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A G u i d e t o S w i t c h c o n S i d e r At i o n S | b y S i g n a l T y p e

A g r e A t e r m e A s u r e o f c o n f i d e n c

w w w . k e i t h l e y . c o m

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y o u r g u i d e T o C r e aT i n g h i G h P e r f o r m A n c e S w i t c h i n G A P P l i c A t i o n S w w w . k

Q u e S t i o n S ? | Q u o t e ? | c o n t A c t u S n o w a g r e a T e r m e a S u r e o f C o n f i d e n

introductionTo design a test system that meets your requirements for accuracy and

precision, you need to select appropriate instruments, apply c reativity indesigning test methods, and pay careful attention to specications and error terms. Most test system applications are complex enough that it is in thedesigner’s best interest to minimize the number of uncontrolled variables. To

accomplish this, the system switch performance should be tightly specied.

Special consideration should be given to tests that approach the specied

limits of accuracy, resolution, or sensitivity of the measurement or sourcing instruments. These generally represent the “most critical test requirements,” and switching sh ould be selected to suppo rt these tests. An app licationdesigned to perform against the “most critical test requirements” will usually

satisfy other test requirements as well.

The applications outlined in this e-handbook offer a good overview of many of the types of test automation challenges you may face.

bAttery teStinGbtts s y xg vty cs stcts. Th tstg qts tycy th chsty,size, specic use, and whether the cells are primary or secondary.

Scy (chg) tts cy tst sg schg chg cycg. Th schg chctstcs scy tty vtt t t th tty’s ccty . Chgg/schgg

tty t tks sv hs, s t s sy s t cct svtts ss t chg schg th stsy. Thvtg ch tty c t g chgg schgg sga two-pole scanner.

In some applications, it may be desirable to measure each cell voltage, both withand without a load. Monitoring the voltage decay over time will give an indication c qty. Wh ths s tcy t y cs, ths tchq cs s scy cs. usg sc ks t ss t tth vtg cy sv cs t t.

The following paragraphs describe the switch congurations for both the charge/ schg cycg tst th vtg tg tst.

Switching ConfgurationsFigure 1 illustrates the switch conguration for charging/discharging a stringof cells connected in series. In this conguration, a series string of 40 cells isconnected to a current source (Model 2400 SourceMeter® Instrument), whichchgs/schgs th cs. a st vtg st sttmonitors the individual battery voltages through a switch. (Note: In thisapplication, the Model 2400 cannot be used for both current sourcing andvoltage measurement, because it is limited to a 5V difference between the input/ tt Hi ss Hi ts.)

In this particular example, the current source is supplying ±10mA to all 40 cellsstsy, s th cs c th chg schg t th stime. The Model 2700 Multimeter/Data Acquisition System, equipped with aModel 7702 40-Channel Differential Multiplexer Module, is used to switch ands th vtg ch c. ech c hs vtg 1.2V, s th ttvoltage across the string of cells is 48V. It is important to ensure that the totalc vtg css th stg s t xc th c vtg tgand the maximum voltage level of the switch module.

Ch. 1 1.2V

Ch. 2 1.2V

Ch. 40 1.2V

Voltmeter

HI LO

Model 2700/ 7702Multimeter/Data Acquisition System

2400CurrentSource

HI

LO

10mA

Charging

Discharging

Figure 1. Charging/discharging multiple batteries in series


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To avoid damage to relays, synchronizing the switch/measure sequence properlys ctc. it s tcy tt t k ct th chs before closing a particular channel. Inadvertently closing multiple channels willshort two or more cells and may damage the relays. Adding a current limitingresistor or fuse in series with each switch will help prevent this type of damage.

T t th vtg cy ss stg cs, ssts st switched across individual cells. Figure 2 illustrates a switching system fortesting 80 primary cells. In this example, there are two sets of switches: one setof two-pole switches (two Model 7702 modules) is used to connect the cells to

the voltmeter, and one set of isolated switches (two Model 7705 40-ChannelCt ms) s s t cct th ssts (rl).

If the load resistor was connected directly across the voltmeter input terminals,the current through the relay contacts would cause a voltage drop and themeasured cell voltage would be in error. This error is eliminated if isolated relaysare used to switch the load resistors to each cell. The Model 7705 module has 40isolated relays. In addition, these extra isolated relays will allow the load resistorst cct scct ch c t y t g th tst cyc.

Ch. 1 B1

Voltmeter

HI LO

Model 2750 Multimeter/Switch System

with two Model 7702 and two Model 7705 Modules

RL

Ch. 81

Ch. 2 B2

RL

Ch. 82

Ch. 80 B80

RL

Ch. 160

Figure 2. Using isolated relays to switch load resistors to batteries

wa exp ffeAtured reSourceSn Optimizing a Switch System for

Mixed Signal Testing

n Understanding the Basics ofSwitching Systems

n Get a Quote or

More Information

AdditionAlreSourceSn Model 2400 SourceMeter Prod

n Model 2700 Multimeter/Data ASystem

n Model 7702 40-channel DifferMultiplexer Module

n Model 7705 40-channel, SinglControl Module

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cAPAcitor leAkAGe meASurementSCcts sst cts s ctcy vy ty ctcqt. lkg sstc s th y ctc chctstcstst ccts. Th kg sstc, t t s “ir” (stresistance), is expressed in megohm-microfarads. In other cases, the leakagey xss s kg ct t gv vtg, sy th tgvtg.

Capacitor leakage is measured by applying a xed voltage to the capacitor andmeasuring the resulting current. The leakage current will decay exponentiallyover time, so it is necessary to apply the voltage for a known period of time (thesk t) sg th ct.

f sttstc ss, qtty ccts st tst t cuseful data. An automated switching system is required to make performingths tsts ctc.

Switching ConfgurationFigure 3 stts cct kg tst syst tht ss th m 6517bElectrometer/Source, Model 7158 Low Current Scanner Cards, and a Form CSwitch Card, such as the Model 7111-S. The cards are installed in a Model 7002Switch Mainframe.

In this test system, one set of switches (on the Model 7111-S) is used to applyth tst vtg t ch cct. i th y cs st, thcapacitor is connected to circuit LO. When the switch is actuated, the capacitor

is connected to the voltage source. Switch actuation is usually staggered (forexample, two seconds apart) so that each capacitor may be charged for thes t ts kg s s. i th x tst vtgis 110V or less, the Model 7111-S card may be used. If voltages greater than110V must be applied, use an appropriately rated switch.

A second set of switches (on the Model 7158) connects each capacitor to thect t st sk . nt tht th cct sswitched to the picoammeter, the capacitor is connected to circuit LO. Thisallows the leakage current to ow continuously while it is being charged up.

Figure 3. Capacitor leakage test system

Diode

6517B Electrometer/Source pA

Output Output

R

7111-S Form C Switch Card 7158 Low Current Card

R

R

C

C

C

HI

LO













5



f ths ct, sg stt vs th th vtg scg the low current measurement functions. The Model 6517B is particularly useful ths ct cs t c sy th sstc kg ctand will source up to 1000VDC.

at th ccts hv tst, th vtg sc sh st t z;some time must be allowed for the capacitors to discharge before they areremoved from the test xture. Note that in Figure 3 the capacitors (C) have schg th thgh th y cs ctct th ys. Th tstsequence is summarized by:

1. Quiescent state - Model 7111-S relays are normally closed and Model 7158ys y cs.

2. Source voltage (soak time) - Model 7111-S relays go to normally open andModel 7158 relays remain normally closed.

3. Measure current - Model 7111-S relays remain normally open and Model7158 relays go to normally open.

4. Discharge capacitors - Model 7111-S relays go to normally closed andModel 7158 relays go to normally closed.

Since the switches on the Model 7111-S Form C Switch Card remain energizedg th st ct, y st ct th c s vtt th st.

The resist or (R), whic h is in serie s with each capaci tor, is an impo rtan tct ths tst syst. it ts th chgg ct ch cctand also protects the relays in case a capacitor becomes short-circuited. Also,th sst ts th aC g th ck t. i g, s thsc cctc css, th s g s css. Th sst tsthis gain to a nite value. A reasonable value is one that results in an RC timeconstant from 0.5 to two seconds. The forward-biased diode in series with theHi ctt (a) t s svs t t th aC g.

A triax-to-BNC adapter (Model 7078-TRX-BNC) is used to connect the Model6517B to the Model 7158 card. The capacitors are connected to the Model 7158cards using low noise coax cables. Insulated wires can be used to connect theModel 7111-S card to the capacitors.

wa exp ffeAtured reSourceSn Capacitor Leakage Measurements

6517A Electrometer

n TestPoint Program to MeasureCapacitor Leakage with6517A/B

n Get a Quote or More

Information

AdditionAl reSourceSn Model 6517B Electrometer/Hi

Resistance Meter

n Model 7002 400-Channel SwitMainframe

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continuity teStinGCtty chcks tycy vty vcs, cgc sss, t cct s, ccts, t s thscomponents have a continuous path where desired. When setting up acontinuity test, the engineer must specify the maximum resistance at whichth vc s cs t v. f x, y s sstc 1Ω or less would indicate a good device. Continuity checks require measuringlow resistance, so a four-wire ohmmeter is normally used to eliminate lead andswitch resistance from the measurement.

a st sstc st sst c tst s t addition to the continuity test. In particular, a multi-conductor cable requiresch cct t v cts th t th th; t sqs ch cct t st th ccts.

Given that continuity testing often involves multi-conductor devices, a switchsyst s s t cct th ht t ch cct ttcy.

Switching ConfgurationFigure 4 illustrates a typical continuity test circuit. Two banks of two-pole switches are used to make four-wire resistance measurements on 20conductors. To measure the resistance of Conductor 1 using the Model 2700Multimeter/Data Acquisition System in the four-wire ohms mode, close Ch. 1.In the four-wire ohms mode, this will automatically close Ch. 21 as well. This ist ch cct.

To measure 20 conductors, a Model 2700 with one Model 7702 40-ChannelDifferential Multiplexer Module is required. Use a Model 2750 Multimeter/SwitchSystem with multiple Model 7702 modules if more than 40 conductors must betst t t.

Ch. 1

Ch. 2

Ch. 20

HI Sense

Ohmmeter

Ch. 21

Ch. 22

Ch. 40

Conductor 1

Conductor 2

Conductor 20

LO Sense

HI Source

LO Source

Model 2700/7702 Multimeter/Data Acquisition System

Figure 4. Continuity test system













7



inSulAtion reSiStAnce teStinG Th dC st sstc (ir) s th t the DC voltage applied between two conductorsst y st t th tt ctflowing between the two conductors. The testvoltage is applied for a specied period of time th stg ct s s. Ths ct s sy qt s, s ct ctt s t q t

k th st.Sts th st sstc ss s y t t tht t s gtth sc v. f x,any resistance value greater than 10MΩ may cs cct. Th cccy thst s t ctc; t s y tttht th s sstc gt th specied value. Examples of insulation resistancests c sg th thbetween traces on a printed circuit board orthe resistance between conductors in a multi-cct c. ir sts t vvmultiple conductors, so a switching system isoften required to switch the picoammeter and the

sc t th ccts th tst cct. The design and type of switchi ng cards used ir tst syst sv cts,cg th tst vtg, gt sstc,accuracy, common connection, etc. The followingsection describes two IR test systems.

Switch cards appropriate for high impedancevoltage switching include the Models 7158 and6522. A card with triax connections is necessaryif the guard voltage could exceed 30VDC. Thisct s cssy t s sty.

Switching ConfgurationFigure 5 stts tst syst sgth ir y t t

cct t th ts sg thModel 7111-S 40-Channel Form C SwitchCard in a Model 7001 Switch Mainframe.

In the de-energized position, the voltagesc s cct t s tst.Wh y gv ch s sct, thkg ct tht t th sis measured. The Model 7111-S card has<100pA specied offset current. With a testvoltage of 100V, this represents a leakageresistance of 1TΩ. This system in a practical

cct c sy tct kg sstcsof greater than 10GΩ.

Figure 6 shows a system that allows applyingth tst vtg t tswhile the current is measured from one ormore terminals. Note that there are twoindependent groups of switches connectedt ch t. o g ccts th tstvoltage to the terminals while the other groupss th kg ct. Th, thir c tst y t t yother or all terminals. Note that all switcheswill be exposed to the test voltage at somet th tst cyc. Th, th gsof switches must be able to withstand the

s tst vtg sh hv gchannel-to-channel isolation to preventgt th s sg.

i fg 6, ir c s t tvyhigh voltage (up to 300V) using Model 3740,a 28-channel isolated Form C switch card. The Model 3740 is used in the Model 3706A . Th Com t s j all Form C relays that will be used to changethe conguration from switch to multiplex. Tomeasure the insulation resistance betweens 1 2, cs Chs 1 22.

Th ssts (r) t th c hgg ctthgh th ys. Ths ssts ccty st js th cs t

z c cctc chg discharge current. A typical R value is 100kΩ.

Figure 5. Testing IR from any one terminal of a multipin connector to all others

Ch. 1

7111-S 40-Channel Form C Switch Card

Ch. 2

Ch. 40

VoltageSource

OutputHI LO

1

2

40

Terminalsof

Multi-pinConnector

6517BElectrometer/Source or

6487Picoammeter/Source

pA

HI

LO

6517B Electrometer/Source

3740 #120-Channel Form C

Switch Card


Switch Card

Ch 1R

Ch 20R

Ch 2R

Ch 21 R

Ch 40 R

Ch 22 R

1

2

20

Output Output

pAHI

LO

R typical value is 100kΩ

Figure 6. Testing IR between any two terminals













8



S t vcs q sg th th sstc cttythrough each conductor (a low resistance) and measuring the insulationresistance between the conductors (a very high resistance). This test systemrequires switching and measuring both low resistance (<1Ω) and very highresistance (>109Ω).

Ths tst syst y s vty vcs, sch s ccts,switches, multiple conductor cables, and printed circuit boards.

Switching ConfgurationFigure 7 stts c ctty ir syst tstg tconductors using a four-wire DMM or SourceMeter instrument. The resistancesR1 through R20 represent the conductor resistances. To measure conductorsstc r1, cs Chs. 1 21. Th sstcs r r stleakage resistance between conductors. The leakage resistance can bemeasured between any two or more conductors. To measure leakage resistanceRa, close Channels 1 and 22. This is essentially the leakage resistance betweenccts 1 2, gv tht r s ch gt th r1.

A single Mod el 2700m t t / d t ac q s t Sy st with a Model 770240-Channel Differentialmt x c

used to test up to 20ccts. a sgModel 3706A with aModel 3722 card can s t tst t48 conductors. A fullyloaded Model 3706A with six Model 3722cs c tst t288 channels. Whensg th kgresistance with a DMM,th x vtg s sy ss th 15V. as, th x s sstc susually not greater than 100MΩ. To test the IR at a specied test voltage, use a

test conguration such as the Model 2400 SourceMeter instrument with Model7011 Quad 1×10 Multiplexer Cards in a Model 7001 or 7002 Switch Mainframe.

i hgh tst vtg s q hgh kg sstc st measured, the circuit in Figure 8 may be used. In this diagram, two Model 7154High Voltage Scanner Cards are used to switch a Model 2410 SourceMeterinstrument and Model 2010 Digital Multimeter to eight conductors. This systemcan measure conductor resistances as low as 0.1mΩ and leakage resistancesas high as 300GΩ with a test voltage as high as 1000V. Note that the Model2410 and Model 2010 are not connected to the card outputs, but are connectedto specic channels of the scanner cards. The outputs of the cards are only

s t x th syst t s g ccts. Tmeasure the resistance of R1, close Chs. 1, 10, 11, and 20. This will connectthe Model 2010 across R1. To measure Ra, the leakage resistance between R1and R2, close Chs. 1, 9, 12, and 19. This will connect the Model 2410 across thekg sstc (r).

combininG continuity And inSulAtion reSiStAnce teStinG



Switch Card


Switch Card

Ch 1R

Ch 20R

Ch 2R

Ch 21 R

Ch 40 R

Ch 22 R

1

2

20

Output Output

pAHI

LO

R typical value is 100kΩ

Figure 7. Continuity and IR test system

Ch. 1

R1

1 1´ Ch. 11

Ch. 3

R3

3 2´ Ch. 13

Ch. 8

R9

8 8´ Ch. 18

2410SourceMeter

Output(not used exceptfor expansion)

HILO

Rb

Rc

Ch. 2

R2

2 2´ Ch. 12

Ra

Ch. 9 Ch. 19

2010DMM

HIHI

Ch. 10 Ch. 20

Output(not used exceptfor expansion)

LOLO

SenseSource

7154 High Voltage Card #1 7154 High Voltage Card #2

Figure 8. Expanded range continuity/IR system

wa exp ffeAtured reSourceSn Solutions for Production Testing o

n Optimizing Switch/Read Rates witDMMs and 7001/7002 Switch Syst

n TestPoint Example to MeasureInsulation Resistance with 65

n Get a Quote or More Informa

AdditionAl reSourceSn Integra Series Integrated

Multimeter/Data Acquisition S

n Series 3700A System Switch/Quick Start Guide

n Series 3700A System Switch/and Plug-In Cards

n Series 2000 High-PerformancDigital Multimeters

n Series 2400 SourceMeter Line





























































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pt cct s (pCbs) s st ctc cts. i pCb hslow insulation resistance (IR), it can degrade the performance of the circuits onth csy. fcts tht ct th sc sstc th c th t, th sc ctgs sch s s skg c ctgs, css. Tt tv htyc s ct th sc sstc.

T tst th st sstc, s c tst tts c cs

created on printed circuit boards. The resistance typically ranges from 107

Ωto 1016Ω and is measured with a picoammeter and voltage source. The testcs sy hv sv ts, s tst systs c scs tswitch the picoammeter and the voltage source to the terminals.

Switching ConfgurationsFigure 9 outlines a system to test a single ve-terminal (“W”) test pattern. Inthis circuit, the Model 7011 Quad 1×10 Multiplexer Card is used to connect thevoltage source to terminals 1 and 5 together or to terminal 3. The Model 7158Low Current Switch Card is used to connect the electrometer to terminal 2 or 4.

At the start of the measurement, close Ch. 1. After a specied “soak” time,energize Ch. 41 and measure the current. The ratio of the applied voltageto the measured current is the resistance between terminals 1 and 2. Next,de-energize Ch. 41 and energize Ch. 42 to measure the insulation resistancebetween terminals 5 and 4. Note that the path from 5 to 4 already has beens. n t sk t s , s t c s ty.De-energize Ch. 42, then open Ch. 1 and close Ch. 2 to apply the test voltageto terminal 3. The 1MΩ resistor located at Ch. 1 will discharge the voltageat terminals 1 and 5, so it will not interfere with subsequent measurements. After the specied soak time, energize Ch. 41 again to measure the resistancebetween terminals 3 and 2. De-energize Ch. 41 and energize Ch. 42 to measurethe resistance between terminals 3 and 4, which already has been biased.

Note that when none of the channels on the Model 7158 card are energized,terminals 2 and 4 are connected to the LO of the picoammeter (pA), whichelectrically is the guard terminal. This guard connection will prevent leakagecurrent from de-energized channels from interfering with the measurement.

Five “W” patterns can be tested as described using one Model 7011 card andone Model 7158 card. Model 7111 Form C Switch Cards can be used in placeof the Model 7011 card. If this card is used, de-energizing a channel will connect

the terminal to circuit LO rather than the voltage source. This will eliminate theneed for the 1MΩ resistors. When using either the Model 7011 or 7111 Cards,the test voltage cannot exceed 110V.

inSulAtion reSiStAnce teStinG of Printed circuit boArdS

Ch. 1100kΩ

7011 Quad 1×10Multiplexer Card

7158 Low CurrentScanner Card

HI

LO

VoltageSource

Equivalent circuit of“W” pattern test coupon


1MΩ

Ch. 2100kΩ

1MΩ

1

2

3

4

5

pA

Output

Output

Ch. 41

Ch. 42

Figure 9. System to test the insulation resistance of one test coupon














10



The 100kΩ resistors are used to limit the available current i n the event of ashort-circuited test coupon. Choose current limiting resistors that are no morethan 10% of the lowest measured resistance.

Figure 10 shows a circuit to test a coupon with ten two-terminal leakage paths.Each coupon can be thought of as a bank of isolated resistors (R1, R2, R3, R4,tc.). ech sst qs vtg ch ct ch. ThModel 7158 card connects the electrometer or picoammeter to one end of eachresistor, while the Model 7111-S 40-Channel Form C Switch Card connects thevtg sc t th th ch sst.

To test resistor R1, rst energize Ch. 1 to bias the test coupon. After a specied“sk” , gz Ch. 21 t s th stg ct. Ct thscss th g sstcs.

Note that when the channels are de-energized, the corresponding resistor terminals are connected to circuit LO, allowing any charge across the

resistances to be dissipated when the resistance is not being measured.

Th ct tg ssts (r) tct th sc cs g thtst c vs sht cct.

Low noise coax cables should be used between the test coupons and theModel 7158 cards to avoid noise currents.

7158Low Current Card

Ch. 1

7111-S 40-ChannelForm C Switch Card

HI

LO

6517B Electrometer/Source pA

R1RCh. 21

Ch. 2R2R

Ch. 22

Ch. 10R10R

Ch. 30

.

.

.

TestCoupon

Output Output

Figure 10. Circuit to test a single ten-resistor coupon

wa exp ffeAtured reSourceSn Improving the Repeatability of Ultr

Resistance and ResistivityMeasurements

n TestPoint Example to MeasureSurface Insulation Resistancewith 6517A/B

n Get a Quote or More

Information

AdditionAl reSourceSn High Resistance Measuremen

Keith28775ACleve(440) Fax: (4www















































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contAct reSiStAnceContact resistance is the resistance to current ow through a closed pair of ctcts. Ths tys sts cts sch sconnectors, relays, and switches. This resistance is normally very small, rangingfrom micro-ohms to a few milliohms, so a four-wire measurement method isused. Programmable scanners greatly reduce measurement time by switchingone set of test instruments to multiple contacts, such as when testing multi-terminal connectors or when testing many contacts automatically in anvt ch.

Switching Confgurations as Figure 11 shows, all four terminals of the ohmmeter are switched in order toprevent the test lead, path, and switch contact resistances from being addedt th st. nt th Hi lo Sc ts cctto one set of two-pole switches, while the HI and LO Sense terminals areconnected to another set of two-pole switches. To measure the resistance of Contact 1, close both Chs. 1 and 21, then measure the resistance with theht. T s Ctct 2, Chs. 1 21, cs Chs. 2 22,

th s th sstc g. A Model 3706A System Switch/Multimeter can be used to measure the contactresistance because it can measure resistances less than 1mΩ and offers offsetcst y cct tstg cts.

Contact #1

Ch. 1 Ch. 31

Contact #2

Ch. 2 Ch. 32

Contact #30

Ch. 30 Ch. 60

.

.

.

Ohmmeter

HI

Source

LO

Sense

HI

LO

3706A/3 720 System Switch/Multimeter

Figure 11. Measuring resistance of 30 contacts

Ch. 1

Ohmmeter

HI

Source

LO

Sense

HI

LO

Ch. 2

Ch. 40

Contact PinandMating Sleeve

3706A/3721 System Switch/Multimeter

Figure 12. Measuring 96 contacts with a common terminal














12



Contacts used in low level applications are often tested under dry circuitconditions, in which current and voltages are limited to levels that cannotcs chgs th hysc ctc ct th ctct jct.In general, a dry circuit is one in which the open circuit voltage is low, usually20mV or less, and the short circuit current is limited to 100mA or less.

In some cases, the number of switches required may be reduced by half byconnecting the samples in a unique series manner, as shown in Figure 12. iths x, th ctct s cct ss ch th tgsleeves is connected to a two-pole switch. In this case, a Model 3706A System

Switch/Multimeter is congured with a Model 3721 Dual 1×20 Multiplexer Cardand can test up to 40 contacts. Up to 240 contacts can be tested using sixModel 3721 modules in one Model 3706A mainframe.

Figure 13 illustrates a high-performance contact resistance system formeasuring very low resistances (μΩ) at relatively low currents (<100μA). Inthis system, a Model 6220 or 6221 Current Source outputs the test currentand a Model 2182A Nanovoltmeter measures the voltage drop across eachcontact. Both the Model 2182A and the Model 622x are switched to eachcontact using a Model 7011 40-Channel Multiplexer Card. The Model 622x has g vtg cc t, s ths syst c s y ccttstg cts.

Twenty contacts can be switched using one Model 7011 card and one Model7001 Switch Mainframe. The Model 7011 card is congured into two 20-channelbanks. Two relays can be simultaneously opened or closed automatically byusing the mainframe’s four-pole switch mode.

Ch. 1 Ch. 21

Ch. 2 Ch. 22

Ch. 20 Ch. 40

.

.

.

622xCurrent Source

2182ANanovoltmeter

7011Bank A&B

7011Bank C&D

OutputOutput

Figure 13. High performance contact resistance system

wa exp ffeAtured reSourceSn Accurate Low-Resistance

Measurements Start withIdentifying Sources of Error

n Techniques for ReducingResistance MeasurementUncertainty: DC CurrentReversals vs. Classic Offset

Compensationn Get a Quote or More

Information

AdditionAl reSourceSn Model 2182A Nanovoltmeter

n Model 6220 DC Current Sourc6221 AC and DC Current Sour

K28C(4Faw

WP

Keithley Instruments, Inc.28775 Aurora RoadCleveland, Ohio 44139(440) 248-0400Fax: (440) 248-6168www.keithley.com

y o u r g u i d e T o C r e aT i n g h i G h P e r f o r m A n c e S w i t c h i n G A P P l i c A t i o n S w w w k



































































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temPerAture ScAnninG Tt s th st cy s hysc ts. Tt s t t t sv cts, s sc s qto switch the measuring instrument to multiple sensors. The type of measuringstt sc c s s th ty tt ssy. Th c ss tys thcs, t rTds,and thermistors. When deciding which temperature sensor to use, keep inmind that the thermocouple is the most versatile, the four-wire RTD is the mostcct, th thst s th st sstv. Th s ths sss sdiscussed in the following switching congurations.

Switching Confgurations

Thermocouples Thermoc ouples are the most w idely used temperature sensors. They cancover a wide temperature range and provide a robust, reliable sensor. Themeasured thermocouple voltage is related to the difference between theunknown temperature and a reference temperature. This reference temperatures t th c jct c (CJr). Wh thcsare to be switched, the reference temperature may be obtained from aninternal reference junction located on the switch card, a simulated referencett, xt c jct. Th chc c jctis limited by the choice of switch card and by the method of cold junctioncst t y th sg stt.

Built-In (Internal) Reference Junction. Ths s th st cvt th t

use if the switch card includes the temperature reference. This reference junctionis built into the switch module and uses a thermistor, a solid-state sensor, orother type of temperature sensor. Switch modules with built-in CJRs includethe Models 7700, 7706, and 7708 modules for the Model 2700/2701/2750Multimeter/ Data Acquisition/Switch Systems. Switch modules with built-inCJCs include Models 3720 and 3721 for the Model 3706A mainframe, with theCJC located on each module’s screw terminal accessory (3720-ST and 3721-ST respectively). The Model 2001-TCSCAN 9-Channel Thermocouple ScannerCard for the Models 2000, 2001, 2002, and 2010 DMMs also has a built-in CJR.

Figure 14 shows multiple thermocouples connected to the Model 3706A with aModel 3720 Dual 1×20 Multiplexer Card installed. The Model 3720 has severalsttgcy c c jct cs t t th jct ttson the screw terminal card. When the temperature of thermocouple T1 is to bemeasured, the meter rst measures the nearby CJR. When Ch. 1 is closed, thevtg thc T1 s s th tt g t th

thermocouple is calculated. The Model 2700 with a Model 7700 card can also s ths ct.

As an alternative to using multiple CJRs, some switch cards employ an on-boardsth ck t k th cct ts t th s tt. The Model 2001-TCSCAN Thermocouple Scanner Card has isothermal blocks.

Simulated Reference Temperature. i ths cs, th s ts ttv tht xts th tt t th t ts th dmm. Thdmm ss ths st c tt cctg th ttt th thc. Th st c tt tchq cbe used with the Models 2000, 2001, 2002, 2010, 2700, 2701, 2750, and3706A. The accuracy of the measurements will depend on the accuracy of thest tt. i th t tt chgs, th th cccyof the thermocouple measurements will be degraded.

o th sg st c tt s t t thapproximate temperature at the location where the thermocouples areconnected to the switch card. The reference temperature used shouldreect the effects of instrument self-heating, not simply the room’s ambienttt. Figure 15 stts th s ths th. i ths cs, thtemperature reference is at the Model 7702 40-Channel Differential Multiplexer

m’s t ts; th, th s st t st gss thtemperature at these input terminals of the switch module. This is the leastaccurate way to make temperature measurements, because it requires the usert xt th c tt s t cct chgs

Ch. 2

Ch. 40

Ch. 1

3706A/3721 System Switch/Multimeter

Ref. Ch.

ColdJunction

ReferenceX6

T1

T2

T40

.

.

.

.

.

.

Voltmeter

Figure 14. Using the internal reference junction of the Model 3706A/3721

y o u r g u i d e T o C r e aT i n g h i G h P e r f o r m A n c e S w i t c h i n G A P P l i c A t i o n S w w w k















14



th t tt th gts css th c. it s stfor measurements with relative accuracy but not absolute accuracy. However,this method is the least expensive because a general-purpose switch card or c s.

Figure 16 stts th s c t s th c tt. i thsexample, a second thermocouple in an ice bath is connected in series back-to-back with each measurement thermocouple. Using this ice point reference is

usually the most accurate way to make temperature measurements with ther-cs. T s th vtg thc T1, cs Ch. 1. Th -sured voltage is proportional to the temperature T1 with a reference of 0°C. If ameter such as the Model 2700/7702 is being used, simply enter this 0°C refer-ence in the meter as the simulated reference temperature. The Model 2700 willth ttcy cct th tt T1 s th s vtg.

External Reference Junction. For switching modules that do not have built-inreference junctions, a thermistor or four-wire RTD can be used to acquire thereference temperature, such as with the Model 2700, 2701, 2750, or 3706A. Inthis case, a thermistor is connected to Ch. 1 or a four-wire RTD is connected toCh. 1 ts ch.Figure 17 shows an example of a thermistor useds th xt tt ss. T s th c jct tt,close Ch. 1. The Model 2700, 2701, 2750, or 3706A automatically measuresth thst sstc ccts th tt t th ss. Thstt g s s y th stt s th c tt

ssqt thc sts. Th thst rTd sh st th ts th chsg s thc tt sts. Th s

this temperature sensor should be insulated to prevent contact with otherccts th .

The accuracy of this method depends on how closely coupled the temperature

ss s t th thc ts.

Ch. 2

Ch. 40

Ch. 1

2700/7700 Multimeter Data Acquisition System

T1

T2

T40

.

.

.

.

.

.

DMM

A

B

A

B

A

B

A

A

A

A

A

A

B A B A B A

0 ϒ C

A and B are dissimilar metalsof the thermocouple

Figure 16. Using “back-to-back” thermocouples and a 0°C reference temperature

Ch. 2

Ch. 40

Ch. 1

2700/ 7702 Multimeter/Data Acquisition S ystem

T1

T2

T40

.

.

.

.

.

.

DMM

Figure 15. Using simulated reference temperature with the Mode l 2700/7702

Ch. 2

Ch. 40

Ch. 1

3706A-S/3721 or2700/7702 Multimeter/Data Acquisition System

T1

T39

.

.

.

.

.

.

DMM

RT

Figure 17. Using a thermistor as an external reference junction
















15

w w w . k


Platinum RTDsPlatinum RTDs may be either wire-wound resistors or thin-lm resistors thatexhibit a positive temperature coefcient of about 0.4%/°C.

Platinum RTDs offer excellent long-term stability, high accuracy, and goodtty. uk thcs, rTds t q c jctcompensation. However, RTDs operate over a narrower temperature span,respond more slowly, and are generally more expensive and more fragile thanthcs.

Figure 18 illustrates a system to measure temperature using RTDs. Twenty

RTDs are connected through four-pole switches to a Model 2700 congured asa four-wire ohmmeter. With the Model 2700 and a Model 7702 module, 20 RTDscan be connected and the meter will convert the resistance measurements totemperature automatically. With the Model 3706A and a Model 3721 card, 48rTds c cct s.

Thermistors Thermistors are devic es that exhibit a non- linear change in res istance with chg tt. mst thsts hv gtv ttcoefficient—in other words, as the temperature increases, the resistancecss.

Thsts th st sstv th t t sss c tct vy s chgs tt qcky. Thy g chcwhen measuring very small changes in temperature. The downside of thisincreased sensitivity is a loss of linearity. They are especially non-linear at high

temperatures, so it is best to use them for measurements of less than 100°C.

Figure 19 ts syst sg tt sg thsts. ntthat a two-wire resistance measurement is adequate, given that thermistors areusually in the kilo-ohm ranges; therefore, switch and lead resistances have littlect th v st. T cvt th sstc st ttt, t s st t s stt tht c cct thst’snon-linearity automatically, such as the Model 2700, 2701, 2750, or 3706A. OneModel 7702 module installed in a Model 2700 can accommodate up to 40thermistors. One Model 3722 card installed in a Model 3706A mainframe canaccommodate up to 96 thermistors.

Ch. 1T1 DMMRTD #1

Ch. 2T2 RTD #2

Ch. 20T20 RTD #20

.

.

.

Source HI

Sense HI

Sense LO

Source LO

3706A-S/3721 Switch Mainframe/Card or2700/7702 Multimeter/Data Acquisition System

Figure 18. Measuring temperature using RTDs

Ch. 1T1 DMM

Ch. 2T2

Ch. 40T40

.

.

.

3706A/3722 Switch Mainframe/Card or2700/7702 Multimeter/Data Acquisition System

Figure 19. Measuring temperature using thermistors

wa exp ffeAtured reSourceSn Understanding Temperature

Measurements (webinar)

n Confgure TemperatureParameters withKeithley’s Model 2700

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n Basics of Temperature Measu

n Basics of Temperature MeasuThermocouples

n Basics of Temperature MeasuThermistors










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16


diode teStinGDiodes are widely used non-linear components. When testing diodes, theelectrical parameters measured include the forward voltage, the reversebreakdown voltage, and the leakage current. These specific tests can bemeasured with a single source-measure instrument. When testing multi-diodedevices, such as pin grid arrays or DIP packages, switching is required toconnect a single source-measure instrument to each individual diode.

Switching ConfgurationsFigure 20 shows an example of testing multiple diodes in a switching system. This conguration can be used for measuring the forward voltage, the reversebreakdown voltage, and the leakage current. This type of system is oftenused for production tests in which performing single point pass/fail DC testson packaged diodes ensures compliance with specications and sorts outctv ts.

In this system, each diode is switched to the Series 2600A System SourceMeterinstrument through two two-pole switches. The Series 2600A instrument cansc s th ct vtg.

T cct th Syst Scmt stt t 1, cs Chs. 1 21. To measure the forward voltage, apply the specied current, then measure theresulting voltage drop. Measure the reverse breakdown voltage by sourcing aspecied reverse current bias, then measuring the voltage drop across the diode. To perform the leakage current test, source a specied reverse voltage, then

s th stg kg ct. rt ths c th s.Note that two two-pole relays are used to connect each diode to the Series

2600A. This is don e to eliminate error from the volt age drop in the lead resistance. (Of fset voltages of the Model 3720 switches can be addressed with the offset-compensated ohms feature of the Series 2600A instrument.)This is particularly important when measuring the forward voltage, becausethe measured voltages are relatively small (hundreds of millivolts) and the

source current may be relatively high (100mA).

For the example in Figure 20, t wo-pole general-purpose cards, suchas the Model 3720 Dual 1×30mtx C, c s.One Model 3720 card will supporttesting up to 30 diodes.

f sg s kgcur rents (<10nA) , use theconguration shown in Figure 21.In this example, the Model 7158Low Current Scanner Card isused to switch ten diodes with ac cth t th m6517b ectt/ Sc.

When measuring the leakage current with this setup, the voltage bias is applied

t th s stsy thgh th y cs ctct chy. Wh tc ch s gz, th kg ct tht will be measured. The current limiting resistor (R) is included to prevent testfailure in the event a diode is short-circuited.

Series 2600ASourceMeter

Ch. 1#1

Ch. 2#2

Ch. 3#3

Ch. 4#4

Ch. 21

Ch. 22

Ch. 23

Ch. 24

HI Source

HI Sense

LO Source

LO Sense

Output Output

4-ElementDiode Array3720 Bank A 3720 Bank B

7158 Low Current Card

HI

LO

6517BElectrometer/Source

pA

RCh. 1

RCh. 2

RCh. 10

..

.

Output

LO HI

R typical value100kΩ

Figure 20. Switching multiple diodes to a Series 2600A SystemSourceMeter instrument

Figure 21. Measuring the leakagecurrent of ten diodes















17


Figure 22 shows a conguration for testing leakage current of diodes using aSc mst ut (Smu) Scmt istt. i ths x,th ott Hi t th Smu s cct t th y ttterminal of the Model 7111-S 40 Channel Form C Switch Card. The Guardt th Smu s cct t th y cs tt t the switch card. The guard voltage is at the same potential as the Output HIt, s th tst vtg s t s t ts thgh thg cct. i th Smu s st stv tt vtg, th swill be reverse biased. The Output LO terminal of the SMU is connected to thec t th s.

7111-S

Output HI

Output LO

SMU orSourceMeterInstrument

A

RCh. 1

RCh. 2

RCh. 40

.

.

.

Output

LO HIR typical value100kΩ

Guard

Figure 22. Using an SMU or SourceMeter Instrument to test the leakagecurrent of diodes

wa exp ffeAtured reSourceSn Diode Production Testing

with Series 2600 SystemSourceMeter ® Instruments

n Diode ProductionTesting with the Series2400 SourceMeter ® Instruments

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AdditionAl reSourceSn Model 3720 Dual 1x30 Multip

n Model 7154 High-Voltage ScaModel 7158 Low Current Scan
























































18


cAPAcitAnce meASurementSCctc sts t vy tht ccts t thct’s sccts. f qty ct ss, g ccts y c vt ch th cctcof each capacitor tested. Multiple switches connect the capacitors to thecctc t.

Test frequency and stray capacitance may impose limitations when switchingcctc. Cctc sts t t hgh qcy(kHz –MHz ranges), so it’s important to choose switches carefully to avoid errors

due to bandwidth limitations. The capacitance introduced to the system by boththe switches and the cable must be corrected for by the LCR meter by using sht cct ct; th, t s tt t t tc lCr t s c g th cssy ccts.

Switching Confgurationsi Figure 23, the Model 7011-S Quad 1×10 Multiplexer Card connects an LCRmeter to a number of unknown capacitors (C1 through C8). For any givencct st, ys, ch k, st cs. Thtts th ks cct t th lCr t’s t ts.

The Model 7011-S card allows making four-wire connections to as many asten capacitors. However, two sets of channels should be used to perform sht ct, s th syst c y tst t ght ccts.Wh g th ct, th Hi Curr Hi poT s st connected together using Ch. 9 of each bank; the LO CURR and LO POT leads

st s cct tgth. Wh g th sht ct, leads are connected together using Ch. 10 of each bank.

The shields of the four coaxial cables connected to the unknown capacitors arecct t ch th. Ths cct sh th cctfor best accuracy. For simplicity, the shields are not shown in Figure 23. Spacelimitations on the Model 7011-S card make it necessary to use sub-miniaturecx cs. Th gth th cx cs chs sh xty th s.

With the Model 7011-S card, the test frequency may be as high as 100kHz. Theminimum unknown capacitance that can be switched with this card is on theorder of 10pF. There is no maximum capacitance other than determined by thec’s x ct tg.

The system shown can be expand ed easi ly by adding more Model 7011-Scards. The backplane of the scanner mainframe will connect the appropriatebanks of each card. Remove any bank-to-bank jumpers from all cards. As moreswitch cards are added to expand the system, the maximum allowable testqcy y cs.

The Model 7011-C version is not recommended for this application because theadded coupling due to this card’s mass-terminated connectors may cause ancct t .

Bank A

Ch. 1

Bank B

C1

Bank C Bank D

Ch. 2 C2

Ch. 8 C8

Ch. 9 OpenCircuit

Ch. 10ShortCircuit

.

.

.

HICURR HIPOT LOPOT LOCURR

LCR Meter

7011-S

Figure 23. Capacitance mea surement using a Model 7011-S card














19


To measure capacitors at 1MHz or higher, an RF switch card, such as the Model7711 2GHz 50Ω RF Module, is essential. The Model 7711 consists of two banksof 1×4 multiplexers. As shown in Figure 24, two Model 7711 modules providefour-terminal connections from a four-terminal capacitance bridge to test up totwo capacitors. One module switches the HI terminals of the bridge, while thesecond module switches the LO terminals.

The second channel of each bank is connected to a jumper to allow short-circuit calibration. When no channels are selected, the rst channel of eachbank, which is normally-closed, is connected to an output port. By connectingcoax cables to all four output ports as shown, an open-circuit calibration can be. ag, t tht ths cs sh th s gth s ths th th chs.

To expand the system and allow testing more capacitors, additional switchingmodules are needed. With two inputs of one bank connected to the outputs of another module, 1×8 multiplexers are possible instead of 1×4 multiplexers. This

system, with a total of six Model 7711 modules, will test up to six capacitors.Similarly, by connecting two modules to yield 1×12 multiplexers, a total of eightmodules will test up to ten capacitors.

Ch. 1

Ch. 2

Ch. 3

Ch. 4

Out A

Ch. 5

Ch. 6

Ch. 7

Ch. 8

Out B Out B

Ch. 16

Ch. 15

Ch. 14

Ch. 13

Out A

Ch. 9

Ch. 10

Ch. 11

Ch. 12

Open

Circuit

Short

Circuit

C1

C2

HIPOT

HICURR

LOCURR

LOPOT

LCR Meter

7711 #12GHz 50Ω RFModule

7711 #22GHz 50Ω RFModule

Bank A

Ch. 1

Bank B

C1

Bank C Bank D

Ch. 2 C2

Ch. 8 C8

Ch. 9 R3

Ch. 10

.

.

.

HICURR

HIPOT

LOPOT

LOCURR

LCR Meter

R2R1

HI

LO

pA

NOTE: All bank-to-bank jumpers must be removed from card.Open-circuit and short-circuit channels are omitted for clarity.

7011-S

Figure 24. High frequency capacitance measurements with twoModel 7711 modules

Figure 25. Me asuring capacitance and leakage current with a Model 7011-S card














20


Figure 25 stts syst tht ss th th cctc kgct ccts. i ths g, t th ct (a) lCr tare connected to the capacitors under test via Chs. 9 and 10, respectively. Theoutput ports on the Model 7011-S card have no connections. However, theoutput ports would be used to increase the total number of capacitors beingtst y g cs.

To measure the leakage current of C1, the c apacitor must rst be polarizedby closing Chs. 1 and 9 of both Banks B and C. This connects the voltagesc css th cct thgh th ct tg sst, r2. atan appropriate “soak” time, close both Ch. 1/Bank A and Ch. 9/Bank A toconnect the picoammeter to the capacitor, then open Ch. 9/Bank B to avoidshort-circuiting the picoammeter. Once the leakage has been measured, thecapacitor should be discharged by rst opening Ch. 9/Bank A and Ch. 9/Bank C. Then close Ch. 9 on Bank B and Bank D, which will place resistor R3 acrosscct C1.

The diode and resistor R1, in series w ith the picoammeter i nput, ser ve twofunctions. First, the resistor will limit the current in case a capacitor becomesshorted. Second, the diode minimizes the picoammeter noise introduced whensg ccts 1f gt. Th s htsstv, s t shbe enclosed with R1 in a light-tight electrostatic shield.

The capacitance of C1 can now be measured by rst opening Ch. 9, Banks Band D, then closing Ch. 10, Banks A through D. This will connect the LCR bridget cct C1. es tht ccts schg cctg thlCr g.

This system is relativel y l ow in cost; however, it has several perfo rmancelimitations:

• The maximum test voltage is 110VDC. It is capable of measuring a leakagecurrent of 1nA with fair accuracy, so it can verify capacitor leakage resistanceof 100V/1nA or 100GΩ.

• The LCR bridge test frequency should be no more than 100kHz.

• The minimum capacitance that can be measured is on the order of 10pF.

wa exp ffeAtured reSourceSn Model 6485 Picoammeter

n Model 6487 Picoammeter/ Voltage Source

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AdditionAl reSourceSn Low Level Measurements Han

n Selector Guide and Data SheeTest Leads, and Probes

•

•

•

•

•

•

•

•

www.keithley.com1.888.KEITHLEY (U.S. only)

S i d e T e x t

L O W L

E V E L M E A S U R E & S O U R C E

M e a s u r e s l o w c u r r e n t s a n d h i g h r e s i s t a n c e s q u i c k l y , a c c u r a t e l y , a n d e c o n o m i c a l l y

• 10fAresolution

• 5½-digitresolution

• <200µV burdenvoltage

• AlternatingVoltage method

ohmsmeasurements• Automated voltage sweepsfor

I-V characterization

• Floatingmeasurementsupto500V

• Upto1000 readings/second

• Built-inModel486 and487emulationmode

• IEEE-488 andRS-232 interfaces

• Analogoutput

• DigitalI/O

apricethaffordabl

LowVo WhileDMbackpico voltagebtheModmeasure

Succe

TheModoneofKetheModmeasuremeasuresecond.I withbuil Alternat Atime-st videsmintionstatiitpossiblcustomc

Featur•DirecSourc

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• 500V6487 ttheam

6487 Pico



















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21


lt tstg s th st c tys ct tsts thtc h hsts g. Th hsts c vtch sjct t sv tt hty ctsto test their reliability. Depending on the manufacturer’s test specication, thehandset may be powered on or powered off during the test. From these tests,th ty t th c h c stt.

A typi cal lifetime test system inclu des a commun ication analy zer, p owersupplies, a handset controller, audio test instruments, and a DMM. A switching

system makes the necessary connections between the various test instruments th hsts.

Switching ConfgurationsFigure 26 is an overview of a cell phone lifetime test system based on Keithley’sSystem 46 Microwave/RF Switch System. Given that this system must be ableto switch RF signals, audio signals, and DC signals, a variety of switch cards areq.

In this example, high frequency switches are required to connect theccts yz t th hst. Th, th rf c sg srouted by coaxial relays in the System 46 chassis.

A Model 7011 Quad 1×10 Multiplexer Card routes the 20Hz to 20kHz signalss th tstg t th hst. f tstg th quality of the handset, a Model 2015 or 2016 Total Harmonic Distortion (THD)Multimeter allows making quick measurements of a variety of parameters, suchas THD, THD plus noise, and signal-to-noise plus distortion (SINAD).

The hands et under test is powered by the Model 2306 Batter y/ChargerSimulator; power is routed to the handsets by the Model 7053 High CurrentSwitch Card. This card, which has 10 channels and can carry up to 5A, caneasily handle the high current transients that may flow when the phone isswitched from receive mode to transmit mode.

A Model 7020 Digital I/O Interface Card is employed to switch the digital signalss t st th h t vs tg s g tstg. Ths cprovides 40 independent inputs and outputs, so it can be used to control manyhandsets at once. Isolated relays, such as those used in the Model 7013 RelaySwitch Card, can be used to control certain test system requirements, such asth cvy.

AccelerAted lifetime teStinG of cellulAr Phone hAndSetS

System 46

Model 7002containing Models7011, 7111-S, 7020,and 7013 Cards

PASS FAIL

RF

Audio

DigitalControl

ConveyorControl

Pass/FailIndication

701320 isolated Ch

70114-1x10

7111-S4 1x10

702040-Ch Dig I/O

Mobile PhoneTest Fixtures

DC Source

Figure 26. Cell phone test system

wa exp ffeAtured reSourceSn The Basics of Through-the-Air Aud

System Characterization

n Maximizing DMM Productivity in Wireless Device Quality Testing

n RF/Microwave SwitchingSystems Subtleties: Achievingthe Performance You Need

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Multimeters and Models 20166-1/2 Digit Audio Analyzing M

n System 46 RF/Microwave SwChannel, Unterminated























































22


Vertical-cavity surface-emitting lasers (VCSELs) are slowly replacing traditionaledge-emitting lasers, most notably in low-bandwidth and short-haulcommunication systems in which cost is a driving factor. Edge-emitting lasersmust be cut from the wafer and edges polished before testing is possible, but VCSEL manufacturers can test their devices at the wafer level.

Th g ht t s ty (l) c t (i)voltage (V) sweep is a series of sts

VCSels t t th tgchctstcs. Th liV tst vvsg ct thgh th VCSel sg th stg ghtoutput with a photodetector (PD).

Figure 27 stts s tstsystem at the wafer level. TwoModel 2602A System SourceMeterinstruments are used. A wafer probeks th ctc cct tch vc thgh c. Th stt s s t sth tc tct cty v thvcs. Wh th ght th VCSEL shines on the reverse-biased

pd, th kg ct css. Th gt th kg ctcts t th tsty th ghtstkg th ctv g.

Switching Confgurationsi th c c cct t y vcs stsy, th systs t Figure 28 c cstct t tst th vcs ch t thprobe card makes contact with the wafer.

a v VCSel s sct tstg th cs g ys cs th VCSel th pd s t vy th ght tsty. ThSourceMeter instrument rst performs the necessary DC tests, such as forwardvoltage, reverse breakdown voltage, and leakage current. Then it forces sufcientcurrent to light the VCSEL and channel B of the Model 2602A measures theincreased leakage of the PD. Once this testing process is complete, switching

chs th xt vc sct.

Measuring the PDs can be done with either a Model 2602A or 2636A,depending on the current sensitivity required by the test specication. TheModel 2602A is useful for measuring currents to approximately 100pA, whilethe Model 2636A reliably measures currents less than 10fA.

The offset current specication for the Model 3722 Multiplexer Card is <100pA,which may exceed the error budget for the test system. Substituting a Model7158 Low Current Scanner Card will lower the offset value to <1pA. Note thatusing a low current card will decrease the number of available channels in thesystem, since the low current cards only have ten channels for scanning.

VcSel teStinG with triGGer Synchronized Smu inStrumentS

VCSEL

Model 2602A

SourceMeterInstrument

Probes

EmittedLight

Model 2602ASourceMeterInstrument

Wafer

Detector

CH A

CH B

Figure 27. Wafer level testing of VCSELs

VCSEL #1 PD #1

VCSEL #2 PD #2

VCSEL #3 PD #3

VCSEL #n PD #n

Model 3722Model 3722 or

Low Current Mux

Model3706A-S/3722

MainframeBackplane

Model 2602ACH A

Model 2636Aor 6517B

TSP-Link TSP-Link

Figure 28. Testing multiple VCSELs

wa exp ffeAtured reSourceSn High Throughput DC Production

Testing of Laser Diode Modulesand VCSELs with the Model2602 System SourceMeter Instrument

n VCSEL Testingwith the Model

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Instrument

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Number2273

VCSELTestingwitModel2400Sourc

IntroductionTherecent commercialization of vertical-cavity surface-emittinglasers(VCSELs, pronounced “vixsels”) into areassuch asdata

communication, optical interconnectionsand memory,sensors,printers,etc.hasled to explosivegrowth in production capacity.For many applications,VCSELsareslowly replacing traditional

edge-emitting lasers, most notably in low-bandwidth and short-haul communication systemsin which cost isadriving factor.

VCSELmanufacturershavetheopportunity to test their

devicesat thewafer level. Thisisin contrast with Fabry-Perot,Bragg,and distributed feedback (DFB) lasers.Edge-emittinglaserslikethesemust becut from thewafer and theedgespol-

ished beforetesting ispossible. Thisincreasesproduction costssignificantly becausethemoney spent in preparing thedevicefortesting hasbeen wasted if thedeviceultimately turnsout to bedefective. Theability to test VCSELsbeforethey arecut from

thewafer eliminatestheneed to continueto expend resourcesonbad devices.

Other advantagesof VCSELsincludetheir high reliabilityand thefact that they requiremuch lesscurrent to operatethanedge-emitting lasers. Thelight pattern emitted from thesurfaceof theVCSELiscircular,rather than theelliptical pattern pro-

duced by edge-emitting lasers.Thissubtledifferencein outputallowsfor moreefficient coupling of VCSELsto round fiber-opticcables.Asshown in Figure1,VCSELsareformed withmany layersof indium-gallium arsenide(InGaAs) to emit at the

red, near IR, and IRwavelength regions. They arecompatiblewith low-cost silicon,germanium,and InGaAsphotodetectors(PD). Thebasicstructureof aVCSELconsistsof athin active

region sandwiched between two highly reflectivedistributedBragg reflectors(DBR).

Figure1. ASimplified VCSELStructure(Source: Kartalopoulos).

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23


Switching power supplies are commonly used in telecommunications, desktopcomputing, and network server hardware; although these supplies are relativelyxsv, thy st tst gsy cy t t hgh v ct qty.

Hghy cct stss scg (HaSS) “ ” s c ctstep for switching power supplies. Extended environmental test is performed tos th ss ct t ct y v th cs th vs. Typically, manufacturers age and monitor thousands of power supplies at once.

Perhaps the most signicant challenge involved in designing this type of testsystem is dealing with the high number of channels the system must monitorstsy.

Several parameters are typically measured as part of power supply testing,tcy tt vtg tt. athgh th tt vtg switching power supply may be anywhere from 3V to 48V, the most commontt vtgs 5V, 12V, 15V, th tts sy . a single switching supply could have as many as six outputs. Obviously, testingmultiple switching supplies at once could involve monitoring hundreds of channels. But for purposes of burn-in, only one output is monitored to reduceth hg chs.

Temperatur e measur ement duri ng burn -in usual ly entai ls moni toring thett th sy, sv ts th sy, thg t tt.

The Model 3706A System Switch/Multimeter integrates a 7½-digit multimeterin a single switch matrix enclosure with six rear-panel slots for switching cards,providing an all-in-one switch/read system. This tight integration simplifiesswitching, measurement, and programming. For burn-in applications, theModel 3706A’s DMM can be used to measure voltage and temperature, whilethe switch system can be configured with the appropriate switch cards toaccommodate up to several hundred channels. The Model 3720 dual 1×30multiplexer card with automatic CJC for thermocouples is ideal for the voltageand temperature measurements required for power supply burn-in applications.Figure 29 illustrates a power supply burn-in test system based on the Model3706A and multiple Model 3720 cards.

This system can assign a measurement function to each channel. As Figure 29shows, channels 1–60 are all dedicated to thermocouples (TCs), channels 61through 300 handle DC voltage measurements, and channels 301 to 360, onthe last card, are also dedicated to TCs. The Model 3706A, when congured

with the Model 3720 switch cards, allows switching and measuring up to 120channels per second. A system configured with one Model 3706A and sixModel 3720s can monitor up to 360 channels every few seconds.

For settings with several test system/stations located throughout themanufacturing area, when two or more systems are used simultaneously, theModel 3706A’s LXI Class B compliance offers a variety of advantages. Thet ch syst c tghty sychz th t tth ctg cty’ ct ct thgh th lan/etht tcfor analysis and processing. Features include a 10/100M Base-T Ethernetconnection, graphical Web server, LAN-based instrument triggering, andIEEE-1588 precision time protocol (PTP) synchronization. This synchronization

tchq vs st th t sychz vcs ethtnetwork with microsecond precision for time/event-based programming.

burn-in teStinG for SwitchinG Power SuPPlieS

3706A

GPIB

Ethernet

USB

TC

TC

3720 TC Chans

3720 DCV Chans

3720 DCV Chans

3720 DCV Chans

3720 DCV Chans

3720 TC Chans

PS PS PS PS PS

PS PS PS PS PS

PS PS PS PS PS

PS PS PS PS PS

PC

Figure 29. Power supply burn-in system with 3706A System Switch/Multimeter

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Burn-inTestingTecSwitchingPowerSu

IntroductionOne ofthe consequencesofthe rapidgrowthofthe telecommu-nications,desktop computing, and networkservermarketsisaburgeoning demand forswitchingpowersuppliesandDC-to-DC

converters. While these powersuppliesare typicallyinexpensive,a highlevel ofqualitymust be maintainedthrough carefulproduction testing.

Highly accelerated stressscreening(HASS)or“burn-in”

isa commonproductionstepforswitchingpowersuppliesdesignedforcomputersand servers. Extendedenvironmentaltestingisperformedtoensure the product will continue tofunc-tionproperly overitsentire service life. It isnot uncommontoage and monitorthousandsofpowersuppliesat once.When

designingthistype oftest system, the biggest challenge isdeal-ingwiththe high numberofchannelsthe system must monitorandthe test system surroundings. Large numbersofswitchingpowersuppliescanproduce tremendousamountsofelectricalnoise, whichcan reduce the test system’smeasurement perform-

ance significantly.

TestDescriptionHigh-endpowersuppliesandDC-to-DC converterswith outputsfrom 400Wto 2000Ware commonlyfoundin manytelecom andserverapplications.These devicestypically have fourtosixvolt-age outputsthat must be verified.Output voltagesmayvaryfrom3.3Vto48V,with one output terminal dedicatedto5V. To verify

that the entire powersupply isfunctioningproperly, the manu-factureroftenmonitorsonlythe 5Voutput. Thisimpliesthat allchannelsare measuredduringmanufacture, but forthe purposesofburn-in, onlyone output ismonitoredto reduce the numberof channelsneeded forthe test system. Reducing the numberof

channelsmonitored allowsa test system toaccommodate morepowersuppliesduring the testingcycle, reducingoverall cost.Lessexpensive and lesscomplicated powersuppliesfoundinPCsmayhave uptosix outputs, while poweradaptersforlaptopcomputerswill have one output.Asinthe previouscase, only

one channel ismonitored.The 5Voutput ismonitoredasthetemperature in the environmental burn-inchamberreachestheupperandlowerlimits, andthe powersupply output is repeated-ly cycled on/off.

MonitoringVoltage

Figure 1isa simple schematic ofa test formonitoringthevoltage output ofa powersupply. Adigital multimeter(DMM)

would be connesure the poweremulate the loamaybe chosenstresstesting

Figure 1.Monio

OutputCyc

To stressthe porepeatedlytur

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“ON”Voltage

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24


ActuAtion time. The time between application of the nominal relaycoil voltage and the nal closure of the relay contacts after the contactc tv.

AutomAtic cjc (cold junction comPenSAtion). a syst multi-channel thermocouple measurements where the temperature ateach thermocouple/switch card junction is sensed and compensated ttcy.

bAndwidth. The range of frequencies that can be switched,

conducted, or amplied within certain limits. Under given load condi-tions, bandwidth is dened by the –3dB (half-power) points.

bAnk. A group of relays with a common connection for scanning ortx cts.

blockinG. A multiplexer of matrix arrangement of relays where onlyone signal path is active at any given time. Common in RF/microwavetstg t t th chctstc c th tst syst.

breAk-before-mAke.dscctg th st cct connecting a new circuit. Also known as Break/Make.

cArry current. Th x cts ct cs ycontacts. Most relays are rated higher for carry current than switchedct. (Ht s gt y i2r sss cy ct i2rlosses plus arcing for switched current.)

chAnnel. One of several signal paths on a switching card. For scanner(or multiplex) cards, the channel is used as a switched input in measuringcircuits or as a switched output in sourcing circuits. For switch cards,ch ch’s sg ths t th chs.

chAnnel croSStAlk. Cg sg ch tth t t h tt y sty cctc, ctv cg,or radiation. Crosstalk is expressed in decibels at a specied loadimpedance and at a specic frequency.

chAnnel iSolAtion. On a switching card, the isolation from signalHi lo ch t sg Hi lo y th ch (the output on switch or scanner cards). Specied as resistance andcctc, xct rf cs (cs qcy g).

coAXiAl cAble. A two-conductor cable that has a center conductorsurrounded by a shield conductor, the two being coaxial and separatedy st.

coil reSiStAnce. a v th sstc th cwinding of a relay.

cold junction. Th jct thc cct tht s t known temperature. Also known as Reference Junction.

cold SwitchinG. Csg th y ctcts yg vtg ct vg vtg ct g thctcts. (Ctcts t k k ct.)

column. As viewed on the schematic of a matrix card/module, thevertical signal lines that are connected via relays to the horizontal rows.

common mode. Between two signal lines and a third line (e.g., fromsg Hi lo t chsss g g).

common mode iSolAtion. On a switching card/module, theisolation from signal HI and LO to guard (or shield) for a 3pole circuit,or from signal HI and LO to chassis ground for a two-pole circuit.Specied as resistance and capacitance.

common mode rejection rAtio. Th ty stt tjct tc c vtg t ts t ts

with respect to ground. Usually expressed in decibels at a frequency.common mode VoltAGe. A voltage between input low and chassisg stt.

contAct bounce. Th tttt s g yctcts g cs.

contAct life. Th x xct css failure. Life is dependent on the switched voltage, current, and power.Failure usually occurs when the contact resistance exceeds the end of v.

contAct PotentiAl. A voltage produced between contact terminals t th tt gt css th y ctcts, threed-to-terminal junctions of dissimilar metals. (The temperature gra-dient is typically caused by the power dissipated by the energized relayc.)

contAct rAtinG. The voltage, current, and power capacities of relaycontacts under specied environmental conditions. See Carry Currentand Switched Current.

contAct reSiStAnce. f y, th sstc hs cssclosed contacts. For a Keithley switching card/module, also includesth t sstc cct t sstc.

contActS. The surfaces of current carrying elements where electricccts cs.

croSSPoint. The intersecting point of a column and row in a relaymatrix. Specied as (column, row) or (row, column).

croSStAlk.S Channel Crosstalk .

current SurGe limitinG. Th ccty cssy t tct yctcts xcssv tst ct.

differentiAl inPut iSolAtion.On a switching card, the isolationfrom signal HI to LO. Specied as resistance and capacitance.

differentiAl multiPleXer. A type of switching card/module where t s t t sv tts (.g., scg) sv ts s t t tt (.g., sg), chchannel uses a two-pole relay conguration (one pole for signal HI and sg lo).

diGitAl i/o. A TTL-level input/output port that is programmable by the.

dry circuit SwitchinG. Switching below specied levels of voltage(e.g., 20mV) and current to minimize any physical and electricalchgs th ctct jct.

dry reed relAy. A glass-enclosed, hermetically sealed, magneticallyactuated contact. No mercury or other wetting material is used.

dut. a vt dvc u Tst.

electrochemicAl effectS. Th ty tht gts ctbetween circuit board conductors due to contamination of the card

surface. Minimized with proper handling and cleaning.

electromechAnicAl relAy. a y tht ss ctgt tv t k k th y ctcts.

emi. avt ectgtc itc. a t thtdenes unwanted electromagnetic radiation from a device that couldinterfere with desired signals in test or communication equipment, forx. rfi (r fqcy itc) emi t stchgy.

floAtinG. The condition where a common mode voltage existsbetween earth ground and the instrument or circuit of interest. (Low of circuit is not at earth potential.) The condition where signal LO in thesyst s ctcy st th g.

form A. A single-pole, normally open contact conguration. Alsocalled SPST-NO. A two-pole conguration is called 2 Form A.

form b. A single-pole, normally closed contact conguration. Alsocalled SPST-NC. A two-pole conguration is called 2 Form B.

form c. A single-pole, double-throw contact conguration. Also

known as a Transfer Switch. A two-pole conguration is called 2 FormC dpdT.

GuArdinG.a tchq tht cs kg s cssresponse time. Consists of a guard conductor driven by a low-impedance source surrounding the lead of a high-impedance signal.

Th g vtg s kt t th tt th sg.

hot SwitchinG. Opening and closing relay contacts while voltage ct . (Ctcts k k ct.) dgscontact life. Typically used for digital signal switching to prevent statechgs.

imPedAnce mAtchinG. To optimize power transfer and minimizemeasurement uncertainty in RF/microwave systems, the ohmic valuesof source, switch, and measure components are equalized, commonlyto 50W. Differences in impedances cause reection of the signal.

indePendent Switch cArd/module. A type of card where eachch s ctcy st th chs. as cIsolated Switch Card/Module.

inPut iSolAtion. On a switching card, the isolation from signal HIto LO (or guard) for a two-pole circuit. Specied as resistance andcctc.

inSertion loSS. Th ttt sgs g switching card. Specied as a decibel value over a frBecomes more important with low signal levels or hig

inSulAtion reSiStAnce. Th hc sstc gs qcky s hty css.

i/o. Abbreviation for input/output, which refers to theinformation to an external device (output), and the ret xt vc (t).

iSolAted Switch. A type of card where each chanisolated from all other channels. Also called Independm.

iSolAtion. On a switching card/module, the impedany stated terminals. Specied as resistance and camicrowave switching, the ratio of the power level betchannels, which is expressed in decibels over a frequit ist.

iSothermAl block. Th thy cctv th tt thc ccts.

lAtchinG relAy. a y tht ts ts ctctposition assumed without the need to keep the coil e

leAkAGe current. Error current that ows througresistance when a voltage is applied.

low noiSe cAble. A cable that is coated with a cobetween the braid and inner insulator (coax and triax sh (tx). Ths cs tctc ctsdue to vibration, movement, or temperature uctuati

mAinfrAme. A switching instrument that operates as cs t cct sgs g scginstruments and devices under test. Signal switchingcs tht st t th ck. a referred to as a Scanner, Multiplexer, Matrix, or Progr

mAke-before-breAk.Connecting a new circuit bdisconnecting the present circuit. Also known as Ma

mAtriX.Cctg t ts t t t

mAtriX cArd/module. A type of card with a switcthat has columns and rows of relay crosspoints. Withsince any one point can be connected to any other, yneously have one input with multiple outputs, multiploutput, or multiple inputs with multiple outputs.

mercury wetted relAy. A reed relay in which thwetted by a lm of mercury. Usually has a required pt; s tys st sstv.

module. S Switch Cards/Modules.

multiPleX.Cctg stt t t t stts t vc tst. as

SwitchinG GloSSAry The following terms are dened to clarify or expand on how they relate specically to the material in this handbook.


http://gw1.vtrenz.net/?K5CHYUBW35












25


multiPleX cArd. S Scanner Card .

noiSe. a s ctc sg xt sc (schas an AC power line, motors, generators, transformers, uorescentghts, CrT sys, cts, tstts, ths) tht ss s sg.

non-blockinG. A multiplexer or matrix arrangement of relays whereit is possible to switch any signal to any DUT at any time. It has highexibility and high cost.

non-lAtchinG relAy. a y tht ts ts cs ctctposition when the coil is energized and its open contact position when

th c s t gz.normAlly cloSed contActS. A contact pair that is closed whenth y s t gz.

normAlly oPen contActS. A contact pair that is open when they s t gz.

normAl mode. Between two signal lines (e.g., from signal HI to signallo).

normAl mode rejection rAtio. Th ty stt tjct aC tc (sy qcy) css ts tts. usy xss cs t qcy.

normAl mode VoltAGe. A voltage applied between the input highand input low terminals of an instrument.

offSet current. A current that comes from a switching card eventhough no signals are applied. It comes mostly from the nite coil-to-ctct c. it s s gt y tctc, zctc, ctchc cts st th c.

PAth iSolAtion. On a matrix switching card, the isolation from signal

HI and LO of one path to signal HI and LO of any other path. Specieds sstc cctc.

PAth reSiStAnce. On a matrix switching card, the resistance perconductor of a closed path, including the contact resistance, wiringsstc, cct t sstc.

PhASe diStortion. The shifting of RF/microwave or digitalwaveforms due to signal paths of different lengths and differentgt ys thgh tst systs. my cs s gttstg.

Piezoelectric currentS. Th ct cs y chcstss t ct stg ts. T z, th stss s vfrom the insulators, and materials with low piezoelectric effect are used.

Pole. A set of mating contacts in a relay or switch: normally open,y cs, th.

ProPAGAtion delAy. The specied amount of time for a signal to berouted through a previously closed channel of a switching card. Thedelay must be considered, for example, when the switched signal iss t sychz th sgs.

reed relAy. A relay using one or more glass-enclosed, hermeticallys, gtcy ctt ctct s. S tys y tv st k th st t. S tys mercury wetted to improve switched current rating and make contactsstc ct. as s Electromechanical Relay Solid State Relay .

reference chAnnel. o thc sc c, th chtht ss th tt th sth ck.

reference outPut. Th tt sg stg th tt th c ch, sy th sth ck, sthc sc cs/s.

relAy. a ctcy ct chc vc tht s css ctc ctct. a y vs st ct sgsfrom switched signals.

relAy driVe. The total current available from the power supply of themainframe to energize the relay coils on switching cards. This current ist t vt tts.

relAy driVe current. Th t ct cssy t gza relay. Usually specied per channel.

relAy SetuP. A conguration of open and closed relays.

releASe time. The time between the removal of the coil voltage andth stz g th ctcts.

return loSS. A measure of the power reected back towardsth sc t c stch g th sc,tsss , th . exss b.

row. As viewed on the schematic of a matrix card/module, thehzt sg s tht cct v ys t th vtccs.

ScAn. Sequential connecting (usually break-before-make) of onestt t t vcs tst t stts t vc tst. as s Multiplex .

ScAnner.S Mainframe.

ScAnner cArd. A type of switching card where one input is routedt sv tts (.g., scg), sv tsis routed to one output (e.g., measuring). The actual switching canbe nonsequential (multiplex) or sequential (scan). Also known as amtx C.

Settle time. Th t q stshg y ccts stzg s ccts.

ShieldinG. a t cs th cct g s metal sleeving surrounding wire conductors (coax or triax cable) toc ctsttc tc. Th sh s sy cct t thlo t th sstv stt..

SinGle-ended multiPleXer. A type of switching card/modulewhere one input is routed to one of several outputs (e.g., sourcing) or sv ts s t t tt (.g., sg). echchannel uses a single-pole relay for signal HI and a single commont s cct t sg lo chs.

Solid StAte relAy. A relay that switches electric circuits by useof semiconductor elements without moving parts or conventionalctcts.

SmA. a ty t cx cct s stts qgsh c sg ccts.

Smb. a ty t cx cct s stts qgsh c sg ccts.

Switch/meASure SyStem. An instrument that integrates a switchmainframe and a digital meter into a single chassis. Signal switching is cs/s tht st t th chsss.

Switched current. Th x ct v tht c yhandled while opening and closing contacts. Also see Carry Current.

SwitchinG cArd/moduleS. The general classication of relay cards.May be subdivided into: independent switch cards (1 input to 1 output),scanner or multiplex cards (1:N, N:1) and matrix cards (M:N).

t/c cold junction. S Cold Junction.

teSt fiXture. a cs, sts sh, s tgsg t vcs tstg ss.

thermAl offSet VoltAGe. S Contact Potential .

triAXiAl cAble. A three-conductor cable that has a centercct s y sh cct tht s ts y t sh cct.

triboelectric current. The current caused by friction betweena conductor and insulator when a cable exes due to vibrations,movement, or temperature uctuation. Also see Low Noise Cable.

triGGer. a xt sts tht tts sttfunctions. Trigger stimuli include: the front panel, an external triggerpulse, and IEEE-488 bus X, Talk, and GET triggers.

tSP. teSt ScriPt ProceSSor. a css, s a growing number of Keithley instruments and switch mainframes,designed for executing test scripts within the instrument. Using

TSp tst scts st pC stt ct vscommunication delays between the PC controller and instrument,allowing improved test throughput. Test scripts can contain math anddecision-making rules that further reduce the interaction between ahst pC th stt.

tSP-link. The TSP-Link master/slave connection offers easy systemexpansion between Keithley’s Series 3700 mainframes. TSP-Link canalso be used to connect to other TSP-Link enabled instruments, suchas Series 2600A System SourceMeter instruments. All instrumentation

connected via TSP-Link can be controlled by the master unit, just as if they were all housed in the same chassis.

VoltAGe clAmPinG. Th ccty cssy t tfrom excessive voltage caused by switching current in

VSwr. avt Vtg Stg Wv rtsignal reection along a transmission line. Expressedhighest voltage to the lowest voltage found along the

fo h adig o wihig iology, :

ANSI/EIA RS-473-1981. Denitions and Termin Relays for Electronic Equipment. American Na

Institute, 1981.

ANSI/IEEE Std. 100-1992. IEEE Standard Dictio Electrical and Electronics Terms. 5th edi tion. Electrical and Electronics Engineers, 1992.

Engineers’ Relay Handbook. 5th edition. RelayIndustry Association (formerly National AssociaManufacturers), 1996.

SwitchinG GloSSAry










http://forum.keithley.com/





26


Switch cArd And Switch module Selector GuideS

Sg cas Ss 3700 maas**Additional Series 3700 cards are currently in development. For a current list of cards and specifications, v isit www.keithley.com.

3720 3721 3722 3723 3724 3730 3731 3732 3740 3750

No. of Channels 60 (Dual 1×30) 40 (dual 1×20) 96 (dual 1×48)60 (dual 1×30) or 120 single pole

(dual 1×60)60 (dual 1×30) 6×16 6×16

448 crosspoints(Quad 4×28)

32

40 digital I/O, 4counter/totalizers,

and 2 isolated analogoutputs

Card Config. Multiplexer Multiplexer Multiplexer Multiplexer Multiplexer Matrix Matrix Matrix Independent Independent

Type of Relay Latching

electromechanicalLatching

electromechanicalLatching

electromechanicalDry reed FET solid-state

Latchingelectromechanical

Dry reed Dry reedLatching

electromechanicalN/A

ContactConfiguration

2 Form A 2 Form A 2 Form A 1 Form A 2 Form A 2 Form A 2 Form A 1 Form A 28 Form C, 4 Form A N/A

Max. Voltage 300 V 300 V (ch 1–40),60 V (ch 41–42)

300 V 200 V 200 V 300 V 200 V 200 V 300 VDC/250 VAC

(Form A)N/A

Max. CurrentSwitched

1 A 2 A (ch 1–40),3 A (ch 41–42)

1 A 1 A 0.1 A 1 A 1 A 0.75 A 2 A (Form C), 7 A

(Form A)N/A

Comments 2 independent 1×30multiplexers. Automatictemperature reference when used with screw

terminal accessory (Model 3720-ST)

2 independent 1×20multiplexers. Automatictemperature reference when used with screw

terminal accessory (Model 3721-ST)

2 independent 1×48multiplexers

2 independent 1×30multiplexers

2 independent1×30 multiplexers.

Automatictemperature

reference when used with screw terminal

accessory (Model3724-ST)

Columns can beexpanded throughthe backplane or isolated by relays

Relay actuation timeof 0.5ms. Columnscan be expanded

through thebackplane or isolated

by relays

Banks can beconnected

together via bank configuration relays

to create a single4×112 or dual 4×56

matrix. Analogbackplane relays also

included for cardto card expansion.

Row expansion with3732-ST-R accessory

to create a dual 8×28or single 16×28

matrix.

32 general purposeindependent

channels.

All-in-one carddesign. 40

bidirectionalI/O. Four 32-bit

counter/totalizers.2 programmableanalog (V or I)

outputs.

Pg- ca Asss

3720 3721 3722 3723 3724 3730 3731 3732 3740 3750

Cables3720-MTC-1.5,3720-MTC-3

3721-MTC-1.5,3721-MTC-3

3722-MTC-1.5,3722-MTC-1.5/MM,

3722-MTC-3,3722-MTC-3/MM

3720-MTC-1.5,3720-MTC-3

3720-MTC-1.5,3720-MTC-3

3721-MTC-1.5,3721-MTC-3

3721-MTC-1.5,3721-MTC-3

3720-MTC-1.5,3720-MTC-3

3721-MTC-1.5,3721-MTC-3

3721-MTC-1.5,3721-MTC-3

Screw TerminalBlock

3720-ST 3721-ST 3723-ST, 3723-ST-1 3724-ST 3730-ST 3731-ST 3732-ST-C, 3732-ST-R 3740-ST 3750-ST

Connector Kits 3791- KIT78 -R 379 0-K IT50 -R 3792-KIT104-R,

3792-KIT104-R/F3791-KIT78-R 3791-KIT78-R 3790-KIT50-R 3790-KIT50-R 3791-KIT78-R 3790-KIT50-R 3790-KIT50-R

Tools 3791-CIT 3791-CIT 3791-CIT 3791-CIT 3791-CIT

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27



Sg cas 7001 a 7002 maas

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cas Card Confg.

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tp ce cs

hiGh denSity hiGh denSity

7011-c 40 mlplx 2 A 110 V 1 A 60 VA <1 µV <100 pA 2 mHz c Yf p 1×10 lplx,

bakpla

7011-s 40 mlplx 2 A 110 V 1 A 60 VA <500 V <100 pA 2 mHz sw . Y

f p 1×10 lplx,

bakpla

7012-c 4×10 max 2 A 110 V 1 A 60 VA <1 µV <100 pA 2 mHz c Y rw aal bakpla

7012-s 4×10 max 2 A 110 V 1 A 60 VA <500 V <100 pA 2 mHz sw . Y rw aal bakpla

7013-c 20 ila swh 2 A 110 V 1 A 60 VA <1 µV <100 pA 10 mHz c Y

7013-s 20 ila swh 2 A 110 V 1 A 60 VA <500 V <100 pA 10 mHz sw . Y

7015-c 40 mlplx 2 A 175 V 34 A 0.3 VA <5 µV <1A 500 kHz c Y sl a wh hh lably

7015-s 40 mlplx 2 A 175 V 34 A 0.3 VA <5 µV <1A 500 kHz sw . Y sl a wh hh lably

7018-c 28 mlplx 3 A 110 V 1 A 60 VA <5 µV <100 pA 2 mHz c Y 3 pl wh

7018-s 28 mlplx 3 A 110 V 1 A 60 VA <5 µV <100 pA 2 mHz sw . Y 3 pl wh

7035 36 mlplx 2 A 60 V 1 A 30 VA <1 µV <100 pA 10 mHz c Y 9 p 1×4 lplx

7036 40 ila swh 1 A 60 V 1 A 30 VA <4 µV <100 pA 10 mHz c Y40 p hal

-pl wh

7111-s 40 mlplx 1 c 110 V 1 A 60 VA <500 V <100 pA 2 mHz sw . Yf p 1×10 lplx,

bakpla

low VoltAGe low VoltAGe

7168 8 mlplx 2 A 10 V 50A <30 V 1 kHz sw . Y

hiGh VoltAGe hiGh VoltAGe

7154 10 mlplx 2 A 1100 V 500A 10 VA <35 µV 1 mHz sw . Y

control control

70207020-d*

80 dal i/o c Y 40 p/40 p

7021 30/20mlplx/ dal i/o

2 A 110 V 1 A 30 VA <3 µV <100 pA 10 mHz c Ydal lplx. up 30 hal,10 al p, 10 al p.

7037-d* 30/20ila/ dal i/o

1 A 110 V 1 A 30 VA <4 µV <100 pA 10 mHz c Y30 p hal

-pl wh, 10 al p,10 al p

7065 Hall Eect measurement buer card

Let us oferav appa
























28



Sg cas 7001 a 7002 maas (.)

ca

n.

cas Card Confg.

ca

Confg.

max.

Vag

max.

c

max.

P

ca

Pa

Oset

c

max.

r.

fq

c

tp ce cs

low current low current

7152 4×5 max 2 A 200 V 500 A 10 VA <20 µV <1 pA 60 mHz c Y

7153 4×5 max 2 A 1300 V 500 A 10 VA <50 µV <1 pA 60 mHz c Y

7158 10 mlplx 1 c 30 V 100 A <200 µV <1 pA 1 mHz Bnc Y

hiGh current hiGh current

7053 10 mlplx 2 c 300 V 5 A 100 VA <1 V 1 mHz sw .

rf rf

7016A bl 1×4 2 la wh 1 pl, 4 hw 30 V 500 A 10 VA <6 µV 2 gHz smA Y opal 50W a

Let us oferav appa

Sg cas 707b, 707A, 708b a 708A maas

can.

cas Card Confg.caConfg.

max. Vag

max.c max. P

caPa Oset Current

max.r.fq

ctp ce cs

low current low current

7072 8×12 max 2 A 200 V 1 A 10 VA <20 µV <1 pA 15 mHz 3-l ax Y

opz appla.

7072-HV 8×12 max 2 A 1300 V 1 A 10 VA <20 µV <1 pA 4 mHz 3-l ax

7174A 8×12 max 2 A 200 V 2 A <100 A 30 mHz 3-l ax Y

hiGh freQuency HigH freQuencY

7073 8×12 max 1 A 200 V 1 A 30 VA <2 µV <200 pA 30 mHz Bnc Yes

7173-50 4×12 max 2 c 30 V 0.5 A 10 VA <15 µV <200 pA 200 mHz Bnc Y
























29


S/c ms 2700, 2701 a 2750 m/daa Aqs/S Sss

m# Aag

ips Confguration Dierential* f-Ptp

cmax.

Vag

max.Sc

cmas

cas d g a i/oSSp o

7700 20mlplx w/

cJc1×20

w 1×101×10

swal

300 V 1 A 2 hal @ 3 A n/A 3 max pw = 125 VA.

7701 32 mlplx1×32

w 1×161×16 d-b 150 V 1 A n/A n/A 3 max pw = 125 VA.

7702 40 mlplx1×40

w 1×201×20

swal

300 V 1 A 2 hal @ 3 A n/A 3 max pw = 125 VA.

7703 32 mlplx1×32

w 1×16

1×16 d-b 300 V 500 A n/A n/A 1 r lay.

7705 40ip

sPstn/A n/A d-b 300 V 2 A n/A n/A 3 max pw = 125 VA.

7706 20mlplx w/

cJc1×20

w 1×101×10

swal

300 V 1 A n/A 16 dalo oly

3 (2) ±12 V aal p hal& 100 kHz v /alz.

max pw = 125 VA.

7707 10mlplx/ dal i/o

1×10 w 1×5 1×5 d-b 300 V 1 A n/A 32 dal

i/o3

max pw = 125 VA.(4) h-b w i/o.

7708 40mlplx w/

cJc1×40

w 1×201×20

swal

300 V 1 A n/A n/A 3 max pw = 125 VA.

7709 48 6×8 max Y Y d-b 300 V 1 A n/A n/A 3

c al dmm.day ha lpl a

p a 6×40 ax.max pw = 125 VA.

7710 20mlplx w/

cJc1×20 w

1×101×10

swal

60 V 100 A n/A n/A 0.5 max pw = 4.2 VA

7711 8 mlplx w 1×4 n smA 30 V,60 Vdc

0.5 A n/A n/A 10 2 gHz, ax pw =

20 W p l

7712 8 mlplx w 1×4 n smA 30 V,42 Vdc

0.5 A n/A n/A 10 3.5 gHz, ax pw =20 W p l

* ca b al dmm xal al.

Sg cas 2000, 2001, 2002, a 2010 ms

n. cas Card Confg.

caConfg.

max. Vag

max.c max. P

caPa c tp ce cs

GenerAl PurPoSe generAL PurPose

2000-scAn 10 mlplx 2 A 110 V 1 A 30 VA <1 µV sw al Y Congurable to four-pole

2001-scAn 10 mlplx 2 A 110V 1 A 30 VA <1 µV sw al Y 2001, 2002 only; congurable to four-pole;w hh-p hal

thermocouPle

2001-tcscAn 9 mlplx 2 A 110 V 1 A 30 VA <1 µV sw al Y Bl- l j

Switch cArd And Switch module Selector GuideSLet us oferav appa
























30



S/S ms 2790 Sm® Aag ts Ss

m# Aag

ips Card ConfgurationcS

VagS i/V cv c mas

caPa

tp c

SSp

7751 12 f 1 A, pl -pl h w-pl 0–50 A 50–500 V Y 0–50 µA <3 µV sw al 3

7752 12 f 1 A, pl -pl h w-pl 0–50 A n <3 µV sw al 3

7753 12 f 1 A, pl -pl h w-pl 0–50 A 50–500 V Y 0–500 µA <3 µV sw al 3

Switch SyStem mAinfrAmeS

P fa S/mas Sss Ate S/c Ss

model 3706A, 3706A-nfP model 2700, 2701, 2750 model 7001 model 7002

sy swh wh pal Hh

Pa ml a Pl-i caia swh/ ma/

daal sy80 ch - 2 sl Hal rak swh

maa400 ch - 10 sl fll rak swh

maa

max. chal cp p cha up 576 h 2688 pp aa up 80 p aa (2700, 2701),p 200 p aa (2750) up 80 p aa up 400 p aa

ca sl 6 2 (2700, 2701), 5 (2750) 2 10

Aa cJc Y (pal) Y (pal) — —

P fa S Ss S

model 707b model 708b SyStem 46, 46t

6-slo, siodo swihig maix -

n fas a ipv Pa

sigl-slo, siodo swihig maix -

n fas a ipv Parf/miowav swih sy, 32 chal uiad &

tiad

max. chal ocopoi p chai

up o 576 p aia up o 96 p aia up o 32 rf/iowav h

cad slo 6 1 0

Aoai cJc — — —

Let us oferav appa









http://www.keithley.com/products/switch/multi?mn=3706A

http://www.keithley.com/products/switch/dmmswitch/?mn=2700

http://www.keithley.com/products/switch/multi/?mn=7001










http://www.keithley.com/products/switch/multi/?mn=707B


http://www.keithley.com/products/switch/multi/?mn=S46








































31

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