OVERVIEW

Feb. 2009

SPI HS60 series

INTRODUCTION

SPI HS60 System

The major roles of the system

Customer’s benefits

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SPI HS60 System

• In-line 3D solder paste inspection system

• Featuring the highest performance – The only one machine guaranteeing true

measuring and high accuracy

– The only one machine meeting 100% inspection at the fastest production line

– Less than 5% GR&R at typical process tolerance

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The major roles of the system

Detecting faulty solder paste locations with “zero” false calls- Volume, Height, Area, Positional Offset, Bridge, Shape

SPC (Statistical process control)- Classical printing process monitoring & control functions- Anyone can have network connection to a machine DB for SPC- Real time monitoring & analysis

Monitoring the current printing process- Helps operator to know printing status quickly at production lines

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Customer’s benefits

Due to high FPY rateCut down rework costs (save

components & PCBs)

Prevent faulty PCBs from going through next process

Helps operator do proper actions on the screen printer

Get optimal control of printing process

Prevent outdoor failure

HARDWARE

Outlook and Dimension

Hardware Schematics

Hardware Configuration

X-Y Gantry Robot

Conveyor Stage

Electric Assemblies

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Outlook and Dimension

※ In case of SPI HS60 (Standard)

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Hardware Schematics

Base Frame

3D Sensor Head(RSC-VI & V)

X axis robot

Electric Parts

Conveyor Stage Y axis robot

Computer

Utility & Interface

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• Gantry X-Y robot - Small foot print

- Linear motor driven X stage

Hardware Configuration

• Conveyor stage- Auto width adjustment

- Clamping mechanism with backup pins

• 3D sensor with Z axis stage- Obtain 2D & 3D image

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• Enclosure & console- Elegant and ergonomic design

Hardware Configuration

• Computer & electric assemblies- Enclosed in the sliding cabinet

- Easy maintenance

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X-Y Gantry Robot

• Move the 3D sensor to obtain 3D & 2D images

• Adopting gantry mechanism– No panel movement during inspection : stable measuring

– Enable entire mechanisms be concise and small foot printed

• Precise and durable– Employing linear motor in the scanner stage

– Made of stable & durable steel casting

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X-Y Gantry Robot

• Zigzag scanning panels– Smooth operation with a constant speed

– More stable than other machines or methods requesting

abrupt several go & stop movements every second

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Conveyor Stage

• Motorized width adjustment

• Panel loading & unloading– Panel transferring Up to 822

mm/sec to shorten cycle time

– Easy changing of the panel transfer direction : few minutes

– Support the pass mode in the case of failures on other parts

• Edge cylinder aligner

– Align PCBs along fixed rail for stable measuring

• Clamping mechanism– Employing backup pins to straighten warped PCBs

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• All the electric assemblies are enclosed in a single cabinet– All of devices are accessible from front side of machine

– The sliding cabinet can be pulled forward for easy maintenance

Electric Assemblies

• Computer– Controls X-Y robot & conveyors

– User Interface : Console, signal lamp, buzzer

– Measuring, defect detection, and DB admin.

• Electric parts– Distribute power to sub-systems

– Control and drive actuators and sensors

– SMEMA interface

3D SENSOR

RSC V

Outstanding Performance

3D Images of Components

3D Images of Panels

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RSC V

• Support 2D & 3D image mode– 2D mode : get fiducial mark image

– 3D mode : get 3D data (height map) for inspection

• Measuring principle– Optical triangulation

– Light source : Laser sheet beam

– Detector : Ultra high speed camera

Perspective View

Top View

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Outstanding Performance

• High accuracy - reliable laser beam centroid finding algorithm

• Most robust - immune to color, surface finishing variation, and ambient noise

• Sheet beam not perpendicular to scan direction - better accuracy

• Measuring speed

– Single laser : 80 ㎠/sec

– Dual Laser : 40 ㎠/sec

– Load/unload/fiducial: 5~6 sec

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3D Images of Components

BGA site QFP site

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3D Images of Panels

Green BoardBlack Board (Flexible 0.7t)

Light Yellow Board (Flexible 0.4t)Dark Green Board (Flexible 0.4t)

Operation Software

Software for panel inspection

Summary of SPIworks

Summary of ePm-SPI

Summary of SPCworks

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Software for panel inspection

SPIworksInspection program

SPCworksSPC program

ePm-SPITeaching program

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Summary of SPIworks

• Machine control & Operator interface

• 3D Measuring and defect detection

• Data save and administration

• Possible for Mixed flow of up & bottom side

• Process monitoring & control functions– Printing status display by value, sigma, fault frequency coloring

– 3D shape viewer

– Measured data viewer

– Defect viewer for current PCB

– Defect reviewer for the past NG PCBs

– X-bar & variance chart

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• Generates output file used by Inspection program (SPIworks)

• Output file contains inspection specific info and parameters

• Supporting the multi Gerber teaching(Layer Concept)

• Inputs : Stencil gerber, CAD X-Y, Mentor Neutral, ECAD Design,

FABmaster Pin Cad, ODB++(Optional), BOM files

• Supporting the Polygon type of pads & rotated pads

• Off-line or on-line programming available

• Easy and fast teaching : 10 ~ 20 minutes

Summary of ePm-SPI

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Summary of SPCworksTM

• Statistical process control for solder paste printing process– Monitoring printing process in real time

– Guide to secure better quality of printed paste

• Access the SQL data base– Networked application

– Huge DB with backup function

• Data analysis– Volume, Height, Area, Offset

– Control charts and process capability analysis

– Reporting

SPECIFICATIONS

Functionality & Measurement

Inspection Performance

Board Specification

Dimension & Conveyor

Hardware System & Interface

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Functionality & Measurement

HS60 HS60L

Measuring Principal Laser Optical Triangulation

Paste Type Supported All (Pb or Pb Free)

Board Type Supported All colors and All pad finishes

Offline Teaching ePm-SPI & GerberWorks

SPC & Process Monitoring SPCworks & RMCworks

System Diagnosis SPImanager

Functionality

HS60 HS60L

Camera system High frame rate sensor, 18x18 ㎛ pixel resolution

Camera system(Dual Laser) High frame rate sensor, 9x18 ㎛ pixel resolution

Scan Resolution 20 ㎛

Lateral Resolution 18 ㎛

Optical Layout Laser with 18° angle

Height Resolution 0.2 ㎛

Max. Paste Height 1,000 ㎛

Max. Paste Size 20 x 20 mm

Measurement

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Inspection Performance

HS60 HS60L

Inspection Type Height, Area, Volume, Offset, Bridge

Inspection Speed 80 ㎠ /sec @ Single Laser, 40 ㎠ /sec @ Dual Laser

Load, Unload and Fiducial Finding 5 sec

Height Repeatability 3 Sigma < 1.0 ㎛, on a certification target

Area Repeatability 3 Sigma < 1%, on a certification target

Volume Repeatability 3 Sigma < 1%, on a certification target

Height Accuracy 3 ㎛, on a certification target

Gage R&R Less than 10 %

Inspection Performance

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Board Specification

HS60 HS60L

Maximum Board Size 390 x 260 mm 550 x 510 mm

Minimum Board Size 50 x 50 mm

Maximum Board Weight 3.5 Kg(Standard mode), 2.0Kg(High Speed mode)

Maximum Board Warp ±5 mm

Board Thickness 0.4 to 4 mm

Board Edge Clearance (Top/Bottom) 2.5 / 3.0 mm

Underside Clearance 25 mm

Topside Clearance 25 mm

Board

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Dimension & Conveyor

HS60 HS60L

Dimension (W x D x H) 900 x 1,000 x 1,450mm 1,060 x 1,285 x 1,450mm

Weight 750 Kg 1,000 Kg

Conveyor Speed Range 370 ~ 822 mm/sec

Conveyor Height 890 ~ 965 mm

Flow Direction Selectable when ordering / Changeable in 10 minute

Conveyor Reference Side Selectable when ordering

System Dimension

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Hardware System & Interface

HS60 HS60L

Data Input Type Gerber (RS-274X & RS-274D)

Board Interface SMEMA

Barcode (option) 1D, 2D

Interface

HS60 HS60L

Conveyor system 1 Conveyor, Auto width adjustable, backup pins option

X-Y robot gantry type, linear motor driven X-stage

ComputerPentium Core II Duo Processor

4GB Memory

Operating System Windows XP Professional

Display 17" LCD

Input Mouse, Keyboard

Supplies AC 220V, 5 Kgf/㎠

Hardware System