanceLx

    Vo

    V

    Vcc=5V

    1.E-03

    1.E-02

    1.E-01

    1.E+00

    1.E+01

    1.E+00 1.E+01 1.E+02 1.E+03 1.E+04

    Illuminamce(Lx)

    Vo

    (V)

    RL=950 ohm

    RL=20k ohm

    RL=260k ohm

    RL=4k ohm

    RL=55k ohm RL=630k ohm

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    Typical photo response time:BCS2015A1 (typ.)

    Measuring circuit

    1.E-04

    1.E-03

    1.E-02

    1.E+03 1.E+04 1.E+05

    Load Resistor RL ()

    Photo

    responsetime(sec)

    tr

    tf

    Optical sensor

    LED pulse light

    +

    - VoutV

    RL

    2V

    Vout

    tr tf

    90%

    10%

    4

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    Temperature stability of output current:BCS2015A1 (typical)

    Spectral response:BCS2015A1 (typical)

    0.0

    0.2

    0.4

    0.6

    0.8

    1.0

    300 400 500 600 700 800

    Wave length(nm)

    Relativeresponce

    Human eyes

    (CIE standard)

    BCS2015A1

    *VR=5V

    FL 100Lux

    0.6

    0.7

    0.8

    0.9

    1

    1.1

    1.2

    -10 0 10 20 30 40 50 60 70 80

    Temperature(deg.C)

    Relativeoutputcurrent

    3

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    Recommended land pattern

    (mm) Stress

    Recommanded reflow heat condition

    Recommended land pattern is shown in Fig. Please arrange a land in the direction as

    shown in Fig. to the direction of curvature as the result of heat stress by reflow and/or

    physical stress.

    *Pb Flee Solder is SnAgCu.

    150deg./C

    200deg./C

    220deg./C

    Less than 40sec

    60sec.-100sec.

    cooled gradually

    For Pb-Sn soldering process

    150deg./C

    180deg./C

    230deg./C

    245deg./C - 255deg./C (MAX. 255deg./C)

    60sec.-120sec.

    30sec - 40sec

    For Pb-Flee soldering process

    cooled gradually

    0.65

    1.

    2

    0.45

    0.5 0.65

    0.45

    0.

    2

    0.

    5

    0.

    5

    5