TCSP Presentation #3TCSP Presentation #3

Team 14 Team 14

SPOT DASHSPOT DASH

SchematicsSchematics

3 Pages3 PagesPage 1: Buttons, LEDs, sensors related Page 1: Buttons, LEDs, sensors related

circuitscircuitsPage 2: Microcontroller related circuitsPage 2: Microcontroller related circuitsPage 3: DC-DC, CAN Bus, RS232 related Page 3: DC-DC, CAN Bus, RS232 related

circuitscircuits

Buzzer

Photocell

Tmp Sensor

Button Interface

LEDs

Optical Isolation for buttons

SchematicsSchematics

3 Pages3 PagesPage 1: Buttons, LEDs, sensors related Page 1: Buttons, LEDs, sensors related

circuitscircuitsPage 2: Microcontroller related circuitsPage 2: Microcontroller related circuitsPage 3: DC-DC, CAN Bus, RS232 related Page 3: DC-DC, CAN Bus, RS232 related

circuitscircuits

Microcontroller

Clock Generator

Debug Headers for Micros

PLD

Bypass Caps

SchematicsSchematics

3 Pages3 PagesPage 1: Buttons, LEDs, sensors related Page 1: Buttons, LEDs, sensors related

circuitscircuitsPage 2: Microcontroller related circuitsPage 2: Microcontroller related circuitsPage 3: DC-DC, CAN Bus, RS232 related Page 3: DC-DC, CAN Bus, RS232 related

circuitscircuits

DC-DC Converter

CAN Bus Transceiver

Transceiver

RS232 Driver/Receiver

Bypass CapsMounting Holes

Schematic Design ConsiderationSchematic Design Consideration

Schematic support I2C and SPI.Schematic support I2C and SPI.Hardware configurable Hardware configurable

Optical isolation for remote buttonsOptical isolation for remote buttons

Cable detectionCable detection

PCBPCB

2 Pages2 PagesPage 1: Top Layer with Unrouted tracesPage 1: Top Layer with Unrouted tracesPage 2: Bottom Layer with Unrouted tracesPage 2: Bottom Layer with Unrouted traces

PCBPCB

2 Pages2 PagesPage 1: Top Layer with Unrouted tracesPage 1: Top Layer with Unrouted tracesPage 2: Bottom Layer with Unrouted tracesPage 2: Bottom Layer with Unrouted traces

PCB Design ConsiderationPCB Design Consideration

Space Constraint 4.5” x 2.75” boardSpace Constraint 4.5” x 2.75” boardPlacement for Crystal and MTE connectorPlacement for Crystal and MTE connectorActive component on top layer, passive Active component on top layer, passive

components on bottom layercomponents on bottom layerPower and GND trace need to be 40 milsPower and GND trace need to be 40 mils

Allowing more current flow.Allowing more current flow.Bypass capacitors need to be close to the Bypass capacitors need to be close to the

component. component.

Bypass capacitors help balance out the Bypass capacitors help balance out the inductance inside the traces.inductance inside the traces.

Grouping different parts into functional Grouping different parts into functional blocksblocks

Connecting Power and GND traces before Connecting Power and GND traces before the signals. the signals.

PCB Design ConsiderationPCB Design Consideration