system on chip scaling - lecture
TRANSCRIPT
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ECE/ME/MSE 6776AIntroduction to SOP which includes
SOC, MCMs, SIP, 2.5D, 3D ICs,
3D Sste!s
2nDCl"ss
SOP by System Scaling
Prof. Rao R. TummalaJoseph M. Pettit Endowed Chair
Professor in ECE & MSEDirector, 3D Sstems Pac!a"in" Research Center
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
Toda)s Class
*hat is S'P+ *hat are S'P Technolo"ies+ ndustr Colla(orations in S'P at -T
-T PRC model for R&D
Educational Pro"rams in S'P at -T
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
-T 5PPR'5C6 T' S7STEM
SC589- Research
ndustr Colla(oration
Education
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
S'P :7 S7STEM SC589-
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
5n E9ode?
Year@%0 000@10 @@0 00@$0 00
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
Pac!a"in" to dateA Sin"le or Multiple Cs
Slide $ / 0121204Sources: Infineon, Georgia Tech, Stats, ST Ericsson
Plastic
Packaging
Leaded Packaging
Ceramic MCM
Packaging
MCM
! Packaging
! "Cs #ith $%&
'$s ! "nterposer
! Photonics
P*
'lass Package
;0 umMemor+
Memor+
Memor+
Memor+
CP, 'P,
Logic
Logic
Laser arra+ (&C%-L)
Photo.detector arra+
/iber
1
5
Memor+Memor+Memor+Memor+
Logic
2rganic
Packaging
*'3 Packaging
*uild ,p
2rganic
%"Ps
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
*hat is S'P+
S'P is li!e S'CB instead of (ein" on an C, it is on apac!a"e (ut with all hetero"eneous sstem functions
S'CA Miniaturiation at C 8e=el
SPA Miniaturiation at Module le=el
S'PA Miniaturiation at Sstem 8e=el
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
S'P Concept -T
Total Sstem Miniaturiation 'ptimied Sstem ComponentsA CM'S and 9on2CM'S Miniaturie Sstem in Two *asA
. Shrin! Sstem (ul!iness & hierarch to A de=ices and sstem
. 5ll components are miniaturied & em(edded at micro & nano
scale
'ptimie for cost and performance (etween de=ice &sstem
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
PRC ision of Di"ital Con=er"ence ( 000F
Digital + Analog + RF +
Optical + Sensors
Computin"#nternet
Di"ital 5udio
Di"ital ma"in"#ideo
Cellular#*ireless
-PS#Satellite
Sensors
5nd, of course,time!eepin"G
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
Package is the System
SstemACon=er"ent Computin",
Communication, Consumer & :iomedical
SOP @ PRC
SOPSOPSlide 0 / 0120204
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
*hat is Pac!a"in" in the new Era+
'ld EraA The S'C or Microelectronics Era >@$4222? nterconnectin"
Powerin"
Coolin"
Protectin" of "Cs 9ew EraA The S'P Era or Microsstems Era >0002?
nterconnectin"
Powerin"
Coolin" Protectin" of 3ll %+stem Components 4 $heir "ntegration
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
3 Tpes of Sstems Pac!a"in" Platforms
%+stem Packaging Platorms
Continues for lo"ic Split2die on horion Can)t inte"rate lo"ic,
memor, RH, sensors,analo"
Current approach is(ul!, e
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
HIGH DENSITY I/O 3D ICs POWER & BATTERIES 40m
-T ision for Sstem Scalin" ( 0240F
40mANTENNAS &FILTERS
PD/TIALASER PHOTODETECTOR
Waveguide Bio-SensorMEMS
CHIPLAST
EMBEDDED IC
EBG &
Is!"a#i!$
NANOMAGNETICS
SENSORS
GaAs RFICTHERMAL SOP
SYSTEM ON CHIP %SOC
3D CAPACITORS
G"ass !' Si C!'e30m
() ELECTRICAL MODELINGDESIGN AND TEST
*) MECHANICAL DESIGN FORRELIABILITY
3) NANO SCALE MATERIALSAND PROCESSES
+) THERMALTECHNOLOGIES
,)INTERCONNECTIONS-ASSEMBLY & RELIABILITY
.) INTERPOSERSAND PACAGES
0) THINFILMPASSI1ES
16 'lass "nterposer
6 Lo# Cost %i
"nterposer
6 ! $hinPack
6 $P"
56 M-M%
Packaging
76 ! 2pto
86 %L"
96 ! !esign $ools
and 3rchitecture
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Chap
ter.
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
Difference (etween SP, 3D Cs and S'P
%"P Means %tacked "Cs and Packages (%"P)
%2P Platorm
SIP Stacked ICs SIP Stacked Packages 3D ICs with TSVSIP Stacked ICs 3D ICs with TSV
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Kltra2thin Electronics Sstem Scalin"
Technolo"ies
.4D and 3D nterposers Silicon and -lass nterposers Electrical Desi"n Thermal S'P MEMS S'P RH S'P 'pto S'P Pac!a"e Materials Chip28e=el nterconnections :oard28e=el nterconnections 'r"anic Pac!a"es Thinfilm Passi=e Components
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Sstem2'n2Pac!a"e Technolo"ies
EMBEDDED COMPONENTS
MI2ED SIGNAL DESIGN
ANTENNAS AND
FILTERS
OPTOELECTRONICS
POWER
Si !' GLASS INTERPOSER
DESIGN FOR RELIABILITY
SYSTEM ON CHIP %SOC
3D ICs
MEMS PACAGING
MEMS GaAsOPTO SOP
THERMAL SOP
SENSORS
WAFER LE1EL PACAGING AND ASSEMBLY
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Sstem on Chip >S'C?
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
SYSTEM ON CHIP %SOC
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
SP and 3D Cs
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
SYSTEMINPACAGE %SOP3D ICs
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Mi
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
MEMS Pac!a"in"
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
MEMS
MEMS PACAGING
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
5ntennas and Hilters
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
ANTENNAS AND
FILTERS
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'ptoelectronics
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
OPTOELECTRONICS
GaAsPD/TIAOPTO SOP
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Thermal S'P
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
THERMAL SOP
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
, .4D and 3D nterposers and Pac!a"es
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
POWER
Si !' GLASS INTERPOSER
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
9ano :io2Components
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
EMBEDDED COMPONENTS
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
Sensors
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
SENSORS
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
Desi"n for Relia(ilit
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
DESIGN FOR RELIABILITY
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st8e=el
Chip2Pac!a"e nterconnections
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
nd8e=el nterconnections
EMBEDDED COMPONENTS
SYSTEM ON CHIP %SOC
3D ICs
MI2ED SIGNAL DESIGN
MEMS PACAGING
MEMS
ANTENNAS AND
FILTERS
OPTOELECTRONICS
GaAsOPTO SOP
THERMAL SOP
POWER
Si !' GLASS INTERPOSER
SENSORS
DESIGN FOR RELIABILITY
WAFER LE1EL PACAGING AND ASSEMBLY
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
Sstem2'n2Pac!a"e Technolo"ies
EMBEDDED COMPONENTS
MI2ED SIGNAL DESIGN
ANTENNAS AND
FILTERS
OPTOELECTRONICS
POWER
Si !' GLASS INTERPOSER
DESIGN FOR RELIABILITY
SYSTEM ON CHIP %SOC
3D ICs
MEMS PACAGING
MEMS GaAsOPTO SOP
THERMAL SOP
SENSORS
WAFER LE1EL PACAGING AND ASSEMBLY
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-T 5PPR'5C6 T' S7STEM
SC589-2 Research
ndustr Colla(oration
Education
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9E* 9DKSTR725C5DEMC
M'DE8
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Sstem Scalin" ReLuires 9ew -lo(al
5cademic2ndustr2-o=t. Model
Ne# 3cademic."ndustr+ Collaboration Model
%mall 4 ultra.small
%+stems
%+stem%caling
Ne#3cademic."ndustr+Model
Ne# $echnologies
%killed :esources
'lobal-nd.,ser.to.%uppl+Chain Mg6
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*h Should ndustr Colla(orate with 5cademia+
-;plorator+:esearch
10 7 0
Time in 7ears
TechnicalSc
ope
%trategic:esearch $echnolog+!e
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%+stem /ab/acilities
PRC
Staff
The 9ew 5cademic2ndustr Model
3cademic/acult+
'raduate%tudents
"ndustr+Partners
:esearch/acult+
-ngineerson Campus
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%+stem /ab/acilities
PRCStaff
'raduate%tudents
"ndustr+Partners
6i"hl2nterdiscipline Hacult
:esearch/acult+
-ngineerson Campus
"nterdisciplinar+3cademic /acult+
Prof. Rao TummalaProfessor & Center Director
Prof. - Chan"Opto
Prof. Masam-ho=anloo
Bioelectronics
Prof. Harro!h 5aiMEMS
Prof. Peter 6es!ethSensors
Prof. Joun"hoim >5ST?
Electrical Design
Prof. Satish umarLED
Prof. 7o"endraJoshi
Theral
Prof. SureshSitaraman
Mechanical Design
Prof. Madha=anSwaminathan
!"
Prof. CP *on"#olyer Materials
3cademic/acult+
Plus many more$
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-T PRC)S
-8':58 9DKSTR7 C'9S'RTKM To Stimulate -lo(al nterest
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Research Strate" & ndustr Pro"rams
16 !esign
Communication-lectronics
-lectronics Photonics mm.a
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-T2PRC ndustr Consortia Pro"ram
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Material 4
$ool %uppliers
"nterposerManuacturers
3pplication-nd ,sers
Package"ntegrators
(2%3$)
!e
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Sin"le ndustr Consortium with 0 Critical
Sstem Scalin" Technolo"ies
Lo#.cost 2rganic"4P (L2"P)
50?m Pitch 2rganicPackages
Lo#.cost 65! and! 'lass "4P
(L'"P)
X.10X Lo#er Cost 410.50?m "@2 Pitch
*oard.le
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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"
-T PRC 2 Consortia Pro"rams
& Pro"ram Mana"ers or Hacult 8eaders16 !esign
Dr. $. #anayappan
-lectrical
.4D nterposer for
(andwidth
Si"nal, power deli=2
er, noise, F2tal!
#rof. Suresh Sitaraan
Mechanical
*arpa"e, relia(ilit
#rof. %ogen&ra 'oshi
$hermal
Thermal
conducti=it of "lass
Thermal interfaces,
characteriation
6 Photonic
%ubstrates
#rof. G$ Chang
! 'lass Photonics
:andwidth (eond
TS
#rof. Stephen !alph
2pto -lectronic Mg
Mf". processes
Photonic structures
6 -lectronic
%ubstrates
Dr. (en)y Sun&ara
'lass %ubstrates
3D -lass su(strate
;0m Pitch
.4D -lass su(2
strate 0m pitch
#rof. C.#. *ong
Pol+mer Materials
6i"h Temp.
Moldin" compounds
Dr. "uhan Liu
:!Ls
N m litho"raph
N $m micro=ia
;2$ laer RD8
02;0m pitch
6 /unctional
Components
Dr. #.M. !a+
! "P3C /unctionalComponents
3D Passi=e &
acti=es in less than
00m
Dr. iani Shara
! "P3C Po#erModules
Capacitors and
inductors
Dr. 'un)i Min
! "P3C :/ Modules
Diple
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-T 5PPR'5C6 T' S7STEM
SC589-
Research
ndustr Colla(oration
Education
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Education Strate"
!isciplinar+-ducation
Packaging -ducation
"nter.disciplinar+4
%+stem-ducation
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Education Strate"
8S Desi"n Semiconductor De=ices Microwa=e Desi"n *ireless C Desi"n
5nalo" Electronics 9anoscale De=ices -i"ascale nte"ration MEMS Radar and EM Sensin" 'ptoelectronics Hinite2Element Hunctional Materials Electro 'ptics 9anomaterials and Structures
Pac!a"in" Desi"n Pac!a"e Su(strates Pac!a"in" 5ssem(l Sstem Pac!a"in"
EM Pac!a"in" 6ands2on Su(strate
Ha(rication 6ands2on 5ssem(l :ioelectronics Power Electronics
!isciplinar+ -ducation Packaging and%+stem Le