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The top documents tagged [chip conference]
OVERCOMING KEY CHALLENGES OF TODAY'S COMPLEX SOC: PERFORMANCE OPTIMIZATION AND VERIFICATION QUALITY
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Temperature-Gradient Based Burn-In for 3D Stacked ICs Nima Aghaee, Zebo Peng, and Petru Eles Embedded Systems Laboratory (ESLAB) Linkoping University 12th
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Twenty Years of HP Videos: 1986 to 2005 Jake Schwartz
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Temperature-Gradient Based Burn-In for 3D Stacked ICs
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CHIP 2012 Conference 2012 Booklet
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