國立臺南大學 數位學習科技系 黃國禎 1

半導體產業及製程

TSMCFAB14張永政

Jonathan_chang@tsmc.com

e-Manufacturing 2

哪裡有IC的存在

Wireless Network

ADSL

PowerfulComputingPower

New IT

e-Manufacturing 3

哪裡有IC的存在

New IT

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IC 製造的演進

真空管 (1895-1947) 電晶體 (William Shockley, John

Bardeen, Walter Brattain –1947-1958 - Ge)

IC (Jack Kilby –1958 - Silison)

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What is IC

I.C. is the short form for INTEGRATEDCIRCUIT.

In Wafer Fabrication, we are forminghundreds or even thousands of I.C. on awafer (thin circular disc) of silicone.

D (Drain)

Gate Ox

Poly

S (Source)Si

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Moore Law (1965) The observation made in 1965 by Gordon Moore, co-

founder of Intel, that the number of transistors persquare inch on integrated circuits had doubled every yearsince the integrated circuit was invented. Moorepredicted that this trend would continue for theforeseeable future. In subsequent years, the pace sloweddown a bit, but data density has doubled approximatelyevery 18 months (1975), and this is the current definitionof Moore's Law, which Moore himself has blessed.

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What is IC size

100 um

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IC gate size 1 um = 10-6 m 1 nm = 10-3 um 頭髮直徑 = 50-100 um Current minimum gate width = 14 nm Minimum gate size = 2.35 * 10–10 m

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Foundry Growth Forecast

0%

5%

10%

15%

20%

25%

30%

35%

40%

1993 1995 1997 1999 2001 2003 2005 2007 2009

0

5

10

15

20

25

30

35

40

45

Source: Dataquest, TSMC

Co

ntr

ibu

tio

nR

ate

Fo

un

dry

Sal

es$

Bill

ion

s

Foundry Sales $B Foundry Contribution Rate in ICMarket

2002-2010 CAGRWW IC = 10%Foundry = 20%

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Sales Trend

Year 2002 : $4.65 Billion25% YoY growth

US $ M

0

1,000

2,000

3,000

4,000

5,000

6,000

'92 '93 '94 '95 '96 '97 '98 '99 '00 '01 '02'02 ‘03

1H 03$2.57 B

11.2% YoY

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TSMC Market Share GrowthWorldwide Dedicated Foundry Industry by Revenue

Source: Companies, TSMC

1Q03$2.1 Billion

1Q03$2.1 Billion

TSMC 53%

Chartered 6%

UMC 27%

Other 14%2Q03

$2.6 Billion2Q03

$2.6 Billion

TSMC 56%

Chartered 5%

UMC 27%

Other 12%

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Sales Breakdown by Technology

0%

25%

50%

75%

100%

1Q02 2Q02 3Q02 4Q02 1Q03Sales(NT$Bn)

35.8 44.2 39.8 41.2 39.3 49.9

0.13u-

0.15u

0.18u

0.25u

0.35u

0.50u+

9

13

25

22

30

1

11

14

23

22

29

1

12

13

27

23

20

5

11

12

24

21

21

11

11

11

25

21

24

8

2Q0399

20

24

21

17

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TSMC Provides Broad Leading-edgeTechnologies

Logic Processes to 90-nm Mixed Signal Processes to 90-nm SiGe BiCMOS Processes to 0.18-micron Embedded High Density Memory to 90-nm Embedded Non-Volatile Memory to 0.18-

micron Image Sensor Technology to 0.18-micron High Voltage Processes to 0.25-micron Copper and Low-k Dielectric Processes

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The R&D Investment Leader

R&D expense between 1992 and 1997 have not been restated under the current definition

R&DR&D

US $ M

CAGR ~ 32%

350

300

250

200

150

100

50

01992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002

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Roadmap Leads ITRST

ech

no

log

yG

ener

atio

n(n

m)

Year99

100

130

180

250

97 01 03 05 07 09

65

99 ITRS (International Technology Roadmapfor Semiconductors)

TSMC

00 ITRS

01 ITRS

90

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How much semiconductor revenue

Worldwide semiconductor sales are expected to hit $237.1 bln in 2005, up4.7% from $226.6 bln in 2004, according to iSuppli. The research companypreviously had predicted 9.6% growth in semiconductor revenue in 2005

e-Manufacturing 17

What is IC industry

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FablessDesign House

Foundryservice

AssemblyService

IDM

DesignDesign

ManufacturingManufacturing

AssemblyAssemblyTestTest

DesignDesign

TSMCTSMC

AssemblyAssemblyTestTest

SalesSales SalesSales

TSMC changes game rule

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台積公司客戶無晶圓廠之專業設計公司

自有晶圓廠之整合元件製造商 系統公司

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What is Foundry Service Industry

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Global FABless Industry

Framework is necessary

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Global FABless Industry

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IC industry

IDM Design House Foundry Assembly Test System Integration

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IC fabrication

Mask Litho Etch Diff CMP TFE

國立臺南大學 數位學習科技系 黃國禎 25

C013 Cu processintroduction

Poly

P Substrate

Pwell

NAPT

Nwell

PAPT

VTP

PolyPSD NSD NSD NSDPSD PSD

W W W WILD

Trench oxide

IMD-1

W W W W

Metal-1

Metal-2

Poly

P Substrate

Pwell

NAPT

Nwell

PAPT

VTP

PolyPSD NSD NSD NSDPSD PSD

W W W WILD

Trench oxide

IMD-1

W W W W

Metal-1

Metal-2

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晶圓的尺寸 所代表的意義

6 inch 8 inch 12 inch

100 dies 180 dies 400 dies

1. 量產 2. 降低生產成本

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微米

0.13um0.25um

1 um = 0.000001 m = 1000 nm柰米

0.13 um = 130 nm100 um = 頭髮的寬度

S 距離 vs 電阻時間 vs 速度

(1) 相同圖形

相同尺寸(面積), Die數

單位面積電容

(2)

儲存容量

TECH 所代表的意義

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IC process 基本製程

黃光

薄膜

蝕刻植入

光阻去除

流程 說明 圖釋

薄膜(Thin_film)1.化學氣相沉積(CVD)2.金屬濺鍍(PVD)3.擴散(Diffusion)

黃光(PHOTO)1.光罩(MASK)2.光阻(Coater)3.曝光(Exposure)4.顯影(Development)

蝕刻(ETCH)1.濕蝕刻(Wet-ETCH)2.乾蝕刻(DRY-ETCH)

光阻去除(PR remove)將光阻去除後就是我們所需的圖形(PATTERN)

FILMWafer

Wafer

FILMWafer

光阻FILMWafer

光阻FILMWafer

光罩

e-Manufacturing 29

What is IC

e-Manufacturing 30

Pwell

NAPT

Poly

NSD NSD NSD

W W W

Trench oxide

W W W

打地基打地基

蓋高樓蓋高樓

IC 的製程就如同人類建造高樓一樣 , 一層一層慢慢的搭建起來,首先在晶

片上鍍上一層薄膜 , 然後在黃光區曝出須要的圖形 , 接著再到蝕刻區將圖案刻薄

膜上 , 如此即結束一層的製程 , 而後再不斷的重覆以上的動作 , 直到全部的圖形都

堆壘在晶片上為止 , 通常一般的

IC 製程須要經過 15-20 層才能完成.

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MEOX4_DP PE-FSG

MEOX1_DP PE-SN

MEOX2_DP PE-FSG

MEOX3_DP PE-SN

VACU1_PH

MEOX5_DP PE-SIONVACU1_ET

MEOX5_PH PR Coating

MEOX5_ET PEB

MEOX5_PH1 TRCHMEOX5_ET1 TRCHMEOX5_ET2 LRM

MECU1SPU SEED

MECU1_DP ECP

MECU1CMP

Dual Damascene ProcessDual Damascene ProcessC013 Copper processC013 Copper process

e-Manufacturing 32

C013 Cu-FSG

HDP PSG

SiN 300A

W-Plug

FSG 1.7KA (2.9KA)

SiN 500A

SiN 300A

M1 (Cu) M1 (2.6K)

M2 (Cu) M2 (3.5K)

FSG 4.9KA

FSG 2.3KA (4.2KA)

Via1

STI

SiN 500A

SiN 300AM3 (Cu) M3 (3.5K)

FSG 4.9KA

FSG 2.3KA (4.2KA)

Via2

SiN 500A

SiN 300AM8 (Cu) M8 (9K)

USG 7.2KA

USG 7.5KA (9.9KA)

Via7

SiN 300AFSG 2.3KA (4.2KA)

SiN 500A

SiN 750A

M7 (3.5K)

5.5KA600A

900A

1200A

900A

AlCu 12KA

PESiN 6KAPEOX 4KA

4KA

SiN 400A

(IMD7=6.5KA)for V7=0.36*0.36

(IMD1~6=4.5KA)

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C013 FSGC013 FSG--Cu 8M Stacked ViaCu 8M Stacked Via

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IT system in IC fabrication

MES EEC EC SC

Engineering Chain(EC)

Supply Chain(SC)

e-Manufacturing

ManufacturingExecution System

(MES)

EquipmentEngineering System

(EES)

InternetInter-Company

Intra-Company

e-Manufacturing

產業活動

策略規劃

品

質

工

程

行 銷

工程與研發 生產規劃

廠區控制

（生產）工廠自動化

維修與服務

行政支援與管理

配 送

e-Manufacturing

產業電子化活動

供應商之供應商 供應商 顧客之

顧客顧客主企業

採購 生產 配銷 採購 生產 配銷 採購 生產 配銷

工程研發工程研發 工程研發

行政支援行政支援 行政支援

營業營業 營業

e-Manufacturing

電子化應用系統 (I)

供應商之供應商 供應商 顧客之

顧客顧客主企業

MESPES/CSM SCM PES/CSM MES SCM MESPES/CSM SCM

CE/PDMCE/PDM CE/PDM

ERPERP ERP

EC/QREC/QR EC/QR

e-Manufacturing

電子化應用系統 (II)

Supply Chain Management (SCM)

ProcurementExecutionSystem(PES)

Enterprise Information Management (PIM)Component &

SupplierManagement

(CSM)

Product DataManagement

(PDM)

EnterpriseDocument

Management(EDM)

Engineering

CAD CAE CAPP

Manufacturing

CAM MES MCS

QuickResponse

(QR)

e-Commerce(EC)

CustomerRelation

Management(CRM)

Enterprise Resource Planning(ERP)

QuickResponse

(QR)

e-Commerce(EC)

CustomerRelation

Management(CRM)

Knowledge Management

。

e-Manufacturing 39

供應鏈管理供應鏈管理SCMSCM

顧客關係管理顧客關係管理CRMCRM

企業智財BIC /

企業資源規劃企業資源規劃ERPERP

EC Platform / WEB Application Server/ Application ServerEC Platform / WEB Application Server/ Application Server電子商務平台電子商務平台//網站應用程式伺服軟體網站應用程式伺服軟體//應用程式伺服軟體應用程式伺服軟體

基礎發展環境基礎發展環境

供應面 需求面知識管理KM

工程資料管理PDM

工程資料管理工程資料管理PDMPDM

製造執行系統MES

製造執行系統製造執行系統MESMES

電子化應用系統 (III)