tactical · open · systems l based on march 01 technology assessment slide 1 an/uyq-70 technology...

LBased on March ’01

Technology AssessmentSlide 1

Tactical · Open · Systems

AN/UYQ-70Technology Insertion

Planning




CO TSTECHNO LO G Y

M ISSIO NAPPLICATIO N

REQ UIREM ENTSDRIVEN

M ISSIO NCRITICAL

andM ISSIO N

ESSENTIALSYSTEM S

IM PRO VEDM ISSIO N

EFFECTIVENESS

AN/UYQ-70Technology

Insertion

RequirementsAnalysis

TechnologySurveys

FeasibilityDemos

PeriodicReview s &Offramps

ProductizationTechnologyEnabled

Q-70 Technology Insertion

• Q-70 System Architectures– VME / Non-VME– Operating Systems– Processors– Storage

• HMIs & Graphics

• Low Cost Enclosures– Volumetrics

• Networking– Infrastructure– Voice/video Distribution– Sensor Distribution

• Miscellaneous– System Development Tools– Modeling & Benchmarking


• HMIs & Graphics




User input is critical to successful Technology Insertion.




AN/UYQ-70 TI Tasks

Operating Systems

Radar DistributionSoftware Development

Communications

Enclosure Volumetrics

Graphics Adapters

Middleware

Display Technologies

Networking

Modeling

Mass Memory

HMI

Q-70Q-70ProductizationProductization

Analysis&

Integration

UserUserRequirementsRequirements

COTS COTS TechnologyTechnology

Mission Success!

Pointing Devices

Infrastructures

Low Cost Enclosures

VME-based Architectures

Miscellaneous

Non-VME Architectures

Isolation Techniques

Power Systems

Clients

Security

ServersPMCs

Technology Insertion is focused on five areas.

System Architectures

Unit Processors

User Identification and Authentication

New Materials

Noise Abatement




Important Disclaimers

• All projections are forward looking statements that may change based on program priorities and projected technology advances.

• The figures on the following slides indicate when the Q-70 program intends to make newer products eligible for productization for the Q-70 user community.

• The figures do not indicate when the Q-70 program will discontinue support for existing products. Products are normally supported for the life of the program.

Trends are based on a March 2001 technology assessment.




• VME-based Architectures– Unit Processors– Operating Systems– Mass Memory– PCI Mezzanine Cards (PMC)

• Non-VME-based Architectures– Workstations– Clients– Servers– Storage

Q-70 System Architectures

Session Server

Thin Clients / Ultra Thin Clients

Q-70 Architectures will become less VME-based.




Combat System ArchitecturesSeamless C4I System

Weapons

Sensors

CAGEmulator

CDs /C&D

AN/UYK-43s With OSM

TAC-n Consoles

DDS

48E

49

CIFF

JMCIS LAN

Combat SystemIntegration LAN(s)

CEP

TAS

SLQ-32

NSSMS

CIWS

RAM

NAVSSIIntegrated

BridgeSystem

DigitalRadar

Video/DataDistribution

C2P

ACDS

LAN

Display

LAN

SSDS

LAN

CEC

LAN

Past Present FutureDedicated Equipment Multi-purpose Workstations Total Compute Plant/Universal WSsPoint-to-Point Networks of Networks Common Network FabricMain Frame Distributed Processing Client / Server ArchitectureCard Level Integration Chassis Level Integration Subsystem Integration

Legacy Architectures Future

Present / Near Term

are evolving into seamless systems.

Switchboard(s)

DisplayEquipment

Groups

Sensors / Weapons / Peripherals




Non-VME WorkstationsNon-VME Workstations will offer even more choices.

Present(2001)

Near Future(2002-2003)

Future(2004+)

Ultra80/ Netra1405

RES204

SUNM icrosystem s

Hewlett Packard

Them is

Intel

Solaris

Solaris

Ultra80 w ith NextGeneration Graphics

Netra 1405Solaris

Demos

Products*

Investigation

IA-64 W orkstation

Solaris HP-UX

Linux Window s

Next Generation HPOffering

HP-UX

J5000/J5600in an ECDW S

(obsolete)HP-UX




Q-70 Client RoadmapNew clients will reduce total cost of ownership.


Future(2004+)

Present(2001)

Thin Clients

* X Protocol* Intelligent Console Architecture (Citrix)* Rem ote Display Protocol (RDP)* W eb Browser w ith Java support

FlatPanel

TouchScreen

UltraThin

ClientDem os

* SunRay HotDesk Protocol

Im provedPerform ance

Clients

ThinClients

Demos

Products*

Investigation

with one userinterface

OtherHM I

Sm artCard

M ulti-graphics

heads

RadarInput

W earablecom puting

W irelessm obile

com puting

ThinClient

Dem os




Q-70 Server RoadmapScalable servers will provide common, centralized processing.

Future(2004+)


Present(2001)

U ltra80 (Session Server)

E4500 (File Server)

Com paq Proliant1850R (Term inal Server)

Rugged E4500 (Them is RES2014s)

Ultra80 repackaged(Netra 1405)

SUNMicrosystem s

Intel

Rugged Ultra80(Them is RES204 )

Power M axion (Application Server)

Com pact 1U Server(IBM Netfinity)

Concurrent(Form erly

Harris)Appliance Technology

(dedicated function)Servers

Solaris 8

Solaris 8

Solaris 8

Pow erMax OS

Solaris 8

Solaris 8

NT4.0Win2000

IA-64

Demos

Products*

Investigation

TBD

Them is

Linux

Serengeti

Next Generation1U Server

Solaris 8

NT4.0Win2000

RES3012

LW 3+

Netra t1 Netra t1+Netra t1 Flapjack




Mass Storage RoadmapMass storage will move from the nodes onto the network.


Present(2001)

Future(2004+)

9 GBMagnetic

FixedHard Drive

M edia

TapeBackupM edia

Netw orkStorage

15-600 slot DVD/CDROM Jukebox

200+ GB Magnetic

1+ TB MEMS

150 GB DAT

Demos

Products*

18 GBMagnetic

Mammoth-2

Fixed Hard Drive Media

Optical Storage Media

640 MB CDROMO pticalStorageM edia

Hybrid CD/DVD-RW

17 GB DVD-ROM

200 GB+ SIL MO

Tape Backup Media

640 MB CD-RW

5.2 GB MO

Netw ork Storage

5.2 GB DVD-ROM

4.7 GB DVD-RW

20 GB SIL MO

75 GB - 120 GBMagnetic

36 GB LVDw ide

240 GB MEMS

40 GB DAT

100 GB AIT2

80 GB DAT

200 GB AIT2 / Mammoth

15-600 Slot CDROMJukebox

2 TB SAN

240 GB RAID-based NAS 1.5 TB RAID-based NAS

5-15 TB SAN

Dedicated RAID




Human Machine Interfaces

• User Identification and Authentication

• Input Devices • Display Technologies• Pervasive Computing• Quality of Life

AVS5100

RFD251-S

Track balls,

Keyboards,

Smart Cards,

X-Terminals,

Touch Screens

HMIs are becoming less intrusive and more natural.

DFP181/R




Q-70 HMI RoadmapHMIs will become more capable and more user friendly.

Future(2004+)


Present(2001)

UserAuthentication

Input Devices

Demos

Products*

Fingerprint

Im m ersiveDisplays

Output Devices

BluetoothWireless PDAs

W earable Com puting,Awareness Com puting

PervasiveCom puting

Quality of Life Em ail

Multi-media,Video on Demand,

Crew Entertainment,Video Conferencing

Biom etric Suite:Voice, Face,

Hand Geom etry

TouchpadsSpoken Com m ands,Voice Recognition

Helm et M ounted,Voice, Virtual Reality

Sm artcard

Investigation

Layeredbiom etrics,

Iris Scan

Internet Access,Productivity Suite

2048 x 2048 FPdisplays

80211b (11 M bps)

80211a (54 M bps)

"M IL" 80211b (11 M bps)

80211g (22 M bps)

Sm art Boards

User Authentication

Password

Input Devices

Output Devices

CRTs, FPs,Thin Clients

KeyboardTrackball

Touchpanels




Low Cost Enclosures

• Enclosure Trends• Common Technologies

– Isolation Techniques– New Materials– Enclosure Volumetrics– Power Systems

Focusing on enclosures will allow the use of more COTS.




Q-70 Enclosures RoadmapQ-70 enclosures can be divided into four classes.

Present/Near Future(2001-2002)

Future(2003+)

W orkstations

Rack-basedConsoles

M EV/M CV

Equipm entRacks

Technology EnhancedCITADEL

M icro-Deck

Rafted DecksVirginia Class

Variants

Next GenerationEquipm ent Racks

(Technology Insertion)

CollaborativeW orkspaces

M ulti-M odal /Im m ersive

W orkstations & Clients

CITADEL

CNDADS

ECDW Set al

EPSet al

NGPSW Set al

M EV/M CV M EV/M CV(Elastomer)

Thin Clients

Intrepid

CND21

DD21Demos

Products*

Investigation

Viking

Elastom ericCabinetSystem

CADRT

CNDi

Products Continue on for life of the Program




Q-70 Enclosures RoadmapQ-70 enclosures are based on common technologies.

Future(2004+)


Present(2001)

Products Continue on for life of the Program

Heat Exchanger(w ater-cooled)

Shock andVibration

Noise

NNI*

Noise Avoidance /Cooling- Fuzzy Fan Control - Flat Fans (Fan Arrays, Board Cooling, W all/

Bulkhead Cooling)

Cooling

Composites(Components)

Composites(Components and Chassis)M aterials

Power

Sheet Polymers

DiscreteCom ponents

Static Fast ABT(Automatic Bus Transfer)

- Platform - System - Chassis

Elastom eric- Trapezoidal - Cubic - Sheet- Cylindrical - Poly Trapezoidal

Particle Collision (Box. Cylindrical)

Metals

Taylor

Fans/Blow ers(air-cooled)

2KVAAC-AC UPS

Integrated(Rack M ount)

Distributed (DC)(DC to High Point of Load Devices)

HyTrel(C-W orthy)

DistributedInterface M ount Noise Abatem ent

- New Sheet Polymers - Acoustic Liners - Active Noise Cancellation

Demos

Products*

Investigation

New TechnologiesNi-Hydride, Electronic Switching,

Longer Life,Smaller Lead Acid Batteries

4KVAAC-AC UPS

*Newport News Industrial




Networking

• Infrastructure

• Security

• Middleware

• Communications– Voice/Data/Video

• Sensor Distribution

Network Server

Solaris GCCSApplication Server

NT Application Server

HP-UX Application

Server

Thin and Ultra Thin Clients

Networking will continue to replace point-to-point connections.

Wireless




Miscellaneous

• Benchmarking

• Modeling

• System Development Tools

Benchmarks are used to calibrate models to predict behavior.




Benchmarking, Modeling, and System Development Tools

Software tools measure, predict, and improve Q-70 systems.

Present(2001)


Future(2004+)

Development Tools

BONeS

OPNET ?EADSim ?M odeling

BenchM arking

CC++

Ada/Ada95

Developm entTools

Graphical S/WConstruction Tools

RapidPrototyping

Unified ModelingLanguage (UML)

Demos

Products

Investigation

RMA Models No LongerSupported

RTM

Application Profiling

TI Benchmarks

CPU LoadingNetw ork LoadingGraphics Loading

X11PerfPixmark

AegisSpec95

Spec2000Ziff-Davis

JavaObject Oriented

Case ToolsData Base Tools

Support ToolsTest/Debug Tools




• US Navy Q- 70 Website:– http://www.Q-70.navy.mil/Q-70/tech_ins/

• Lockheed Q-70 Website:– http://www.q70.com/

[Ask [email protected] about access to our IDE site -- registration required.]

• Lockheed Q-70 Internal Website:– http://web2/Q70/technology_insertion.htm or

– \\dakota\engineering\technology\whit_pap\.

Want More Information ?New and old Q-70 TI investigations can be viewed on the web!




CO TSTECHNO LO G Y

M ISSIO NAPPLICATIO N

REQ UIREM ENTSDRIVEN

M ISSIO NCRITICAL

andM ISSIO N

ESSENTIALSYSTEM S

IM PRO VEDM ISSIO N

EFFECTIVENESS

AN/UYQ-70Technology

Insertion

RequirementsAnalysis

TechnologySurveys

FeasibilityDemos

PeriodicReview s &Offramps

ProductizationTechnologyEnabled

Q-70 Technology InsertionUser input is critical to successful Technology Insertion.


• HMIs & Graphics





• HMIs & Graphics




tactical · open · systems l based on march 01 technology assessment slide 1 an/uyq-70 technology...

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technology insertion

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