spl06-003 - 深圳市荣泰电子有限公司€¦ · the spl06-003 is a new generation of high...
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Preliminary Datasheet
SPL06-003 Digital pressure sensor
Tel: + 86 536 8525155
Fax: + 86 536 8525000
E- Mail: [email protected]
Website: http://www.goertekacoustics.com
Address: No.268 Dongfang Road, High-Tech Industry
Development District, Weifang, Shandong, P.R.C
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Introduction
The SPL06-003 is a new generation of high precision digital pressure sensor developed
by GoerTek Inc. for consumer applications.
The ultra-low power, low voltage electronics of the SPL06-003 is optimized for use in
mobile phones, wearable, GPS navigation devices and outdoor equipment.
With a low altitude noise of merely 5cm at fast conversion time, the SPL06-003 offers
superior performance.
The I2C interface allows for easy system integration with microcontroller.
Key features
Pressure range: 300 ... 1100hPa (+9000m ... -500m relating to sea level)
Supply voltage: 1.7 ... 3.6V (VDD)
Package: LGA package with metal lid
Small footprint: 2mm x 2.5mm; Super-flat: 0.95mm height
Low noise: 1Pa (8cm)
Temperature measurement included
I2C interface mainly, reserved SPI port
Fully calibrated
Pb-free, halogen-free and RoHS compliant
MSL 1
Typical applications
Enhancement of GPS navigation (dead-reckoning, slope detection, etc.)
In- and out-door navigation
Leisure and sports
Weather forecast
Vertical velocity indication (rise/sink speed)
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Restricted 1. Security warning
The information contained in this document is the exclusive property of GoerTek
Inc. and should not be disclosed to any third party without the written consent of
GoerTek Inc.
2. Publication history
Version Date Description Author Approved
Preliminary 1.0 2016.7.11 New design Wiming Sammy
Preliminary 2.0 2016.7.22
Update
electrical
characteristics
Wiming Sammy
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Index of Contents
1. INTRODUCTION .............................................................................................................. 2
2. TEST CONDITION ........................................................................................................... 5
3. ABSOLUTE MAXIMUM RATINGS ................................................................................... 5
4. ELECTRICAL CHARACTERISTICS ................................................................................ 5
5. OPERATION ..................................................................................................................... 6
5.1 General description ............................................................................................... 6
5.2 General function and application schematics........................................................ 7
5.3 Measurement of pressure and temperature .......................................................... 7
5.4 Calculating absolute altitude and calculating pressure at sea level ..................... 8
5.5 Device and register address .................................................................................. 8
5.6 I2C Interface .......................................................................................................... 9
6. MECHANICAL CHARACTERISTICS ............................................................................. 12
6.1 Pin configuration .................................................................................................. 12
6.2 Outline dimensions .............................................................................................. 12
6.3 Marking instructions ............................................................................................. 14
7. STORAGE AND TRANSPORTATION ............................................................................ 14
8. SOLDERING RECOMMENDATION .............................................................................. 15
9. PACKAGE SPECIFICATIONS........................................................................................ 16
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1. Test condition
Table 1: Test condition
Standard Conditions Temperature Humidity Air pressure
Environment conditions -40℃-85℃
25%RH-75%RH 300hPa-1100hPa
Basic test conditions 25℃
60%RH-70%RH 300hPa-1100hPa
2. Absolute maximum ratings
Table 2: Absolute maximum ratings
Parameter Condition Min Max Units
Storage temperature -40 125 °C
Supply Voltage All pin -0.3 +4.25 V
ESD rating HBM,R=1.5kohm,C=100pF ±2 kV
Overpressure 3600 hPa
3. Electrical characteristics
If not stated otherwise, the given values are ±3-Sigma values over temperature/voltage
range in the given operation mode. All values represent the new parts specification; the
additional solder drift is shown separately.
Table 3: Operating conditions, output signal and mechanical characteristics
Parameter Symbol Condition Min Type Max Units
Operating
temperature TA
Operational -40 25 85 °C
Full accuracy 0 70 °C
Operating
Pressure P 300 1100 hPa
Supply voltage Vdd Ripple
max.50mVpp 1.7 - 3.6 V
Peak current Ipeak During conversion 1500 1650 μA
○G standby current Iddsbm @25°C 20 250 nA
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Note :○G Key performance.
4. Operation
4.1 General description
The SPL06-003 is designed to be connected directly to a microcontroller of a mobile
device via the I2C. Digital compensation of signal offset, sensitivity, temperature, and
non-linearity is accomplished via an 26-bit internal digital signal processor (DSP)
running a correction algorithm. Calibration coefficients are stored on-chip in a highly
reliable, nonvolatile, multiple-time programmable (MTP) memory.
○G Supply current
1 sample / sec.
@25°C
Iddstd
OSR × 1 9 10
μA OSR × 2 18 20
OSR × 4 36 40
OSR × 8 72 80
Relative accuracy
pressure
VDD = 3.3V
P_R 950-1050 hPa
@ 25 °C
±0.10 hPa
±0.8 m
○G Absolute
accuracy pressure
VDD = 3.3V
P_A
300- 1100 hPa @
0°C~70 °C -2 ±1 2 hPa
300- 1100 hPa @
-20°C~0°C -3 ±1 3 hPa
Resolution of
output data
Pressure 0.0047 Pa
Temperature 0.0047 °C
Noise in pressure P_Noise
OSR × 1 2
Pa
RMS
OSR × 2 1.5
OSR × 4 1.2
OSR × 8 1
Offset
temperature
coefficient
Tco 25 ~40 ℃
@1000hPa
1 Pa/℃
8.4 cm/℃
Absolute accuracy
temperature
VDD = 3.3V
@25°C -1 ±0.5 1 °C
@0°C~70 °C -1.5 ±1 1.5 °C
Conversion time tc_p &
temp
OSR × 1 8
ms OSR × 2 16
OSR × 4 32
OSR × 8 64
Serial data clock For I2C 3.4 MHz
Solder drifts -2.5 0.5 hPa
Long term stability ±1 hPa CONFIDENTIAL
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4.2 General function and application schematics
The SPL06-003 consists of a MEMS pressure sensor with a conditioning IC to provide
accurate pressure measurement from 300 to 1100hPa.
Developed for correction of resistive bridge sensors, it can also provide a corrected
temperature output measured with an internal sensor. The measured and corrected
bridge values are provided at the digital output pins, which can be configured as I2C.
UP = pressure data (24 bit)
UT = temperature data (24 bit)
Figure 1: Typical application circuit
4.3 Measurement of pressure and temperature
The microcontroller sends a start sequence to start a pressure and temperature
measurement. After converting time, the result value (UP and UT) can be read via the
I2C interface. The compensation of sensor offset, sensitivity, temperature drift, and non-
linearity is accomplished via a Digital Signal Processing (DSP) unit running a correction
algorithm with calibration coefficients stored in an MTP memory. The SPL06-003’s
operational mode is being used typically in which the IC wakes up from a Sleep (low
power) State, runs a measurement in Active State and turns back automatically to the
Sleep State.
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4.4 Calculating absolute altitude and calculating pressure at sea
level
With the measured pressure P and the pressure at sea level P0=1013.25hPa, the altitude
in meters can be calculated with the international barometric formula:
Altitude = 44330 × [𝟏 − (𝐏
P0)
𝟏𝟓.𝟐𝟓𝟓
.
]
Thus, a pressure change of Δp = 1hPa corresponds to 8.43m at sea level.
Figure 2: Transfer function: Altitude over sea level – Barometric pressure
With the measured pressure p and the absolute altitude the pressure at sea level can be
calculated:
P0 =𝑝
(1 −altitude44330 )
5.255
Thus, a difference in altitude of Δaltitude = 10m corresponds to 1.2hPa pressure change
at sea level.
4.5 Device and register address
The SPL06-003 module address is shown below. The LSB of the device address
distinguishes between read (1) and write (0) operation, corresponding to address 0xED
(read) and 0xEC (write).
Figure 3 SPL06-003 addresses
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4.6 I2C Interface
In I2C Mode, each command is started as shown in figure 4. Only the number of bytes
that is needed for the command has to be sent. After the execution of a command (busy
= 0) the expected data can be read as illustrated in figure 5. or if no data are returned by
the command the next command can be sent. The status can be read at any time as
described in figure 6.
Figure 4 I2C Command Request
Figure 5 I2C Read Status
Figure 6 I2C Read Data
All mandatory I²C-bus protocol features are implemented. Optional features like clock
stretching, 10-bit slave address, etc., are not supported by the SPL06-003’s interface.
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The I2C commands supported by the SPL06-003 are listed in Table 4.
The commands to read an address in the user memory is the same as its address.
Table 4 I2C commands
Command Returns Description Convert
formula
AAHEX
24-bit fully
corrected
bridge
measuremen
t data
+ 24-bit
corrected
internal
temperature
Measure Trigger full measurement
cycle and calculation and storage of
data in the output buffer using the
configuration from MTP.
Temperature=Te
mpdata/
16777216*(85+4
0)-40
Pressure=Bridge
data/
16777216*1000
+260
ACHEX
Oversample-2 Measure Mean value
generation: 2 full measurements are
conducted (as in command AAHEX),
the measurements’ mean value is
calculated, and data is stored in the
output buffer using the configuration
from MTP; no power down or pause
between the 2 measurements.
ADHEX
Oversample-4 Measure Mean value
generation: 4 full measurements (as in
command AAHEX) are conducted, the
measurements’ mean value is
calculated, and data is stored in the
output buffer using the configuration
from MTP; no power down or pause
between the 4 measurements.
AEHEX
Oversample-8 Measure Mean value
generation: 8 full measurements (as in
command AAHEX) are conducted, the
measurements’ mean value is
calculated, and data is stored in the
output buffer using the configuration
from MTP; no power down or pause
between the 8 measurements.
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The measurement flow of SPL06-003 as following:
Start
Initialization
Command 0xAC~0xAE
Status= 0x40 ?
Read temperature and pressure
data
Delay
YES
NO
Calculate pressure and temperature
End
Temperature=Tempdata/16777216*125-40
Pressure=Bridgedata/16777216*1000+260
24-bit corrected internal temperature
24-bit fully corrected bridge measurement data
Figure 7 Measurement flow of SPL06-003
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5. Mechanical characteristics
5.1 Pin configuration
Device pins are shown here transparently only for orientation purposes.
Figure 8: Layout pin configuration SPL06-003 (top view, pad not visible)
Table 5: Pin configuration of SPL06-003
Pin No. Name Function
1 GND Ground
2 CSB NC(reserved SPI port)
3 SDA Data
4 SCK Clock
5 SDO NC(reserved SPI port)
6 VDDIO NC
7 GND Ground
8 VDD Power supply
5.2 Outline dimensions
The sensor housing is an 8Pin LGA package with metal lid. Its dimensions are 2mm (±0.1
mm) ○G x 2.5mm (±0.1 mm) ○G x 0.95mm (±0.05mm) ○G , undeclared tolerance
(±0.1mm).
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Figure 9: Top view of SPL06-003
Figure 10: Bottom view of SPL06-003
Figure 11: Side view of SPL06-003
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5.3 Marking instructions
Symbol Meaning Introductions
C ID SPL06-003
Y Year One number, such as "6" on behalf of 2016
M Month One number, A ~ L for 1 ~ 12 month, such as "E" on behalf of May
DD Day Two numbers 01 ~ 31, such as "19" on behalf of the 19th
XXX Serial
number
Three numbers 001-999, each batch of products occupy a serial
number
6. Storage and transportation
Keep in warehouse with less than 75% humidity and without sudden temperature
change, acid air, any other harmful air or strong magnetic field.
The MEMS pressure sensor with normal pack can be transported by ordinary
conveyances. Please protect products against moist, shock, sunburn and pressure
during transportation.
Storage Temperature Range:-40℃~+125℃
Operating Temperature Range:-40℃~+85℃
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7. Soldering recommendation
Recommended Solder Reflow
Profile Feature Pb-Free Assembly
Average ramp-up rate(TsMAX to TP) 2.5℃/seconds max.
Preheat
-Temperature Min.(TsMIN)
-Temperature Max.(TsMAX)
-Time(TsMIN to TsMAX)(Ts)
170℃
180℃
120~180seconds
Time maintained above:
-Temperature(TL)
-Time(tL)
217℃
80seconds max.
Peak temperature(TP) 260℃
Time within 5℃ of actual peak temperature(TP)2 20~40seconds
Ramp-down rate 5℃/seconds max.
Time 25℃ to peak temperature 8 minutes max.
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8. Package Specifications
Carrier Tape Information [Unit: mm]
Quantity per reel: 10kpcs.
Figure 12: Carrier Tape (1)
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Figure 13: Carrier Tape (2)
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