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_______________________________________________________________________ Preliminary 2.0 Have sound, will travel Confidential Page 1 / 18 Preliminary Datasheet SPL06-003 Digital pressure sensor Tel: + 86 536 8525155 Fax: + 86 536 8525000 E- Mail: [email protected] Website: http://www.goertekacoustics.com Address: No.268 Dongfang Road, High-Tech Industry Development District, Weifang, Shandong, P.R.C CONFIDENTIAL

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_______________________________________________________________________ Preliminary 2.0 Have sound, will travel Confidential Page 1 / 18

Preliminary Datasheet

SPL06-003 Digital pressure sensor

Tel: + 86 536 8525155

Fax: + 86 536 8525000

E- Mail: [email protected]

Website: http://www.goertekacoustics.com

Address: No.268 Dongfang Road, High-Tech Industry

Development District, Weifang, Shandong, P.R.C

CONFIDENTIAL

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Introduction

The SPL06-003 is a new generation of high precision digital pressure sensor developed

by GoerTek Inc. for consumer applications.

The ultra-low power, low voltage electronics of the SPL06-003 is optimized for use in

mobile phones, wearable, GPS navigation devices and outdoor equipment.

With a low altitude noise of merely 5cm at fast conversion time, the SPL06-003 offers

superior performance.

The I2C interface allows for easy system integration with microcontroller.

Key features

Pressure range: 300 ... 1100hPa (+9000m ... -500m relating to sea level)

Supply voltage: 1.7 ... 3.6V (VDD)

Package: LGA package with metal lid

Small footprint: 2mm x 2.5mm; Super-flat: 0.95mm height

Low noise: 1Pa (8cm)

Temperature measurement included

I2C interface mainly, reserved SPI port

Fully calibrated

Pb-free, halogen-free and RoHS compliant

MSL 1

Typical applications

Enhancement of GPS navigation (dead-reckoning, slope detection, etc.)

In- and out-door navigation

Leisure and sports

Weather forecast

Vertical velocity indication (rise/sink speed)

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Restricted 1. Security warning

The information contained in this document is the exclusive property of GoerTek

Inc. and should not be disclosed to any third party without the written consent of

GoerTek Inc.

2. Publication history

Version Date Description Author Approved

Preliminary 1.0 2016.7.11 New design Wiming Sammy

Preliminary 2.0 2016.7.22

Update

electrical

characteristics

Wiming Sammy

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Index of Contents

1. INTRODUCTION .............................................................................................................. 2

2. TEST CONDITION ........................................................................................................... 5

3. ABSOLUTE MAXIMUM RATINGS ................................................................................... 5

4. ELECTRICAL CHARACTERISTICS ................................................................................ 5

5. OPERATION ..................................................................................................................... 6

5.1 General description ............................................................................................... 6

5.2 General function and application schematics........................................................ 7

5.3 Measurement of pressure and temperature .......................................................... 7

5.4 Calculating absolute altitude and calculating pressure at sea level ..................... 8

5.5 Device and register address .................................................................................. 8

5.6 I2C Interface .......................................................................................................... 9

6. MECHANICAL CHARACTERISTICS ............................................................................. 12

6.1 Pin configuration .................................................................................................. 12

6.2 Outline dimensions .............................................................................................. 12

6.3 Marking instructions ............................................................................................. 14

7. STORAGE AND TRANSPORTATION ............................................................................ 14

8. SOLDERING RECOMMENDATION .............................................................................. 15

9. PACKAGE SPECIFICATIONS........................................................................................ 16

CONFIDENTIAL

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1. Test condition

Table 1: Test condition

Standard Conditions Temperature Humidity Air pressure

Environment conditions -40℃-85℃

25%RH-75%RH 300hPa-1100hPa

Basic test conditions 25℃

60%RH-70%RH 300hPa-1100hPa

2. Absolute maximum ratings

Table 2: Absolute maximum ratings

Parameter Condition Min Max Units

Storage temperature -40 125 °C

Supply Voltage All pin -0.3 +4.25 V

ESD rating HBM,R=1.5kohm,C=100pF ±2 kV

Overpressure 3600 hPa

3. Electrical characteristics

If not stated otherwise, the given values are ±3-Sigma values over temperature/voltage

range in the given operation mode. All values represent the new parts specification; the

additional solder drift is shown separately.

Table 3: Operating conditions, output signal and mechanical characteristics

Parameter Symbol Condition Min Type Max Units

Operating

temperature TA

Operational -40 25 85 °C

Full accuracy 0 70 °C

Operating

Pressure P 300 1100 hPa

Supply voltage Vdd Ripple

max.50mVpp 1.7 - 3.6 V

Peak current Ipeak During conversion 1500 1650 μA

○G standby current Iddsbm @25°C 20 250 nA

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Note :○G Key performance.

4. Operation

4.1 General description

The SPL06-003 is designed to be connected directly to a microcontroller of a mobile

device via the I2C. Digital compensation of signal offset, sensitivity, temperature, and

non-linearity is accomplished via an 26-bit internal digital signal processor (DSP)

running a correction algorithm. Calibration coefficients are stored on-chip in a highly

reliable, nonvolatile, multiple-time programmable (MTP) memory.

○G Supply current

1 sample / sec.

@25°C

Iddstd

OSR × 1 9 10

μA OSR × 2 18 20

OSR × 4 36 40

OSR × 8 72 80

Relative accuracy

pressure

VDD = 3.3V

P_R 950-1050 hPa

@ 25 °C

±0.10 hPa

±0.8 m

○G Absolute

accuracy pressure

VDD = 3.3V

P_A

300- 1100 hPa @

0°C~70 °C -2 ±1 2 hPa

300- 1100 hPa @

-20°C~0°C -3 ±1 3 hPa

Resolution of

output data

Pressure 0.0047 Pa

Temperature 0.0047 °C

Noise in pressure P_Noise

OSR × 1 2

Pa

RMS

OSR × 2 1.5

OSR × 4 1.2

OSR × 8 1

Offset

temperature

coefficient

Tco 25 ~40 ℃

@1000hPa

1 Pa/℃

8.4 cm/℃

Absolute accuracy

temperature

VDD = 3.3V

@25°C -1 ±0.5 1 °C

@0°C~70 °C -1.5 ±1 1.5 °C

Conversion time tc_p &

temp

OSR × 1 8

ms OSR × 2 16

OSR × 4 32

OSR × 8 64

Serial data clock For I2C 3.4 MHz

Solder drifts -2.5 0.5 hPa

Long term stability ±1 hPa CONFIDENTIAL

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4.2 General function and application schematics

The SPL06-003 consists of a MEMS pressure sensor with a conditioning IC to provide

accurate pressure measurement from 300 to 1100hPa.

Developed for correction of resistive bridge sensors, it can also provide a corrected

temperature output measured with an internal sensor. The measured and corrected

bridge values are provided at the digital output pins, which can be configured as I2C.

UP = pressure data (24 bit)

UT = temperature data (24 bit)

Figure 1: Typical application circuit

4.3 Measurement of pressure and temperature

The microcontroller sends a start sequence to start a pressure and temperature

measurement. After converting time, the result value (UP and UT) can be read via the

I2C interface. The compensation of sensor offset, sensitivity, temperature drift, and non-

linearity is accomplished via a Digital Signal Processing (DSP) unit running a correction

algorithm with calibration coefficients stored in an MTP memory. The SPL06-003’s

operational mode is being used typically in which the IC wakes up from a Sleep (low

power) State, runs a measurement in Active State and turns back automatically to the

Sleep State.

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4.4 Calculating absolute altitude and calculating pressure at sea

level

With the measured pressure P and the pressure at sea level P0=1013.25hPa, the altitude

in meters can be calculated with the international barometric formula:

Altitude = 44330 × [𝟏 − (𝐏

P0)

𝟏𝟓.𝟐𝟓𝟓

.

]

Thus, a pressure change of Δp = 1hPa corresponds to 8.43m at sea level.

Figure 2: Transfer function: Altitude over sea level – Barometric pressure

With the measured pressure p and the absolute altitude the pressure at sea level can be

calculated:

P0 =𝑝

(1 −altitude44330 )

5.255

Thus, a difference in altitude of Δaltitude = 10m corresponds to 1.2hPa pressure change

at sea level.

4.5 Device and register address

The SPL06-003 module address is shown below. The LSB of the device address

distinguishes between read (1) and write (0) operation, corresponding to address 0xED

(read) and 0xEC (write).

Figure 3 SPL06-003 addresses

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4.6 I2C Interface

In I2C Mode, each command is started as shown in figure 4. Only the number of bytes

that is needed for the command has to be sent. After the execution of a command (busy

= 0) the expected data can be read as illustrated in figure 5. or if no data are returned by

the command the next command can be sent. The status can be read at any time as

described in figure 6.

Figure 4 I2C Command Request

Figure 5 I2C Read Status

Figure 6 I2C Read Data

All mandatory I²C-bus protocol features are implemented. Optional features like clock

stretching, 10-bit slave address, etc., are not supported by the SPL06-003’s interface.

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The I2C commands supported by the SPL06-003 are listed in Table 4.

The commands to read an address in the user memory is the same as its address.

Table 4 I2C commands

Command Returns Description Convert

formula

AAHEX

24-bit fully

corrected

bridge

measuremen

t data

+ 24-bit

corrected

internal

temperature

Measure Trigger full measurement

cycle and calculation and storage of

data in the output buffer using the

configuration from MTP.

Temperature=Te

mpdata/

16777216*(85+4

0)-40

Pressure=Bridge

data/

16777216*1000

+260

ACHEX

Oversample-2 Measure Mean value

generation: 2 full measurements are

conducted (as in command AAHEX),

the measurements’ mean value is

calculated, and data is stored in the

output buffer using the configuration

from MTP; no power down or pause

between the 2 measurements.

ADHEX

Oversample-4 Measure Mean value

generation: 4 full measurements (as in

command AAHEX) are conducted, the

measurements’ mean value is

calculated, and data is stored in the

output buffer using the configuration

from MTP; no power down or pause

between the 4 measurements.

AEHEX

Oversample-8 Measure Mean value

generation: 8 full measurements (as in

command AAHEX) are conducted, the

measurements’ mean value is

calculated, and data is stored in the

output buffer using the configuration

from MTP; no power down or pause

between the 8 measurements.

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The measurement flow of SPL06-003 as following:

Start

Initialization

Command 0xAC~0xAE

Status= 0x40 ?

Read temperature and pressure

data

Delay

YES

NO

Calculate pressure and temperature

End

Temperature=Tempdata/16777216*125-40

Pressure=Bridgedata/16777216*1000+260

24-bit corrected internal temperature

24-bit fully corrected bridge measurement data

Figure 7 Measurement flow of SPL06-003

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5. Mechanical characteristics

5.1 Pin configuration

Device pins are shown here transparently only for orientation purposes.

Figure 8: Layout pin configuration SPL06-003 (top view, pad not visible)

Table 5: Pin configuration of SPL06-003

Pin No. Name Function

1 GND Ground

2 CSB NC(reserved SPI port)

3 SDA Data

4 SCK Clock

5 SDO NC(reserved SPI port)

6 VDDIO NC

7 GND Ground

8 VDD Power supply

5.2 Outline dimensions

The sensor housing is an 8Pin LGA package with metal lid. Its dimensions are 2mm (±0.1

mm) ○G x 2.5mm (±0.1 mm) ○G x 0.95mm (±0.05mm) ○G , undeclared tolerance

(±0.1mm).

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Figure 9: Top view of SPL06-003

Figure 10: Bottom view of SPL06-003

Figure 11: Side view of SPL06-003

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5.3 Marking instructions

Symbol Meaning Introductions

C ID SPL06-003

Y Year One number, such as "6" on behalf of 2016

M Month One number, A ~ L for 1 ~ 12 month, such as "E" on behalf of May

DD Day Two numbers 01 ~ 31, such as "19" on behalf of the 19th

XXX Serial

number

Three numbers 001-999, each batch of products occupy a serial

number

6. Storage and transportation

Keep in warehouse with less than 75% humidity and without sudden temperature

change, acid air, any other harmful air or strong magnetic field.

The MEMS pressure sensor with normal pack can be transported by ordinary

conveyances. Please protect products against moist, shock, sunburn and pressure

during transportation.

Storage Temperature Range:-40℃~+125℃

Operating Temperature Range:-40℃~+85℃

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7. Soldering recommendation

Recommended Solder Reflow

Profile Feature Pb-Free Assembly

Average ramp-up rate(TsMAX to TP) 2.5℃/seconds max.

Preheat

-Temperature Min.(TsMIN)

-Temperature Max.(TsMAX)

-Time(TsMIN to TsMAX)(Ts)

170℃

180℃

120~180seconds

Time maintained above:

-Temperature(TL)

-Time(tL)

217℃

80seconds max.

Peak temperature(TP) 260℃

Time within 5℃ of actual peak temperature(TP)2 20~40seconds

Ramp-down rate 5℃/seconds max.

Time 25℃ to peak temperature 8 minutes max.

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8. Package Specifications

Carrier Tape Information [Unit: mm]

Quantity per reel: 10kpcs.

Figure 12: Carrier Tape (1)

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Figure 13: Carrier Tape (2)

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Figure 14: Packing Box

CONFIDENTIAL