star-pxl mechanical integration and cooling
DESCRIPTION
STAR-PXL Mechanical Integration and Cooling. St. Odile Ultra-Thin Vertex Detector Workshop 8-Sept-2011 Howard Wieman. PIXEL Work. Eric Anderssen Mario Cepeda Leo Greiner Tom Johnson Howard Matis Hans Georg Ritter Thorsten Stezelberger Xiangming Sun Michal Szelezniak Jim Thomas - PowerPoint PPT PresentationTRANSCRIPT
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STAR-PXL Mechanical Integration and Cooling
St. Odile Ultra-Thin Vertex Detector Workshop
8-Sept-2011
Howard Wieman
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PIXEL Work• Eric Anderssen• Mario Cepeda• Leo Greiner• Tom Johnson• Howard Matis• Hans Georg Ritter• Thorsten Stezelberger• Xiangming Sun• Michal Szelezniak • Jim Thomas• Chi Vu
ARES Corporation:Darrell BultmanSteve NeyRalph RickettsErik Swensen
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Pixel geometry
2.5 cm radius
8 cm radius
Inner layer
Outer layer
End view
One of two half cylinders
20 cm
coverage +-1
total 40 ladders
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Topics
• Mechanical trade offs in achieving the highest pointing precision
• Work addressing mechanical precision and stability.
• Rapid Detector Replacement
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vertex projection from two points
212
21
22
rrrrxv
0
6.13 Xpc
Mevm
1rv m detector layer 1
detector layer 2
pointing resolution = (13 19GeV/pc) m
fromdetectorpositionerror
fromcoulombscattering
r2r1
true vertexperceived vertex
x
x
v
r2r1
true vertexperceived vertex
v
m
expectations for the HFT pixels
%3.00 Xfirst pixel layer
more than 3 timesbetter than anyoneelse
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Know where the pixels are• Build a mechanically
stable structure• Measure pixel
locations – i.e. generate a spatial pixel map that will not be corrupted by mechanical changes
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development of spatial mapBob ConnorsSpiros MargetisYifei Zhang
touch probe 2-3 m (xyz) andvisual 2-3 m (xy) 50 m (z)
active volume: huge
10 gm touchprobe force
visual sub micron (xyz) repeatability 5 m accuracy over active volume
no touch probe
active volume: 30 in X 30 in X 12 in
MEMOSTAR3, 30 m pitch
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Mechanical Stability
• Movement from temperature changes• Movement from humidity changes• Deflection from gravity• Vibration movement from mounts in STAR• Movement induced by cooling air
– how much air is required– vibration and static displacement
Once the pixel positions are measured will they stay in the same place to within 20 µm? Issues that have been addressed:
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Stability requirement drove design choices
• The detector ladders are thinned silicon, on a flex kapton/aluminum cable
• The large CTE difference between silicon and kapton is a potential source of thermal induced deformation even with modest 10-15 deg C temperature swings
• Two methods of control– ALICE style carbon
composite sector support beam with large moment of inertia
– Soft decoupling adhesive bonding ladder layers
Multiple designs were considered. This design optimized low X0, mechanical stability and ease of fabrication
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Ladder design with soft adhesive (6 psi shear modulus)cable bundle
drivers
pixel chips
adhesive
wire bonds
capacitors
adhesivecomposite backer
kapton flex cable
adhesive:3M 200MP2 mil, film adhesive
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FEA analysis showing bi-metal thermally induced deformation ladder cross sectionshort direction
rigid bond500 micron deformation
20 deg C temperature change
soft adhesive4.3 micron deformation
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FEA analysis of thermally induced deformation of sector beam
• FEA shell elements• Shear force load
from ladders • 20 deg temperature
rise• Soft adhesive
coupling• 200 micron carbon
composite beam• end cap
reinforcement• Maximum
deformation 9 microns (30 microns if no end cap)
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FEA analysis - sector beam deformation – gravity load
• FEA shell analysis• 120 micron wall
thickness composite beam
• gravity load includes ladders
• maximum structure deformation 4 microns
• ladder deformation only 0.6 microns
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Air cooling of silicon detectors - CFD analysis
air flow path – flows along both inside and outside surface of the sector
• Silicon power: 100 mW/cm2 (~ power of sunlight)
• 240 W total Si + drivers
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Air cooling – CFD analysis• air flow velocity 9-10 m/s• maximum temperature rise
above ambient: 12 deg C• sector beam surface –
important component to cooling
• dynamic pressure force 1.7 times gravity
stream lines with velocity
silicon surface temperature
velocity contours
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Cooling Test with Full Size Mockup
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Detector mockup
Driver section ~6 cm
Sensor section ~20 cm
5 1 6
3 2 4
Kapton cables with copper traces forming heaters allow us to dissipate the expected amount of power in the detector
There are 6 thermistors on each ladder (except for the ladder with silicon chips mounted) that allow us to monitor their temperature with an automated measurement system based on the Touch-1 cable tester
One of the sectors (sector 1) was equipped with 10 dummy silicon chips per ladder, with Pt heaters deposited on top of silicon
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Setup
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Setup
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Cooling tests at ~360 W – IR imagesAir 13.8 m/s Hot spots ~37 °C
Air 10.1 m/s Hot spots ~41 °C
Air 4.7 m/s Hot spots ~48 °C
Air temperature ~27 °C
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Cooling tests at ~360 W
Air temperature ~27 °C
unsuported endmid-section fixed endSolid – inner layerOpen – outer layer
Observations:• Mid-section is the hottest part of the ladder• max temperature increase above ambient is
~ 8 °C @ 13.8 m/s~12 °C @ 10.1 m/s~17 °C @ 4.7 m/s
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vibration modes – preliminary – better composite numbers available
229 Hz
316 Hz
224 Hz
473 Hz
348 Hz
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vibration modes with reinforced end cap
• The message– Lots of complicated modes
close in frequency– End cap raises frequencies a
bit
259 Hz
397 Hz
276 Hz
441 Hz
497 Hz
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air velocity probetwo positions shown
capacitance vibration probetwo positions shown
carbon fiber sector beam
wind tunnel setup to test vibration and displacement
adjustablewall for airturn around
air in
air out
C:\Documents and Settings\Howard Wieman\My Documents\aps project\mechanical\PXL phase 1 sept 2008\sector ph1 wind tunnel.SLDASM
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wind tunnel, rapid prototype parts from model
air flow controlparts built with3D printer
parts built with SLA, stereolithography apparatus
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wind tunnel
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capacitive probe vibration measurements
air velocity 2.7 m/s
position signal, 25 m/volt
air velocity 9.5 m/s
position signal, 25 m/volt
log FFT, peak at 135 Hz
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Ladder vibration induced by cooling air
30m12
20m12
system resolution limitall errors
desired vibration target
required air velocity18 mph
0 2 4 6 8 10 120
2
4
6
8
10
measured vibration with negative pressure modemeasured vibration with positive pressure mode
Ladder Vibration
air velocity (m/s)
vibr
atio
n R
MS
(mic
rons
)
5.77
8.66
8
no reinforcement at the end
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-167 µm
6 µm
17 µm17 µm
-179 µm
-248 µm
measured static deformation from 9 m/s air flow
-156 µm
-163 µm-113 µm
9 µm11 µm
1 µm
open end
reinforcedend
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measured vibration (RMS) induced by 9 m/s air flow
13 µm14 µm
14 µm
4 µm 6 µm6 µm
8 µm
3 µm3 µm
2 µm
11 µm
4 µm
openend
reinforcedend
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• Sector 1, Ladder 2
Vibrations caused by airflow
0
2
4
6
8
10
12
14
16
18
0 5 10 15 20 25 30
location on ladder (cm)
vibr
aito
ns R
MS
(um
)
~4.7 m/s~9.3 m/s~12.8 m/s~4.7 m/s (fixed end)~9.3 m/s (fixed end)~12.8 m/s (fixed end)
Beginning of the driver section(Supported end)
End of sensor section(Unsupported end)
coupled means that the unsupported end is tied to sector 2
(coupled )(coupled )(coupled )
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Vibration from STAR support, accelerometer measurement
0 100 200 300 400 5001 10 4
1 10 3
0.01
0.1
1
10
100
1 103
based on red PSD curve fig. 2based on blue PSD curve of fig. 2
RMS vibration displacement relative to support
frequency (Hz)
RM
S (m
icro
ns)
• detector vibration from STAR support < 0.1 micron RMS
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measurements of thermal sector distortions
to be added
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maybe more on insertions mechanism
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end with conclusions
rest are backup
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Development of sector beam and ladder fabrication
• Eric Anderssen and Tom Johnson have been working on fabrication methods for:– Sector Beam– and Ladders
• Produced sample beams, 244 m thick, 7 ply, 21 gm
• expected ladder mass 7.5 gm
ladders
sector beam
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Sector structures
38
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ladder fabrication and tooling
39
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ladder fabrication and tooling
40
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ladder fabrication and tooling
41finalizing mechanical designs and developing rapid production methods
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ladder fabrication and tooling
42
ladder withsilicon heaterchips(50 m thick)