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The top documents tagged [wire bond]
Wafer Level CSP Overview Fillion 2011
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B5_Fabula 1 PEM Qualification Requirements For Radiation Hardened Non- Hermetic Products Qualifiable for Space Flight Applications
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Detector module development for the CBM Silicon Tracking System Anton Lymanets for the CBM collaboration Universität Tübingen, Kiev Institute for Nuclear
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Supporting the Electronic Manufacturing Services market CONFIDENTIAL: All contents copyright of Illinois Tool Works, Inc. (ITW). The ITW Photonics Group,
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Strip Module Working Group Meeting 16 th May 2012 Hybrids A Greenall
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LED design has evolved to increase extraction efficiency, but all forms have the same basic epilayer structure (a). Metallic contacts can be added to this
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Ronald J. Erickson Masters Project Thesis. By utilizing a fab-less manufacturing system it allows the company stay price competitive. However by using
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Bulk MEMS 2013, Part 2
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. Micro hot plate: how many litho steps ? Pt heater Nitride Pt measurement electrodes sensor material oxide
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Designing for the Transportation market CONFIDENTIAL: All contents copyright of Illinois Tool Works, Inc. (ITW). The ITW Photonics Group, Cal Sensors,
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DESIGN OF A PARAMETRIC OUTLIER DETECTION SYSTEM
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MEPTEC Report Winter 2012
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